BTA316B-600E,118

IMPORTANT NOTICE 10 December 2015 1. Global joint venture starts operations as WeEn Semiconductors Dear customer, As from November 9th, 2015 NXP Semiconductors N.V. and Beijing JianGuang Asset Management Co. Ltd established Bipolar Power joint venture (JV), WeEn Semiconductors, which will be used in future Bipolar Power documents together with new contact details. In this document where the previous NXP references remain, please use the new links as shown below. WWW - For www.nxp.com use www.ween-semi.com Email - For salesaddresses@nxp.com use salesaddresses@ween-semi.com For the copyright notice at the bottom of each page (or elsewhere in the document, depending on the version) “© NXP Semiconductors N.V. {year}. All rights reserved” becomes “© WeEn Semiconductors Co., Ltd. {year}. All rights reserved” If you have any questions related to this document, please contact our nearest sales office via email or phone (details via salesaddresses@ween-semi.com). Thank you for your cooperation and understanding, WeEn Semiconductors D2 PA K BTA316B-600E 3Q Hi-Com Triac 6 August 2014 Product data sheet 1. General description Planar passivated high commutation three quadrant triac in a SOT404 plastic package. This "series E" triac balances the requirements of commutation performance and gate sensitivity. The "sensitive gate" "series E" is intended for interfacing with low power drivers including microcontrollers. 2. Features and benefits • • • • • • • • 3Q technology for improved noise immunity Direct interfacing with low power drivers and microcontrollers Good immunity to false turn-on by dV/dt High commutation capability with sensitive gate High voltage capability Planar passivated for voltage ruggedness and reliability Surface mountable package Triggering in three quadrants only 3. Applications • • Electronic thermostats (heating and cooling) High power motor controls e.g. washing machines and vacuum cleaners 4. Quick reference data Table 1. Quick reference data Symbol Parameter VDRM Conditions Min Typ Max Unit repetitive peak offstate voltage - - 600 V ITSM non-repetitive peak on- full sine wave; Tj(init) = 25 °C; state current tp = 20 ms; Fig. 4; Fig. 5 - - 140 A IT(RMS) RMS on-state current - - 16 A - - 10 mA - - 10 mA full sine wave; Tmb ≤ 101 °C; Fig. 1; Fig. 2; Fig. 3 Static characteristics IGT gate trigger current VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 °C; Fig. 7 VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C; Fig. 7 Scan or click this QR code to view the latest information for this product BTA316B-600E NXP Semiconductors 3Q Hi-Com Triac Symbol Parameter Conditions Min Typ Max Unit VD = 12 V; IT = 0.1 A; T2- G-; - - 10 mA Tj = 25 °C; Fig. 7 5. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline 1 T1 main terminal 1 2 T2 main terminal 2 3 G gate mb T2 mounting base; main terminal 2 mb Graphic symbol T2 sym051 T1 G 2 1 3 D2PAK (SOT404) 6. Ordering information Table 3. Ordering information Type number BTA316B-600E BTA316B-600E Product data sheet Package Name Description Version D2PAK plastic single-ended surface-mounted package (D2PAK); 3 leads SOT404 (one lead cropped) All information provided in this document is subject to legal disclaimers. 6 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 2 / 14 BTA316B-600E NXP Semiconductors 3Q Hi-Com Triac 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VDRM repetitive peak off-state voltage IT(RMS) RMS on-state current full sine wave; Tmb ≤ 101 °C; Fig. 1; Min Max Unit - 600 V - 16 A - 140 A - 150 A Fig. 2; Fig. 3 ITSM non-repetitive peak on-state current full sine wave; Tj(init) = 25 °C; tp = 20 ms; Fig. 4; Fig. 5 full sine wave; Tj(init) = 25 °C; tp = 16.7 ms I t I t for fusing tp = 10 ms; SIN - 98 A s dIT/dt rate of rise of on-state current IT = 20 A; IG = 0.2 A; dIG/dt = 0.2 A/µs - 100 A/µs IGM peak gate current - 2 A PGM peak gate power - 5 W PG(AV) average gate power - 0.5 W Tstg storage temperature -40 150 °C Tj junction temperature - 125 °C 2 2 over any 20 ms period 003aab685 60 IT(RMS) (A) 50 2 003aab684 20 IT(RMS) (A) 16 40 12 30 8 20 4 10 0 10-2 10-1 0 -50 1 10 surge duration (s) f = 50 Hz; Tmb = 101 °C Fig. 1. Fig. 2. RMS on-state current as a function of surge duration; maximum values BTA316B-600E Product data sheet 50 100 150 Tmb (°C) RMS on-state current as a function of mounting base temperature; maximum values All information provided in this document is subject to legal disclaimers. 6 August 2014 0 © NXP Semiconductors N.V. 2014. All rights reserved 3 / 14 BTA316B-600E NXP Semiconductors 3Q Hi-Com Triac 003aab689 20 Ptot (W) 15 10 conduction angle, (degrees) form factor a 30 60 90 120 180 4 2.8 2.2 1.9 1.57 α = 180° 120° 90° α 60° 30° 5 0 0 2 4 6 8 10 12 14 IT(RMS) (A) 16 α = conduction angle a = form factor = IT(RMS) / IT(AV) Fig. 3. Total power dissipation as a function of RMS on-state current; maximum values 003aab668 160 ITSM (A) 120 80 ITSM IT 40 0 t 1/f Tj(init) = 25 °C max 1 102 10 number of cycles (n) 103 f = 50 Hz Fig. 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values BTA316B-600E Product data sheet All information provided in this document is subject to legal disclaimers. 6 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 4 / 14 BTA316B-600E NXP Semiconductors 3Q Hi-Com Triac 003aab671 103 ITSM (A) (1) 102 ITSM IT t 10 10-5 tp Tj(init) = 25 °C max 10-4 10-3 10-2 tp (s) 10-1 tp ≤ 20 ms (1) dIT/dt limit Fig. 5. Non-repetitive peak on-state current as a function of pulse duration; maximum values BTA316B-600E Product data sheet All information provided in this document is subject to legal disclaimers. 6 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 5 / 14 BTA316B-600E NXP Semiconductors 3Q Hi-Com Triac 8. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base full cycle; Fig. 6 - - 1.2 K/W half cycle; Fig. 6 - - 1.7 K/W thermal resistance from junction to ambient printed circuit board mounted; minimum footprint - 55 - K/W Rth(j-a) 003aab776 10 Zth(j-mb) (K/W) (1) 1 (2) 10- 1 P 10- 2 t tp 10- 3 10- 5 10- 4 10- 3 10- 2 10- 1 1 tp (s) 10 (1) Unidirectional (half cycle) (2) Bidirectional (full cycle) Fig. 6. Transient thermal impedance from junction to mounting base as a function of pulse duration BTA316B-600E Product data sheet All information provided in this document is subject to legal disclaimers. 6 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 6 / 14 BTA316B-600E NXP Semiconductors 3Q Hi-Com Triac 9. Characteristics Table 6. Characteristics Symbol Parameter Conditions Min Typ Max Unit VD = 12 V; IT = 0.1 A; T2+ G+; - - 10 mA - - 10 mA - - 10 mA - - 25 mA - - 30 mA - - 25 mA Static characteristics IGT gate trigger current Tj = 25 °C; Fig. 7 VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C; Fig. 7 VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 °C; Fig. 7 IL latching current VD = 12 V; IG = 0.1 A; T2+ G+; Tj = 25 °C; Fig. 8 VD = 12 V; IG = 0.1 A; T2+ G-; Tj = 25 °C; Fig. 8 VD = 12 V; IG = 0.1 A; T2- G-; Tj = 25 °C; Fig. 8 IH holding current VD = 12 V; Tj = 25 °C; Fig. 9 - - 15 mA VT on-state voltage IT = 18 A; Tj = 25 °C; Fig. 10 - 1.3 1.5 V VGT gate trigger voltage VD = 12 V; IT = 0.1 A; Tj = 25 °C; - 0.8 1 V 0.25 0.4 - V VD = 600 V; Tj = 125 °C - 0.1 0.5 mA VDM = 402 V; Tj = 125 °C; (VDM = 67% 50 - - V/µs 3 - - A/ms 6 - - A/ms 10 - - A/ms Fig. 11 VD = 400 V; IT = 0.1 A; Tj = 125 °C; Fig. 11 ID off-state current Dynamic characteristics dVD/dt rate of rise of off-state voltage of VDRM); exponential waveform; gate open circuit dIcom/dt rate of change of commutating current VD = 400 V; Tj = 125 °C; IT(RMS) = 16 A; dVcom/dt = 20 V/µs; (snubberless condition); gate open circuit VD = 400 V; Tj = 125 °C; IT(RMS) = 16 A; dVcom/dt = 10 V/µs; gate open circuit VD = 400 V; Tj = 125 °C; IT(RMS) = 16 A; dVcom/dt = 1 V/µs; gate open circuit BTA316B-600E Product data sheet All information provided in this document is subject to legal disclaimers. 6 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 7 / 14 BTA316B-600E NXP Semiconductors 3Q Hi-Com Triac 3 001aac669 001aab100 3 (1) IGT IL IL(25°C) IGT(25°C) 2 2 (2) (3) 1 1 0 - 50 0 50 100 Tj (°C) 0 -50 150 (1) T2- G(2) T2+ G(3) T2+ G+ Fig. 7. Fig. 8. 0 50 100 Tj (°C) 150 Normalized latching current as a function of junction temperature Normalized gate trigger current as a function of junction temperature 001aab099 3 003aab666 50 IT (A) IH IH(25°C) 40 2 30 (1) 20 (2) (3) 1 10 0 -50 Fig. 9. 0 50 100 Tj (°C) 0 150 0 0.5 1 1.5 VT (V) 2 Vo = 1.024 V; Rs = 0.021 Ω Normalized holding current as a function of junction temperature (1) Tj = 125 °C; typical values (2) Tj = 125 °C; maximum values (3) Tj = 25 °C; maximum values Fig. 10. On-state current as a function of on-state voltage BTA316B-600E Product data sheet All information provided in this document is subject to legal disclaimers. 6 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 8 / 14 BTA316B-600E NXP Semiconductors 3Q Hi-Com Triac 001aab101 1.6 VGT VGT(25°C) 1.2 0.8 0.4 -50 0 50 100 Tj (°C) 150 Fig. 11. Normalized gate trigger voltage as a function of junction temperature BTA316B-600E Product data sheet All information provided in this document is subject to legal disclaimers. 6 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 9 / 14 BTA316B-600E NXP Semiconductors 3Q Hi-Com Triac 10. Package outline Plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped) SOT404 A A1 E mounting base D1 D HD 2 Lp 1 3 b2 c b e e Q 0 5 mm scale Dimensions (mm are the original dimensions) Unit max nom min mm A A1 b b2 c 4.5 1.40 0.85 1.45 0.64 4.1 1.27 0.60 1.05 0.46 D D1 E 11 1.6 10.3 1.2 9.7 e 2.54 HD Lp Q 15.8 2.9 2.6 14.8 2.1 2.2 sot404_po Outline version References IEC JEDEC JEITA European projection Issue date 06-03-16 13-02-25 SOT404 Fig. 12. Package outline D2PAK (SOT404) BTA316B-600E Product data sheet All information provided in this document is subject to legal disclaimers. 6 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 10 / 14 BTA316B-600E NXP Semiconductors 3Q Hi-Com Triac 11. Soldering 10.85 10.60 10.50 1.50 7.50 7.40 1.70 2.25 2.15 8.15 8.35 8.275 1.50 4.60 0.30 4.85 5.40 7.95 8.075 3.00 0.20 1.20 1.30 1.55 solder lands solder resist 5.08 msd057 occupied area solder paste Fig. 13. Reflow soldering footprint for D2PAK (SOT404) BTA316B-600E Product data sheet All information provided in this document is subject to legal disclaimers. 6 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 11 / 14 BTA316B-600E NXP Semiconductors 3Q Hi-Com Triac In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. 12. Legal information 12.1 Data sheet status Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Document status [1][2] Product status [3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] [2] [3] Definition Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Preview — The document is a preview version only. The document is still subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 12.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. BTA316B-600E Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. 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In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, ICODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP Semiconductors N.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation. BTA316B-600E Product data sheet All information provided in this document is subject to legal disclaimers. 6 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 13 / 14 BTA316B-600E NXP Semiconductors 3Q Hi-Com Triac 13. Contents 1 General description ............................................... 1 2 Features and benefits ............................................1 3 Applications ........................................................... 1 4 Quick reference data ............................................. 1 5 Pinning information ............................................... 2 6 Ordering information ............................................. 2 7 Limiting values .......................................................3 8 Thermal characteristics .........................................6 9 Characteristics ....................................................... 7 10 Package outline ................................................... 10 11 Soldering .............................................................. 11 12 12.1 12.2 12.3 12.4 Legal information .................................................12 Data sheet status ............................................... 12 Definitions ...........................................................12 Disclaimers .........................................................12 Trademarks ........................................................ 13 © NXP Semiconductors N.V. 2014. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 6 August 2014 BTA316B-600E Product data sheet All information provided in this document is subject to legal disclaimers. 6 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 14 / 14