BL-HKC36P-TRB

BRIGHT LED ELECTRONICS CORP. SINCE 1981 Specification for Approval ● ● SAMPLES  ATTACHED AREA  DEVICE NUMBER: BL-HKC36P-TRB CUSTOMER: PAGE DATE 2015/1/23 1 2 3 4 5 1.0 1.0 1.0 1.0 1.0 6 7 8 CONTENTS 1.0 1.0 1.0 Initial Released FOR CUSTOMER’S APPROVAL STAMP OR SIGNATURE APPROVED PURCHASE 佰鴻工業股份有限公司 MANUFACTURE QUALITY ENGINEERING ISSUED APPROVED PREPARED 張 占 任 2015.01.23 2015.01.23 2015.01.23 孝 嚴 旭 穎 BRIGHT LED ELECTRONICS CORP. 新北市板橋區和平路 19 號 3 樓 3F., No.19, He Ping Road, Ban Qiao Dist., New Taipei City, Taiwan Tel: +886-2-29591090 BRIGHT LED ELECTRONICS CORP. BL-HKC36P-TRB SINCE 1981 ● Features: ●Package Dimensions: 1. Emitted Color : Super Yellow 2. Lens Appearance : Water Clear 3. Mono-color type. 4. 1.6x0.8x0.6mm(0603) standard package 5. Suitable for all SMT assembly methods. 6. Compatible with infrared and vapor phase reflow solder process. 7. Compatible with automatic placement equipment. 8. This product doesn’t contain restriction Substance, comply ROHS standard. NOTES: 1.All dimensions are in millimeters (inches). 2.Tolerance is ± 0.10mm (0.004”) unless otherwise specified. 3.Specifications are subject to change without notice. ● Applications: 1. Automotive: Dashboards, stop lamps, turn signals. 2. Backlighting: LCDs, Key pads advertising. 3. Status indicators: Comsumer & industrial electronics. 4. General use. ● Absolute Maximum Ratings(Ta=25℃) Parameter Symbol Rating Unit Power Dissipation Pd 52 mW Forward Current IF 20 mA Peak Forward Current ＊1 IFP 100 mA Reverse Volage VR 5 V Operating Temperature Topr -40℃~85℃ - Storage Temperature Tstg -40℃~85℃ - Soldering Temperature Tsol See Page6 - ＊ 1 Condition for IFp is pulse of 1/10 duty and 0.1msec width. Ver.1.0 Page 1 of 8 BRIGHT LED ELECTRONICS CORP. BL-HKC36P-TRB SINCE 1981 ● Electrical and optical characteristics(Ta=25℃) Parameter Symbol Condition Min. Typ. Max. Unit Forward Voltage Vf IF=20mA - 2.2 2.6 V Luminous Intensity Iv IF=20mA 63 120 - mcd Reverse Current IR VR=5V - - 100 µA Peak Wave Length λp IF=20mA - 590 - nm Dominant Wave Length λd IF=20mA 584 - 594 nm Spectral Line Half-width Δλ IF=20mA - 15 - nm Viewing Angle 2θ1/2 IF=20mA - 120 - deg ● Typical Electro-Optical Characteristics Curves Fig.2 Forward current derating curve Fig.1 Relative intensity vs. wavelength vs. ambient temperature 1.0 30 20 Forward current(mA) Relative radiant intensity 25 0.5 15 10 5 0 0 540 590 20 640 Wavelength (nm) 60 100 3.0 2.5 30 20 10 (Normalized @ 20mA) Relative luminous intensity 40 2.0 1.5 1.0 0.5 0 1 2 3 4 5 0 -40 Forward voltage(V) -20 0 20 60 40 A mbient temperature Ta( C) Fig.6 Radiation diagram Fig.5 Relative luminous intensity vs. forward current 0 2.0 10 20 30 1.5 Relative radiant intensity Relative luminous intensity (@20mA) 80 Fig.4 Relative luminous intensity vs. ambient temperature Fig.3 Forward current vs. forward voltage 50 Forward current (mA) 40 A mbient temperature Ta( C) 1.0 0.5 40 1.0 0.9 50 0.8 60 70 0.7 80 90 0 10 20 30 40 50 0.5 0.3 0.1 0.2 0.4 0.6 Forward current (mA) Ver.1.0 Page 2 of8 BRIGHT LED ELECTRONICS CORP. BL-HKC36P-TRB SINCE 1981 ● Tapping and packaging specifications(Units: mm) Quantity:1000-4000PCS CATHODE 8.0 ± 0.3 ANODE USER DIRECTION OF FEED ● Package Method:(unit:mm)Vacuum 12 bag/box 4000 pcs/reel 200 Bar Code Label 245 220 220 Aluminum Foil Bag 185 645 6 box/carton 210 470 Ver.1.0 Page 3 of 8 BRIGHT LED ELECTRONICS CORP. BL-HKC36P-TRB SINCE 1981 ● Bin Limits I n t e n s i t y B i n L i m i ts ( A t 2 0 m A ) BIN CODE Min. (mcd) Max. (mcd) P 63 94 Q 94 140 R 140 210 S 210 317 To l e r a n c e f o r e a c h B i n l i m i t i s ± 1 5 % . C o l o r B i n L i m i ts ( A t 2 0 m A ) BIN CODE Min. (nm) Max. (nm) 3 584 586 4 586 588 5 588 590 6 590 592 7 592 594 To l e r a n c e f o r e a c h B i n l i m i t i s ± 1 n m . V F B i n L i m i ts ( A t 2 0 m A ) BIN CODE Min.(v) Max.(v) B 1.8 2.0 C 2.0 2.2 D 2.2 2.4 E 2.4 2.6 To l e r a n c e f o r e a c h B i n l i m i t i s ± 0 . 0 5 V. ● B IN： x x x VF BIN CODE Color BIN CODE Intensity BIN CODE Ver.1.0 Page 4 of 8 BRIGHT LED ELECTRONICS CORP. BL-HKC36P-TRB SINCE 1981 ● Reliability Test Classification Endurance Test Test Item Reference Standard MIL-STD-750D:1026 Operation Life MIL-STD-883D:1005 JIS-C-7021 :B-1 High Temperature MIL-STD-202F:103B High Humidity JIS-C-7021 :B-11 Storage High MIL-STD-883:1008 Temperature JIS-C-7021 :B-10 Storage Low Temperature JIS-C-7021 :B-11 Storage Temperature Cycling MIL-STD-202F:107D MIL-STD-750D:1051 MIL-STD-883D:1010 JIS-C-7021 :A-2 Test Conditions Result Ta: Under room temperature Test time:1,000hrs IF=Product Recommended IF Ta:85±5℃ RH:90%-95% Test time:240hrs Ta:100±5℃ Test time:1,000hrs 0/32 0/32 Ta: -40±5℃ Test time=1,000hrs 0/32 Ta:-35±5 ℃ ~25±5 ℃ ~85±5 ℃ ~25±5 ℃ 30min 5min 30min 5min MIL-STD-202F:107D(1980) Ta:-40±5℃ ~+85±5℃ Thermal Shock MIL-STD-750D:1051(1995) 10min 10 min Environmental MIL-STD-883D:1011(1991) Time: 20min/cycle 10cycle Test MIL-STD-883:2003 Ta:230±5℃ Wetting MIL-STD-202F:208D Time:5±0.5s balance MIL-STD-883D:2003 Solder Resistance MIL-STD-202F:210A MIL-STD-883D:1011 JIS-C-7021 :A-1 0/32 Ta:260±10℃ Time:10±1s 0/32 0/32 0/32 0/32 ● Judgment criteria of failure for the reliability Measuring items Forward voltage Reverse current Luminous intensity Note: Symbol VF ( V) IR(uA) Iv ( mcd ) Measuring conditions IF=20mA VR=5V IF=20mA Judgement criteria for failure Initial Level*1.1 Over U*2 Initial Level*0.7 1.U means the upper limit of specified characteristics. 2. Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test. Ver.1.0 Page 5 of 8 BRIGHT LED ELECTRONICS CORP. BL-HKC36P-TRB SINCE 1981 ●IR-Reflow Soldering RAMP-UP 3°c/s max Max260°C Max 10sec. 255°C 245°C TEMPERATURE(°c) 240°C 217°C 200°C 30 sec. Max 150°C RAMP-UP 3°c/s max RAMP-DOWN 6°c/s max 60-120sec. 60-120sec. TIME(sec.) 1. Avoid any external stress applied to the resin while the LEDs are at high temperature, especially during soldering . 2. Avoid rapid cooling or any excess vibration during temperature ramp-down process 3. Although the soldering condition is recommended above, soldering at the lowest possible temperature is feasible for the LEDs Ver.1.0 Page 6of 8 BRIGHT LED ELECTRONICS CORP. BL-HKC36P-TRB SINCE 1981 ●Dip Soldering TEMPERATURE( °C) 300 Max:260℃,5sec. Suggest:2~3sec. 250 200 150 100 Fluxing 50 30 Preheat 10 20 30 40 50 60 70 80 90 100 110 120 TIME(sec.) 1. Please avoid any external stress applied to the lead-frames and epoxy while the LEDs are at high temperature,especially during soldering 2. DIP soldering and hand soldering should not be done more than one time. 3. After soldering, avoid the epoxy lens from mechanical shock or vibration until the LEDs are back to room temerature. 4. Avoid rapid cooling during temperature ramp-down process 5. Although the soldering condition is recommended above, soldering at the lowest possible temperature is feasible for the LEDs ● IRON Soldering 300℃ Within 3 sec.,One time only. Ver.1.0 Page 7of 8 BRIGHT LED ELECTRONICS CORP. BL-HKC36P-TRB SINCE 1981 ● Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the BRIGHT LEDs. ● Storage: In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 168 hours. b. Stored at less than 30% RH. (3) Devices require baking before mounting, if: (2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions: 48 hours at 60℃±3℃. ● Package and Label of Products: (1) Package: Products are packed in one bag of 4000 pcs (one taping reel) and a label is attached on each bag. (2) Label: BRIGHT LED LOGO B Part No. Quantity BIN. Sealing Date x xx xx Year Month xx Day Manufacture Location Ver.1.0 Page 8 of 8