MT5811
Highly Integrated, High Performance
Wireless Power Transmitter
Maximizing IC Performance
1 KEY FEATURES
Wide input voltage range from 3.5V to 12V
Less than 15W of power transfer
Compliant with latest WPC Qi specification
power sleeping mode
Embedded 32-bit ARM M0® processor with
QC2.0/QC3.0, FCP/SCP support
Integrated three pairs of N-MOSFET drivers
Supports 8~24MHz XTAL
Integrated 440~660MHz programmable PLL
for high performance PWM generation
(support for single coil applications only)
Integrated high voltage Buck converter to
Build-in 10bit ADC for voltage, current and
temperature measurement
reduce transmitter’s power consumption in
Integrated 60MHz programmable oscillator
for system and PWM generation
16KB eFlash and 4 KB SRAM
Integrated Watchdog for sleeping power
monitor and wake-up
v1.2.4 with proprietary protocol support
Integrated 32KHz oscillator for ultra-low
high voltage input cases
Build-in 10bit DAC with output buffer
Integrated 3.3V LDO for internal and I/O
Low operating current and extremely low
standby current in deep sleeping mode
power supplies
Integrated 1.5V LDO for core power supply
Supports SWD debug mode
Precise low-side current sensing function for
Supports I2C, UART and SPI Interface with
plenty of GPIO’s
FOD and current mode demodulation
4 channels demodulation AFE for voltage
Dual VDD_IO pins for flexible I/O levels
and current mode demodulation
Over-voltage/current/temperature protection
16 channels dedicated DSP for robust ASK
Input under voltage detection and lockout
demodulation
function
Dedicate FSK modulation hardware with
Available in 6mm x 6mm QFN48 package
programmable modulation depth
2
high
performance
PWM
generation
modules with 6 channels PWM output for
each module, both with programmable dead
time control
2 APPLICATIONS
WPC compliant wireless power transmitters
for smart phones and wearable devices
Other wireless power applications
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Copyright © 2019 Maxic Technology Corporation
Rev 1.0
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MT5811
Maximizing IC Performance
Highly Integrated, High Performance
Wireless Power Transmitter
3 DESCRIPTION
The MT5811 is a highly integrated, high performance System on Chip (SoC) for magnetic induction
based wireless power transmitter solutions. It is fully compliant with the latest Wireless Power
Consortium (WPC) Qi v1.2.4 specification, with both Baseline Power Profile (BPP) and Extended Power
Profile (EPP) support. The integrated large size e-FLASH enables flexible customer function support.
The MT5811 integrates high voltage Buck, two LDO’s, three pairs of N-MOSFET’s drivers, four channels
of ASK demodulation Analog Front End (AFE), 16 channels of ASK demodulation DSP. The embedded
precise low-side current sensing, generic 10 bit ADC and DAC enable high performance FOD and Q
factor detection.
It supports over voltage, over current, under voltage protection and over temperature protection (OVP,
OCP, UVP, OTP) for safe operation.
The MT5811 integrates separated high frequency and low frequency oscillators for low power and low
cost application. The internal high frequency PLL with support of external crystal is designed for high
accuracy clock and PWM signal generation. The high flexible I/O configuration enables multi-coil
application with optimized standalone MOSFET driver (MT5603). The MT5811 is able to provide flexible
dead time control and phase shift generation to improve EMI performance.
The MT5811 supports multi-protocol power adaptor interface detection and control with support of QC
2.0/3.0, SCP, FCP, etc.
The MT5811 integrates an ARM Cortex M0 processor with 16KB eFlash memory and various serial
interfaces (I2C, UART, GPIO’s, etc.), offering powerful processing capabilities and code space. The
reference application is available with standard firmware. With the support of library (released
separately), customers can easily develop the customized features.
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MT5811
Highly Integrated, High Performance
Wireless Power Transmitter
Maximizing IC Performance
4 TYPICAL APPLICATION CIRCUIT
Single Coil Application
VIN+
VIN-
SW_B
ISH
ISL
VIN
Optional
VIN_SNS
BST1
VDD5V
DRV1H
SW1
VIN5V
DRV1L
LDO1P5
BST2
LDO3P3
DRV2H
MT5811
SW2
DRV2L
GND
BST3
GPIO
DRV3H
SW3
GND
Functional Modules
(including Indicator LED,
Buzzer, Sensing,
Protections, etc.)
Coil
GND
Fast Charging Adapter
Interface (including
QC2.0/3.0, FCP, SCP,
etc.)
DRV3L
GPIO
XIN
XOUT
ISNS_O
DEMOD1
DEMOD0
Optional
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MT5811
Highly Integrated, High Performance
Wireless Power Transmitter
Maximizing IC Performance
5 PIN CONFIGURATIONS AND FUNCTION
5.1 Pin Configurations
ISH
ISL
ISNS_O
DEMOD1
DEMOD0
NC2
LDO3P3
VDD5V
VIN_SNS
NC1
VIN
SW_B
48
47
46
45
44
43
42
41
40
39
38
37
Top View
VIN5V
1
36
GND
NC0
2
35
BST1
GPIOA1
3
34
DRV1H
GPIOA3
4
33
SW1
GPIOA4
5
32
DRV1L
GPIOA6
6
MT5811
31
BST3
LDO1P5
7
YYWWXX
XXXX
30
DRV3H
GND
8
29
SW3
XIN
9
28
DRV3L
XOUT
10
27
BST2
GPIOA7
11
26
DRV2H
VDDIOA
12
25
SW2
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GND
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MT5811
Highly Integrated, High Performance
Wireless Power Transmitter
Maximizing IC Performance
5.2 Pin Functions
Pin Name
Pin No.
Type
Description
VIN5V
1
PWR
+5V input voltage pin, connect 4.7uF capacitor.
VDD5V
41
PWR
BUCK converter’s output, 100mA souring capability, connect 10uF and 0.1uF
capacitor to GND.
LDO1P5
7
PWR
VDDIOA
12
PWR
Internal 1.5V LDO’s output, connect 1uF capacitor to GND.
Power supply for GPIO group A, connect 1.8V/3.3V/5V power, and connect
1uF capacitor to GND.
Power supply for GPIO group B, connect 1.8V/3.3V/5V power, and connect
VDDIOB
13
PWR
1uF capacitor to GND.
VIN
38
PWR
Power Supply Input.
LDO3P3
42
PWR
Internal 3.3V LDO’s output, connect 1uF capacitor to GND.
GPIOA1
3
I/O
Can be configured as GPIO/SWCK/SDA/TXD/DM/FCP/DAC/ADC2
GPIOA3
4
I/O
Can be configured as GPIO/SWDIO/SCL/TRXD/DP/DAC/ADC4
GPIOA4
5
I/O
Can be configured as GPIO/SCL2/TRXD2/ADC5
GPIOA6
6
I/O
Can be configured as GPIO/SDA2/TXD2/ADC7
GPIOA7
11
I/O
Can be configured as GPIO/SDA2/TXD2/ADC9
GPIOB0
14
I/O
Can be configured as GPIO/SCL3/TRXD3/PWM/ADC12
GPIOB1
15
I/O
Can be configured as GPIO/SDA3/TXD3/PWM/ADC13
GPIOB2
16
I/O
Can be configured as GPIO/SCS/PWM/ADC14
GPIOB3
17
I/O
Can be configured as GPIO/MOSI/SCL3/ADC15
GPIOB4
18
I/O
Can be configured as GPIO/SCP/PWM/ADC16
GPIOB5
19
I/O
Can be configured as GPIO/MISO/SDA3/ADC17
GPIOB8
20
I/O
Can be configured as GPIO/PWM
GPIOB6
21
I/O
Can be configured as GPIO/LED/SCS/PWM
GPIOB7
22
I/O
Can be configured as GPIO/LED/SCP/PWM
GPIOC0
23
I/O
GPIO
XIN
9
I/O
Clock input pin, can be configured as external XTAL OSC(8~24MHz) /GPIO
XOUT
10
I/O
Clock output pin, can be configured as external XTAL OSC(8~24MHz) /GPIO
DRV2L
24
PWM
Output-Drive pin for low side power MOSFET in the 2nd switch pair.
SW2
25
PWM
Switching node in the 2nd switch pair.
DRV2H
26
PWM
Output-Drive pin for high side power MOSFET in the 2nd switch pair.
BST2
27
ANA
Bootstrap cap in the 2nd switch pair, connect 10nF capacitor to SW2.
DRV3L
28
PWM
Output-Drive pin for low side power MOSFET in the 3rd switch pair.
SW3
29
PWM
Switching node in the 3rd switch pair.
DRV3H
30
PWM
Output-Drive pin for high side power MOSFET in the 3rd switch pair.
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MT5811
Highly Integrated, High Performance
Wireless Power Transmitter
Maximizing IC Performance
Pin Name
Pin No.
Type
BST3
31
ANA
Bootstrap cap in the 3rd switch pair, connect 10nF capacitor to SW3.
DRV1L
32
PWM
Output-Drive pin for low side power MOSFET in the 1st switch pair.
SW1
33
PWM
Switching node in the 1st switch pair.
DRV1H
34
PWM
Output-Drive pin for high side power MOSFET in the 1st switch pair.
BST1
35
ANA
Bootstrap cap in the 1st switch pair, connect 10nF capacitor to SW1.
SW_B
37
ANA
Switching node of internal BUCK converter.
VIN_SNS
40
ANA
Input Voltage Sense.
DEMOD0
44
ANA
Demodulation channel 0 input pin.
DEMOD1
45
ANA
Demodulation channel 1 input pin.
ISNS_O
46
ANA
Input current sense voltage output.
ISL
47
ANA
Negative input of current sense
ISH
48
ANA
Positive input of current sense
NC0
2
NC
No connection. Must keep floating.
NC1
39
NC
No connection. Must keep floating.
NC2
43
NC
No connection. Must keep floating.
GND
8, 36, GND
GND
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Description
Power Ground.
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MT5811
Highly Integrated, High Performance
Wireless Power Transmitter
Maximizing IC Performance
5.3 I/O Pin Configuration
Pin Name
Bit[3:0] VALUE
0~3
4
5
GPIOA1
GPIO
swclk
GPIOA2
GPIO
GPIOA3
GPIO
swdio
GPIOA4
GPIO
i2c_scl
uart_trxd
GPIOA5
GPIO
GPIOA6
GPIO
i2c_sda
uart_txd
GPIOA7
GPIO
i2c_sda
uart_txd
GPIOA8
GPIO
i2c_scl
uart_trxd
GPIOA9
GPIO
GPIOA10
GPIO
6
7
I2C
GPIOA4
GPIOA6
GPIOA7
GPIOA8
scl_o
output from I2C0
scl_i
input to I2C0
sda_o
output from I2C0
sda_i
input to I2C0
sda_o
output from I2C0
sda_i
input to I2C0
scl_o
output from I2C0
scl_i
input to I2C0
(address = 0x4000_2030 bit[1:0] = 2’b00, default)
uart_txd
output from UART0
(address = 0x4000_2030 bit[3:2] = 2’b00, default)
(address = 0x4000_2030 bit[1:0] = 2’b00, default)
(address = 0x4000_2030 bit[1:0] = 2’b00, default)
(address = 0x4000_2030 bit[1:0] = 2’b00, default)
UART
GPIOA4
//need set(address = 0x4000_1800 bit[5] //= 1’b1)
GPIOA6
uart_rxd
input to UART0
uart_txd
output from UART0
(address = 0x4000_2030 bit[3:2] = 2’b00, default)
//need set(address = 0x4000_1800 bit[5] //= 1’b0) default
GPIOA7
uart_txd
output from UART0
(address = 0x4000_2030 bit[3:2] = 2’b00, default)
//need set(address = 0x4000_1800 bit[5]
//= 1’b0)
default
GPIOA8
uart_txd
output from UART0
(address = 0x4000_2030 bit[3:2] = 2’b00, default)
//need set(address = 0x4000_1800 bit[5]
uart_rxd
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//= 1’b1)
input to UART0
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MT5811
Highly Integrated, High Performance
Wireless Power Transmitter
Maximizing IC Performance
Pin Name
Bit[3:0] VALUE
0~3
4
5
8
9
A
B
GPIOB0
GPIO
GPIO
i2c_scl
uart_trxd
PWM1_1P
PWM1_1N
ATIM1_P
GPIOB1
GPIO
GPIO
i2c_sda
uart_txd
PWM1_1P
PWM1_1N
ATIM1_P
GPIOB2
GPIO
GPIO
spi_cs
LED1
PWM1_3P
PWM1_3N
ATIM3_P
GPIOB3
GPIO
GPIO
spi_sda
i2c_scl
PWM1_2P
PWM1_2N
ATIM2_P
GPIOB4
GPIO
GPIO
spi_sck
LED2
PWM1_3P
PWM1_3N
ATIM3_P
GPIOB5
GPIO
GPIO
spi_sda
i2c_sda
PWM1_2P
PWM1_2N
ATIM2_P
GPIOB6
GPIO
GPIO
spi_cs
LED1
PWM1_2P
PWM1_2N
ATIM2_P
GPIOB7
GPIO
GPIO
spi_sck
LED2
PWM1_2P
PWM1_2N
ATIM2_P
GPIOB8
GPIO
GPIO
PWM1_3P
PWM1_3N
ATIM3_P
GPIOB9
GPIO
GPIO
PWM1_2P
PWM1_2N
ATIM2_P
I2C
GPIOB0
GPIOB1
GPIOB3
GPIOB5
scl_o
output from I2C1
scl_i
input to I2C1
sda_o
output from I2C1
sda_i
input to I2C1
scl_o
output from I2C1
scl_i
input to I2C1
sda_o
output from I2C1
sda_i
input to I2C1
uart_txd
output from UART1
uart_rxd
input to UART1
(address = 0x4000_2030 bit[1:0] = 2’b01)
(address = 0x4000_2030 bit[1:0] = 2’b01)
(address = 0x4000_2030 bit[1:0] = 2’b01)
(address = 0x4000_2030 bit[1:0] = 2’b01)
UART
GPIOB0
(address = 0x4000_2030 bit[3:2] = 2’b01)
//need set
address = 0x4000_1A00 bit[2] = 1
GPIOB1
uart_txd
output from UART1
(address = 0x4000_2030 bit[3:2] = 2’b01)
//need set
address = 0x4000_1A00 bit[2] = 0 default
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MT5811
Highly Integrated, High Performance
Wireless Power Transmitter
Maximizing IC Performance
Pin
Bit[3:0] VALUE
Name
0~3
4
5
6
7
PWM1_3P
PWM2_3P
ATIM3_P
8
9
A
B
C
D
GPIOC0
GPIO
GPIOC1
GPIO
PWM1_1P
PWM1_1N
PWM2_1P
PWM2_1N
ATIM1_P
ATIM1_N
GPIOC2
GPIO
PWM1_1P
PWM1_1N
PWM1_2P
PWM1_2N
PWM2_1P
PWM2_1N
GPIOC3
GPIO
PWM2_2N
PWM1_2N
PWM1_1P
PWM1_1N
PWM1_2P
PWM1_2N
PWM2_1P
PWM2_1N
ATIM1_P
ATIM1_N
GPIOC4
GPIO
PWM1_2P
PWM1_2N
PWM1_3P
PWM1_3N
PWM2_2P
PWM2_2N
PWM2_3N
PWM_2_3P
ATIM2_N
ATIM2_P
GPIOC5
GPIO
PWM1_2P
PWM1_2N
PWM1_3P
PWM1_3N
PWM2_2P
PWM2_2N
ATIM2_P
ATIM2_N
GPIOC6
GPIO
PWM1_2P
PWM1_2N
PWM1_3P
PWM1_3N
PWM2_2P
PWM2_2N
ATIM2_P
ATIM2_N
GPIOC7
GPIO
PWM1_1P
PWM1_1N
PWM1_3P
PWM1_3N
PWM2_1P
PWM2_1N
ATIM3_P
ATIM3_N
GPIOC8
GPIO
PWM1_1P
PWM1_1N
PWM1_3P
PWM1_3N
PWM2_3P
PWM2_3N
ATIM3_P
ATIM3_N
GPIOC9
GPIO
PWM1_1P
PWM1_1N
PWM1_3P
PWM1_3N
PWM2_1P
PWM2_1N
ATIM3_P
ATIM3_N
GPIOC10
GPIO
PWM1_3P
PWM1_3N
PWM2_1P
PWM2_1N
PWM2_3P
PWM2_3N
ATIM2_P
ATIM2_N
GPIOC11
GPIO
PWM1_2P
PWM1_2N
PWM1_3P
PWM1_3N
PWM2_2P
PWM2_2N
ATIM2_P
ATIM2_N
PWM1_1P
PWM1_1N
Bit[3:0] VALUE
Pin Name
GPIO
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0
1
2
3
Hiz
input
output
inout
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MT5811
Highly Integrated, High Performance
Wireless Power Transmitter
Maximizing IC Performance
6 SPECIFICATIONS
6.1 Absolute Maximum Ratings
VIN_SNS, VIN
30V
SW_B, SW1, SW2, SW3
24V
BST1, DRV1H
SW1+6V
BST2, DRV2H
SW2+6V
BST3, DRV3H
SW3+6V
VDD5V, VIN5V, VDDIOA, VDDIOB, GPIO_groupA, GPIO_groupB,
GPIOC0, XIN, XOUT, DRV1L, DRV2L, DRV3L, DEMOD0,
6V
DEMOD1, ISNS_O
LDO3P3
3.9V
LDO1P5
1.8V
ISL, ISH, GND
±0.3V
Storage Temperature
-55°C to 150°C
Operating Junction Temperature Range, TJ
-40°C to 125°C
Maximum Soldering Temperature (Reflow, Pb-Free, soldering, 10s)
260°C
6.2 ESD Ratings
Test Model
Pins
Ratings
HBM
All pins
±1500V
CDM
All pins
±500V
6.3 Recommended Operating Conditions
Operating Voltage (Vin)
3.5V ~ 12V
Operating Current (Iin)
0 ~ 2A
Operating Temperature (Environment)
-40°C ~ 85°C
6.4 Thermal Information (Package Thermal Data)
Junction to ambient (RθJA)
36°C/W
Notes:
(1) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. These are stress ratings only and functional operation of the device at these or any other conditions
beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to absolute–
maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) ESD testing is performed according to the respective JESD22 JEDEC standard. 6.1 Absolute Maximum
Ratings.
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MT5811
Highly Integrated, High Performance
Wireless Power Transmitter
Maximizing IC Performance
6.5 Electrical Characteristics
(Test conditions: VIN=5.5V, TA=25°C unless otherwise stated.)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Power Supply
Vin
UVLO
UVLO_HYS
Input operating voltage
range
Under voltage lockout
Ramp from 0~5V.
Under Voltage Lockout
Hysteresis
Idc
DC operation input current
Iq
Quiescent input current
Isleep
Sleep mode input current
3.5~12
V
2.5
V
0.3
V
TBD
mA
1
mA
TBD
uA
LDO
LDO3P3_Vout
Output voltage
LDO3P3_Iout
Load current
LDO1P5
1.5V LDO Regulator
Cout=1uF; VIN=5V
Cout=1uF; VIN=5V
3.0
3.3
3.6
50
V
mA
1.35
1.5
1.65
V
4.5
5
5.5
V
BUCK Converter
Vout
Output voltage
Iout
Load current
Cout=10uF; L=4.7uH
100
mA
Current Sense Programming Ability
Vsns_offset
Gain
Current sense output offset
ISL=ISH,
1.6/1.2/
programming step
Measure ISNS_O PIN
0.9/0.6
Current sense gain
20/30/40/
programming step
50
V
DEMOD
Demodulation input
Vdem_cm
common mode voltage
programming step
Programmable.
Default=0.6V
0.6/0.9
/1.2
V
ADC
Vin_adc
ADC input range
0~2.4
V
N_adc
Number of bits of ADC
10
bit
N_ch
Number of input channels
16
N
DNL
Differential Nonlinearity
±1
LSB
S_adc
ADC sampling rate
100
KSPS
Vdac
DAC output range
0~2.4
V
N_dac
Number of bits of DAC
10
bit
S_dac
DAC code update speed
2
M
Low speed oscillator
32
KHz
DAC
CLOCK
F_osc32k
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MT5811
Highly Integrated, High Performance
Wireless Power Transmitter
Maximizing IC Performance
Symbol
Parameter
F_osc60M
60M oscillator
Conditions
Min
Typ
Max
Unit
60
MHz
50
ns
50
ns
MOSFET Drivers
Tl_on_off
Th_on_off
Low-side Gate Driver Rise
CLOAD= 3nF; 10% to
and Fall Times
90%, 90% to 10%
High-side Gate Driver Rise
CLOAD= 3nF; 10% to
and Fall Times
90%, 90% to 10%
GPIO
VIH
Input high voltage
0.7*
V
VDDIO
VIL
Input low voltage
0.3*
VDDIO
VOH
Output high voltage
I=8mA
0.8*
V
VDDIO
VOL
Output low voltage
I=8mA
0.2*
VDDIO
I_lkg
V
leakage current
V
1
uA
DP and DM
VDPsrc
Voltage source on DP
0.6
V
VDP3p3
3.3V source on DP
3.3
V
IDPsrc
DP current source
10
uA
IDPsink
DP sink current
100
uA
IDMsink
DM sink current
100
uA
RDMdown
DM pull down resistor
20
KΩ
IDPlkg
DP leakage current
DP/DM open
1
uA
IDMlkg
DM leakage current
DP/DM open
1
uA
140
°C
120
°C
Thermal Shut Down
T_thermal_r
Thermal shut down rising
threshold
T_thermal_f
Thermal shut down falling
threshold
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MT5811
Highly Integrated, High Performance
Wireless Power Transmitter
Maximizing IC Performance
6.6 Typical Operating Characteristics
The following performance characteristics were taken using MT5811 wireless power transmitter and
MT5715 wireless power receiver at TA=25°C, unless otherwise noted.
Efficiency vs. Output Load
Test Condition: Vin=5.5V, Vout=5V
Efficiency(%)
95
90
85
80
75
70
65
60
55
50
45
40
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
1
1.1 1.2 1.3 1.4 1.5
Output Current(A)
Efficiency(%)
Efficiency vs. Output Load
Test Condition: Vin=9V, Vout=9V
95
90
85
80
75
70
65
60
55
50
45
40
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
1
1.1 1.2 1.3 1.4 1.5
Output Current(A)
Efficiency(%)
Efficiency vs. Output Load
Test Condition: Vin=9V, Vout=12V
95
90
85
80
75
70
65
60
55
50
45
40
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
1
1.1 1.2 1.3 1.4 1.5
Output Current(A)
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Tel: 86-10-62662828
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Copyright © 2019 Maxic Technology Corporation
Rev 1.0
Page 13
MT5811
Highly Integrated, High Performance
Wireless Power Transmitter
Maximizing IC Performance
7 DETAILED DESCRIPTIONS
7.1 Overview
MT5811 is an SoC for wireless power transmitter solutions. It integrates all major functional blocks
to ensure high flexibility, high performance and high reliability.
With the abundant hardware functional blocks and the powerful M0 and the spacious eFlash
memory, we allow our customers to implement differentiated functions and features on their own,
based on the basic building blocks and libraries provided by us.
MT5811 represents the state of art wireless power transmitter SoC solution and sets an industry
bench mark for high integration, rich feature set, extraordinary performance, extreme flexibility and
low cost.
Email: sales@maxictech.com
Tel: 86-10-62662828
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Copyright © 2019 Maxic Technology Corporation
Rev 1.0
Page 14
MT5811
Highly Integrated, High Performance
Wireless Power Transmitter
Maximizing IC Performance
7.2 Functional Block Diagram
LDO1P5
VIN5V VDD5V SW_B VIN
VIN_SNS
ISH
ISL
ISNS_O
MT5811
GND
Biasing
LDO 1.5V
HV BUCK
OVP
Low Side Current Sense
BST1
1.5V
LDO3P3
DRV1H
3.3V
LDO 3.3V
SW1
FOD &
Q Factor Detection
DEMOD0
Demodulation
DRV1L
PWM
Generator
and FSK
Modulator
MOS
Driver
BST3
QC 2.0/3.0 Sensing
DEMOD1
DRV3H
SW3
10bit DAC
GPIO(ADC)
10bit ADC
DRV3L
32K OSC
GPIO(DAC)
BST2
XIN
60M OSC
Core
PLL
DRV2H
SW2
XOUT
DRV2L
GND
I/O Interface
VDDIOA
VDDIOB
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Tel: 86-10-62662828
GPIO
(FCP, SCP, QC2.0/3.0)
GPIO
(LED, Buzzer, etc.)
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Copyright © 2019 Maxic Technology Corporation
Rev 1.0
Page 15
MT5811
Highly Integrated, High Performance
Wireless Power Transmitter
Maximizing IC Performance
7.3 Theory of Operation
The wireless power system uses magnetic induction to transfer power from a power transmitter (Tx) to
a power receiver (Rx).
Before power transfer begins, the Rx and Tx communicate with each other to establish that the Rx is
indeed capable of power receiving, whether it needs power transfer, how much power is required, etc.
In short, the communication ensures an appropriate power transfer from the power transmitter to the
power receiver.
When power transfer begins, the power transmitter runs an alternating electrical current through its
coil(s), which generates an alternating magnetic field in accordance with Faraday's law. Varying electric
field generates varying magnetic field; varying magnetic field generates varying electric field. Therefore,
the power transfer is achieved.
Transmitter (Tx)
Input
Power
MT5811
Receiver (Rx)
MT5715
Load
Communication
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Tel: 86-10-62662828
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Copyright © 2019 Maxic Technology Corporation
Rev 1.0
Page 16
MT5811
Highly Integrated, High Performance
Wireless Power Transmitter
Maximizing IC Performance
8 DETAILED PACKAGING INFORMATIONS
QFN48 Package Outline and Dimensions
SYMBOL
A
A1
b
c
D
D2
e
Ne
Nd
E
E2
L
b1
h
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Tel: 86-10-62662828
MILLIMETER
MIN
0.70
0.15
0.18
5.90
4.10
5.90
4.10
0.35
0.69
0.30
NOM
0.75
0.02
0.20
0.20
6.00
4.20
0.40BSC
4.40BSC
4.40BSC
6.00
4.20
0.40
0.35
MAX
0.80
0.05
0.25
0.23
6.10
4.30
6.102.7
4.30
0.45
0.79
0.40
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Copyright © 2019 Maxic Technology Corporation
Rev 1.0
Page 17
MT5811
Highly Integrated, High Performance
Wireless Power Transmitter
Maximizing IC Performance
9 ORDERING INFORMATION
Part No.
MT5811
Package
Package
Package
Ambient
Type
Information
Quantity
Temperature
QFN48
6 x 6 mm QFN48
3000
-40°C~+85°C
Chip Mark
MT5811
YYWWXX
XXXX
10 REVISION HISTORY
Revision
Date
1.0
2019-05-27
Description
Initial release.
Important Notice
Maxic Technology Corporation (Maxic) reserves the right to make correction, modifications,
enhancements, improvements and other changes to its products and services at any time and to
discontinue any product or service without notice. Customers should obtain the latest relevant
information before placing orders and should verify that such information is current and complete.
All products are sold subject to Maxic’s terms and conditions of sale supplied at the time of order
acknowledgement.
Reproduction, copying, transferring, reprinting this paper without Maxic’s written permission is
prohibited.
Maxic assumes no liability for applications assistance or the design of customers’ products. Maxic
warrants the performance of its products to the specifications applicable at the time of sale.
Customers are responsible for their products and applications using Maxic components. To
minimize the risks associated with customers’ products and applications, customers should provide
adequate design and operating safeguards.
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Tel: 86-10-62662828
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Copyright © 2019 Maxic Technology Corporation
Rev 1.0
Page 18
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