T0603HI4000TM

Revision of November 2018 TF-FUSE® Thin Film Surface Mount Fuses HI Series (High Inrush), 0603 Size Features: • • • • • Applications: • • • • • • Low DCR High inrush current withstanding capability Fiberglass enforced epoxy fuse body Copper termination with nickel and tin plating Halogen free, RoHS compliance and lead-free Shape and Dimensions: Consumer Electronics Notebook Computers and Tablets Telecom Devices Mobile Phone Battery Pack Digital Camera Unit Inch 0.063 ± 0.004 0.032 ± 0.004 0.014 ± 0.004 0.014 ± 0.004 mm 1.60 ± 0.10 0.81 ± 0.10 0.36 ± 0.10 0.36 ± 0.10 Nominal Cold DCR (Ω)1 Nominal I2t (A2s)2 Marking 0.1550 0.019 C 0.0830 0.036 D 0.0500 0.052 E Length (L) Width (W) Thickness (T) Termination bandwidth (b) Clearing Time Characteristics: % of Current Rating 100% 200% 1000% Opening Time at 25oC 4 hours min. 1 second min. 0.0002 second min. 60 seconds max. 0.02 second max. Agency Approval: Recognized Under the Components Program of UL. File Number: E232989. Typical Ratings and Characteristics: Operating temperature: -55 to +90°C Part Number Current Rating (A) Voltage Rating (VDC) T0603HI0500TM 0.50 65 T0603HI0750TM 0.75 65 T0603HI1000TM 1.00 65 T0603HI1500TM 1.50 65 0.0290 0.110 T T0603HI2000TM 2.00 35 0.0200 0.310 F T0603HI2500TM 2.50 35 0.0165 0.400 J 0.0140 0.600 L Interrupting Rating 50A@35V DC/AC 13A@65V DC 35A@35V DC/AC 50A@24V DC/AC T0603HI3000TM 3.00 35 T0603HI3500TM 3.50 35 0.0120 0.800 N T0603HI4000TM 4.00 35 0.0095 1.200 P 1 2 Measured at ≤ 10% of rated current and 25˚C ambient . Melting I2t at 0.001 sec. Website: www.aemchina.com & www.aemcomponents.com Revision of November 2018 TF-FUSE® Thin Film Surface Mount Fuses HI Series (High Inrush), 0603 Size 4.00 A 3.50 A 3.00 A 2.50 A 2.00 A 1.50 A 1.00 A 0.75 A 0.50 A Average Pre-arcing Time Curves: 100 10 Pre-arcing Time (Sec) 1 0.1 0.01 0.001 0.0001 0.1 1 Current (A) 10 Website: www.aemchina.com & www.aemcomponents.com 100 Revision of November 2018 TF-FUSE® Thin Film Surface Mount Fuses HI Series (High Inrush), 0603 Size Average I2t vs. t Curves: 1000 4.00 A 3.50 A 3.00 A 2.50 A 100 2.00 A 1.50 A 1.00 A 0.75 A 10 0.50 A I 2 t (A2S) 1 0.1 0.01 0.001 0.0001 0.0001 0.001 0.01 0.1 1 10 Time (Sec) Website: www.aemchina.com & www.aemcomponents.com 100 Revision of November 2018 TF-FUSE® Thin Film Surface Mount Fuses Product Identification: T 0603 FF 1000 T M (1) (2) (3) (4) (5) (6) (1) Product Code: T-Thin Film (2) Size Code: Standard EIA chip sizes (3) Series Code: FF—Very Fast Acting, HI—High Inrush (4) Current Rating Code: 0500—0.5A, 1000—1.0A (5) Package Code: T—Tape & Reel; B—Bulk Environmental Tests: No. Test item Requirement Test condition Reference 1 Bending ≤1A: 10% DCR change max. >1A: 20% DCR change max. 2mm Refer to AEM QIQ034 2 Solderability 95% coverage min. One dip at 255℃ for 5 seconds MIL-STD-202 Method 208 3 Thermal shock DCR change within ±10% No mechanical damage 100 cycles between -55°C and +125°C MIL-STD-202 Method 107 4 Moisture resistance DCR change within ±10% No excessive corrosion 10 cycles MIL-STD-202 Method 106 5 Salt spray DCR change within ≤ ±10% No excessive corrosion 5% salt solution, 48 hour exposure MIL-STD-202 Method 101 6 Mechanical vibration DCR change within ≤ ±10% No mechanical damage 0.4” D.A. or 30G between 5 and 3000 Hz MIL-STD-202 Method 204 7 Mechanical shock DCR change within ≤ ±10% No mechanical damage 1500G, 0.5 ms, half sine shocks MIL-STD-202 Method 213 8 Life Change of voltage drop within ±10%, no open circuit 75% rated current, 2000 hours, ambient temperature +20°C to 30°C Refer to AEM QIQ106 Packaging: Chip Size Parts on 7 inch (178mm) Reel 0603(1608) 8,000 0402(1005) 20,000 Website: www.aemchina.com & www.aemcomponents.com Revision of November 2018 TF-FUSE® Thin Film Surface Mount Fuses Temperature Effect on Current Rating: Recommended Reflow Soldering Profile: Pb-Free Assembly Profile Feature Preheat/Soak Temperature Min (Tsmin) Temperature Max(Tsmax) Time(ts) from (Tsmin to Tsmax) Liquidous temperature(TL) Time(tL) maintained above TL 150°C 200°C 60~120 seconds 3°C/second max. 217°C 60~150 seconds Peak package body temperature (Tp) 260°C Time (tp)*within 5°C of the specified classification temperature (Tc) 30 seconds * Ramp-uprate (TL to Tp) Ramp-down rate (Tp to TL) Time 25°C to peak temperature 6°C/second max. 8 minutes max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum Thermal Shock When Making Correction with a Soldering Iron: The temperature of solder iron tip should be controlled under 350°C and soldering time should be less than 3 sec. The soldering iron tip should not directly touch the top side termination of the component. Fig 3 Correct handling method of soldering iron Website: www.aemchina.com & www.aemcomponents.com Revision of November 2018 Disclaimer Specifications are subject to change without notice. AEM products are designed for specific applications and should not be used for any purpose (including, without limitation, automotive, aerospace, medical, life-saving applications, or any other application which requires especially high reliability for the prevention of such defect as may directly cause damage to the third party’s life, body or property) not expressly set forth in applicable AEM product documentation. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Warranties granted by AEM shall be deemed void for products used for any purpose not expressly set forth in applicable AEM product documentation. AEM shall not be liable for any claims or damages arising out of products used in applications not expressly intended by AEM as set forth in applicable AEM product documentation. The sale and use of AEM products is subject to AEM terms and conditions of sale. Please refer Website: www.aemchina.com & www.aemcomponents.com