RALEC
Thick Film Chip Resistors Array
Product Specification
旺 詮
1
Document No.
IE-SP-011
Released Date
2011/02/20
1/21
Page No.
Scope:
This specification is applicable to lead and halogen free RTA series thick film
chip resistors array。
2
Explanation Of Part Numbers:
03
RTA
(EX)
Size
Type
Lead-Free Thick 01(0201)
Thick Film Chip
Resistors Array
02(0402)
03(0603)
4
Number of
Circuits
Terminal
Type
2: 2 circuits
4: 4 circuits
8: 8 circuits
D:Convex
C:Concave
D
101
Nominal Resistance
E24 Series
3EX 10Ω =100
Digit
4.7Ω =4R7
Resistors
E24/E96 Series
4EX 10.2Ω =10R2
Digit
10KΩ =1002
TP
Resistance
Tolerance
D=± 0.5%
F=± 1%
G=± 2%
J=± 5%
000
Jumper
3
J
Packaging
TH
H2
H3
H4
TP
P2
P3
P4
2 mm Pitch Paper(Taping) 10000 pcs
2 mm Pitch Paper(Taping) 20000 pcs
2 mm Pitch Paper(Taping) 30000 pcs
2 mm Pitch Paper(Taping) 40000 pcs
4 mm Pitch Paper(Taping) 5000 pcs
4 mm Pitch Paper(Taping) 10000 pcs
4 mm Pitch Paper(Taping) 15000 pcs
4 mm Pitch Paper(Taping) 20000 pcs
General Specifications:
Type
T.C.R.
Rated Max.
Max.
Power Working Overload (ppm/℃)
at 70℃ Voltage Voltage
RTA01-2D
1/32W 12.5V
(0201)
25V
Resistance Range
G(± 2%)
J(± 5%)
E-24
D(± 0.5%)
E-24、E-96
F(± 1%)
E-24、E-96
± 500
-----
-----
3Ω≦R＜10Ω
± 300
-----
-----
10Ω≦R＜1K Ω
± 200
-----
-----
1KΩ≦R ≦1 MΩ
± 300
-----
1Ω≦R＜10Ω
1Ω≦R＜10Ω
± 200
-----
10Ω≦R≦1MΩ 10Ω≦R≦1MΩ
± 200
-----
10Ω≦R≦1MΩ 1Ω≦R≦10MΩ
Number
Number
of
of
Terminals Resistors
JUMPER JUMPER
(0Ω)
(0Ω)
Rated
Resistance
Current
Value
4
2
0.5A
50mΩMax.
4
2
1A
50mΩMax.
4
2
1A
50mΩMax.
8
4
1A
50mΩMax.
8
4
1A
50mΩMax.
8
4
1A
50mΩMax.
RTA02-2D
1/16W
(0402)
25V
50V
RTA03-2D 1/16W
(0603)
50V
100V
RTA02-4D
1/16W
(0402)
25V
50V
RTA02-4C
1/16W
(0402)
25V
50V
RTA03-4D
1/16W
(0603)
50V
100V
± 200
RTA03-4C
1/16W
(0603)
50V
100V
± 200
-----
1Ω≦R≦1MΩ
1Ω≦R≦10MΩ
8
4
1A
50mΩMax.
25V
50V
± 250
-----
10Ω≦R≦1MΩ
1Ω≦R≦1MΩ
16
8
1A
50mΩMax.
50V
100V
± 200
-----
1Ω≦R≦1MΩ
1Ω≦R≦10MΩ
16
8
1A
50mΩMax.
RTA03-2C
1/16W
(0603)
50V
100V
± 200
-----
1Ω≦R≦1MΩ
1Ω≦R≦10MΩ
4
2
1A
50mΩMax.
RTA02-2C
1/16W
(0402)
25V
50V
3Ω≦R＜10Ω
3Ω≦R＜10Ω
4
2
1A
50mΩMax.
RTA02-8D 1/16W
(0402)
RTA03-8C
1/16W
(0603)
± 300
-----
± 200
-----
± 400
-----
± 200
-----
± 650
± 250
1Ω≦R＜10Ω
1Ω≦R＜10Ω
Checked
Written
1Ω≦R＜10Ω
10Ω≦R≦1MΩ 10Ω≦R≦1MΩ
22Ω≦R≦470KΩ 1Ω≦R≦10MΩ 1Ω≦R≦10MΩ
-----
10Ω≦R≦1MΩ 10Ω≦R≦1MΩ
Operating Temperature Range
Approved
1Ω≦R＜10Ω
10Ω≦R≦1MΩ 10Ω≦R≦1MΩ
－55℃ ~ ＋155℃
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Series No.
60
RALEC
旺 詮
Thick Film Chip Resistors Array
Product Specification
Document No.
IE-SP-011
Released Date
2011/02/20
2/21
Page No.
3.1 Power Derating Curve:
Operating Temperature Range： - 55〜155 ℃
Rated Load(%)
For resistors operated in ambient temperatures above 70 ℃ , power rating shall be
derated in accordance with figure below.
70
100
80
60
40
155
20
0
-55
20 40 60 80 100 120 140 160
Ambient Temperature(℃)
3.2 Voltage Rating:
Rated Voltage: The resistor shall have a DC continuous working voltage or a rms.
AC continuous working voltage at commercial-line frequency and wave form
corresponding to the power rating, as determined from the following:
E= Rated voltage (v)
P= power rating (w)
R= Nominal resistance(Ω)
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Series No.
60
RALEC
Thick Film Chip Resistors Array
Product Specification
旺 詮
4
Document No.
IE-SP-011
Released Date
2011/02/20
3/21
Page No.
Dimensions: (mm)
RTA03-2C
RTA03-2D
RTA02-4C / RTA03-4C
Circuits
Q
R1
R2
R4
R3
P
L
R1=R2=R3=R4
RTA02-4D / RTA03-4D
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Series No.
60
RALEC
旺 詮
Thick Film Chip Resistors Array
Product Specification
Document No.
IE-SP-011
Released Date
2011/02/20
4/21
Page No.
RTA02-8D / RTA03-8C
Circuits
R1
R2
R3
R4
R5
R6
R7
R8
R1 = R2= R3 = R4 = R5 = R6 = R7 = R8
RTA01-2D / RTA02-2D
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Series No.
60
RALEC
Thick Film Chip Resistors Array
Product Specification
旺 詮
Document No.
IE-SP-011
Released Date
2011/02/20
5/21
Page No.
RTA02-2C
型式
尺寸
L
W
H
L1
L2
P
Q
RTA01-2D
(0201)
0.80± 0.10 0.60± 0.10 0.30± 0.05 0.15± 0.10 0.15± 0.05
(0.50)
0.35± 0.10
RTA02-2D
(0402)
1.00± 0.10 1.00± 0.10 0.30± 0.05 0.15± 0.10 0.25± 0.10
(0.67)
0.33± 0.10
RTA03-2D
(0603)
1.60± 0.15 1.60± 0.15 0.45± 0.10 0.30± 0.15 0.30± 0.15
(0.80)
0.60± 0.10
RTA02-4D
(0402)
2.00± 0.10 1.00± 0.10 0.40± 0.10 0.20± 0.10 0.25± 0.10
(0.50)
0.30± 0.10
RTA02-4C
(0402)
2.00± 0.10 1.00± 0.10 0.40± 0.10 0.15± 0.10 0.25± 0.10
(0.50)
0.30± 0.10
RTA03-4D
(0603)
3.20± 0.20 1.60± 0.15 0.50± 0.10 0.30± 0.15 0.30± 0.15
(0.80)
0.50± 0.10
RTA03-4C
(0603)
3.20± 0.15 1.60± 0.15 0.55± 0.10 0.35± 0.15 0.45± 0.15
(0.80)
0.50± 0.10
RTA02-8D
(0402)
4.00± 0.20 1.60± 0.10 0.40± 0.10 0.30± 0.15 0.30± 0.10
(0.50)
0.25± 0.10
RTA03-8C
(0603)
6.40± 0.20 1.60± 0.20 0.55± 0.10 0.30± 0.15 0.40± 0.15
(0.80)
0.50± 0.10
RTA03-2C
(0603)
1.60± 0.15 1.60± 0.15 0.55± 0.10 0.30± 0.15 0.40± 0.15
(0.80)
0.50± 0.10
RTA02-2C
(0402)
1.00± 0.10 1.00± 0.10 0.30± 0.10 0.18± 0.10 0.25± 0.10
(0.50)
0.30± 0.10
Unit:mm
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Series No.
60
RALEC
旺 詮
Remark
Thick Film Chip Resistors Array
Product Specification
IT’ S NOT UNDER CONTROL FOR PDF FILE
Document No.
IE-SP-011
Released Date
2011/02/20
6/21
Page No.
Issue Dep. DATA Center.
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Series No.
60
RALEC
旺 詮
5
Thick Film Chip Resistors Array
Product Specification
Document No.
IE-SP-011
Released Date
2011/02/20
7/21
Page No.
Reliability Test:
5.1 Electrical Performance Test
ITEM
Specifications
Resistors
Conditions
Jumper
（ R2－ R1）
Temperature
Refer item 3. General
NA
6
Coefficientof TCR（ppm/℃）＝ R1（ T2－ T1） × 10
Specifications
Resistance R1: Resistance at room temperature
R2: Resistance at -55℃ or +125℃
T1: Room temperature
T2: Temperature -55℃ or +125℃
Refer to JIS-C5201-1 4.8
0.5%、1%:± (1.0%＋0.05Ω)
50mΩ
Short Time Applied 2.5 times rated voltage for 5 seconds and
Lower
Overload release the load for about 30 minutes , then measure its 2%、5% :± (2.0%＋0.10Ω)
resistance variance rate. (Rated voltage refer to item 3.
general specifications)
No evidence of mechanical damage,
Refer to JIS-C5201-1 4.13
Insulation Put the resistor in the fixture, add 100 VDC in + ,- ≧109Ω
Resistance terminal for 60 sec then measured the insulation
resistance between electrodes and insulating enclosure
or between electrodes and base material.
Refer to JIS-C5201-1 4.6
Dielectric
Withstand
Voltage
Intermittent
Overload
Put the resistor in the fixture, add 300 VAC in +,No short or burned on the appearance.
terminal for 60 sec.
Refer to JIS-C5201-1 4.7
Put the tested resistor in chamber under temperature
50mΩ
± (5.0%＋0.10Ω)
25± 2℃ and load 2.5 times rated DC voltage for 1 sec
Lower
on , 25 sec off , 10000 +400
test cycles, then it be left at
0
no-load for 1 hour , then measure its resistance variance
rate.
Refer to JIS-C5201-1 4.13
NA
Resistance
Noise
Noise Level Refer to JIS-C5201-1 4.12
R ＜100Ω
≦-10db(0.32 uV/V)
100Ω ≦R＜1KΩ
≦ 0db(1.0 uV/V)
1KΩ ≦R＜10KΩ
≦ 10db(3.2 uV/V)
10KΩ ≦R＜100KΩ ≦ 15db(5.6 uV/V)
100KΩ ≦R＜1MΩ
1MΩ ≦R
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≦ 20db(10 uV/V)
≦ 30db(32 uV/V)
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Series No.
60
RALEC
Thick Film Chip Resistors Array
Product Specification
旺 詮
Document No.
IE-SP-011
Released Date
2011/02/20
8/21
Page No.
5.2 Mechanical Performance Test
ITEM
Conditions
Resistance to The tested resistor be immersed into isopropyl alcohol of
solvent
20~25℃ for 5 minutes, then the resistor is left in the
room for 48 hr , then measure its resistance variance
rate.
Refer to JIS-C5201-1 4.29
Resistance to ◎Test method 1 (Reflow test):
soldering heat The tested resistor should be subject in the following
procedure, and after finish each step, it should be left
for a duration of 2 hours or longer at a temperature of
30℃ or lower and a humidity of 70% RH or lower.
Step
1
Procedure
Specifications
Resistors
Jumper
01-2D:± (1.0%+0.05Ω)
50mΩ
Other:± (0.5%+0.05Ω)
Lower
No evidence of mechanical damage, no
G2 overcoating and Sn layer by leaching.
± (1.0%+0.05Ω)
50mΩ
Lower
No evidence of electrode damage.
No side conductive peel off.
Environmental test condition
Resistance
measuring
Room temperature
2
Baking
125℃， 24 hours
3
Humidification
85℃，85%，168 hours
4
Reflow (1)
Reflow temperature curve and component
surface temperature Table 1
5
Humidification
85℃，65%，24 hours
6
Reflow (2)
Reflow temperature curve and component
surface temperature Table 2
7
Resistance
measuring
Room temperature
◎Reflow temperature curve
◎Component surface temperature
Table 1 Description example in specification
document(1)
Temperature measured
Temperature-retaining
Peak
at the component body
time:230℃ or higher temperature
surface during
preheating
30 seconds
240℃
150 to 160 ℃
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Series No.
60
RALEC
旺 詮
Thick Film Chip Resistors Array
Product Specification
ITEM
Document No.
IE-SP-011
Released Date
2011/02/20
9/21
Page No.
Specifications
Resistors
Conditions
Jumper
Table 2 Description example in specification
document(2)
Temperature
Temperature-retaining
time
Temperature
measured at the
component body
surface during
preheating
220℃ or higher
230℃ or higher
240℃ or higher
Peak
90 seconds
60 seconds
5 seconds
245℃
150 to 160℃
◎Test method 2 (sloder pot test):
The tested resistor should be subject in the following
procedure, and after finish each step, it should be left for
a duration of 2 hours or lower at a temperature of 30℃
or lower and a humidity of 70% RH or lower.
Step
1
2
3
4
5
6
7
Procedure
Resistance
measuring
Baking
Humidification
Sloder pot test
Placed
Sloder pot test
Resistance
measuring
Environmental test condition
Room temperature
125℃， 24 hours
85℃，85%，168 hours
260± 3℃， 10 sec
85℃，65%，24 hours
260± 3℃， 10 sec
Room temperature
By Sony (SS-00254-5)
Refer to JIS-C5201-1 4.18
Solderability Preconditioning:
1.Test item 1:
Put the tested resistor in the apparatus of PCT, at a
Solder coverage over 95%
temperature of 105℃, humidity of 100% RH, and
pressure of 1.22× 105 Pa for a duration of 4 hours. Then
after left the tested resistor in room temperature for 2
hours or more.
Test method:
◎Test item 1 (solder pot test):
The resistor be immersed into solder pot in temperature
235± 5℃ for 2 sec, then the resistor is left as placed
under microscope to observed its solder area.
By SONY (SS-00254-2)
Refer to JIS-C5201-1 4.17
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Series No.
60
RALEC
旺 詮
ITEM
Thick Film Chip Resistors Array
Product Specification
Conditions
Joint strength Preconditioning:
of solder Put the tested resistor in the apparatus of PCT, at a
temperature of 105℃, humidity of 100% RH, and
pressure of 1.22× 105 Pa for a duration of 4 hours. Then
after left the tested resistor in room temperature for 2
hours or more.
Test method:
◎Test item 1 (Adhesion):
A static load using a R0.5 scratch tool shall be applied
on the core of the component and in the direction of the
arrow and held for 10 seconds and under load measure
its resistance variance rate.
1.02-2C=10N load
2.Other=20N load
3.01-2D=5N load
Document No.
IE-SP-011
Released Date
2011/02/20
10/21
Page No.
Specifications
Resistors
Jumper
50mΩ
Test item1:
Lower
1.△R%=± (1.0%+0.05Ω)
2.No evidence of mechanical
damage.
No terminal peel off.
Test item2:
1.△R%=± (1.0%+0.05Ω)
2.No evidence of mechanical
damage.
No terminal peel off and
core body cracked.
Test item3:
(1).Adhesion
After application of
temperature cycle, adhesion
should be 50% or more of
initial strength.
(2).Bending Strength:
After application of
temperature cycle, bending
load should be 50% or more
of initial strength.
Refer to JIS-C5201-1 4.32
◎Test item 2 (Bending Strength):
Solder tested resistor on the PC board, add force in
the middle down, and under load measure its
resistance variance rate .
D=(1)01-2D=3mm
(2)Other=5mm
Refer to JIS-C5201-1 4.33
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Series No.
60
RALEC
旺 詮
ITEM
Thick Film Chip Resistors Array
Product Specification
Conditions
◎Test item 3 (Endurance measurement):
Put the tested resistor in the chamber under the
temperature cycle which shown in table 1 shall be
repeated 1000± 4 times consecutively. Then separate
follow test item 1 and test item 2 50% condition to test,
measured its resistance variance rate.
Table 1 Temperature cycle test condition
Testing condition
Lowest temperature
-35± 5℃
Highest temperature
105± 5℃
Temperature-retaining time
15 minutes each
By SONY (SS-00254-9)
Leaching Test The tested resistor be immersed into molten solder of
260± 5℃ for 30 seconds. Then the resistor is left as
placed under microscope to observed its solder area.
By SONY (SS-00254-9)
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Document No.
IE-SP-011
Released Date
2011/02/20
11/21
Page No.
Specifications
Resistors
Jumper
1.Solder coverage over 95%.
2.The underlying material (such as
ceramic) shall not be visible at the crest
corner area of the electrode.
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Series No.
60
RALEC
旺 詮
Thick Film Chip Resistors Array
Product Specification
Document No.
IE-SP-011
Released Date
2011/02/20
12/21
Page No.
5.3 Environmental Test
ITEM
Specifications
Resistors
Conditions
Resistance to Put tested resistors in chamber under temperature 155± 5℃
for 1,000± 4 hours. Then leaving in room temperature for 60
Dry Heat
0.5%、1%:± (1.0%＋0.05Ω)
2%、5% :± (2.0%＋0.10Ω)
Jumper
50mΩ
Lower
minutes, and measure its resistance variance rate
.
Refer to JIS-C5201-1 4.25
Thermal
Shock
No evidence of mechanical
damage,
No evidence of mechanical.
Put the tested resistor in the thermal shock chamber under the ± (1.0%＋0.05Ω)
50mΩ
temperature cycle which shown in the following table shall be
Lower
repeated 300 times consecuitively. Then leaving the tested
No evidence of mechanical damage,
resistor in the room temperature for 1 hours, and measure its
resistance variance rate.
Testing Condition
Lowest Temperature
-55± 5℃
Highest Temperature
125± 5℃
Temperature-retaining time
15 minutes each
Refer to MIL-STD 202 Method 107
Loading Life in Put the tested resistor in the chamber under temperature 40± 0.5%、1%:± (2.0%＋0.10Ω)
2℃, relative humidity 90~95% and load the rated voltage for 90 2%、5% :± (3.0%＋0.10Ω)
Moisture
minutes on, 30 minutes off, total 1000 hours. Then leaving the
tested resistor in room temperature for 60 minutes, and
measure its resistance variance rate.
Refer to JIS-C5201-1 4.24
Put the tested resistor in chamber under temperature 70± 2℃
Load Life
and load the rated voltage for 90 minutes on, 30 minutes off,
total 1000 hours. Then leaving the tested resistor in room
temperature for 60 minutes, and measure its resistance
variance rate.
Refer to JIS-C5201-1 4.25
Put the tested resistor in the chamber at room temperature
Low
Temperature 25℃.Decreasing the temperature to -55℃ and keep the
Operation temperature at -55℃ for 1 hour. Then load the rated voltage
for 45 minutes on, and 15 minutes off. Then leaving the tested
resistor in room temperature for 8± 1 hours, and measure its
resistance variance rate.
Refer to MIL-R-55342D 4.7.4
Whisker Test ◎Test item 1 (Thermal Shock test):
Minimum storage temperature
-40± 2℃
Maximum storage temperature
85± 2℃
Temperature-rataining time
7 min.
Number of temperature cycles
1,500
50mΩ
Lower
No evidence of mechanical damage.
0.5%、1%:± (2.0%＋0.10Ω)
2%、5% :± (3.0%＋0.10Ω)
No evidence of mechanical
damage, no short or burned on the
appearance.
50mΩ
Lower
0.5%、1%:± (0.5%＋0.05Ω)
50mΩ
2%、5% :± (1.0%＋0.05Ω)
Lower
No evidence of mechanical damage,
Max. 50μm
◎Test item 2 (Constant temperature/humidity test):
Remark
Temperature
85℃
Humidity
85%
Testing duration
500± 4 hours
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Series No.
60
RALEC
旺 詮
ITEM
Thick Film Chip Resistors Array
Product Specification
Conditions
Document No.
IE-SP-011
Released Date
2011/02/20
13/21
Page No.
Specifications
Resistors
Jumper
◎Inspection:
Inspect for whisker formation on specimens that underwent the
acceleration test specified in subciause 4.2, with a magnifier
(stereomicroscope) of about 40 or higher magnification. If
judgment is hard in this method, use a scanning electron microscope (SEM) of about 1,000 or higher magnification.
By SONY (SS-00254-8)
6
Recommend Soldering Method
6.1 Lead Free Reflow Soldering Profile
6.2 Soldering Iron: temperature 350℃± 10℃ , dwell time shall be less than 3 sec.
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60
RALEC
Thick Film Chip Resistors Array
Product Specification
旺 詮
7
Document No.
IE-SP-011
Released Date
2011/02/20
14/21
Page No.
Recommend Land Pattern Design (For Reflow Soldering):
Unit : mm
RTA01-2D / RTA02-2D
RTA02-2C / RTA03-2D / RTA03-2C
TYPE
8
DIM
RTA02-4D / RTA02-4C
RTA03-4D / RTA03-4C
RTA02-8D / RTA03-8C
A
B
P
Q1
Q2
RTA01-2D
0.30
0.90
0.50
0.30
0.30
RTA02-2D
0.50
2.00
0.67
0.33
0.34
RTA03-2D
1.00
2.60
0.80
0.40
0.40
RTA02-4D
RTA02-4C
0.50
2.00
0.50
0.28
0.22
RTA03-4D
RTA03-4C
RTA03-2C
1.00
2.60
0.80
0.40
0.40
RTA02-8D
1.00
2.60
0.50
0.25
0.25
RTA03-8C
1.00
2.60
0.80
0.40
0.40
RTA02-2C
0.50
2.00
0.50
0.28
0.22
Marking Diagrams:
8.1 ± 2%、± 5% Tolerance:
8.1.1 Resistance Range ≧ 10 Ω : 3 digits in E-24 series, first two digits are significant
figures, third digit is is multiplier (10× ).
《EX》Marking→100
100＝10 × 100 ＝10Ω
8.1.2 Resistance Range ＜ 10 Ω : 3 digits in E-24 series, first and thrid digits are significant
figures, second digit is multiplier (10-1).
《EX》Marking→4R7
4R7＝47× 10-1 ＝4.7Ω
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Series No.
60
RALEC
Thick Film Chip Resistors Array
Product Specification
旺 詮
Document No.
IE-SP-011
Released Date
2011/02/20
15/21
Page No.
8.2 ± 0.5%、1% Tolerance:
8.2.1 Resistance Range ≧ 100 Ω : 4 digits in E-24 series or E-96 series, first three digits
are significant figures, forth digit is multiplier (10× ).
《EX》Marking→1002
1002＝100× 102 ＝10000Ω＝10KΩ
8.2.2 Resistance Range ＜ 100 Ω : 4 digits in E-24 series or E-96 series, three digits are
significant figures,R digit is multiplier (10× ).
《EX》Marking→10R2 ,R digit is multiplier (10-1).
10R2＝102× 10-1 ＝10.2Ω
Marking→1R02 ,R digit is multiplier (10-2).
1R02＝102× 10-2 ＝1.02Ω
8.3 RTA01-2D、RTA02-2D、RTA02-2C、RTA02-4C No Marking
8.4 Marking Standard
Standard
1
TYPE
2
3
4
5
6
7
8
9
0
R
Marking
RTA03-2D
RTA02-4D
RTA03-2C
RTA03-4D
RTA03-4C
RTA02-8D
RTA03-8C
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Series No.
60
RALEC
Thick Film Chip Resistors Array
Product Specification
旺 詮
Document No.
IE-SP-011
Released Date
2011/02/20
16/21
Page No.
8.5 Marking
8.5.1 E-24 series
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
8.5.2 E-96 series
9
100
102
105
107
110
113
115
118
121
124
127
130
133
137
140
143
147
150
154
158
162
165
169
174
178
182
187
191
196
200
205
210
215
221
226
232
237
243
249
255
261
267
274
280
287
294
301
309
316
324
332
340
348
357
365
374
383
392
402
412
422
432
442
453
464
475
487
499
511
523
536
549
562
576
590
604
619
634
649
665
681
698
715
732
750
768
787
806
825
845
866
887
909
931
953
976
Plating Thickness:
9.1 Ni: ≧1μｍ
9.2 Sn(Tin): ≧3μｍ
9.3 Sn(Tin): Matte Sn
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Series No.
60
RALEC
Thick Film Chip Resistors Array
Product Specification
旺 詮
Document No.
IE-SP-011
Released Date
2011/02/20
17/21
Page No.
10 Taping Specifications
10.1Tape Dimension
Unit : mm
Packaging
DIM
Type
A
B
W
E
F
T1
T2
P
P0
10× P0
P1
RTA01-2D 0.90± 0.1
0.70± 0.1
8.0± 0.2
1.75± 0.1
3.5± 0.05 0.45+0.2/-0 0.43± 0.1
2.0± 0.1
4.0± 0.05 40.0± 0.20 2.0± 0.05
TH
RTA02-2D 1.20± 0.1
1.20± 0.1
8.0± 0.2
1.75± 0.1
3.5± 0.05 0.45+0.2/-0 0.43± 0.1
2.0± 0.1
4.0± 0.05 40.0± 0.20 2.0± 0.05
Carrier
RTA02-2C 1.20± 0.1
1.20± 0.1
8.0± 0.2
1.75± 0.1
3.5± 0.05 0.45+0.2/-0 0.43± 0.1
2.0± 0.1
4.0± 0.05 40.0± 0.20 2.0± 0.05
RTA02-4D 2.20± 0.1
1.20± 0.1
8.0± 0.2
1.75± 0.1
3.5± 0.05 0.60+0.2/-0 0.60± 0.1
2.0± 0.1
4.0± 0.05 40.0± 0.20 2.0± 0.05
Tape
TP
RTA02-4C 2.20± 0.1
1.20± 0.1
8.0± 0.2
1.75± 0.1
3.5± 0.05 0.60+0.2/-0 0.60± 0.1
2.0± 0.1
4.0± 0.05 40.0± 0.20 2.0± 0.05
RTA03-2D 1.90± 0.1
1.90± 0.1
8.0± 0.2
1.75± 0.1
3.5± 0.05 0.60+0.2/-0 0.60± 0.1
4.0± 0.1
4.0± 0.05 40.0± 0.20 2.0± 0.05
8.0± 0.2
1.75± 0.1
3.5± 0.05 0.75+0.2/-0 0.75± 0.1
4.0± 0.1
4.0± 0.05 40.0± 0.20 2.0± 0.05
RTA03-4D 3.45± 0.1
1.90± 0.1
Carrier
RTA03-4C 3.45± 0.1
1.90± 0.1
8.0± 0.2
1.75± 0.1
3.5± 0.05 0.75+0.2/-0 0.75± 0.1
4.0± 0.1
4.0± 0.05 40.0± 0.20 2.0± 0.05
Tape
RTA02-8D 4.30± 0.2
1.90± 0.2
12.0± 0.2
1.75± 0.1
5.5± 0.05 0.60+0.2/-0 0.60± 0.1
4.0± 0.1
4.0± 0.05 40.0± 0.20 2.0± 0.05
RTA03-8C 6.90± 0.2
2.00± 0.2
12.0± 0.2
1.75± 0.1
5.5± 0.05 0.75+0.2/-0 0.75± 0.1
4.0± 0.1
4.0± 0.05 40.0± 0.20 2.0± 0.05
RTA03-2C 1.90± 0.1
1.90± 0.1
8.0± 0.2
1.75± 0.1
3.5± 0.05 0.75+0.2/-0 0.75± 0.1
4.0± 0.1
4.0± 0.05 40.0± 0.20 2.0± 0.05
10.2Lead Dimensions:
Carrier Tape
95~270mm
Chip Filled Area
≧160mm
Cover Tape
Unfilled Area
≧400mm
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Series No.
60
RALEC
Thick Film Chip Resistors Array
Product Specification
旺 詮
Document No.
IE-SP-011
Released Date
2011/02/20
18/21
Page No.
10.3Cover Tape Peel off Strength
Specifications:0.07~0.7N (7.1~71.4gf)
Top Cover Tape
Carrier Tape
Peeling Speed (300mm/min)
Peeling Angle
10°
Direction of unreeling
10.4Packaging Qty:
Packaging (pcs/reel)
Type
Tape
Width
RTA01-2D
8 mm
RTA02-2D、RTA02-2C
8 mm
RTA02-4C、RTA02-4D
8 mm
RTA03-2D、RTA03-2C
8 mm
RTA03-4C、RTA03-4D
8 mm
RTA02-8D、RTA03-8C
12 mm
TH
Reel Type
TH
TP
2 mm Pitch
4 mm Pitch
H2
H3
H4
10,000 20,000 30,000 40,000
TP
P2
P2
P4
--
--
--
--
--
--
--
--
5,000
7”
10”
13”
13”
7”
10,000 15,000 20,000
10”
13”
13”
10.4.1Typical taping type: TH、TP
10.4.2Other taping type are upon customer’ s request.
10.5Reel Dimensions:
Unit:mm
Remark
Reel Type / Tape
Wa
M
7” reel for 8 mm
tape
9.0
± 0.5
178
± 2.0
60.0
± 1.0
7” reel for 12 mm
tape
13.8
± 0.5
178
± 2.0
80.0
± 1.0
10” reel for 8 mm
tape
10.0
± 0.5
254
± 2.0
13” reel for 8 mm
tape
10.0
± 0.5
330
± 2.0
IT’ S NOT UNDER CONTROL FOR PDF FILE
A
B
C
2.0
13.5 21.0
± 0.5 ± 0.5 ± 0.5
100.0
± 1.0
100.0
± 1.0
Issue Dep. DATA Center.
PLS NOTE THE VERSION STATED.
Do not copy without permission
D
Series No.
60
RALEC
Thick Film Chip Resistors Array
Product Specification
旺 詮
Document No.
IE-SP-011
Released Date
2011/02/20
19/21
Page No.
10.6Label:
Computer No. Type Tolerance R Value Quantity
RTA03-4D 5%
10K Pb-free
508J103
5000 PCS
R09010001
RTA03-4D103JTP
001
RALEC
Lot No.
R
0
9
0
1
Running
Number
Part No.
0
0
Week
Logo
0
1
Running
Number
Year(2009)
RALEC
10.7Inner Box
Reel Number
D Dimension (mm)
1
12
2
24
3
36
4
48
5
60
6
72
7
84
8
96
9
108
10
120
D
180
180
10.8Box
10R Inner Box Number
2
Remark
L(mm) W(mm) D(mm)
272
205
210
4
375
280
210
8
544
380
210
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RAL
EC
Issue Dep. DATA Center.
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Series No.
60
RALEC
Thick Film Chip Resistors Array
Product Specification
旺 詮
Document No.
IE-SP-011
Released Date
2011/02/20
20/21
Page No.
10.9Box (For China)
10R Inner BoxNumber
2
L(m m ) W( mm) D( mm)
272
205
210
4
375
280
210
8
544
380
210
EC
RAL
11 Stock period
11.1The temperature condition must be controlled at 25 ± 5 ℃ , the R.H. must be
controlled at 60± 15%. The stock can maintain quality level in two years.
12 The carton packaged for electronic-information products is made by
the symbol as follows: (For china)
Marking for control of pollution cause
by electronic-information products
Remark
Marking for package recovery
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Series No.
60
RALEC
旺 詮
Thick Film Chip Resistors Array
Product Specification
Document No.
IE-SP-011
Released Date
2011/02/20
21/21
Page No.
13 For this part. It does not use the materials that include the
substances specified in RoHS，the detail refer to the part of
prohibition or exclusion items in RoHS (2002/95/EC).
1. Cadmium and cadmium compounds (permissive content＜100 ppm)
2. Lead and lead compounds (permissive content＜1000 ppm)
Exceptions specified:
(1). Lead contained in the glass of cathode ray tubes, electronic components
and fluorescent tubes.
(2). The glass material used in the electronic components, which includes
resistor elements, conductive pastes (silver or copper ones), adhesives,
glass frit and sealing materials.
3. Mercury and its mercury compounds (permissive content＜100 ppm)
4. Hexavalent chromium compounds (permissive content＜100 ppm)
5. Polybrominated biphenyls(PBB) (permissive content＜100 ppm)
6. Polybrominated diphenylethers(PBDE) (permissive content＜100 ppm)
14 Attachments
14.1Document Revise Record Paper
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Series No.
60
