BL-HB335B-TRB-6

BRIGHT LED ELECTRONICS CORP. SINCE 1981 Specification for Approval ● ● SAMPLES  ATTACHED AREA  DEVICE NUMBER: BL-HB335B-TRB CUSTOMER: PAGE DATE 2015/1/22 1 2 3 4 5 1.0 1.0 1.0 1.0 1.0 6 7 CONTENTS 1.0 1.0 Initial Released FOR CUSTOMER’S APPROVAL STAMP OR SIGNATURE APPROVED PURCHASE 佰鴻工業股份有限公司 MANUFACTURE ISSUED QUALITY ENGINEERING APPROVED PREPARED BRIGHT LED ELECTRONICS CORP. 新北市板橋區和平路 19 號 3 樓 3F., No.19, He Ping Road, Ban Qiao Dist., New Taipei City, Taiwan Tel: +886-2-29591090 張 占 任 2015.01.22 2015.01.22 2015.01.22 孝 嚴 旭 穎 BRIGHT LED ELECTRONICS CORP. BL-HB335B-TRB SINCE 1981 ● Features: 1. Emitted Color : Super Blue ●Package Dimensions: 2. Lens Appearance : Water Clear. 2.0 3. Mono-color type. 1.25 4. 2.0x1.25x1.0mm(0805) standard package. 5. Suitable for all SMT assembly methods. 6. Compatible with infrared and vapor phase 1.0±0.1 reflow solder process. 7. Compatible with automatic placement equipment. 2.0 1.25 8. This product doesn’t contain restriction Substance, comply ROHS standard. NOTES: 1.All dimensions are in millimeters (inches). 2.Tolerance is ±0.10mm (0.004”) unless otherwise specified. 3.Specifications are subject to change without notice. ● Applications: 1. Automotive : Dashboards, stop lamps, turn signals. 2. Backlighting : LCDs, Key pads advertising. 3. Status indicators : Comsumer & industrial electronics. 4. General use. ● Absolute Maximum Ratings(Ta=25℃) Parameter Symbol Rating Unit Power Dissipation Pd 72 mW Forward Current IF 20 mA Peak Forward Current ＊1 IFP 100 mA Reverse Volage VR 5 V Operating Temperature Topr -40℃~85℃ - Storage Temperature Tstg -40℃~85℃ - Soldering Temperature Tsol See Page6 - ＊ 1 Condition for IFP is pulse of 1/10 duty and 0.1msec width. Ver.1.0 Page 1 of 7 BRIGHT LED ELECTRONICS CORP. BL-HB335B-TRB SINCE 1981 ● Electrical and optical characteristics(Ta=25℃) Parameter Symbol Condition Min. Typ. Max. Unit Forward Voltage Vf IF=5mA - 2.8 3.2 V Luminous Intensity Iv IF=5mA 12.3 25 - mcd Reverse Current IR VR=5V - - 1 µA Peak Wave Length λp IF=5mA - 460 - nm Dominant Wave Length λd IF=5mA 465 470 nm Spectral Line Half-width Δλ IF=5mA - 30 - nm Veiwing Angle 2θ1/2 IF=5mA - 120 - deg ● Typical Electro-Optical Characteristics Curves Fig.2 Forward c urrent derating curve Fig.1 Relativ e intensity vs. wavelength vs . am bient temperature 1.0 30 Forward current (mA) Relative radiant intensity 25 0.5 20 15 10 5 0 0 410 460 20 510 W av elength (nm) 50 100 2.5 30 20 10 (Normalized @20mA) Relative Luminous intensity Forward current (mA) 80 3.0 40 2.0 1.5 1.0 0.5 1 2 3 4 0 -40 5 -20 Forward voltage(V) 0 20 40 60 Ambient temperature Ta( C) Fig.5 Relative lum inous intensity v s. forward current Fig.6 Radiation diagram 0 2.0 10 20 30 1.5 Relative radiant intensity Relative luminous intensity (@20mA) 60 Fig.4 Relativ e lum inous intensity vs. am bient tem perature Fig.3 Forward c urrent v s. forward voltage 0 40 Ambient tempe ratu re Ta( C) 1.0 0.5 1 .0 40 0 .9 50 0 .8 60 70 0 .7 80 90 0 10 20 30 40 50 0 .5 0.3 0.1 0.2 0.4 0 .6 Forward c urrent (mA) Ver.1.0 Page 2 of 7 BRIGHT LED ELECTRONICS CORP. BL-HB335B-TRB SINCE 1981 ● Tapping and packaging specifications(Units: mm) Quantity:1000-3000PCS CATHODE 8.0 ± 0.3 ANODE USER DIRECTION OF FEED ● Package Method:(unit:mm) Vacuum 12 bag/box 3000 pcs/reel 200 Bar Code Label 245 220 220 Aluminum Foil Bag 185 645 6 box/carton 210 470 Ver.1.0 Page 3 of 7 BRIGHT LED ELECTRONICS CORP. BL-HB335B-TRB SINCE 1981 ● Bin Limits I n t e n s i t y B i n L i m i ts ( A t 5 m A ) BIN CODE Min. (mcd) Max. (mcd) K 12.3 18.5 L 18.5 28 M 28 42 N 42 63 To l e r a n c e f o r e a c h B i n l i m i t i s ± 1 5 % C o l o r B i n L i m i ts ( A t 5 m A ) BIN CODE Min. (nm) Max. (nm) 465 470 4 To l e r a n c e f o r e a c h B i n l i m i t i s ± 1 n m . V F B i n L i m i ts ( A t 5 m A ) BIN CODE Min.(v) Max.(v) E 2.4 2.6 F 2.6 2.8 G 2.8 3.0 H 3.0 3.2 To l e r a n c e f o r e a c h B i n l i m i t i s ± 0 . 0 5 V. ● B IN： x x x VF BIN CODE Color BIN CODE Intensity BIN CODE Ver.1.0 Page 4 of 7 BRIGHT LED ELECTRONICS CORP. BL-HB335B-TRB SINCE 1981 ● Reliability Test Classification Endurance Test Environmental Test Test Item Reference Standard MIL-STD-750D:1026 Operation Life MIL-STD-883D:1005 JIS-C-7021 :B-1 High Temperature MIL-STD-202F:103B High Humidity JIS-C-7021 :B-11 Storage High MIL-STD-883:1008 Temperature JIS-C-7021 :B-10 Storage Low Temperature JIS-C-7021 :B-11 Storage MIL-STD-202F:107D Temperature MIL-STD-750D:1051 Cycling MIL-STD-883D:1010 JIS-C-7021 :A-2 MIL-STD-202F:107D(1980) Thermal Shock MIL-STD-750D:1051(1995) MIL-STD-883D:1011(1991) Test Conditions Result Ta: Under room temperature Test time:1,000hrs IF=Product Recommended IF Ta:85±5℃ RH:90%-95% Test time:240hrs Ta:100±5℃ Test time:1,000hrs 0/32 0/32 0/32 Ta: -40±5℃ Test time=1,000hrs 0/32 Ta:-35±5℃~25±5℃~85±5℃~25±5℃ 30min 5min 30min 5min 0/32 Ta:-40±5℃ ~+85±5℃ 10min 10 min Time: 20min/cycle 10cycle 0/32 Wetting balance MIL-STD-883:2003 MIL-STD-202F:208D MIL-STD-883D:2003 Ta:230±5℃ Time:5±0.5s 0/32 Solder Resistance MIL-STD-202F:210A MIL-STD-883D:1011 JIS-C-7021 :A-1 Ta:260±10℃ Time:10±1s 0/32 ● Judgment criteria of failure for the reliability Measuring items Forward voltage Reverse current Luminous intensity Note: Symbol VF ( V) IR(uA) Iv ( mcd ) Measuring conditions IF=5mA VR=5V IF=5mA Judgement criteria for failure Initial Level*1.1 Over U*2 Initial Level*0.7 1.U means the upper limit of specified characteristics. 2.Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test. Ver.1.0 Page 5 of 7 BRIGHT LED ELECTRONICS CORP. BL-HB335B-TRB SINCE 1981 RAMP-UP 3°c/s max Max260°C MAX10S 255°C 245°C TEMPERATURE(°c) 240°C 217°C 200°C 30 sec Max 150°C RAMP-UP 3°c/s max RAMP-DOWN 6°c/s max 60-120S 60-120S TIME(sec) IR-REFLOW 1. Avoid any external stress applied to the resin while the LEDs are at high temperature, especially during soldering . 2. Avoid rapid cooling or any excess vibration during temperature ramp-down process 3. Although the soldering condition is recommended above, soldering at the lowest possible temperature is feasible for the LEDs Temperature( C) laminar wave Fluxing Preheat Time(s) 1. Please avoid any external stress applied to the lead-frames and epoxy while the LEDs are at high temperature,especially during soldering 2. DIP soldering and hand soldering should not be done more than one time. 3. After soldering, avoid the epoxy lens from mechanical shock or vibration until the LEDs are back to room temerature. 4. Avoid rapid cooling during temperature ramp-down process 5. Although the soldering condition is recommended above, soldering at the lowest possible temperature is feasible for the LEDs. ● Handling : Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such as the sand blast and the metal hook. Ver.1.0 Page 6 of 7 BRIGHT LED ELECTRONICS CORP. BL-HB335B-TRB SINCE 1981 ● Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the BRIGHT LEDs. ● Storage: In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 168 hours. b. Stored at less than 30% RH. (3) Devices require baking before mounting, if: (2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions: 48 hours at 60℃±3℃. ● Package and Label of Products: (1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached on each bag. (2) Label: B Part No Quantity BIN. Sealing Date x xx xx xx x xx xx Year Month xx Year Month Day Manufacture Location Ver.1.0 Page 7 of 7