1SC3528VGB01MH08

The RGB Series 1SC3528VGB01MH08 ◆Outline (L* W*H): 3.5*2.8*1.8mm ◆Good thermal dissipation & optical uniformity Table of Contents Features Product Code Method-----------------------------------------2  Forward current: R≦50mA ;G&B≦30mA Maximum Rating-----------------------------------------------2  Typical view angle 50% Iv:120° Typical Product Characteristics------------------------------3  Lens color: white diffused Range of Bins---------------------------------------------------3  RoHS and REACH-compliant Directive Characteristics--------------------------------------5  ESD level 1kV(HBM) Electronic-Optical Characteristics---------------------------6 Applications Dimensions -----------------------------------------------------7  Indoor decorating Packing------------------------------------------------------------8  Outdoor lighting for amusement Precautions ------------------------------------------------------9  Consumer electronics Test Items and Results of Reliability------------------------12  Other applications Version: IS-2.8 BT-35-1011003 Page 1 of 12 The RGB Series  Product Code Method ----------------------------------------------------------------------------------------------------------------------------------- 1 - S - C - 3528 - VGB0 - 1 - M - H - 08 ② ③ ① ④ ⑤ ⑥ ⑦ ⑧ ⑨ ① ② ③ ④ ⑤ Process Type Category LED Type Lead Frame Size Dice wavelength &luminous rank V:red 1: normal process C: PLCC top view 3528: D: PLCC side view 3.5*2.8mm S: SMD LED G:green B:blue ⑥ ⑦ ⑧ ⑨ Lap Polarity Cap Color PCB Module Code Flow Code 1: common anode M: white diffused H: article mode 08: no expression above meaning for company  Maximum Rating(Ta=25℃) -----------------------------------------------------------------------------------------------------------------------------------Characteristics Symbol Typical Unit DC Forward Current IF G&B≦30 / R≦50 mA Pulse Forward Current*3 IPF 80 mA Reverse Voltage VR 5 V Power Dissipation PD G&B:80 / R:100 mW Junction Temperature TJ 110 o Operating Temperature Range TOP -40~80 o Storage Temperature Range TSTG -40~100 o Soldering Temperature*4 TSD 260 o C C C C Notes 1: There is no maximum or typical voltage parameter 2: For other ambient, limited setting of current will be depended on de-rating curves. 3: Duty 1/10, pulse width 0.1ms 4: The maximum of soldering time is 5 seconds in TSD Version: IS-2.8 BT-35-1011003 Page 2 of 12 The RGB Series  Typical Product Characteristics(Ta=25℃) -----------------------------------------------------------------------------------------------------------------------------------Characteristics Forward Voltage Symbol Min Typical Max R 1.8 2.1 2.6 G 2.8 3.2 3.8 B 2.8 3.2 3.8 - 10 VF Reverse Current Luminous Intensity Dominant Wavelength View Angle IR Iv λd 2θ1/2 R 160 235 - G 640 1000 - B 200 285 - R 615 - 630 G 519 - 534 B 461 - 476 - 120 - Unit Test condition V IF=20mA μA VR= 5V mcd IF=20mA nm IF=20mA deg IF=20mA Notes: 1. Measurement Errors: Forward Voltage: ±0.1V, Luminous Intensity: ±10%Iv, Dominant Wavelength: ±1.0nm 2. Electrical-Optical Characteristics (Ta=25℃)  Range of Bins -----------------------------------------------------------------------------------------------------------------------------------1).Luminous Intensity Bins (IF=20mA) Min. Iv (mcd) Max. Iv (mcd) 7 160 200 8 200 250 9 250 310 9 640 800 10 800 1000 11 1000 1250 8 200 250 9 250 310 10 310 388 Bin code R G B Version: IS-2.8 BT-35-1011003 Page 3 of 12 The RGB Series  Range of Bins -----------------------------------------------------------------------------------------------------------------------------------2).Dominant Wavelength Bins (IF=20mA) Min. λd (nm) Max. λd (nm) 2 615 620 3 620 625 4 625 630 2 519 524 3 524 529 4 529 534 2 461 466 3 466 471 4 471 476 Bin Code R G B Version: IS-2.8 BT-35-1011003 Page 4 of 12 The RGB Series  Electronic-Optical Characteristics Relative Luminous Intensity -----------------------------------------------------------------------------------------------------------------------------------1). Relative Spectral Distribution 2). Typical Spatial Distribution Wavelength (nm) 4). Relative Luminous Flux .Ambient Temperature Relative Luminous Flux 10000 1000 100 10 0 0 5 10 30 25 20 15 Forward Current (mA) Relative Luminous Flux(%) 3). Relative Luminous Flux .Current 110% 100% 90% 80% 70% 0 20 40 60 80 100 Ambient Temperature(°C) 5). Electrical Characteristics 6). Forward Voltage Temperature 3.4 25 Forward Voltage Forward Current IF(mA) 30 20 15 10 5 0 1.5 3.2 3.0 2.0 1.8 2.5 2 3 3.5 1.6 Forward Voltage VF(V) 620 600 520 500 470 450 420 0 Version: IS-2.8 10 20 30 85 45 65 Ambient Temperature(℃) 105 8). Thermal Design Forward Current IF(mA) Choromaticity Coordinates(wd) 7). Wavelength and Current 25 40 50 50 40 30 20 10 0 Forward Current (mA) BT-35-1011003 0 20 40 60 80 Ambient Temperature Ta(°C) 100 Page 5 of 12 The RGB Series  Dimensions -----------------------------------------------------------------------------------------------------------------------------------2 2.8 B 2.00 4 2.750 1 B 3.50 3.15 0.95 1.97 0.15 3 G 0.800 R 2.283 3.2 1 2 R 3 G 4 1.80 Recommend Padlayout 1.6 1.8 0.7 2.2 1.8 § All dimensions are in millimeters. § Tolerance is ±0.1mm unless other specified § Specifications are subject to change without notice Version: IS-2.8 BT-35-1011003 Page 6 of 12 The RGB Series  Reflow Profile -----------------------------------------------------------------------------------------------------------------------------------1. IR reflow soldering Profile for Lead Free solder 300 ℃ 250 temperature 10sec. max 1-5℃/sec 2-5℃/sec 230℃ max Pre heating 150-180℃ 200 260℃ max 2-5℃/sec 150 120sec.Max 50sec.max 100 50 25℃ 0 0 50 100 Time 150 200 250 300 sec 2. IR reflow soldering Profile for Lead solder 300 ℃ 1-5℃/sec temperature 250 Pre heating 150-180℃ 200 240℃ max 10sec. max 210℃ max 2-5℃/sec 2-5℃/sec 150 120sec.Max 50sec.max 100 50 25℃ 0 0 50 100 Time 150 200 250 300 sec Notes: 1. We recommend the reflow temperature 240℃ (±5℃).the maximum soldering temperature should be limited to 260℃. 2. Don’t cause stress to the silicone resin while it is exposed to high temperature. 3. Number of reflow process shall be less than 3 times. Version: IS-2.8 BT-35-1011003 Page 7 of 12 The RGB Series  Test Circuit and Handling Precautions -----------------------------------------------------------------------------------------------------------------------------------1. Test circuit V LED 2. Handling precautions 2.1. Over-current-proof Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn out will happen). 2.2. Storage 1). It is recommended to store the products in the following conditions: Humidity: 60% R.H. Max. Temperature : 5℃~30℃(41℉~86℉) 2). Shelf life in sealed bag: 12 month at ＜5℃~30℃ and ＜60% R.H. after the package is Opened, the products should be used within a week or they should be keeping to stored at ≦20%R.H. with zip-lock sealed. 2.3. Baking It is recommended to baking before soldering when the pack is unsealed after 24hrs. The Conditions are as followings: 1). 60±3℃ X 6hrs and ＜5%RH, for reel 2). 125±3℃ X 2hrs, for single LED It shall be normal to see slight color fading of carrier (light yellow) after baking in process Version: IS-2.8 BT-35-1011003 Page 8 of 12 The RGB Series  Packing ----------------------------------------------------------------------------------------------------------------------------------- Dimensions of Reel (Unit: mm) 60±0.50 13±0.2 173±0.10 Unit:mm 9±0.5 Labelposition 12±0.15 Dimensions of Tape (Unit: mm) 2.0±0.05 1.55±0.05 1.75±0.10  0.20 8.00±0.10 5.25±0.10 4.0±0.10 2.08 4.0±0.10  Arrangement of Tape Empty parts Loaded Parts Empty Parts (min.10) (LED:2000Pcs) (min.40) Feeding Direction Cover Tape Emboss T ape Conclusion Parts Introduction Parts (Min.40mm) (Min.160mm) Notes: 1. Empty component pockets are sealed with top cover tape 2. The max loss number of SMD is 2pcs 3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481 specifications 4. 2,000pcs per reel Version: IS-2.8 BT-35-1011003 Page 9 of 12 The RGB Series  Packing ---------------------------------------------------------------------------------------------------------------------------------- Packaging specifications Reel(2,000pcs) Moisture-poof bag Label inspection request form Inner box(Max. 7 reels) Label Outer box(Max. 4 inner boxes) Notes: Reeled product (max.2,000 ) is packed in a sealed moisture-proof bag. Seven bags are packed in an inner box (size: about 260 X 230 X 100 mm) and four inner boxes are in an outer box (size: about 480 X 275 X 215 mm). On the label of moisture-poof bag, there should be the information of Part No., Lot No. and quantity number; also the total quantity number should be on inspection request form on outer box. Version: IS-2.8 BT-35-1011003 Page 10 of 12 The RGB Series  Precautions ---------------------------------------------------------------------------------------------------------------------------------------1. Abnormal situation caused by improper setting of collet To choose the right collet is the key issue in improving the product’s quality. LED is different from other electronic components, which is not only about electrical output but also for optical output. This characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height is not well set, it will bring damage to the gold wire at the time of collet’s picking up and loading which will cause the LED fail to light up, light up now and then or other quality problems 2. How to choose the collet During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in case that improper position of collet will damage the gold wire inside the LED. Different collets fit for different products, please refer to the following pictures cross out Outer diameter of collet should be larger than the lighting area Picture 1() Picture 2(X) 3. Other points for attention A. No pressure should be exerted to the epoxy shell of the SMD under high temperature. B. Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross out easy to break. C. LED should be used as soon as possible when being taken out of the original package, and should be stored in anti-moisture and anti-ESD package. 4. This usage and handling instruction is only for your reference. Version: IS-2.8 BT-35-1011003 Page 11 of 12 The RGB Series  Test Items and Results of Reliability ------------------------------------------------------------------------------------------------------------------------------------ Test Item Test Conditions Duration/ Cycle Number of Damage Reference -40℃ 30min Temperature Cycle ↑↓1min 85℃ 30min 100 cycles 0/22 JEITA ED-4701 300 303 High Temperature Storage Ta=100℃±5℃ 1000 hrs 0/22 EIAJED-4701 200 201 500 hrs 0/22 Tested with Brightek standard 1000 hrs 0/22 EIAJED-4701 100 103 1000 hrs 0/22 Tested with Brightek standard 1000 hrs 0/22 Tested with Brightek standard 1000 hrs 0/22 Tested with Brightek standard High Humidity Heat Life Test Humidity Heat Storage Life Test Low Temperature Life Test High Temperature Life Test Ta=85℃ RH=85% IF=20mA Ta=85℃ RH=85% Ta=25℃ IF=20mA Ta=-40℃ IF=20mA Ta=85℃ IF=20mA *Criteria for Judging Criteria for Judgment of Pass Item Symbol Condition Min Max Forward Voltage VF IF=20mA - USL*1×1.1 Reverse Current IR VR= 5V - 10μA Luminous Intensity Iv IF=20mA LSL*2×0.7 - [Note] USL*1: Upper Specification Level LSL*2: Lower Specification Level Version: IS-2.8 BT-35-1011003 Page 12 of 12