SMD1812P200TF

TM Product: SMD1812P200TF Revision: D Date: April 10, 2008 Page: 1 of 1 EVERFUSE POLYTRONICS TECHNOLOGY CORP. Polymeric PTC Fuse 24-1,Industry E.4th Rd. Science Park, Hsinchu,Taiwan, R.O.C. TEL: +886-3-5643931 FAX: +886-3-5644624 Device Specification ELECTRICAL CHARACTERISTICS Part Number I hold (A) Itrip (A) Vmax (Vdc) I max (A) Pd max. (W) SMD1812P200TF 2.00 3.50 8 100 0.8 Maximum Time To Trip Current Time (A) (Sec.) 8.00 2.00 Resistance R min (Ω) R 1max (Ω) 0.020 0.060 Note: I hold = Hold current: maximum current device will pass without tripping in 20℃ still air. I trip = Trip current: minimum current at which the device will trip in 20℃ still air. Vmax = Maximum voltage device can withstand without damage at rated current (I max) I max = Maximum fault current device can withstand without damage at rated voltage (Vmax) Pd = Power dissipated from device when in the tripped state at 20℃ still air. R min= Minimum resistance of device in initial (un-soldered) state. R 1max= Maximum resistance of device at 20℃ measured one hour after tripping or reflow soldering of 260℃ for 20 sec. *Value specified were determined using the PCB with 0.030”*1.5oz copper traces. *Customer should verify the device performance in their specified conditions. Caution: Operation beyond the specified rating may result in damage and possible arcing and flame. Recognitions: FIGURE Marking: SOLDER PAD LAYOUTS Polytronics/ Polystar Logo P200 Part Identification Note: Polystar is Polytronics’s manufacturing site in China. The Polystar ID marking shall appear on smallest package. PHYSICAL DIMENSIONS (mm) Part Number SMD1812P200TF A B C D E Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. 4.37 4.73 3.07 3.41 0.81 1.20 0.30 1.20 0.25 0.50 ◎ Specifications are subject to change without notice.