UMW
R
UMW FDN340P
SOT-23 Plastic-Encapsulate MOSFETS
FDN340P
P-Channel 20-V(D-S) MOSFET
V(BR)DSS
RDS(on)MAX
ID
70mΩ@ -4.5V
-20 V
-2A
110mΩ@ -2.5V
210mΩ@ -1.8V
FEATURE
APPLICATION
※ Battery protection
※ Load switch
● TrenchFET Power MOSFET
● Supper high density cell design
※ Battery management
MARKING
Equivalent Circuit
SOT–23
1. GATE
2. SOURCE
3. DRAIN
Maximum ratings ( Ta=25℃ unless otherwise noted)
Parameter
Symbol
Value
Drain-Source Voltage
VDS
-20
Gate-Source Voltage
VGS
±8
ID
-2
Pulsed Diode Curren
IDM
-10
Power Dissipation
PD
1.1
W
RθJA
250
℃/W
TJ
150
℃
TSTG
-55~+150
℃
Continuous Drain Current
Thermal Resistance from Junction to Ambient (t≤10s)
Operating Junction
Storage Temperature
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1
Unit
V
A
友台半导体有限公司
UMW
R
UMW FDN340P
SOT-23 Plastic-Encapsulate MOSFETS
MOSFET ELECTRICAL CHARACTERISTICS
Static Electrical Characteristics (Ta = 25 ℃ Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Static
Drain-source breakdown voltage
V(BR)DSS VGS = 0V, ID = -250µA
VGS(th)
VDS =VGS, ID = -250µA
Gate-source leakage
IGSS
Zero gate voltage drain current
IDSS
Gate-source threshold voltage
Drain-source on-state resistancea
RDS(on)
-20
V
-0.4
-1.5
V
VDS =0V, VGS = ±8V
±100
nA
VDS = -16V, VGS =0V
-1
µA
VGS = -4.5V, ID = -2A
52
70
mΩ
VGS = -2.5V, ID = -1.7A
78
110
mΩ
210
mΩ
VGS = -1.8V, ID = -1.2A
Forward transconductancea
Diode forward voltage
gfs
VDS = -4.5V, ID = -2A
8
VSD
IS= -1A,VGS=0V
-0.8
S
-1.2
V
Dynamic
Input capacitance
Ciss
Output capacitance
Coss
Reverse transfer capacitanceb
Crss
Total gate charge
Qg
Gate-source charge
Qgs
Gate-drain charge
Qgd
Gate resistance
VDS = -10V,VGS =0V,
f=1MHz
VDS = -10V,VGS = -4.5V,
ID = -2A
Rg
f=1MHz
600
pF
175
pF
80
pF
8
nC
1.3
nC
2.2
nC
0.5
3.2
Ω
Switchingbtr
Turn-on delay time
Rise time
Turn-off delay time
Fall time
td(on)
tr
td(off)
VDS= -10V
RL=3.5Ω, ID ≈ -1A,
VGEN= -4.5V,Rg=3Ω
tf
6
ns
9
ns
31
ns
26
ns
Drain-source body diode characteristicstr
Continuous Source-Drain Diode Current
Pulsed Diode forward Curren
IS
Tc=25℃
ISM
-1.2
A
-10
A
Note :
1. Repetitive Rating : Pulse width limited by maximum junction temperature.
2. Surface Mounted on FR4 Board, t < 10 sec.
3. Pulse Test : Pulse Width≤300µs, Duty Cycle ≤ 2%.
4. Guaranteed by design, not subject to production testing.
www.umw-ic.com
2
友台半导体有限公司
UMW
R
www.umw-ic.com
UMW FDN340P
SOT-23 Plastic-Encapsulate MOSFETS
3
友台半导体有限公司
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