TMPC1205HP-4R7MG-D

P1 TAIPAQ SMD Power Inductor TMPC1205HP-Serise-D ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 12/02/08 新發行 張龍旺 羅宜春 李芳 備 注 P2 TAIPAQ SMD Power Inductor TMPC1205HP-Serise-D 1. Features 1. Carbonyl Powder. 2. Compact design. 3. High current，low DCR，high efficiency. Halogen Pb Halogen-free Pb-free 4. Very low acoustic noise and very low leakage flux noise. 5. High reliability. 6. 100% Lead(Pb)-Free and RoHS compliant. 2. Applications Note PC power system，incl. IMVP-6 DC/DC converter . Recommend PC Board Pattern 3. Dimensions Dr. MOS application C L H D 　4R7 1150 E B A G Series A(mm) TMPC1205HP 13.5±0.5 B(mm) C(mm) D(mm) E(mm) L(mm) G(mm) H(mm) 12.5±0.3 4.8±0.2 2.3±0.3 4.7±0.3 14.2 8.0 5.0 4. Part Numbering TMPC 1205 HP A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance F: 印 D/C - 4R7 MG D E - D F BxC HP:H:Carbonyl Powder,P:PAD broaden. 4R7=4.70uH M=±20% 印字:黑色.4R7 及 D/C 1150 (11 年,50 週期)(依實際生產日期而定) P3 TAIPAQ 5. Specification Part Number Inductance L0 (uH)±20% @ 0 A I rms (A) Typ. I sat (A) Typ. DCR (mΩ) Typ. @25℃ DCR (mΩ) Max. @25℃ TMPC1205HP-R33MG-D 0.33 42 80 0.7 0.9 TMPC1205HP-R47MG-D 0.47 38 65 0.86 1.1 TMPC1205HP-R56MG-D 0.56 36 55 1.0 1.5 TMPC1205HP-R68MG-D 0.68 34 54 1.4 1.7 TMPC1205HP-1R0MG-D 1.00 29 50 1.85 2.5 TMPC1205HP-1R5MG-D 1.50 27 48 2.8 3.3 TMPC1205HP-1R8MG-D 1.80 21 40 4.0 4.9 TMPC1205HP-2R2MG-D 2.20 20 32 4.2 5.5 TMPC1205HP-3R3MG-D 3.30 15 32 6.8 9.2 TMPC1205HP-4R7MG-D 4.70 12 27 11.4 15.0 TMPC1205HP-5R6MG-D 5.60 11.5 22 12.3 16.5 TMPC1205HP-6R8MG-D 6.80 11 21 14.5 18.5 TMPC1205HP-8R2MG-D 8.20 9.5 18 16.8 22.5 TMPC1205HP-100MG-D 10.0 9.0 16 21.4 25.5 TMPC1205HP-180MG-D 18.0 7.5 11 40 45 Note: 1. Test frequency : L : 100KHz /1.0V; 2. All test data referenced to 25℃ ambient. 3. Testing Instrument : L/Q: HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δt of 40℃ (keep 1min.). 5. Saturation Current (Isat) will cause L0 to drop 20% typical. (keep quickly). 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. P4 TAIPAQ 6. Material List 5 NO Items 1 Core Carbonyl Powder. Materials 2 Wire Polyester Wire or equivalent. 3 Solder Plating 100% Pb free solder 4 Ink Halogen-free ketone 5 paint Epoxy resin 7. Reliability and Test Condition Item Performance Operating temperature -40~+125℃ Storage temperature and Humidity range -10~+40℃,50~60%RH (Product without taping) Test Condition Electrical Performance Test Inductance Refer to standard electrical characteristics list. DCR HP4284A,CH11025,CH3302,CH1320,CH1320S LCR Meter. CH16502,Agilent33420A Micro-Ohm Meter. Saturation Current (Isat) △L20% typical. Saturation DC Current (Isat) will cause L0 to drop △L(%)(keep quickly). Heat Rated Current (Irms) Approximately △T≦40℃ Heat Rated Current (Irms) will cause the coil temperature rise △T(℃) without core loss. 1.Applied the allowed DC current(keep 1 min.). 2.Temperature measured by digital surface thermometer Reliability Test High Temperature Exposure Test Temperature:125±2℃. Duration:1000±12hrs. Measured at room temperature after placing for 2 to 3hrs. (MIL-PRF-27) Low Temperature Life Test Temperature:-40±2℃. Duration:500±12hrs. Measured at room temperature after placing for 2 to 3hrs. Biased Humidity Test Humidity:85±3%RH. Temperature:85±2℃. Duration:1000±12hrs. Measured at room temperature after placing for 2 to 3hrs (AEC-Q200-REV C) Thermal shock test Condition for 1 cycle Step1:-40+0 / -2℃ 15±1 min. Step2:Room temperature within ≦0.2 min. Step3:+125+2 / -0℃ 15±1min. Number of cycles:300 Measured at room temperature after placing for 2 to 3 hrs. (AEC-Q200-REV C) Electric specifications should be satisfied Vibration test Frequency: 10-2000-10Hz for 20 min. Amplitude: Parts mounted within 2" from any secure point. Directions and times: X, Y, Z directions for 20 min. This cycle shall be performed 12 times in each of three mutually perpendicular directions (Total 12hours). (MIL-STD-202 Method 204 D Test condition B) Reflow test Pre-heat：150±5℃ Duration：5 minutes Temperature：260±5℃，20~40 seconds (IPC/JEDEC J-STD-020C) Solder test Terminals should be covered by over 95% solder on visual inspection After dip into flux，dip into solder 235±5℃，4±1seconds Flux 、solder for lead free (ANSI /J-STD-002C Method B) P5 TAIPAQ 8. Soldering and Mounting (1) Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. TAIPAQ terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. (2) Solder re-flow: Recommended temperature profiles for re-flow soldering in Figure 1. (3) Soldering Iron: Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150℃ ‧355℃ tip temperature (max) ‧Never contact the ceramic with the iron tip ‧1.0mm tip diameter (max) Iron Soldering Reflow Soldering SOLDERING 20~40s TEMPERATURE(¢X C) TP(260¢X C / 40s max.) 217 60~150s 200 150 PRE-HEATING NATURAL COOLING 60~180s SOLDERING within 4~5s TEMPERATURE(¢X C) PRE-HEATING ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧Limit soldering time to 4~5sec. 350 150 Gradual cooling Over 60s 480s max. NATURAL COOLING 25 TIME( sec.) Reflow times: 3 times max. Fig.1 TIME(sec.) Iron Soldering times: 1 times max. Fig.2 P6 TAIPAQ 9. Packaging Information (1) Reel Dimension COVER TAPE Type A(mm) B(mm) C(mm) D(mm) 13”x24mm 24.0±0.5 100±2 13.5±0.5 330 C B D 2.0¡ Ó 0.5 A EMBOSSED CARRIER z (2) Tape Dimension K0 Az Series Size TMPC 1205 Bo(mm) Bz(mm) 14.1±0.1 13.0±0.1 Ao(mm) 12.9±0.1 Az(mm) Ko(mm) 7.0±0.1 5.5±0.1 P(mm) W(mm) F(mm) t(mm) 16.0±0.1 24±0.3 11.5±0.1 0.35±0.05 (3) Packaging Quantity TMPC 1205 Chip / Reel 500 Inner box 1000 Carton 4000 (4) Tearing Off Force F Top cover tape The force for tearing off cover tape is 10 to 130 grams in the arrow direction under the following conditions(referenced ANSI/EIA-481-C-2003 of 4.11 stadnard). 165¢Xto180¢X Base tape Room Temp. (℃) Room Humidity (%) Room atm (hPa) Tearing Speed mm/min 5~35 45~85 860~1060 300 Application Notice ‧Storage Conditions To maintain the solderability of terminal electrodes: 1. TAIPAQ products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40℃ and 60% RH. 3. Recommended products should be used within 12 months form the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. ‧Transportation 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. P7 TAIPAQ 10. Typical Performance Curves TMPC1205HP-R33 0.8 150 1 120 0.8 TMPC1205HP-R47 120 100 0.8 80 0.6 60 0.4 40 0.2 20 60 0.6 60 0.4 0.2 TEMP. RISE(oC) 90 0.4 TEMP. RISE(oC) INDUCTANCE (uH) 90 TEMP. RISE(oC) INDUCTANCE (uH) INDUCTANCE (uH) 0.6 TMPC1205HP-R56 1 30 30 0 0.2 0 0 20 40 60 0 80 0 0 13 26 DC CURRENT(A) TMPC1205HP-R68 1.5 39 52 0 65 0 0 11 22 DC CURRENT(A) 150 2 1.2 120 0.9 90 0.6 60 0.3 30 33 44 55 DC CURRENT(A) TMPC1205HP-1R0 150 3 1.6 120 2.4 1.2 90 0.8 60 0.4 30 TMPC1205HP-1R5 120 60 1.2 TEMP. RISE(oC) TEMP. RISE(oC) INDUCTANCE (uH) TEMP. RISE(oC) INDUCTANCE (uH) INDUCTANCE (uH) 90 1.8 30 0 0 9 18 27 36 45 0 54 0 0 10 20 DC CURRENT(A) TMPC1205HP-1R8 4 30 40 0 50 150 120 1 3 90 2 60 1 30 TEMP. RISE(oC) INDUCTANCE (uH) 60 TEMP. RISE(oC) INDUCTANCE (uH) INDUCTANCE (uH) 90 2 30 0 0 20 30 0 40 0 0 8 DC CURRENT(A) 16 150 10 120 18 24 30 36 24 TMPC1205HP-3R3 42 150 4 120 3 90 2 60 1 30 0 32 0 0 8 DC CURRENT(A) TMPC1205HP-4R7 8 12 5 120 10 6 DC CURRENT(A) TMPC1205HP-2R2 4 3 0 0 0 DC CURRENT(A) TEMP. RISE(oC) 0 0.6 16 24 32 DC CURRENT(A) TMPC1205HP-5R6 TMPC1205HP-6R8 150 10 100 8 120 8 80 6 90 6 60 4 60 4 40 30 2 30 2 20 0 0 0 0 TEMP. RISE(oC) 60 TEMP. RISE(oC) INDUCTANCE (uH) 90 4 TEMP. RISE(oC) INDUCTANCE (uH) INDUCTANCE (uH) 6 2 10.8 16.2 21.6 27 0 4.4 8.8 DC CURRENT(A) TMPC1205HP-8R2 12 100 60 6 40 4 20 2 0 0 9 DC CURRENT(A) 22 0 0 5.25 13.5 18 20 36 15 27 10 18 20 5 9 0 0 40 6 3 0 8 12 TMPC1205HP-180 80 60 DC CURRENT(A) 21 25 9 4 15.75 100 12 0 10.5 DC CURRENT(A) 15 80 8 4.5 17.6 TMPC1205HP-100 18 TEMP. RISE(oC) INDUCTANCE (uH) INDUCTANCE (uH) 10 0 13.2 DC CURRENT(A) 16 TEMP. RISE(oC) 5.4 INDUCTANCE (uH) 0 45 0 0 2.2 4.4 6.6 DC CURRENT(A) 8.8 11 TEMP. RISE(oC) 0