MST236A054U

MST236A054U Features      Low operating voltage: 5V Ultra low capacitance: 0.7pF Solid-state silicon-avalanche and active circuit triggering technology Back-drive protection for power-down mode Lead-free version available IEC COMPATIBILITY (EN61000-4)  IEC 61000-4-2 (ESD) ±27kV (air), ±16kV (contact)  IEC 61000-4-4 (EFT) Level-3,55A (5/50ns)  IEC 61000-4-5 (Lightning) 6A (8/20μs) Mechanical Characteristics Applications  SOT-23-6L package  Video/Graphics Card  Molding compound flammability rating: UL 94V-0  Digital Visual Interface (DVI)  Marking: Marking Code  USB2.0 Power and Data lines protection  Packaging: Tape and Reel  Notebook and PC Computers  RoHS/WEEE Compliant  Monitors and Flat Panel Displays Circuit Diagram Schematic & PIN Configuration 5 1 3 4 1 6 2 5 3 4 6 2 SOT-23-6L (Top View) Page 1 of 4 MST236A054U Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Power ( tp =8/20μs ) PPP 120 Watts Peak Pulse Current ( tp =8/20μs ) Ipp 6 A Operating Temperature TJ -55 to + 85 °C TSTG -55 to +150 °C Storage Temperature Electrical Parameters (T=25℃) Symbol I Parameter IF IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM IR VBR Working Peak Reverse Voltage VC VBR VRWM V IR VF IT Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT IT Test Current IF Forward Current VF Forward Voltage @ IF IPP Electrical Characteristics MST236A054U Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Symbol VRWM Pin5 to pin2 T=25°C VBR IT=1mA Pin 5 to pin2 Reverse Leakage Current IR Forward Voltage VF Clamping Voltage VC Junction Capacitance Conditions Cj Minimum Typical I/O pin to GND 5.0 V V 5 µA 0.8 1 V 17.5 20 V Pin 5 to pin2 IPP=6A, tp=8/20μs Units 6.0 VRWM=5V, T=25°C IT=10mA Maximum VR = 0V, f = 1MHz I/O pin to GND 0.8 pF VR = 0V, f = 1MHz Between I/O pins 0.5 pF Page 2 of 4 MST236A054U Typical Characteristics Figure 2: Power Derating Curve 10 110 100 Percent of Rated Power for Ipp Ppp – Peak Pulse Power - Ppp(KW) Figure 1: Peak Pulse Power vs. Pulse Time 1 0.1 0.01 0.1 1 10 100 90 80 70 60 50 40 30 20 10 0 1,000 0 25 td – Pulse Duration - µs 50 75 100 125 150 Ambient Temperature - TA (℃) Figure 3: Pulse Waveform Figure 4: Clamping Voltage vs. Peak Pulse Current 110 90 Percent Ipp 80 Clamping Voltage -VC(V) Waveform Paramters tr=8µs td=20µs 100 70 e-t 60 50 40 td=Ipp/2 30 20 10 0 0 5 10 15 20 25 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 0 12 1 2 3 4 5 6 7 8 9 10 11 Peak Pulse Current -Ipp(A) Time (µs) Figure 5: Capacitance vs. Reverse Voltage Figure 6: Forward Voltage vs. Forward Current 5 8 7 Forward Voltage–VF(V) Capacitance–Cj (pF) f=1 MHz 4 I/O Pin to Gnd 3 2 Between I/O Lines 1 6 5 4 3 Test Waveform Paramters tr=8µs td=20µs 2 1 0 0 0 1 2 3 4 5 Reverse Voltage–VR (V) 0 2 4 6 8 Forward Current–IF(A) Page 3 of 4 10 12 MST236A054U Outline Drawing – SOT-23-6L PACKAGE OUTLINE b E E1 DIMENSIONS SEE DETAIL A e e1 D 0.2 A θ A2 c L A1 X SYMBOL INCHES MIN MAX MILLIMETER MIN MAX A 0.041 0.049 1.050 1.250 A1 0.000 0.004 0.000 0.100 A2 0.041 0.045 1.050 1.150 D 0.111 0.119 2.820 3.020 E 0.059 0.067 1.500 1.700 E1 0.104 0.116 2.650 2.950 e 0.037(BSC) 0.950(BSC) e1 0.071 0.079 1.800 2.000 L 0.012 0.024 0.300 0.600 θ 0ｏ 8ｏ 0ｏ 8ｏ Notes THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT DIMENSIONS G C Y P Z YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S DIM INCHES MILLIMETERS Z 0.141 3.60 G 0.055 1.40 P 0.037 0.95 X 0.024 0.60 Y 0.043 1.10 C (0.098) (2.50) Page 4 of 4 MANUFACTURING GUIDELINES ARE MET.