TMAX-0530-2R2-M

TDG HOLDING CO., LTD. 天通控股股份有限公司 Revision: Control No.: A3 Revision Record Control No. Revision A0 A1 A2 Description Initial release TMAX-0530-4R7-M Add TMAX-0530-100-M Add TMAX-0530-1R0-M Date Drawn Approved 2018/10/23 Heter Roger 2018/10/29 Heter Roger 2018/11/14 Heter Roger 2018/11/21 Heter Roger Add TMAX-0530-R33-M TMAX-0530-R68-M A3 TMAX-0530-2R2-M TMAX-0530-3R3-M TMAX-0530-6R8-M 1 / 12 http://www.tdgcore.com TDG HOLDING CO., LTD. 天通控股股份有限公司 Revision: Control No.: A3 TMAX-0530-XXX-M Molded Power Inductor Features       Low profile Low core loss and low DCR High rated current High performance (Isat) realized by metal dust core RoHS compliant and Halogen Free Low EMI and low noise Applications       Voltage Regulator Module DC/DC converters Thin type on-board power supply module for exchanger Graphics cards Laptops and PCs SSD modules Product Description TMAX - 0530 - 1R0 - M Tolerance Inductance Dimensions Product Series M=±20% 1R0=1.0μH Dimensions in millimeters 2 / 12 http://www.tdgcore.com A 5.4±0.30 B 5.2±0.20 C 3.0 Max. D 2.1±0.20 E 1.2±0.20 F 0~0.15 TDG HOLDING CO., LTD. 天通控股股份有限公司 Revision: Control No.: A3 Recommend Land Pattern Dimensions in millimeters 6.0 2.5 2.2 Marking   The inductor is marked with a 3-digit code by ink. For example: 1R0→ 1.0μH, R10→ 0.1μH. Inductance: 1.0μH Specifications Inductance DCR (mΩ) Part No. Saturation Heat Rating Current Current Isat (Amps.) Idc (Amps.) L0(μH) Tolerance Typ. Max. Typ. Typ. TMAX-0530-R33-M 0.33 ±20% 4.55 5.15 19 14 TMAX-0530-R68-M 0.68 ±20% 9.0 10.0 13 11 TMAX-0530-1R0-M 1.0 ±20% 12 13.5 11 9.0 TMAX-0530-2R2-M 2.2 ±20% 25 29 9.0 6.5 TMAX-0530-3R3-M 3.3 ±20% 33 38 8.0 5.5 TMAX-0530-4R7-M 4.7 ±20% 51 60 6.0 4.5 TMAX-0530-6R8-M 6.8 ±20% 80 90 4.5 3.5 TMAX-0530-100-M 10.0 ±20% 110 125 4.0 3.0 3 / 12 http://www.tdgcore.com TDG HOLDING CO., LTD. 天通控股股份有限公司 Revision: Control No.: A3 Notes: 1. All test data is referenced to 23±3 °C and 45%RH to 70%RH ambient. 2. Test Instruments：3260B LCR Meter, 3265B Bias Current Source（100kHz,1V），EUCOL-U2516B DC Low ohm meter. 3. Operating temperature range - 55 °C to + 125 °C（ambient + self-temp. rise）. 4. Isat: DC current (A) that will cause L0 to drop approximately 30 %. 5. Idc: DC current (A) that will cause an approximate ΔT of 40 °C. 6. The part temperature (ambient + temp. rise) should not exceed 125 °C under worst case operating conditions. Circuit design, component placement, PWB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. The rated current as listed is either the saturation current or the heat rating current depending on which value is lower. Inductance and Temperature Rise vs. DC Current 4 / 12 http://www.tdgcore.com TDG HOLDING CO., LTD. 天通控股股份有限公司 5 / 12 http://www.tdgcore.com Revision: Control No.: A3 TDG HOLDING CO., LTD. 天通控股股份有限公司 Revision: Control No.: A3 Reliability: Item Test Method Solderability Solder heat proof : 1.Preheating: 160  10°C for 90 seconds 2.Retention time: 245  5℃ for 2  0.5 seconds Vibration 1.Vibration frequency: (10Hz to 55Hz to10Hz) in 60 seconds as a period 2.Vibration time: period cycled for 2 hours in each of 3 mutual perpendicular directions 3.Amplitude: 1.5mm max. Shock Specification and Requirement The surface of terminal immersed shall be minimum of 95% covered with a new coating of solder. ΔL/L0≤  5% No mechanical damage such as 1.Peak value: 100 G 2.Duration of pulse: 11ms 3.3 times in each positive and negative direction of 3 mutual perpendicular directions 6 / 12 http://www.tdgcore.com break. TDG HOLDING CO., LTD. 天通控股股份有限公司 Revision: Control No.: A3 Reliability: Item Test Method Thermal Shock 1.Repeat 100 cycle as follow: (-55  2°C,30  3minutes) (Room temperature, 5 minutes)(+125  2°C,30  3minutes) (Room temperature, 5 minutes) 2.Recovery: 48 + 4 / - 0 hours of recovery under the standard condition after the test High Temperature Resistance 1.Environment Temperature : 85  2°C 2.Applied Current: Rated current 3.Duration : 1,000 + 4 / - 0 hours Specification and Requirement ΔL/L0≤  5% No distinct damage in appearance. Humidity Resistance Low Temperature Store High Temperature Store 1.Environment Temperature: 60  2°C 2.Relative Humidity: 90~95% 3.Duration: 1,000 + 4 / - 0 hours 1.Store temperature: -55  2°C for total 1,000 + 4 / - 0 hours 1.Store temperature: +125  2°C for total 1,000 + 4 / - 0 hours 7 / 12 http://www.tdgcore.com TDG HOLDING CO., LTD. 天通控股股份有限公司 Revision: Control No.: A3 Packaging Dimensions in millimeters G F I T H A 5.4  0.1 5.8 0.1 3.5  0.15 0.35  0.05 8.0  0.1 12  0.2 J K D E B C φ1.5 0.1 φ1.5 0.1 2.0  0.1 4.0  0.1 5.5  0.1 1.75 0.1 100 ± 1.0 330.0 ± 2.0 Reel Dimensions in millimeters 20.0 ± 0.5 2.0 ± 0.5 13.0 ± 1.0 B 8 / 12 A http://www.tdgcore.com A B Color 12.5  0.2 2.0  0.2 Blue TDG HOLDING CO., LTD. 天通控股股份有限公司 Peeling of top cover tape  The peeling speed shall be about 300 mm/minute.  The peeling force shall be between 0.1 to 0.7 N. 9 / 12 http://www.tdgcore.com Revision: Control No.: A3 TDG HOLDING CO., LTD. 天通控股股份有限公司 Reflow Profile Revision: Control No.: A3 Table1-StandardSnPb Solder(Tc) Package Thickness Volume mm3 ＜350 Volume mm3 ≧350 ＜2.5mm 235℃ 220℃ ≧2.5mm 220℃ 220℃ Table2-Lead(Pb)Free Solder(Tc) Package Thickness Volume mm3 ＜350 Volume mm3 350-2000 Volume mm3 >2000 ＜1.6mm 260℃ 260℃ 260℃ 1.6-2.5mm 260℃ 250℃ 245℃ >2.5mm 250℃ 245℃ 245℃ Reference JDEC J-STD-020(latest revision) Profile Feature Standard SnPb solder Lead(Pb) Free Solder ●Temperature min.(Tsmin) 100℃ 150℃ ●Temperature max.(Tsmax) 150℃ 200℃ ●Time(ts):Tsmin to Tsmax 60-120 Seconds 60-120 Seconds Average ramp up rate TL to Tp 3℃/Second Max. 3℃/Second Max. Liquidous temperature(TL) 183℃ 183℃ Time at liquidous (tL) 60-150 Seconds 60-150 Seconds Peak package body temperature(Tp)* Table 1 Table 2 20seconds** 30seconds** Average ramp-down rate Tp to TL 6℃/Second Max. 6℃/Second Max. Time 25℃ to Peak Temperature 6 Minutes Max. 8 Minutes Max. Preheat and Soak Time (tp)**within 5 ℃ of the specified classification temperature(Tc) *Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. 10 / 12 http://www.tdgcore.com TDG HOLDING CO., LTD. 天通控股股份有限公司 Revision: Control No.: A3 Numbers of taping  2,000 pieces/reel Label marking  The following items shall be marked on the production and shipping  Label on the reel Production Label      Part No. Description Quantity Produce No. Taping No. Shipping Label      Customer’s Name Customer’s Part No. Manufacturer’s Part No. Manufacturer’s Name Manufacturer’s Country Care note for use  Storage Condition: Temperature 25 to 35°C, Humidity 45 to 75% RH  Use Temperature:  Minimum Temperature: -55°C Ambient temperature of molded power inductor.  Maximum Temperature: +125°C The value of temperature including ambient of the transformer and temperature rise of molded power inductor.  There is not a problem from -55°C ~ +125°C in a reliability test.  However, this is not meant a temperature grade guarantee of UL.  Model: When this molded power inductor was used in a similar or new product to the original one, sometimes it might be unable to satisfy the specifications due to difference of condition of usage.  Drop: If the molded power inductor suffered mechanical stress such as drop, characteristics may become poor (due to damage on coil bobbin, etc.).Never use such stressed molded power inductor. 11 / 12 http://www.tdgcore.com TDG HOLDING CO., LTD. 天通控股股份有限公司 Revision: Control No.: A3 Care note for Safety  Provision to Abnormal Condition This molded power inductor itself does not have any protective function in abnormal condition such as overload, short-circuit and open-circuit conditions, etc. Therefore, it shall be confirmed as the end product that there is no risk of smoking, fire, dielectric withstand voltage, insulation resistance, etc. in abnormal conditions to provide protective devices and/or protection circuit in the end product.  Temperature Rise Temperature rise of molded power inductor depends on the installation condition on end products. It shall be confirmed on the actual end product that temperature rise of molded power inductor is in the limit of specified temperature class.  Dielectric Strength Dielectric withstanding test with higher voltage than specific value will damage insulating material and shorten its life.  Water This molded power inductor must not be used in wet condition by water, coffee or any liquid because insulation strength becomes very low on the condition.  Potting If this molded power inductor is potted in some compound, coating material of magnet wire might be occasionally damaged. Please ask us if you intend to pot this molding.  Detergent Please consult our company once in case of this because the confirmation of reliability etc. is needed when the washing medicine is used for the molded power inductor.  Notes This electronic component has been designed and developed for usage in general electronic equipment only, not for usage in areas such as military, aerospace, aviation, transportation (automotive control, train control, ship control) etc.. TDG Holding Co., Ltd. must be informed about the intent of such usage before the design-in stage and the parties must have executed an agreement specifically governing such use. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component. 12 / 12 http://www.tdgcore.com