2SK3018W

2SK3018W Rev.F Jul.-2019 描述 / DATA SHEET Descriptions SOT-323 塑封封装 N 沟 MOS 场效应管。N-Channel MOSFET in a SOT-323 Plastic Package. 特征 / Features 低导通电阻,开关速度快,低电压驱动,简化驱动电路和简便平面。无卤产品。 Low on-resistance, fast switching speed, low voltage drive, easily designed drive circuits, easy to parallel. Halogen free product. 用途 / Applications 触摸屏，交换开关。 Interfacing, switching. 内部等效电路 引脚排列 / Equivalent Circuit / Pinning 3 2 1 PIN1：S 印章代码 PIN 2：G PIN 3：D / Marking Marking http://www.fsbrec.com KN 1/6 2SK3018W Rev.F Jul.-2019 极限参数 / DATA SHEET Absolute Maximum Ratings(Ta=25℃) 参数 Parameter 符号 Symbol 数值 Rating 单位 Unit Drain-Source Voltage VDSS 30 V Gate-Source Voltage VGSS ±20 V ID 100 mA Drain Current– Pulsed IDP*1 200 mA Reverse drain current–Continuous IDR 100 mA Drain Current – Continuous *1 Reverse drain current– Pulsed IDRP 200 mA Total power dissipation (Tc=25℃) PD*2 200 mW Channel Temperature Tch 150 V Storage Temperature Range Tstg -55～150 ℃ *1:Pw≤10μs, Duty cycle≤50% *2:With each pin mounted on the recommended lands 电性能参数 / Electrical Characteristics(Ta=25℃) 参数 Parameter Drain–Source Breakdown Voltage 符号 Symbol 最小值 典型值 最大值 单位 Min Typ Max Unit VGS=0V ID=10μA 30 VGS(th) VDS=3.0V ID=100μA 0.8 RDS(on)1 VGS=4.0V ID=10mA RDS(on)2 VGS=2.5V ID=1.0mA Zero Gate Voltage Drain Current IDSS VDS=30V Gate–Body Leakage. IGSS Forward Transconductance gFS Input Capacitance Ciss Gate threshold voltage Static Drain–Source On–Resistance V(BR)DSS 测试条件 Test Conditions V 1.5 V 5.0 8.0 Ω 7.0 13 Ω VGS=0V 1.0 μA VGS=±20V VDS=0V ±1 μA VDS=3V ID=10mA VDS=5.0V f=1.0MHz VGS=0V 20 mS 13 pF 9.0 pF Output Capacitance Coss Reverse Transfer Capacitance Crss 4.0 pF Turn–On Delay Time td(on) 15 ns Turn–On Rise Time tr 35 ns Turn–Off Delay Time td(off) 80 ns 80 ns Turn–Off Fall Time http://www.fsbrec.com tr ID=10mA VGS=5.0V RGS=10Ω VDD≈5.0V RL=500Ω 2/6 2SK3018W Rev.F Jul.-2019 电参数曲线图 DATA SHEET / Electrical Characteristic Curve http://www.fsbrec.com 3/6 2SK3018W Rev.F Jul.-2019 外形尺寸图 DATA SHEET / Package Dimensions http://www.fsbrec.com 4/6 2SK3018W Rev.F Jul.-2019 印章说明 / DATA SHEET Marking Instructions KN 说明： KN： 为封装型号 Note: KN: http://www.fsbrec.com Package type. 5/6 2SK3018W Rev.F Jul.-2019 DATA SHEET 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： Note: 1、预热温度 150～180℃，时间 60～90sec; 1.Preheating:150~180℃, Time:60~90sec. 2、峰值温度 245±5℃，时间持续为 5±0.5sec; 2.Peak Temp.:245±5℃, Duration:5±0.5sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 包装规格 Time:10±1 sec / REEL Package Type 封装形式 使用说明 Temp:260±5℃ / Packaging SPEC. 卷盘包装 SOT-323 时间：10±1 sec. Units 包装数量 Dimension 包装尺寸 3 (unit：mm ) Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 3,000 10 30,000 6 180,000 7〞×8 180×120×180 390×385×205 / Notices http://www.fsbrec.com 6/6