BTA2008W-800D,135

BTA2008W-800D 3Q Hi-Com Triac Rev.02 - 28 June 2019 Product data sheet 1. General description Planar passivated high commutation three quadrant triac in a SOT223 surface mountable plastic package. This "series D" triac balances the requirements of commutation performance and gate sensitivity and is intended for interfacing with low power drivers and logic ICs including microcontrollers. 2. Features and benefits • • • • • • • • 3Q technology for improved noise immunity Direct gate triggering from low power drivers and logic ICs High commutation capability with very sensitive gate High voltage capability Planar passivated for voltage ruggedness and reliability Surface mountable package Triggering in three quadrants only Very sensitive gate for easy logic level triggering 3. Applications • • • Low power motor controls Small inductive loads e.g. solenoids, door locks, water valves Small loads in large white goods 4. Quick reference data Table 1. Quick reference data Symbol Parameter VDRM repetitive peak offstate voltage IT(RMS) RMS on-state current ITSM Tj Conditions Min Typ Max Unit - - 800 V - - 0.8 A non-repetitive peak on- full sine wave; Tj(init) = 25 °C; state current tp = 20 ms; Fig. 4; Fig. 5 - - 9 A full sine wave; Tj(init) = 25 °C; tp = 16.7 ms - - 9.9 A - - 125 °C 0.25 - 5 mA full sine wave; Tsp ≤ 111 °C; Fig. 1; Fig. 2; Fig. 3 junction temperature Static characteristics IGT gate trigger current VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 °C; Fig. 9 BTA2008W-800D WeEn Semiconductors 3Q Hi-Com Triac Symbol Parameter Conditions Min Typ Max Unit VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C; Fig. 9 0.25 - 5 mA VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 °C; Fig. 9 0.25 - 5 mA IH holding current VD = 12 V; Tj = 25 °C; Fig. 11 - - 10 mA VT on-state voltage IT = 0.85 A; Tj = 25 °C; Fig. 12 - 1.35 1.6 V Dynamic characteristics dVD/dt rate of rise of off-state voltage VDM = 536 V; Tj = 125 °C; (VDM = 67% of VDRM); exponential waveform; gate open circuit 200 - - V/µs dIcom/dt rate of change of commutating current VD = 400 V; Tj = 125 °C; IT(RMS) = 0.8 A; dVcom/dt = 10 V/µs; gate open circuit 0.5 - - A/ms 5. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline 1 T1 main terminal 1 2 T2 main terminal 2 3 G gate 4 mb mounting base; connected to main terminal 2 Graphic symbol 4 T2 sym051 1 2 T1 G 3 SC-73 (SOT223) 6. Ordering information Table 3. Ordering information Type number BTA2008W-800D BTA2008W-800D Product data sheet Package Orderable part number Packing Name method SOT223 BTA2008W-800D,135 Reel Small packing quantity 4000 All information provided in this document is subject to legal disclaimers. 28 June 2019 Package version SOT223 © Package issue date 16-Mar-2006 WeEn Semiconductors Co., Ltd. 2019. All rights reserved 2 / 16 BTA2008W-800D WeEn Semiconductors 3Q Hi-Com Triac 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDRM repetitive peak off-state voltage IT(RMS) RMS on-state current ITSM non-repetitive peak onstate current 2 Conditions 2 Min Max Unit - 800 V full sine wave; Tsp ≤ 111 °C; Fig. 1; Fig. 2; Fig. 3 - 0.8 A full sine wave; Tj(init) = 25 °C; tp = 20 ms; Fig. 4; Fig. 5 - 9 A full sine wave; Tj(init) = 25 °C; tp = 16.7 ms - 9.9 A I t I t for fusing tp = 10 ms; SIN - 0.41 A²s dIT/dt rate of rise of on-state current IG = 20 mA - 100 A/µs IGM peak gate current - 2 A PGM peak gate power - 5 W PG(AV) average gate power - 0.1 W Tstg storage temperature -40 150 °C Tj junction temperature - 125 °C over any 20ms period 003aag395 6 003aag396 1 IT(RMS) (A) 0.8 IT(RMS) (A) 111°C 4 0.6 0.4 2 0.2 0 10-2 10-1 f = 50 Hz; Tsp = 111 °C Fig. 1. RMS on-state current as a function of surge duration; maximum values BTA2008W-800D Product data sheet 0 -50 1 10 surge duration (s) 0 50 100 Tsp (°C) 150 Fig. 2. RMS on-state current as a function of lead temperature; maximum values All information provided in this document is subject to legal disclaimers. 28 June 2019 © WeEn Semiconductors Co., Ltd. 2019. All rights reserved 3 / 16 BTA2008W-800D WeEn Semiconductors 3Q Hi-Com Triac 003aac118 1.0 Ptot (W) 0.8 0.6 conduction angle (degrees) form factor a 30 60 90 120 180 4 2.8 2.2 1.9 1.57 α = 180° 120° 90° α 60° 30° 0.4 0.2 0.0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 IT(RMS) (A) α = conduction angle a = form factor = IT(RMS) / IT(AV) Fig. 3. Total power dissipation as a function of RMS on-state current; maximum values 003aag393 12 ITSM (A) 8 ITSM IT 4 t 1/f 0 Tj(init) = 25 °C max 1 102 10 number of cycles 103 f = 50 Hz Fig. 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values BTA2008W-800D Product data sheet All information provided in this document is subject to legal disclaimers. 28 June 2019 © WeEn Semiconductors Co., Ltd. 2019. All rights reserved 4 / 16 BTA2008W-800D WeEn Semiconductors 3Q Hi-Com Triac 003aag394 103 ITSM IT ITSM (A) t tp Tj(init) = 25 °C max (1) 102 10 1 10-5 10-4 10-3 10-2 tp (s) 10-1 tp ≤ 20 ms; (1) dIT/dt limit Fig. 5. Non-repetitive peak on-state current as a function of pulse duration; maximum values BTA2008W-800D Product data sheet All information provided in this document is subject to legal disclaimers. 28 June 2019 © WeEn Semiconductors Co., Ltd. 2019. All rights reserved 5 / 16 BTA2008W-800D WeEn Semiconductors 3Q Hi-Com Triac 8. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-sp) thermal resistance from junction to solder point full cycle; Fig. 6 - - 15 K/W Rth(j-a) thermal resistance from junction to ambient free air in free air; printed-circuit board mounted: minimum footprint; Fig. 7 - 156 - K/W in free air; printed-circuit board mounted; pad area; Fig. 8 - 70 - K/W 003aac210 102 Z th(j-sp) (K/W) 10 1 P 10-1 10-2 10-5 tp 10-4 10-3 10-2 10-1 1 tp (s) t 10 Fig. 6. Transient thermal impedance from junction to solder point as a function of pulse width BTA2008W-800D Product data sheet All information provided in this document is subject to legal disclaimers. 28 June 2019 © WeEn Semiconductors Co., Ltd. 2019. All rights reserved 6 / 16 BTA2008W-800D WeEn Semiconductors 3Q Hi-Com Triac 3.8 min 36 1.5 min 18 6.3 1.5 min (3×) 60 9 4.5 4.6 2.3 10 1.5 min 4.6 001aab508 7 All dimensions are in mm 15 Fig. 7. Minimum footprint SOT223 50 001aab509 All dimensions are in mm Printed circuit board: FR4 epoxy glass (1.6 mm thick), copper laminate (35 um thick) Fig. 8. Printed circuit board pad area: SOT223 BTA2008W-800D Product data sheet All information provided in this document is subject to legal disclaimers. 28 June 2019 © WeEn Semiconductors Co., Ltd. 2019. All rights reserved 7 / 16 BTA2008W-800D WeEn Semiconductors 3Q Hi-Com Triac 9. Characteristics Table 6. Characteristics Symbol Parameter Conditions Min Typ Max Unit VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 °C; Fig. 9 0.25 - 5 mA VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C; Fig. 9 0.25 - 5 mA VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 °C; Fig. 9 0.25 - 5 mA VD = 12 V; IG = 0.1 A; T2+ G+; Tj = 25 °C; Fig. 10 - - 10 mA VD = 12 V; IG = 0.1 A; T2+ G-; Tj = 25 °C; Fig. 10 - - 20 mA VD = 12 V; IG = 0.1 A; T2- G-; Tj = 25 °C; Fig. 10 - - 10 mA Static characteristics IGT IL gate trigger current latching current IH holding current VD = 12 V; Tj = 25 °C; Fig. 11 - - 10 mA VT on-state voltage IT = 0.85 A; Tj = 25 °C; Fig. 12 - 1.35 1.6 V VGT gate trigger voltage VD = 12 V; IT = 0.1 A; Tj = 25 °C; Fig. 13 - 0.9 1.5 V VD = 400 V; IT = 0.1 A; Tj = 125 °C; Fig. 13 0.2 0.3 - V VD = 800 V; Tj = 125 °C - 0.1 0.5 mA ID off-state current Dynamic characteristics dVD/dt rate of rise of off-state voltage VDM = 536 V; Tj = 125 °C; (VDM = 67% of VDRM); exponential waveform; gate open circuit 200 - - V/µs dIcom/dt rate of change of commutating current VD = 400 V; Tj = 125 °C; IT(RMS) = 0.8 A; dVcom/dt = 10 V/µs; gate open circuit 0.5 - - A/ms BTA2008W-800D Product data sheet All information provided in this document is subject to legal disclaimers. 28 June 2019 © WeEn Semiconductors Co., Ltd. 2019. All rights reserved 8 / 16 BTA2008W-800D WeEn Semiconductors 3Q Hi-Com Triac 003aaa959 3 003aak510 3 IGT IL IGT(25°C) IL(25°C) 2 2 (1) (2) (3) 1 1 (3) (2) (1) 0 - 50 0 50 100 Tj (°C) 0 -50 150 (1) T2- G(2) T2+ G(3) T2+ G+ 0 50 100 Tj (°C) 150 Fig. 10. Normalized latching current as a function of junction temperature Fig. 9. Normalized gate trigger current as a function of junction temperature 003aak511 3 003aac114 1 IT (A) IH IH(25°C) 0.8 2 0.6 (2) (1) 0.4 (3) 1 0.2 0 -50 0 50 100 Tj (°C) 0 150 0 0.5 1 1.5 VT (V) 2 Vo = 0.835 V; Rs = 0.50 Ω (1) Tj = 125 °C; typical values (2) Tj = 125 °C; maximum values (3) Tj = 25 °C; maximum values Fig. 11. Normalized holding current as a function of junction temperature Fig. 12. On-state current as a function of on-state voltage BTA2008W-800D Product data sheet All information provided in this document is subject to legal disclaimers. 28 June 2019 © WeEn Semiconductors Co., Ltd. 2019. All rights reserved 9 / 16 BTA2008W-800D WeEn Semiconductors 3Q Hi-Com Triac 003aak512 1.6 VGT VGT(25°C) 1.2 0.8 0.4 -50 0 50 100 Tj (°C) 150 Fig. 13. Normalized gate trigger voltage as a function of junction temperature BTA2008W-800D Product data sheet All information provided in this document is subject to legal disclaimers. 28 June 2019 © WeEn Semiconductors Co., Ltd. 2019. All rights reserved 10 / 16 BTA2008W-800D WeEn Semiconductors 3Q Hi-Com Triac 10. Package outline Plastic surface-mounted package with increased heatsink; 4 leads D SOT223 E B A X c y HE v M A b1 4 Q A A1 1 2 e1 3 Lp bp w M B detail X e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp b1 c D E e e1 HE Lp Q v w y mm 1.8 1.5 0.10 0.01 0.80 0.60 3.1 2.9 0.32 0.22 6.7 6.3 3.7 3.3 4.6 2.3 7.3 6.7 1.1 0.7 0.95 0.85 0.2 0.1 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT223 JEITA EUROPEAN PROJECTION ISSUE DATE 04-11-10 06-03-16 SC-73 Fig. 14. Package outline SC-73 (SOT223) BTA2008W-800D Product data sheet All information provided in this document is subject to legal disclaimers. 28 June 2019 © WeEn Semiconductors Co., Ltd. 2019. All rights reserved 11 / 16 BTA2008W-800D WeEn Semiconductors 3Q Hi-Com Triac 11. Package outline (minimized) 6.7 6.3 3.1 2.9 1.8 1.5 4 1.1 0.7 7.3 6.7 3.7 3.3 1 2.3 2 3 0.8 0.6 4.6 0.32 0.22 Dimensions in mm 04-11-10 Fig. 15. Package outline SC-73 (SOT223) 12. Soldering 7 3.85 3.6 3.5 0.3 1.3 1.2 (4×) (4×) solder lands 4 solder resist 3.9 6.1 7.65 solder paste occupied area 1 2 3 Dimensions in mm 2.3 2.3 1.2 (3×) 1.3 (3×) 6.15 sot223_fr Fig. 16. Reflow soldering footprint for SC-73 (SOT223) BTA2008W-800D Product data sheet All information provided in this document is subject to legal disclaimers. 28 June 2019 © WeEn Semiconductors Co., Ltd. 2019. All rights reserved 12 / 16 BTA2008W-800D WeEn Semiconductors 3Q Hi-Com Triac 8.9 6.7 1.9 solder lands 4 solder resist 6.2 1 2 8.7 Dimensions in mm 3 1.9 (3×) 2.7 occupied area preferred transport direction during soldering 2.7 1.1 1.9 (2×) sot223_fw Fig. 17. Wave soldering footprint for SC-73 (SOT223) BTA2008W-800D Product data sheet All information provided in this document is subject to legal disclaimers. 28 June 2019 © WeEn Semiconductors Co., Ltd. 2019. All rights reserved 13 / 16 BTA2008W-800D WeEn Semiconductors 3Q Hi-Com Triac Right to make changes — WeEn Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. 13. Legal information Suitability for use — WeEn Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an WeEn Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. WeEn Semiconductors and its suppliers accept no liability for inclusion and/or use of WeEn Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Data sheet status Document status [1][2] Product status [3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] [2] [3] Definition Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. WeEn Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.ween-semi.com. Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local WeEn Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 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In no event shall WeEn Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, WeEn Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of WeEn Semiconductors. BTA2008W-800D Product data sheet Customers are responsible for the design and operation of their applications and products using WeEn Semiconductors products, and WeEn Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the WeEn Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. WeEn Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using WeEn Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). WeEn does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific WeEn Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. WeEn Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without WeEn Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond WeEn Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies WeEn Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond WeEn Semiconductors’ standard warranty and WeEn Semiconductors’ product specifications. All information provided in this document is subject to legal disclaimers. 28 June 2019 © WeEn Semiconductors Co., Ltd. 2019. All rights reserved 14 / 16 BTA2008W-800D WeEn Semiconductors 3Q Hi-Com Triac Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. BTA2008W-800D Product data sheet All information provided in this document is subject to legal disclaimers. 28 June 2019 © WeEn Semiconductors Co., Ltd. 2019. All rights reserved 15 / 16 BTA2008W-800D WeEn Semiconductors 3Q Hi-Com Triac 14. Contents 1. General description......................................................1 2. Features and benefits.................................................. 1 3. Applications.................................................................. 1 4. Quick reference data....................................................1 5. Pinning information......................................................2 6. Ordering information....................................................2 7. Limiting values............................................................. 3 8. Thermal characteristics............................................... 6 9. Characteristics..............................................................8 10. Package outline........................................................ 11 11. Package outline (minimized)................................... 12 12. Soldering................................................................... 12 13. Legal information..................................................... 14 © WeEn Semiconductors Co., Ltd. 2019. All rights reserved For more information, please visit: http://www.ween-semi.com For sales office addresses, please send an email to: salesaddresses@ween-semi.com Date of release: 28 June 2019 BTA2008W-800D Product data sheet All information provided in this document is subject to legal disclaimers. 28 June 2019 © WeEn Semiconductors Co., Ltd. 2019. All rights reserved 16 / 16