SD18OB261-060

Confidential Degree : Confidential Specification of MEMS Microphone (RoHS Compliance & Halogen Free) Customer Name : Customer Model : GoerTek Model : GoerTek Jasen 2018.10.05 CHKD Samual 2018.10.05 Sweety 2018.10.05 Daniel 2018.10.05 APVD Version：1.0 CUSTOMER APPROVAL DESIGN STANDARD SD18OB261-060 Confidential in Goertek, shall not be spread if not be privileged. page 1/16 Confidential Degree : Confidential Restricted 1 Security Warning The information contained in this document is the exclusive property of GoerTek Inc. and should not be disclosed to any third party without the written consent of GoerTek Inc. 2 Publication History Version Description Date Author 1.0 New Design 2018.10.05 Jasen Confidential in Goertek, shall not be spread if not be privileged. Approved Daniel page 2/16 Confidential Degree : Confidential Contents 1 Introduction 2 Test Condition 3 Acoustical and Electrical Characteristics 4 4 4 3.1 Standard Performance Mode 4 3.2 Frequency Response Curve and Limits 4 3.3 Low Power Mode 5 3.4 General Microphone Specification 5 3.5 Micronphone Interface Specifications 6 4 Measurement Circuit 5 Test Setup Drawing 6 Mechanical Characteristics 6.1 Appearance Drawing 7 7 8 8 6.2 Weight 8 7 Reliability Test 9 7.1 Vibration Test 9 7.2 Drop Test 9 7.3 Temperature Test 9 7.4 Humidity Test 9 7.5 Mechanical Shock Test 9 7.6 Thermal Shock Test 9 7.7 Reflow Test 9 7.8 ESD Shock Test 9 8 Package 10 8.1 Tape Specification 10 8.2 Reel Dimension 11 8.3 The Content of Box 11 8.4 Packing Explain 12 9 Storage and Transportation 10 Land Pattern Recommendation 12 13 10.1 The Pattern of MIC Pad 13 10.2 Recommended Soldering Surface Land Pattern 13 11 Soldering Recommendation 14 11.1 Soldering Machine Condition 14 11.2 The Drawing and Dimension of Nozzle 14 11.3 Reflow Profile 15 11.4 Rework 16 12 Cautions When Using MEMS MIC 16 12.1 Board Wash Restrictions 16 12.2 Sound Hole Productions 16 12.3 Wire Width Adaption 16 12.4 Ultrasonic Restrictions 16 13 Output Inspection Standard 16 Confidential in Goertek, shall not be spread if not be privileged. page 3/16 Confidential Degree : Confidential 1 Introduction: MEMS MIC which is able to endure reflow temperature up to 260 ℃ for 50 seconds can be used in SMT process. It is widely used in telecommunication and electronics device such as mobile phone, MP3, PDAs etc. 2 Test Condition (L=50 cm) StandardConditions (As IEC 60268-4) Air pressure Humidity Temperature Environment Conditions +15℃～+35℃ 25％RH～75%RH 86kPa～106kPa Basic Test Conditions +20℃±2℃ 60％RH～70%RH 86kPa～106kPa 3 Acoustical and Electrical Characteristics 3.1 Standard Performance Mode (Test Condition: V DD=1.8V, fCLK=2.4MHz) Item Symbol Test Conditions Min Typ Max Unit f=1kHz, Pin=1Pa -27 -26 -25 dBFS (Note 1) Sensitivity S Current Consumption (Note 2) I fclk=2.4MHz - 390 500 μA S/N Ratio SNR f=1kHz, Pin=1Pa A-Weighted Curve - 65 - dB Distortion THD 94dB SPL@ 1kHz - - 1 % Acoustic Overload Point AOP 10% THD @1 kHz - 120 - dB SPL Power Supply Rejection PSR 100mVpp squarewave@217Hz - -88 - dBFS Power Supply Rejection Ratio PSRR - 60 - dBFS 100mVpp squarewave@217Hz 3.2 Frequency Response Curve and Limits Relative Response (dB) +15 +10 +5 +3 +3 +3 -3 -3 +3 0 +1 -5 -5 -3 -3 -10 -15 -20 100 200 300 500 1k 1.1k Frequency (Hz) Confidential in Goertek, shall not be spread if not be privileged. 3k 5k 8k page 4/16 Confidential Degree : Confidential 3.3 Low Power Mode (Test Condition: V DD=1.8V, fCLK=768kHz) Item Sensitivity Current Consumption (Note 2) Symbol S Test Conditions Min Typ Max Unit f=1kHz, Pin=1Pa -26.5 -25.5 -24.5 dBFS (Note 1) I fclk=768kHz - 250 350 μA S/N Ratio SNR f=1kHz, Pin=1Pa A-Weighted Curve - 62 - dB Distortion THD 94dB SPL@ 1kHz - - 1 % Acoustic Overload Point AOP 10% THD @1 kHz - 120 - dB SPL Power Supply Rejection PSR 100mVpp squarewave@217Hz - -88 - dBFS Power Supply Rejection Ratio PSRR - 60 - dBFS 100mVpp squarewave@217Hz 3.4 General Microphone Specifications Test Condition: VDD=1.8V,fCLK=2.4MHz, select pin grounded,no load. Typ Max Unit 1.60 - 3.6 V Sleep Mode 0 - 150 kHz Standard Mode 1.2 - 3.5 MHz - 10 - μA Supply Voltage Frequency Range Symbol Min Item Sleep Current Test Conditions VDD Isleep Omnidirectional Directivity Increasing Sound Polarity Increasing density of 1's Data Format PDM Short Circuit Current ISC Output Load Cload Ground Data Pin Fall-asleep Time Wake-up Time TW Start-up Time TS Mode-Change Time fCLK≥200kHz - - 20 mA - 140 - pF - - 10 ms - - 20 ms - - 50 ms - - 10 ms Confidential in Goertek, shall not be spread if not be privileged. page 5/16 Confidential Degree : Confidential 3.5 Microphone Interface Specifications Typ Max Unit 0.65 VDD - 3.6 V V IL -0.3 - 0.35 VDD V Logic Output High VOH VDD-0.45 - VDD V Logic Output Low VOL 0 - 0.45 V SELECT(high) VDD-0.45 - 3.6 V SELECT(low) -0.3 - 0.2 V fCLK ≤ 2.4MHz 40 - 60 % 2.4MHz < fCLK ≤ 3.5MHz 48 52 % 6 ns 50 ns 16 ns Item Symbol Logic Input High V IH Logic Input Low Clock Duty Cycle Clock Rise/Fall Time Dalay Time for Valid Data (Note 3) DalayTime for High Z Min Test Conditions tCF,tCR No load for min tDV tDV 50 - 18 Max CLOAD for max tDV tDH 5 - Note 1. dBFS = 20xlog (A/B) where A is the level of the signal, B is the level that corrsponds to Full-scale level. Note 2. The current consumption depends on the applied Clock Frequency and the load on the DATA output. Note 3. Timing tCF tCR CLOCK tDV DATA L/R=0 HIGH Z tDH DATA VALID tDH DATA L/R=1 tDV HIGH Z DATA VALID Confidential in Goertek, shall not be spread if not be privileged. page 6/16 Confidential Degree : Confidential 4 Measurement Circuit Term.5 VDD + Term.2 L/R Vreg Amp ΣΔ Modulator Term.1 DATA Select Term.4 CLK Charge Pump ASIC Term.3 GND MEMS MIC 5 Test Setup Drawing Power Amplifier Free-field 1/2" Microphone Audio Analyzer 50cm Speaker MIC Input Output Remote Control PDM Line Driver Turn Table Anechoic Room Confidential in Goertek, shall not be spread if not be privileged. page 7/16 Confidential Degree : Confidential 6 Mechanical Characteristics 6.1 Appearance Drawing (Unit: mm) W 0.95 4-0.725 H 0.125 0.125 4-0.522 5 L 1.513 GWWD YLLL 5 1 4 2 0.3 Ø1.025 3 Ø1.625 R0.25 Top View Pin# AP 1.325 Side View ITEM Function Bottom View DIMENSION TOLERANCE UNITS Length(L) 3.50 ±0.10 mm Width(W) 2.65 ±0.10 mm 1 Data 2 L/R Height(H) 0.98 ±0.10 mm 3 GND ACOUSTIC PORT(AP) Ø0.325 ±0.05 mm 4 CLK 5 VDD Note: 1. Tolerance ±0.10mm unless otherwise specified. 2. Identification Number Convention: Job Identification Number. Identification G W W D Number Y LLL G : GoerTek Y :Year WW L L L :Week D :Day : Lot Number 2D Code 6.2 Weight The weight of the MIC is Less than 0.05g. Confidential in Goertek, shall not be spread if not be privileged. page 8/16 Confidential Degree : Confidential 7 Reliability Test 7.1 Vibration Test 7.2 Drop Test To be no interference in operation after vibrations, 4 cycles, from 20 to 2000HZ in each direction (X,Y,Z), 48min, user acceleration of 20g, sensitivity should vary within ±3dB from initial sensitivity. (The measurement to be done after 2 hours of conditioning at +15 ℃～+35℃, R.H 25%～75%) To be no interference in operation after dropped to 1.0 cm steel plate 12 times from 1.5 meter height in state of JIG,JIG weight of 100 g, sensitivity should vary within ±3dB from initial sensitivity. (The measurement to be done after 2 hours of conditioning at +15 ℃～+35℃, R.H 25%～75%) a) After exposure at +125℃ for 200h, sensitivity should vary within ±3dB from initial sensitivity. 7.3 (The measurement to be done after 2h of conditioning at +15 ℃～+35℃, R.H 25%～75%) Temperature b) After exposure at -40℃ for 200h, sensitivity should vary within ±3dB from initial Test sensitivity. (The measurement to be done after 2 hours of conditioning at +15 ℃～+35℃, R.H 25%～75%) 7.4 Humidity Test After exposure at +85℃ and 85% relative humidity for 200 hours, sensitivity should vary within ±3dB from initial sensitivity. (The measurement to be done after 2 hours of conditioning at +15 ℃～+35℃, R.H 25%～75%) Then subject samples to three one-half sine shock pulses (3000 g for 0.3 milliseconds) in 7.5 each direction (for six axes in total) along each of the three mutually perpendicular axes for a Mechanical total of 18 shocks, sensitivity should vary within ±3dB from initial sensitivity. Shock Test (The measurement to be done after 2 hours of conditioning at +15 ℃～+35℃, R.H 25%～75%) 7.6 Thermal Shock Test 7.7 Reflow Test After exposure at -40℃ for 30min, at +125℃ for 30min (change time 20 seconds) 32 cycles, sensitivity should vary within ±3dB from initial sensitivity. (The measurement to be done after 2 hours of conditioning at +15℃～+35℃, R.H 25%～75%) Adopt the reflow curve of item 12.3, after three reflows, sensitivity should vary within ±3dB from initial sensitivity. (The measurement to be done after 2 hours of conditioning at +15 ℃～+35℃, R.H 25%～75%) Under C=150pF, R=330ohm. 7.8 Tested to ±8KV contact to the case and tested to ±2kV contact to I/O terminals.10 times. ESD Shock Grounding. Sensitivity should vary within ±3dB from initial sensitivity. Test (The measurement to be done after 2 hours of conditioning at +15℃～+35℃, R.H.25％～75%) Confidential in Goertek, shall not be spread if not be privileged. page 9/16 Confidential Degree : Confidential 8 Package 8.1 Tape Specification ØD0 P2 E P0 A B W F A B P1 Pin 1# (DATA) ØD1 B-B A-A T 10° 10° B0 A0 K0 The Dimensions as Follows: ITEM W E F ØD0 ØD1 DIM(mm) 12.0±0.30 1.75±0.10 5.5±0.05 1.50+0.10 0 0.50±0.10 ITEM P0 10P0 P1 DIM(mm) 4.00±0.10 40.00±0.20 8.00±0.10 ITEM K0 P2 T DIM(mm) 1.30±0.10 2.00±0.05 0.30±0.05 A0 3.75±0.05 Confidential in Goertek, shall not be spread if not be privileged. B0 2.85±0.05 page 10/16 Confidential Degree : Confidential 8.2 Reel Dimension 7'' reel for sample stage 13'' reel will be provided for the mass production stage The following is 13'' reel dimensions (unit:mm) 12.4±0.2 inner side A 1.9±0.4 Ø21±0.4 Ø13±0.2 Ø330(max) Ø100±0.5 DETAIL "A" 120° 8.3 The Content of Box(13'' reel) Packing (5,000PCS) Two Inner Box(50,000PCS) Inner Box(25,000PCS) (340mm 135mm 355mm) Outer Box(50,000PCS) (370mm 300mm 390mm) Confidential in Goertek, shall not be spread if not be privileged. page 11/16 Confidential Degree : Confidential 8.4 Packing Explain 8.4.1 The Label Content of the Reel The Content Includes: Product type, Lot, Customer P/N; and other essential information such as Quantity, Date etc. 8.4.2 The RoHS Label RoHS Compliance& Halogen Free Mark RoHS 9 Storage and Transportation 9.1 Keep MEMS MIC in warehouse with less than 75% humidity and without sudden temperature change, acid air, any other harmful air or strong magnetic field. Recommend storage period no more than 1 year and floor life(out of bag) at factory no more than 4 weeks. 9.2 The MEMS MIC with normal pack can be transported by ordinary conveyances. Please protect products against moist, shock, sunburn and pressure during transportation. 9.3 Storage Temperature Range ：-40℃～+70℃ 9.4 Operating Temperature Range ：-40℃～+100℃ Confidential in Goertek, shall not be spread if not be privileged. page 12/16 Confidential Degree : Confidential 10 Land Pattern Recommendation 10.1 The Pattern of MIC Pad(Unit:mm) 0.95 4-0.725 4-0.522 0.125 0.125 1.513 0.3 Ø1.025 Ø1.625 1.325 10.2 Recommended Soldering Surface Land Pattern ( Unit:mm) 4-0.725 0.95 1.513 4-0.522 0.3 Ø1.025 Ø1.625 Confidential in Goertek, shall not be spread if not be privileged. page 13/16 Confidential Degree : Confidential 11 Soldering Recommendation 11.1 Soldering Machine Condition Temperature Control 8 zones Heater Type Hot Air Solder Type Lead-free 11.2 The Drawing and Dimension of Nozzle Inside Diameter: 1.0mm; Please don't vacuum over the acoustic port directly. Please don't blow the acoustic port directly. Ø1.0 Confidential in Goertek, shall not be spread if not be privileged. page 14/16 Confidential Degree : Confidential 11.3 Reflow Profile Temp. °C Tp Max. Ramp-up rate = 3 ℃/s Max. Ramp-down rate = 6 ℃/s TL Tsmax Preheat area tp tL Tsmin ts 25 time 25℃ to peak Time. sec Key Features of The Profile: Average Ramp-up rate(T smax to Tp) 3℃/s max. Preheat : Temperature Min(Tsmin) Temperature Max(Tsmax) Time(Tsmin to Tsmax)(ts) 150℃ 200℃ 60~180s Time maintained above : Tempreature(TL) Time(tL) 217℃ 60~150s Peak Temperature(Tp) 260℃ Time within 5℃ of actual Peak Temperature(tp) : 30~40s Ramp-down rate(Tp to Tsmax) 6℃/s max Time 25℃ to Peak Temperature 8min max When MEMS MIC is soldered on PCB, the reflow profile is set according to solder paste and the thickness of PCB etc. Confidential in Goertek, shall not be spread if not be privileged. page 15/16 Confidential Degree : Confidential 11.4 Rework (1) 250℃～270℃, maximum 30 sec，Peak temperature 330℃. (2) Wind speed: 15L/m. (3) It is very important not to put a heatgun over the acoustic port of the microphone. 12 Cautions When Using MEMS MIC 12.1 Board Wash Restrictions It is very important not to wash this silicon microphone, otherwise this could damage the microphone. 12.2 Sound Hole Protection It is very important not to operate vacuum and air blow into sound hole(without any covering over sound holes), otherwise this could damage the microphone. And it is necessary to be careful about foreign substances into sound hole inside silicon microphone. 12.3 Wire width Adaption It is needed to adjust the dumping resistance according to the wire length and wire tod,etc. when using. It is also necessary to insert dumping resistance in the Data line located adjacent to the microphone according to circumstances. 12.4 Ultrasonic Restrictions It is very important not to use ultrasonic process. otherwise this could damage themicrophone. 13 Output Inspection Standard Output inspection standard is executed according to . Confidential in Goertek, shall not be spread if not be privileged. page 16/16