FR9889
23V, 3A, 340KHz Synchronous Step-Down
DC/DC Converter
Description
The FR9889 is a synchronous step-down DC/DC
converter that provides wide 4.5V to 23V input
voltage range and 3A continuous load current
capability. At light load condition, the FR9889 can
operate at power saving mode to support high
efficiency and reduce power lose.
The FR9889 fault protection includes cycle-by-cycle
current limit, UVLO, output overvoltage protection
and thermal shutdown. The soft-start function
prevents inrush current at turn-on. This device
uses current mode control scheme which provides
fast transient response. Internal compensation
function
reduces
external
compensation
components and simplifies the design process. In
shutdown mode, the supply current is about 1µA.
Features
Low RDS(ON) Integrated Power MOSFET
(120mΩ /100mΩ)
Internal Compensation Function
Internal Power Good Function
Wide Input Voltage Range: 4.5V to 23V
Adjustable Output Voltage Down to 0.925V
3A Output Current
340kHz Switching Frequency
External Programmable Soft-Start or Internal
600µs Soft-Start
Cycle-by-Cycle Current Limit
Over-Temperature Protection with Auto Recovery
OVP, UVLO
Hiccup Short Circuit Protection
SOP-8 Exposed Pad Package
The FR9889 is available in a SOP-8 exposed pad
package,
which
provides
good
thermal
conductance.
Applications
Pin Assignments
Ordering Information
SP Package (SOP-8 Exposed Pad)
FR9889□□□
STB (Set-Top-Box)
LCD Display, TV
Distributed Power System
Networking, XDSL Modem
TR: Tape/Reel
C: Green
Package Type
SP: SOP-8 (Exposed Pad)
Figure 1. Pin Assignment of FR9889
FR9889-1.1-MAY-2016
1
FR9889
Typical Application Circuit
Figure 2. CIN /COUT use Ceramic Capacitors Application Circuit
Figure 3. CIN/COUT use Electrolytic Capacitors Application Circuit
VIN=12V, the recommended BOM list is as below.
VOUT
1.2V
1.8V
2.5V
3.3V
5V
1.2V
1.8V
2.5V
3.3V
5V
R1
3kΩ
9.53kΩ
16.9kΩ
26.1kΩ
44.2kΩ
3kΩ
9.53kΩ
16.9kΩ
26.1kΩ
44.2kΩ
R2
10kΩ
10kΩ
10kΩ
10kΩ
10kΩ
10kΩ
10kΩ
10kΩ
10kΩ
10kΩ
C6
10pF~10nF
10pF~10nF
10pF~10nF
10pF~10nF
10pF~10nF
------
L1
4.7µH
4.7µH
6.8µH
10µH
10µH
4.7µH
4.7µH
6.8µH
10µH
10µH
C2
22µF MLCC x2
22µF MLCC x2
22µF MLCC x2
22µF MLCC x2
22µF MLCC x2
100µF EC x1
100µF EC x1
100µF EC x1
100µF EC x1
100µF EC x1
Table 1. Recommended Component Values
FR9889-1.1-MAY-2016
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FR9889
Functional Pin Description
Pin Name
Pin No.
Pin Function
BST
1
High Side Gate Drive Boost Pin. A capacitor rating between 10nF~100nF must be connected from
this pin to LX. It can boost the gate drive to fully turn on the internal high side NMOS.
VIN
2
Power Supply Input Pin. Placed input capacitors as close as possible from VIN to GND to avoid
noise influence.
LX
3
Power Switching Node. Connect an external inductor to this switching node.
GND
4
Ground Pin. Connect GND to exposed pad.
FB
5
Voltage Feedback Input Pin. Connect FB and VOUT with a resistive voltage divider. This IC
senses feedback voltage via FB and regulates it at 0.925V.
PG
6
Open Drain Power Good Output Pin.
SHDN
7
Enable Input Pin. Pull high to turn on IC, and pull low to turn off IC. Connect VIN with a 100kΩ
resistor for self-startup.
SS
8
Soft-start Pin. This pin controls the soft-start period. Connect a capacitor from SS to GND to set the
soft-start period. If disconnect capacitor from SS to GND, the internal soft-start time will be 600µs.
Exposed Pad
9
Ground Pin. The exposed pad must be soldered to a large PCB area and connected to GND for
maximum power dissipation.
Block Diagram
Figure 4. Block Diagram of FR9889
FR9889-1.1-MAY-2016
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FR9889
Absolute Maximum Ratings (Note 1)
● Supply Voltage VIN ----------------------------------------------------------------------------------------- -0.3V to +25V
● Enable Voltage VSHDN ----------------------------------------------------------------------------------- -0.3V to +25V
● LX Voltage VLX ---------------------------------------------------------------------------------------------- -1V to VIN+0.3V
● BST Pin Voltage VBST ------------------------------------------------------------------------------------- VLX-0.3V to VLX+6.5V
● All Other Pins Voltage ------------------------------------------------------------------------------------ -0.3V to +6V
● Maximum Junction Temperature (TJ) ----------------------------------------------------------------- +150°C
● Storage Temperature (TS) ------------------------------------------------------------------------------- -65°C to +150°C
● Lead Temperature (Soldering, 10sec.) --------------------------------------------------------------- +260°C
● Power Dissipation @TA=25°C, (PD) (Note 2)
SOP-8 (Exposed Pad) ------------------------------------------------------------------------ 2.08W
● Package Thermal Resistance, (θJA)
SOP-8 (Exposed Pad) ------------------------------------------------------------------------ 60°C/W
● Package Thermal Resistance, (θJC)
SOP-8 (Exposed Pad) ------------------------------------------------------------------------ 15°C/W
Note 1:Stresses beyond this listed under “Absolute Maximum Ratings" may cause permanent damage to the device.
2
Note 2:PCB heat sink copper area = 10mm .
Recommended Operating Conditions
● Supply Voltage VIN ----------------------------------------------------------------------------------------- +4.5V to +23V
● Operation Temperature Range ------------------------------------------------------------------------- -40°C to +85°C
FR9889-1.1-MAY-2016
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FR9889
Electrical Characteristics
(VIN=12V, TA=25°C, unless otherwise specified.)
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
0.8
1
mA
1
10
µA
0.925
0.944
V
VIN Quiescent Current
IDDQ
VSHDN =2V, VFB=1.0V
VIN Shutdown Supply Current
ISD
VSHDN =0V
Feedback Voltage
VFB
4.5V≦ VIN≦ 23V
Feedback OVP Threshold Voltage
VOVP
1.25
V
RDS(ON)
120
mΩ
RDS(ON)
100
mΩ
High-Side MOSFET RDS(ON)
Low-Side MOSFET RDS(ON)
(Note 3)
(Note 3)
High-Side MOSFET Leakage Current
High-Side MOSFET Current Limit
(Note 3)
Oscillation Frequency
VSHDN =0V, VLX=0V
ILIMIT(HS)
Minimum Duty
FOSC
Short Circuit Oscillation Frequency
Maximum Duty Cycle
Minimum On Time
ILX(leak)
FOSC(short)
DMAX
(Note 3)
0.906
10
4
4.7
280
340
VUVLO(Vth)
Input Supply Voltage UVLO Threshold
Hysteresis
VUVLO(HYS)
Soft-Start Current
ISS
Internal Soft-Start Period
TSS
A
400
kHz
VFB=0V
110
kHz
VFB=0.8V
88
%
110
ns
4.2
V
400
mV
6
µA
600
µs
TMIN
Input Supply Voltage UVLO Threshold
µA
VIN Rising
VSS=0V
PG High Threshold
VPG (H)
VFB Rising
92
%
PG Low Threshold
VPG (L)
VFB Falling
82
%
IPG
VPG=0.3V
1
mA
PG Sink Current
SHDN Input Low Voltage
VSHDN(L)
SHDN Input High Voltage
VSHDN(H)
ISHDN
SHDN Input Current
Thermal Shutdown Threshold
(Note 3)
TSD
0.4
2
VSHDN =2V
V
V
2
µA
165
°C
Note 3:Not production tested.
FR9889-1.1-MAY-2016
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FR9889
Typical Performance Curves (Continued)
VIN=12V, VOUT=3.3V, C1=10µF×2, C2=22µF×2, L1=10µH, TA=+25°C, unless otherwise noted.
IOUT=0A
IOUT=3A
VIN
20mV/div.
VOUT
20mV/div.
VIN
100mV/div.
IL
1A/div.
VOUT
20mV/div.
VLX
5V/div.
IL
1A/div.
VLX
5V/div.
4ms/div.
4µs/div.
Figure 5. Steady State Waveform
Figure 6. Steady State Waveform
IOUT=0A
VIN
5V/div.
VOUT
IL
IOUT=3A
VIN
1V/div.
VOUT
5V/div.
1V/div.
1A/div.
IL
VLX
5V/div.
1A/div.
VLX
5V/div.
4ms/div.
4ms/div.
Figure 7. Power On through VIN Waveform
Figure 8. Power On through VIN Waveform
IOUT=3A
IOUT=0A
VIN
10V/div.
VOUT
IL
1V/div.
VIN
10V/div.
VOUT
1V/div.
1A/div.
IL
VLX
5V/div.
VLX
1A/div.
5V/div.
100ms/div.
100ms/div.
Figure 9. Power Off through VIN Waveform
Figure 10. Power Off through VIN Waveform
FR9889-1.1-MAY-2016
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FR9889
Typical Performance Curves (Continued)
VIN=12V, VOUT=3.3V, C1=10µF×2, C2=22µF×2, L1=10µH, TA=+25°C, unless otherwise noted.
IOUT=0A
VSHDN
5V/div.
VOUT
IL
IOUT=3A
VSHDN
VOUT
1V/div.
IL
1A/div.
VLX
1V/div.
1A/div.
VLX
5V/div.
5V/div.
4ms/div.
5V/div.
4ms/div.
Figure 11. Power On through SHDN Waveform
IOUT=0A
Figure 12. Power On through SHDN Waveform
IOUT=3A
VSHDN
VOUT
IL
VLX
VSHDN
5V/div.
1V/div.
VOUT
IL
1A/div.
4ms/div.
Figure 13. Power Off through SHDN Waveform
1V/div.
1A/div.
VLX
5V/div.
5V/div.
5V/div.
80µs/div.
Figure 14. Power Off through SHDN Waveform
IOUT=0.1A to 3A
VOUT
200mV/div.
IL
1A/div.
VOUT
IL
1V/div.
2A/div.
400us/div.
10ms/div.
Figure 15. Load Transient Waveform
Figure 16. Short Circuit Test
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FR9889
Typical Performance Curves
VIN=12V, VOUT=3.3V, C1=10µF×2, C2=22µF×2, L1=10µH, TA=+25°C, unless otherwise noted.
90
90
80
80
70
70
Efficiency(%)
100
Efficiency(%)
100
60
50
40
30
20
0.1
1
40
30
5V to 3.3V
12V to 3.3V
19V to 3.3V
10
12V to 1.2V
0
0.01
50
20
5V to 1.2V
10
60
0
0.01
10
0.1
Figure 17. Efficiency vs. Load Current
10
Figure 18. Efficiency vs. Load Current
100
0.95
90
0.945
Feedback Voltage (V)
80
Efficiency(%)
1
Load Current(A)
Load Current(A)
70
60
50
40
30
20
12V to 5V
10
IOUT=400mA
0.94
0.935
0.93
0.925
0.92
0.915
0.91
0.905
19V to 5V
0.9
0
0.01
0.1
1
10
Load Current(A)
Figure 19. Efficiency vs. Load Current
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
Ambient Temperature (℃)
Figure 20. Feedback Voltage vs. Temperature
400
Switching Frequency (kHz)
IOUT=400mA
380
360
340
320
300
280
-40 -30 -20 -10 0
10 20 30 40 50 60 70 80 90
Ambient Temperature (℃)
Figure 21. Switching Frequency vs. Temperature
FR9889-1.1-MAY-2016
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FR9889
Function Description
The FR9889 is a high efficiency, internal
compensation and constant frequency current mode
step-down synchronous DC/DC converter. It has
integrated high-side (120mΩ, typ) and low-side
(100mΩ, typ) power switches, and provides 3A
continuous load current. It regulates input voltage
from 4.5V to 23V, and down to an output voltage as
low as 0.925V.
Input Under Voltage Lockout
When the FR9889 is power on, the internal circuits
will be held inactive until VIN voltage exceeds the
input UVLO threshold voltage. And the regulator
will be disabled when VIN is below the input UVLO
threshold voltage. The hysteretic of the UVLO
comparator is 400mV (typ).
Over Current Protection
Control Loop
Under normal operation, the output voltage is
sensed by FB pin through a resistive voltage divider
and amplified through the error amplifier. The
voltage of error amplifier output is compared to the
switch current to control the RS latch. At the
beginning of each clock cycle, the high-side NMOS
will turn on when the oscillator sets the RS latch, and
turn off when current comparator resets the RS
latch. Then the low-side NMOS will turn on until
the clock period ends.
The FR9889 over current protection function is
implemented by using cycle-by-cycle current limit
architecture. The inductor current is monitored by
measuring the high-side MOSFET series sense
resistor voltage. When the load current increases,
the inductor current will also increase. When the
peak inductor current reaches the current limit
threshold, the output voltage will start to drop.
When the over current condition is removed, the
output voltage will return to the regulated value.
Short Circuit Protection
Enable
The FR9889 SHDN pin provides digital control to
turn on/turn off the regulator. When the voltage of
SHDN exceeds the threshold voltage, the regulator
will start the soft start function. If the SHDN pin
voltage is below the shutdown threshold voltage, the
regulator will turn into the shutdown mode and the
shutdown current will be smaller than 1µA. For
auto start-up operation, connect SHDN to VIN
through a 100kΩ resistor.
Soft Start
The FR9889 employs internal and programmable
external soft start functions to reduce input inrush
current during start up. When SS pin doesn’t
connect to CSS capacitor, the internal soft start time
will be 600µs. When SS pin connects to CSS
capacitor, the CSS capacitor will be charged by a 6µA
current. The equation for the soft start time is
shown as below:
TSS ms =
CSS nF ×VFB
ISS µA
The VFB voltage is 0.925V and the ISS current is 6µA.
If a 0.1µF capacitor is connected from SS pin to
GND, the soft start time will be 15ms.
Output Over Voltage Protection
When the FB pin voltage exceeds 1.25V, the output
over voltage protection function will be triggered and
turn off the high-side/low-side MOSFET.
FR9889-1.1-MAY-2016
The FR9889 provides short circuit protection
function to prevent the device damage from short
condition. When the short condition occurs and the
feedback voltage drops lower than 0.4V, the
oscillator frequency will be reduced to 110kHz and
hiccup mode will be triggered to prevent the inductor
current increasing beyond the current limit. Once
the short condition is removed, the frequency will
return to normal.
Over Temperature Protection
The FR9889 incorporates an over temperature
protection circuit to protect itself from overheating.
When the junction temperature exceeds the thermal
shutdown threshold temperature, the regulator will
be shutdown. And the hysteretic of the over
temperature protection is 50°C (typ).
Internal Compensation Function
The stability of the feedback circuit is controlled
through internal compensation circuits.
This
internal compensation function is optimized for most
applications, and this function can reduce external
R, C components.
PG Signal Output
PG pin is an open-drain output and requires a pull
up resistor. When the sensed output voltage is
below 82% of nominal point, PG is actively held low
in soft-start, standby and shutdown. It is released
when the output voltage rises above 92% of nominal
regulation point.
9
FR9889
Application Information
Output Voltage Setting
The output voltage VOUT is set by using a resistive
divider from the output to FB. The FB pin regulated
voltage is 0.925V. Thus the output voltage is:
VOUT =0.925V× 1+
1
R1
R2
2
Output Capacitor Selection
Table 2 lists recommended values of R1 and R2 for
most used output voltage.
Table 2
A low ESR capacitor is required to keep the noise
minimum.
Ceramic capacitors are better, but
tantalum or low ESR electrolytic capacitors may also
suffice.
When using tantalum or electrolytic
capacitors, a 0.1µF
µF ceramic capacitor should be
placed as close
e to the IC as possible.
Recommended Resistance Values
VOUT
R1
R2
5V
44.2kΩ
10kΩ
3.3V
26.1kΩ
10kΩ
2.5V
16.9kΩ
10kΩ
1.8V
9.53kΩ
10kΩ
1.2V
3kΩ
10kΩ
The output capacitor is used to keep the DC output
voltage and supply the load transient current.
When operating in constant current mode, the
output ripple is determined by four components:
VRIPPLE t =VRIPPLE(C) t +VRIPPLE(ESR)
(t)
RIPPLE
+VRIPPLE(ESL) (t)+V
VNOISE (t)
The following figures show the form of the ripple
contributions.
VRIPPLE(ESR)(t)
Place resistors R1 and R2 close to FB pin to prevent
stray pickup.
Input Capacitor Selection
The use of the input capacitor is filtering the input
voltage ripple and the MOSFETS switching spike
voltage.
Because the input current to the
step-down
down converter is discontinuous, the input
capacitor is required
uired to supply the current to the
converter to keep the DC input voltage. The
capacitor voltage rating should be 1.25 to 1.5 times
greater than the maximum input voltage. The input
capacitor ripple current RMS value is calculated as:
+
VRIPPLE(ESL) (t)
(t)
+
VRIPPLE(C) (t)
(t)
+
VNOISE (t)
(t)
ICIN(RMS) =IOUT × D× 1-D
D
D=
VOUT
VIN
Where D is the duty cycle of the power MOSFET.
This function reaches the maximum value at D=0.5,
D=0.5
and the equivalent RMS current is equal to IOUT/2.
The
following
diagram
is
the
graphical
representation of above equation.
1.75
3A
ICIN(RMS) (A)
1.5
1.25
=
VRIPPLE(t)
2A
1
0.75
1A
0.5
(t)
0.25
0
10 20 30 40 50 60 70 80 90
D (%)
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FR9889
Application Information (Continued)
VRIPPLE(ESR, p-p) =
VOUT
VOUT
× 1×ESR
FOSC ×L
VIN
VRIPPLE(ESL, p-p) =
ESL
×V
L+ESL IN
∆IL=
VOUT
VOUT
× 18×FOSC2 ×L×COUT
VIN
Where FOSC is the switching frequency, L is the
inductance value, VIN is the input voltage, ESR is the
equivalent series resistance value of the output
capacitor, ESL is the equivalent series inductance
value of the output capacitor and the COUT is the
output capacitor.
Low ESR capacitors are preferred to use.
Ceramic, tantalum or low ESR electrolytic capacitors
can be used depending on the output ripple
requirements. When using the ceramic capacitors,
the ESL component is usually negligible.
It is important to use the proper method to eliminate
high frequency noise when measuring the output
ripple. The figure shows how to locate the probe
across the capacitor when measuring output ripple.
Remove the scope probe plastic jacket in order to
expose the ground at the tip of the probe. It gives a
very short connection from the probe ground to the
capacitor and eliminating noise.
Probe Ground
VOUT
VOUT
× 1FOSC ×L
VIN
The following diagram is an example to graphical
represent ∆IL equation.
2
L=4.7µH
1.8
1.6
∆IL (A)
VRIPPLE(C, p-p) =
That will lower ripple current and result in lower
output ripple voltage.
The ∆IL is inductor
peak-to-peak ripple current:
1.4
L=6.8µH
1.2
1
L=10µH
0.8
0.6
0.4
0.2
5
8
11
14
17
20
23
VIN (V)
VOUT=3.3V, FOSC=340kHz
A good compromise value between size and
efficiency is to set the peak-to-peak inductor ripple
current ∆IL equal to 30% of the maximum load
current. But setting the peak-to-peak inductor
ripple current ∆IL between 20%~50% of the
maximum load current is also acceptable. Then
the inductance can be calculated with the following
equation:
∆IL=0.3×IOUT(MAX)
L=
VOUT
GND
Ceramic Capacitor
VIN -VOUT ×VOUT
VIN ×FOSC ×∆IL
To guarantee sufficient output current, peak inductor
current must be lower than the FR9889 high-side
MOSFET current limit. The peak inductor current
is as below:
IPEAK =IOUT(MAX) +
∆IL
2
Inductor Selection
The output inductor is used for storing energy and
filtering output ripple current. But the trade-off
condition often happens between maximum energy
storage and the physical size of the inductor. The
first consideration for selecting the output inductor is
to make sure that the inductance is large enough to
keep the converter in the continuous current mode.
FR9889-1.1-MAY-2016
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FR9889
Application Information (Continued)
Feedforward Capacitor Selection
PCB Layout Recommendation
Internal compensation function allows users saving
time in design and saving cost by reducing the
number of external components. The use of a
feedforward capacitor C6 in the feedback network is
recommended to improve the transient response or
higher phase margin.
The device’s performance and stability are
dramatically affected by PCB layout.
It is
recommended to follow these general guidelines
shown as below:
1. Place the input capacitors and output capacitors
as close to the device as possible. The traces
which connect to these capacitors should be as
short and wide as possible to minimize parasitic
inductance and resistance.
2. Place feedback resistors close to the FB pin.
3. Keep the sensitive signal (FB) away from the
switching signal (LX).
For optimizing the feedforward capacitor, knowing
the cross frequency is the first thing. The cross
frequency (or the converter bandwidth) can be
determined by using a network analyzer. When
getting the cross frequency with no feedforward
capacitor identified, the value of feedforward
capacitor C6 can be calculated with the following
equation:
C6=
4. The exposed pad of the package should be
soldered to an equivalent area of metal on the
PCB. This area should connect to the GND
plane and have multiple via connections to the
back of the PCB as well as connections to
intermediate PCB layers. The GND plane area
connecting to the exposed pad should be
maximized to improve thermal performance.
5. Multi-layer PCB design is recommended.
1
1
1
1
×
×
+
2π×FCROSS
R1 R1 R2
Where FCROSS is the cross frequency.
To reduce transient ripple, the feedforward capacitor
value can be increased to push the cross frequency
to higher region.
Although this can improve
transient response, it also decreases phase margin
and causes more ringing. In the other hand, if
more phase margin is desired, the feedforward
capacitor value can be decreased to push the cross
frequency to lower region.
In general, the
feedforward capacitor range is between 10pF to
10nF.
Figure 22. Recommended PCB Layout Diagram
External Diode Selection
For 5V input applications, it is recommended to add
an external boost diode. This helps improving the
efficiency. The boost diode can be a low cost one,
such as 1N4148.
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FR9889
Outline Information
SOP-8 (Exposed Pad) Package (Unit: mm)
SYMBOLS
UNIT
DIMENSION IN MILLIMETER
MIN
MAX
A
1.25
1.70
A1
0.00
0.15
A2
1.25
1.55
B
0.31
0.51
D
4.80
5.00
D1
3.04
3.50
E
3.80
4.00
E1
2.15
2.41
e
1.20
1.34
H
5.80
6.20
L
0.40
1.27
Note:Followed From JEDEC MO-012-E.
Carrier Dimensions
Life Support Policy
Fitipower’s products are not authorized for use as critical components in life support devices or other medical systems.
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