BLS2731-110
Microwave power transistor
Rev. 6 — 1 September 2015
Product data sheet
IMPORTANT NOTICE
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Philips Semiconductors
Product specification
Microwave power transistor
BLS2731-110
FEATURES
PINNING - SOT423A
• Suitable for short and medium pulse applications
PIN
• Internal input and output matching networks for an easy
circuit design
• Emitter ballasting resistors improve ruggedness
• Gold metallization ensures excellent reliability
DESCRIPTION
1
collector
2
emitter
3
base; connected to flange
• Interdigitated emitter-base structure provides high
emitter efficiency
• Multicell geometry improves power sharing and reduces
thermal resistance.
1
dbook, halfpage
APPLICATIONS
• Common base class-C pulsed power amplifiers for radar
applications in the 2.7 to 3.1 GHz band.
3
3
2
DESCRIPTION
NPN silicon planar epitaxial microwave power transistor in
a 2-lead rectangular flange package with a ceramic cap
(SOT423A) with the common base connected to the
flange.
MBK052
Fig.1 Simplified outline.
QUICK REFERENCE DATA
RF performance at Th = 25 °C in a common base class-C test circuit.
MODE OF OPERATION
Pulsed class-C
f
(GHz)
VCB
(V)
PL
(W)
Gp
(dB)
ηC
(%)
2.7 to 3.1
40
>110
>7
>35
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged.
All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety
precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of
the user. It must never be thrown out with the general or domestic waste.
2001 Dec 05
2
Philips Semiconductors
Product specification
Microwave power transistor
BLS2731-110
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCBO
collector-base voltage
open emitter
−
75
V
VCES
collector-emitter voltage
RBE = 0
−
75
V
VEBO
emitter-base voltage
open collector
−
2
V
ICM
peak collector current
tp ≤ 100 µs; δ ≤ 10%
−
12
A
Ptot
total power dissipation
tp = 100 µs; δ = 10%; Tmb = 25 °C −
500
W
Tstg
storage temperature
−65
+200
°C
Tj
operating junction temperature
−
200
°C
Tsld
soldering temperature
−
235
°C
up to 0.2 mm from ceramic cap;
t ≤ 10 s
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
thermal impedance from junction to
heatsink
Zth j-h
VALUE
tp = 100 µs; δ = 10%; note 1
0.24
UNIT
K/W
Note
1. Equivalent thermal impedance under pulsed microwave operating conditions.
CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
−
UNIT
V(BR)CBO
collector-base breakdown voltage
IC = 30 mA; open emitter
75
V
V(BR)CES
collector-emitter breakdown voltage
IC = 30 mA; VBE = 0
75
−
V
ICBO
collector leakage current
VCB = 40 V; IE = 0
−
3
mA
ICES
collector leakage current
VCE = 40 V; VBE = 0
−
6
mA
IEBO
emitter leakage current
VEB = 1.5 V; IC = 0
−
0.6
mA
hFE
DC current gain
VCE = 5 V; IC = 3 A
40
100
APPLICATION INFORMATION
RF performance at Th = 25 °C in a common base test circuit.
MODE OF OPERATION
Class-C; tp = 100 µs; δ = 10%
2001 Dec 05
f
(GHz)
VCE
(V)
PL
(W)
GP
(dB)
ηC
(%)
2.7 to 3.1
40
≥110
≥7
≥35
2.7 to 2.9
40
typ. 130
typ. 8
typ. 42
2.9 to 3.1
40
typ. 120
typ. 7.5
typ. 40
3
Philips Semiconductors
Product specification
Microwave power transistor
BLS2731-110
MBK284
10
handbook, halfpage
Gp
(dB)
8
ηC
50
ηC
MBK285
140
PL halfpage
handbook,
2.7
(W)
120
(%)
3.1
2.9 GHz
40
Gp
100
6
30
4
20
80
60
40
10
2
20
0
2.7
2.8
2.9
3
f (GHz)
0
3.1
0
10
12
14
VCE = 40 V; class-C; tp = 100 µs; δ = 10%.
VCE = 40 V; class-C; tp = 100 µs; δ = 10%.
Fig.2
Fig.3
Power gain and efficiency as functions of
frequency; typical values.
MGM538
18
16
20
Load power as a function of drive power;
typical values.
MGM539
8
12
PD (W)
handbook, halfpage
handbook, halfpage
ZL
(Ω)
xi
Zi
RL
(Ω)
4
8
0
ri
4
−4
0
2.6
2.8
3
f (GHz)
XL
−8
2.6
3.2
2.8
VCB = 40 V; class-C; PL = 110 W.
VCB = 40 V; class-C; PL = 110 W.
Fig.4
Fig.5
Input impedance as function of frequency
(series components); typical values.
2001 Dec 05
4
3
f (GHz)
3.2
Load impedance as function of frequency
(series components); typical values.
Philips Semiconductors
Product specification
Microwave power transistor
BLS2731-110
30
handbook, full pagewidth
30
40
L8
L11
L2
RC
C2
L6
L7
L1
L4
L10
L9
L3
C1
input
output
L13
L14
L5
L12
MGM540
Dimensions in mm.
The components are located on one side of the copper-clad printed-circuit board, the other side is unetched and serves as a ground plane.
Earth connections from the component side to the ground plane are made by through metallization.
Fig.6 Component layout for 2.7 to 3.1 GHz class-C test circuit.
2001 Dec 05
5
Philips Semiconductors
Product specification
Microwave power transistor
BLS2731-110
List of components (see Fig.6)
COMPONENT
DESCRIPTION
VALUE
DIMENSIONS
C1
multilayer ceramic chip capacitor; note 1
12 pF
C2
multilayer ceramic chip capacitor; note 1
18 pF
RC
multilayer ceramic chip capacitor in series
with SMD resistor
100 nF + 5 Ω
L1
stripline; note 2
length 4.5 mm
width 10 mm
L2
stripline; note 2
length 2.5 mm
width 16.4 mm
L3
stripline; note 2
length 8.3 mm
width 1 mm
L4
stripline; note 2
length 8 mm
width 1.5 mm
L5
stripline; note 2
length 2 mm
width 8.9 mm
L6
stripline; note 2
length 12.7 mm
width 1.2 mm
L7
stripline; note 2
length 4.5 mm
width 10 mm
L8
stripline; note 2
length 2.5 mm
width 24.4 mm
L9
stripline; note 2
length 4.4 mm
width 1 mm
L10
stripline; note 2
length 5.2 mm
width 1 mm
L11
stripline; note 2
length 9.3 mm
width 1 mm
L12
stripline; note 2
length 2.5 mm
width 6 mm
L13
stripline; note 2
length 7.8 mm
width 1.2 mm
L14
stripline; note 2
length 7.5 mm
width 1.2 mm
Notes
1. American Technical Ceramics type 100A or capacitor of same quality.
2. The striplines are on double-clad printed-circuit board with Duroid dielectric (εr = 2.2); thickness = 0.38 mm.
2001 Dec 05
6
Philips Semiconductors
Product specification
Microwave power transistor
BLS2731-110
PACKAGE OUTLINE
Flanged hermetic ceramic package; 2 mounting holes; 2 leads
SOT423A
D
A
F
3
D1
U1
B
q
C
c
1
H
p
U2
E1
E
w1 M A M B M
A
2
Q
w2 M C M
b
0
5
10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
UNIT
A
b
c
D
D1
E
E1
F
H
p
Q
q
U1
U2
w1
w2
mm
5.72
4.90
9.53
9.27
0.10
0.05
12.09
11.71
12.83
12.57
8.84
8.56
10.29
10.03
1.58
1.47
19.81
18.29
3.43
3.18
3.35
2.95
16.51
22.99
22.73
9.91
9.65
0.25
0.76
inches
0.225
0.193
0.375
0.365
0.004
0.002
0.476
0.461
0.505
0.495
0.348
0.337
0.405
0.395
0.062
0.058
0.78
0.72
0.135
0.125
0.132
0.116
0.65
0.905
0.895
0.390
0.380
0.01
0.03
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
99-03-29
SOT423A
2001 Dec 05
EUROPEAN
PROJECTION
7
Philips Semiconductors
Product specification
Microwave power transistor
BLS2731-110
DATA SHEET STATUS
DATA SHEET STATUS(1)
PRODUCT
STATUS(2)
DEFINITIONS
Objective data
Development
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS
DISCLAIMERS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
CAUTION
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport
and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B.
2001 Dec 05
8
Philips Semiconductors
Product specification
Microwave power transistor
BLS2731-110
NOTES
2001 Dec 05
9
Philips Semiconductors
Product specification
Microwave power transistor
BLS2731-110
NOTES
2001 Dec 05
10
Philips Semiconductors
Product specification
Microwave power transistor
BLS2731-110
NOTES
2001 Dec 05
11
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
SCA73
© Koninklijke Philips Electronics N.V. 2001
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613524/05/pp12
Date of release: 2001
Dec 05
Document order number:
9397 750 09083
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