VS2622AE
20V/56A N-Channel Advanced Power MOSFET
V DS
20
V
R DS(on),TYP@ VGS=10V
4.8
mΩ
N-Channel,2.5V logic level control
R DS(on),TYP@ VGS=4.5V
5.6
mΩ
Enhancement mode
ID
56
A
Features
Low on-resistance RDS(on) @ VGS=2.5 V
PDFN3333
Fast Switching and High efficiency
Pb-free lead plating; RoHS compliant
Part ID
Package Type
Marking
VS2622AE
PDFN3333
2622AE
Tape and reel
information
5000pcs/Reel
Maximum ratings, at T A=25 °C, unless otherwise specified
Symbol
Parameter
Rating
Unit
V(BR)DSS
Drain-Source breakdown voltage
20
V
VGS
Gate-Source voltage
±12
V
IS
Diode continuous forward current
TA=25°C
56
A
TC =25°C
56
A
ID
Continuous drain current @VGS=4.5V
TC =100°C
35
A
TC =25°C
220
A
TA=25°C
20
A
TA=70°C
16
A
33
mJ
IDM
Pulse drain current tested ①
IDSM
Continuous drain current @VGS=4.5V
②
EAS
Avalanche energy, single pulsed
PD
Maximum power dissipation
TC =25°C
29
W
PDSM
Maximum power dissipation ③
TA=25°C
3.6
W
TSTG , TJ
Storage and junction temperature range
-55 to 150
°C
Typical
Unit
Thermal Characteristics
Symbol
Parameter
RθJC
Thermal Resistance, Junction-to-Case
4.3
°C/W
R JA
Thermal Resistance, Junction-to-Ambient
35
°C/W
Copyright Vanguard Semiconductor Co., Ltd
Rev A – JUN, 2018
www.vgsemi.com
VS2622AE
20V/56A N-Channel Advanced Power MOSFET
Electrical Characteristics
Symbol
Parameter
Condition
Min.
Typ.
Max.
Unit
Static Electrical Characteristics @ Tj = 25°C (unless otherwise stated)
Drain-Source Breakdown Voltage
VGS=0V, ID=250μA
20
--
--
V
Zero Gate Voltage Drain Current(Tj=25℃)
VDS=20V,VGS=0V
--
--
1
μA
Zero Gate Voltage Drain Current(Tj=125℃)
VDS=20V,VGS=0V
--
--
100
μA
IGSS
Gate-Body Leakage Current
VGS=±12V,VDS=0V
--
--
±100
nA
VGS(TH)
Gate Threshold Voltage
VDS=VGS,ID=250μA
0.4
0.7
1
V
RDS(ON)
Drain-Source On-State Resistance ④
VGS=10V, ID=15A
--
4.8
6.7
mΩ
RDS(ON)
Drain-Source On-State Resistance ④
VGS=4.5V, ID=10A
--
5.6
7.8
mΩ
RDS(ON)
Drain-Source On-State Resistance ④
VGS=2.5V, ID=4A
--
7.7
10.8
mΩ
1040
1290
1540
pF
130
200
270
pF
120
180
240
pF
--
2.5
--
Ω
--
18
--
nC
--
7.5
--
nC
--
8.5
--
nC
--
3.1
--
μs
V(BR)DSS
IDSS
Dynamic Electrical Characteristics @ T j= 25°C (unless otherwise stated)
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate Resistance
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
VDS=10V,VGS=0V,
f=1MHz
f=1MHz
VDS=10V,ID=10A,
VGS=4.5V
Switching Characteristics
t d(on)
Turn-on Delay Time
tr
Turn-on Rise Time
ID=10A,
--
4.6
--
μs
t d(off)
Turn-Off Delay Time
RG=3Ω,
--
9
--
μs
tf
Turn-Off Fall Time
--
9.4
--
μs
VDD=10V,
VGS=4.5V
Source- Drain Diode Characteristics@ Tj = 25°C (unless otherwise stated)
VSD
Forward on voltage
ISD=10A,VGS=0V
--
0.8
1.2
V
t rr
Reverse Recovery Time
Tj=25℃,Isd=10A,
--
13
--
ns
Qrr
Reverse Recovery Charge
--
17
--
nC
VGS=0V
di/dt=500A/μs
NOTE:
① Repetitive rating; pulse width limited by max junction temperature.
② Limited by TJmax, starting TJ = 25°C, L = 0.1mH, RG = 25Ω, IAS = 20A, VGS =4.5V. Part not recommended for use above this value
③ The power dissipation PDSM is based on RθJA and the maximum allowed junction temperature of 150°C.
④ Pulse width ≤ 300μs; duty cycle≤ 2%.
Copyright Vanguard Semiconductor Co., Ltd
Rev A – JUN, 2018
www.vgsemi.com
VS2622AE
20V/56A N-Channel Advanced Power MOSFET
VDS, Drain -Source Voltage (V)
Fig1. Typical Output Characteristics
Normalized Threshold Voltage (Vth)
ID, Drain-Source Current (A)
Typical Characteristics
Tj - Junction Temperature (°C)
Fig2. Normalized Threshold Voltage Vs. Temperature
Tc, Case Temperature (°C)
Normalized On Resistance
ID, Drain-Source Current (A)
Fig2. Maximum Drain Current Vs.Case Temperature
Fig3. Typical Transfer Characteristics
Fig4. Normalized On-Resistance Vs. Temperature
ID - Drain Current (A)
Tj - Junction Temperature (°C)
ISD, Reverse Drain Current (A)
VGS, Gate -Source Voltage (V)
VSD, Source-Drain Voltage (V)
Fig5. Typical Source-Drain Diode Forward Voltage
Copyright Vanguard Semiconductor Co., Ltd
Rev A – JUN, 2018
VDS, Drain -Source Voltage (V)
Fig6. Maximum Safe Operating Area
www.vgsemi.com
VS2622AE
20V/56A N-Channel Advanced Power MOSFET
C, Capacitance (pF)
VGS, Gate-Source Voltage (V)
Typical Characteristics
VDS, Drain-Source Voltage (V)
Qg - Total Gate Charge (nC)
Fig7. Typical Capacitance Vs. Drain-Source Voltage
Fig8. Typical Gate Charge Vs. Gate-Source
Voltage
VSD, Source-Drain Voltage (V)
Thermal Resistance)
ZqJA Normalized Transient
Fig7. Typical Source-Drain Diode Forward Voltage
Pulse Width (s)
Fig9. Normalized Maximum Transient Thermal Impedance
Fig10. Unclamped Inductive Test Circuit and
Fig11. Switching Time Test Circuit and waveforms
waveforms
Copyright Vanguard Semiconductor Co., Ltd
Rev A – JUN, 2018
www.vgsemi.com
VS2622AE
20V/56A N-Channel Advanced Power MOSFET
Marking Information
Vs
2622AE
XXXYWW
1st line:
2nd line:
3rd line:
Dot:
Vanguard Code(Vs)
Part Number(2622AE)
Date code (XXXYWW)
XXX: Wafer Lot Number Code , code changed with Lot Number
Y:
Year Code,(e.g. E=2017, F=2018, G=2019, H=2020, etc)
WW: Week Code (01 to 53)
Pin1 identification
Copyright Vanguard Semiconductor Co., Ltd
Rev A – JUN, 2018
www.vgsemi.com
VS2622AE
20V/56A N-Channel Advanced Power MOSFET
PDFN3333 Package Outline Data
Symbol
DIMENSIONS ( unit : mm )
Min
Typ
Max
A
0.7
0.75
0.8
Notes:
b
0.25
0.3
0.35
1. Follow JEDEC MO-240 variation CA.
C
0.1
0.15
0.25
2. Dimensions "D1" and "E1" do NOT include mold flash
D
3.25
3.35
3.45
protrusions or gate burrs.
D1
3
3.1
3.2
3. Dimensions "D1" and "E1" include interterminal flash or
D2
1.78
1.88
1.98
protrusion. Interterminal flash or protrusion shall not exceed
D3
--
0.13
--
E
3.2
3.3
3.4
E1
3
3.15
3.2
E2
2.39
2.49
2.59
0.65 BSC
e
H
0.3
0.39
0.5
L
0.3
0.4
0.5
L1
--
0.13
--
θ
--
10°
12°
M
*
*
0.15
* Not specified
Copyright Vanguard Semiconductor Co., Ltd
Rev A – JUN, 2018
0.25mm per side.
Customer Service
Sales and Service:
sales@vgsemi.com
Vanguard Semiconductor CO., LTD
TEL: (86-755) -26902410
FAX: (86-755) -26907027
WEB: www.vgsemi.com
www.vgsemi.com