GHB0603HF-601T01

TAI-TECH TBM01-160601005 Ferrite Chip Bead for GHz Range Noise Suppression (Lead Free) GHB0603HF-Series ECN HISTORY LIST REV DATE DESCRIPTION 1.0 13/10/29 初版發行 2.0 14/01/24 3.0 14/08/01 變更 Reflow 圖示 4.0 16/01/26 APPROVED CHECKED DRAWN 楊祥忠 羅培君 張嘉玲 楊祥忠 羅培君 張嘉玲 楊祥忠 羅培君 張嘉玲 楊祥忠 詹偉特 張嘉玲 變更電鍍錫層厚度 3.0um min.=>3.5um min. 增訂可靠度 Thermal shock: (Bead) Step3：125±2℃ 30±5min 備 註 www.tai-tech.com.tw P1. TAI-TECH TBM01-160601005 Ferrite Chip Bead for GHz Range Noise Suppression (Lead Free) P2. GHB0603HF-Series 1.Features 1.Monolithic inorganic material construction. 2.Closed magnetic circuit avoids crosstalk. 3.S.M.T. type. 4.Suitable for reflow soldering. 5.The GHB1005 series is intended for standard signal lines as this series Halogen Pb Halogen-free Pb-free provides significant impedance across a broad frequency range. 6.The magnetic shielded structure minimizes crosstalk. 7.100% Lead(Pb) & Halogen-Free and RoHS compliant. 2.Dimensions Chip Size A 0.60±0.03 B 0.30±0.03 C 0.30±0.03 D 0.15±0.05 Unit：mm 3.Part Numbering GHB 0603 HF A B C A: Series B: Dimension C: Material D: Impedance E: Packaging F: Rated Current - 102 T 01 D E F LxW Lead Free Material 102=1000Ω T=Taping and Reel, B=Bulk(Bags) 4.Specification ● ● Tai-Tech Part Number Impedance (Ω) Test Frequency (Hz) DC Resistance (Ω) max. Rated Current (mA) max. GHB0603HF-601T01 600±25% 60mV/100M 1.5 160 GHB0603HF-102T01 1000±25% 60mV/100M 2.5 130 GHB0603HF-152T01 1500±25% 60mV/100M 3.2 115 Rated current: based on temperature rise test In compliance with EIA 595 www.tai-tech.com.tw TAI-TECH P3. TBM01-160601005 5. Reliability and Test Condition Item Series No. Operating Temperature Performance FCB FCM HCI -- -40~+125℃ (Including self-temperature rise) -40~+105℃ (Including self-temperature rise) -- -40~+125℃ (on board) -40~+105℃ (on board) Transportation Storage Temperature HCB GHB FCA FCI Test Condition FHI FCH For long storage conditions, please see the Application Notice Agilent4291 Impedance (Z) Agilent E4991 Inductance (Ls) Agilent4287 Q Factor Agilent16192 Refer to standard electrical characteristics list DC Resistance Agilent 4338 Rated Current DC Power Supply Over Rated Current requirements, there will be some risk Rated Current < 1A ∆T 20℃Max Temperature Rise Test 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Rated Current ≧ 1A ∆T 40℃Max Number of heat cycles: 1 Resistance to Soldering Heat Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Temperature (°C) Time (s) Temperature ramp/immersion and emersion rate 260 ±5 (solder temp) 10 ±1 25mm/s ±6 mm/s Depth: completely cover the termination Preheating Dipping Natural cooling More than 95% of the terminal Solderability electrode should be covered 245° C 150° C 60 second with solder. Terminal strength Bending Vibration Test 4±1 second Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Appearance：No damage. Impedance：within±10% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Preheat: 150℃,60sec. Solder: Sn96.5%-Ag3%-Cu0.5% Solder temperature: 245±5℃ Flux for lead free: Rosin. 9.5% Depth: completely cover the termination. Dip time: 4±1sec. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Component mounted on a PCB apply a force (>0805:1kg =0805:40x100x1.2mm =0805:1.2mm 1GΩ 6.Soldering and Mounting 6-1. Recommended PC Board Pattern Land Patterns For Reflow Soldering Chip Size Series Type GHB 0603 A(mm) B(mm) C(mm) D(mm) L(mm) G(mm) H(mm) 0.6±0.03 0.30±0.03 0.30±0.03 0.15±0.05 0.80 0.30 0.30 L H P4. PC board should be designed so that products can prevent damage from mechanical stress when warping the board. G 6-2. Soldering Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Note. If wave soldering is used ,there will be some risk. Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk 6-2.1 Lead Free Solder re-flow: Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C) www.tai-tech.com.tw TAI-TECH TBM01-160601005 P5. 6-2.2 Soldering Iron: Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2. ‧Preheat circuit and products to 150℃ ‧350℃ tip temperature (max) ‧Never contact the ceramic with the iron tip ‧1.0mm tip diameter (max) R eflow S oldering Iron Soldering PRE-HEATING NATUR AL CO O LING SO LDER IN G PRE-HEATING TEMPERATURE(° C) TP(260 ℃ / 10s m ax.) 217 60~150s 200 150 SOLDERING within 4~5s tp(245° C / 20~40s.) TEMPERATURE(° C) ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧Limit soldering time to 4~5sec. 60~180s NATURAL COOLING 350 150 Gradual cooling Over 60s 480s m ax. 25 TIME(sec.) TIM E( sec.) Reflow times: 3 times max Fig.1 Iron Soldering times：1 times max Fig.2 6-2.3 Solder Volume: Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in right side: Minimum fillet height = soldering thickness + 25% product height Upper limit Recommendable t 7.Packaging Information 7-1. Reel Dimension COVER TAPE Type A(mm) B(mm) C(mm) D(mm) 7”x8mm 10±1.5 50 min 13±0.2 178±2 C B D 2.0±0.5 A EMBOSSED CARRIER 7-2. Tape Dimension / 8mm 0 0. 10. 5+ . 1 D: F:3.5±0.05 B0 t W:8.0±0.3 E:1.75±0.1 P0:4±0.1 Size 060303 P A0 Ko www.tai-tech.com.tw Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) 0.45max 2.0±0.05 0.50max 0.70±0.06 0.40±0.06 TAI-TECH TBM01-160601005 7-3. Packaging Quantity Chip Size 060303 Chip / Reel 15000 Inner box 75000 Middle box 375000 Carton 750000 7-4. Tearing Off Force F Top cover tape The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. 165° to180° Base tape Room Temp. Room Humidity Room atm Tearing Speed (℃) (%) (hPa) mm/min 5~35 45~85 860~1060 300 Application Notice ‧Storage Conditions To maintain the solder ability of terminal electrodes: 1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40℃ and 60% RH. 3. Recommended products should be used within 12 months from the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. ‧Transportation 1.Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. www.tai-tech.com.tw P6. TAI-TECH TBM01-160601005 Impedance Frequency Characteristics(Typical) IMPEDANCE(Ohm) IMPEDANCE(Ohm) 1500 1000 Z 500 GHB0603HF-102T01 3000 2000 Z 1000 X X 0 100 FREQUENCY(MHz) Z 2000 1000 X R 0 10 3000 R R 1 GHB0603HF-152T01 4000 IMPEDANCE(Ohm) GHB0603HF-601T01 2000 1000 10000 0 1 10 100 1000 10000 FREQUENCY(MHz) www.tai-tech.com.tw 1 10 100 FREQUENCY(MHz) 1000 10000 P7.