HPC3015TF-1R5Y

P1 TAI-TECH HPC3015TF-SERIES Power Inductor ECN HISTORY LIST REV DATE 1.0 14/04/14 DESCRIPTION 新 發 行 備 註 www.tai-tech.com.tw APPROVED CHECKED DRAWN 楊祥忠 詹偉特 羅文鍵 P2 TAI-TECH HPC3015TF-SERIES Power Inductor 1. Features 1. This specification applies Low Profile Power Inductors. 2. 100% Lead(Pb) & Halogen-Free and RoHS compliant. 2. Dimension Series A(mm) B(mm) C(mm) D(mm) E(mm) HPC3015TF 3.0±0.2 3.0±0.2 1.5 max. 1.0 ref. 1.0 ref. Halogen Pb Halogen-free Pb-free Units: mm 3. Part Numbering 4. HPC 3015 TF A B C - 2R2 M D E A: Series B: Dimension C: Lead Free D: Inductance 2R2=2.2uH E: Inductance Tolerance M=±20%; Y=±30% TAI-TECH Inductance Tolerance Test Frequency Specification Part Number (uH) (%) (Hz) SRF (MHz) min. DCR (Ω) ±20% I sat (A)typ I rms (A)typ HPC3015TF-1R0Y 1.0 ±30% 1V100K 100 0.030 2.20 2.20 HPC3015 TF -1R5Y 1.5 ±30% 1V100K 87 0.040 2.00 2.00 HPC3015 TF -2R2M 2.2 ±20% 1V100K 64 0.060 1.70 1.70 HPC3015 TF -3R3M 3.3 ±20% 1V100K 49 0.080 1.40 1.40 HPC3015 TF -4R7M 4.7 ±20% 1V100K 40 0.120 1.20 1.20 HPC3015 TF -6R8M 6.8 ±20% 1V100K 36 0.160 1.00 1.00 HPC3015 TF -100M 10 ±20% 1V100K 28 0.220 0.75 0.80 HPC3015 TF -150M 15 ±20% 1V100K 23 0.320 0.65 0.70 HPC3015 TF -220M 22 ±20% 1V100K 20 0.460 0.55 0.60 HPC3015 TF -330M 33 ±20% 1V100K 18 0.800 0.40 0.45 HPC3015 TF -470M 47 ±20% 1V100K 17 1.200 0.35 0.40 Note: Isat：Based on inductance change （△L/L0：≦-30%）@ ambient temp. 25℃ Irms：Based on temperature rise （△T：40℃ ） www.tai-tech.com.tw P3 TAI-TECH HPC3015TF-1R0 2 HPC3015TF-1R5 2.5 2 Inductance(uH) Inductance(uH) 1.5 1 1.5 1 0.5 0.5 0 0 0.5 1 1.5 2 0 2.5 0 DCcurrent(A) 0.5 1.5 2 HPC3015TF-3R3 4 6 3 4.5 Inductance(uH) Inductance(uH) HPC3015TF-2R2 2 1 3 1.5 0 0 0 0.5 1 1.5 2 0 0.3 DCcurrent(A) 0.6 0.9 1.2 1.5 DCcurrent(A) HPC3015TF-4R7 HPC3015TF-6R8 8 12 6 9 Inductance(uH) Inductance(uH) 1 DCcurrent(A) 4 2 6 3 0 0 0.3 0.6 0.9 1.2 0 1.5 0 DCcurrent(A) 0.2 0.4 0.6 0.8 1 0.8 1 DCcurrent(A) HPC3015TF-100 HPC3015TF-150 20 25 20 Inductance(uH) Inductance(uH) 15 10 15 10 5 5 0 0 0 0.2 0.4 0.6 DCcurrent(A) 0.8 1 0 www.tai-tech.com.tw 0.2 0.4 0.6 DCcurrent(A) P4 TAI-TECH HPC3015TF-220 40 45 Inductance(uH) 30 Inductance(uH) HPC3015TF-330 60 20 10 30 15 0 0 0 0.15 0.3 0.45 0.6 0 DCcurrent(A) HPC3015TF-470 Inductance(uH) 60 40 20 0 0.1 0.2 0.3 0.2 0.3 DCcurrent(A) 80 0 0.1 0.4 0.5 DCcurrent(A) www.tai-tech.com.tw 0.4 0.5 P5 TAI-TECH Void appearance tolerance Limit Exposed wire tolerance Size of voids occurring to coating resin is specified below. limit of coating resin part on product side. Size of exposed wire occurring to coating resin is specified below. 1. Width direction（dimension a）：Acceptable when a≦w/2 Nonconforming when a＞w/2 ：Dimension b is not specified. 2. Length direction（dimension b） 3. The total area of exposed wire occurring to each sides is not greater than 50% of coating resin area, and is acceptable. External appearance criterion for exposed wire Exposed end of the winding wire at the secondary side should be 2mm and below. 6. Material No. Description Specification a. Core Ferrite Core b. Coating Epoxy c Termination Tin (Pb Free) d Wire Enameled Copper Wire www.tai-tech.com.tw P6 TAI-TECH 7. Reliability and Test Condition Item Operating Temperature Performance Test Condition -55~+125℃(For products in unopened tape package, less than 40℃) Electrical Performance Test Inductance L Agilent-4291, Agilent-4287 Refer to standard electrical characteristic list SRF Agilent-4291 Agilent-E4991 Agilent-4291, DC Resistance Rated Current Base on temp. rise & △L/L0A≦30%. Saturation DC Current (Isat) will cause L0 to drop approximately △L(%). Temperature Rise Test ΔT 40℃Max Heat Rated Current (Irms) will cause the coil temperature rise approximately △T(℃) without core loss. 1.Applied the allowed DC current. 2.Temperature measured by digital surface thermometer Mechanical Performance Test Appearance：No damage. Inductance：within±10% of initial value Solder Heat Resistance RDC：within ±15% of initial value and shall not exceed the specification value Temperature (°C) Time (s) Temperature ramp/immersion and emersion rate 260 ±5 (solder temp) 10 ±1 25mm/s±6 mm/s Number of heat cycles 1 Depth: completely cover the termination Solderability Test More than 95% of terminal electrode should be covered with solder. Preheat: 150℃,60sec.。 Solder: Sn99.5%-Cu0. 5%。 Temperature: 245±5℃。 Flux for lead free: Rosin. 9.5%。 Dip time: 4±1sec。 Depth: completely cover the termination Reliability Test Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Temperature：125±2℃(Bead) Life Test Temperature： 85±2℃(Inductor) Applied current：rated current Duration：1000±12hrs Measured at room temperature after placing for 24±2 hrs Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Thermal shock Appearance：No damage. Step1：-40±2℃ 30±5min Inductance：within±10% of initial value Step2：25±2℃ ≦0.5min RDC：within ±15% of initial value and shall not exceed the specification value Step3：105±2℃ 30±5min Number of cycles： 500 Measured at room fempraturc after placing for 24±2 hrs Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Humidity：85±2﹪R.H, Humidity Resistance Test Temperature：85℃±2℃ Duration：1000hrs Min. with 100% rated current Measured at room temperature after placing for 24±2 www.tai-tech.com.tw hrs P7 TAI-TECH Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Oscillation Frequency: 10～2K～10Hz for 20 minutes Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 Vibration Test 8. Soldering and Mounting 8-1. Soldering Mildly activated rosin fluxes are preferred. TAI-TECH terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 8-1.1 Solder re-flow: Recommended temperature profiles for re-flow soldering in Figure 1. 8-1.2 Soldering Iron(Figure 2): Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150℃ ‧355℃ tip temperature (max) ‧Never contact the ceramic with the iron tip ‧1.0mm tip diameter (max) Iron Soldering Reflow Soldering PRE-HEATING SOLDERING 20~40s PRE-HEATING NATURAL COOLING TEMPERATURE(C) 217 60~150s 200 150 SOLDERING within 4~5s TP(260 C / 40s max.) TEMPERATURE(C) ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧Limit soldering time to 4~5 sec. 60~180s NATURAL COOLING 350 150 Gradual cooling Over 60s 480s max. 25 TIME(sec.) TIME( sec.) Reflow times: 3 times max. Iron Soldering times: 1 times max. Fig.1 Fig.2 8-2. Recommended PC Board Pattern L G(mm) H(mm) 3.2 1.0 3.2 H L(mm) G www.tai-tech.com.tw P8 TAI-TECH 9. Packaging Information 9-1. Reel Dimension C B D A Type A(mm) B(mm) C(mm) D(mm) 7”x8mm 8.4±1.0 50 min. 13±0.8 178±2 7"x8mm 9-2. Tape Dimension / 8mm t P Ao Bo Po:4∮0.1 W:8.0∮ 0.1 P2:2∮0.05 Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) HPC 3015 3.2±0.05 3.2±0.05 1.70±0.2 4.0±0.05 0.23±0.05 Ko 9-3. Packaging Quantity Chip size 3015 Chip / Reel 2000 9-4. Tearing Off Force F Top cover tape The force for tearing off cover tape is 15 to 80 grams in the arrow direction under the following conditions. 165to180 Base tape Room Temp. Room Humidity Room atm Tearing Speed (℃) (%) (hPa) mm/min 5~35 45~85 860~1060 300 Application Notice ‧Storage Conditions To maintain the solderability of terminal electrodes: 1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40℃ and 60% RH. 3. Recommended products should be used within 12 months form the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. ‧Transportation 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. www.tai-tech.com.tw t(mm) P9 TAI-TECH www.tai-tech.com.tw