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BTA316B-600BT,118

BTA316B-600BT,118

  • 厂商:

    WEEN(瑞能)

  • 封装:

    TO263-3

  • 描述:

    TRIAC 600V 16A D2PAK

  • 详情介绍
  • 数据手册
  • 价格&库存
BTA316B-600BT,118 数据手册
BTA316B-600BT 3Q Hi-Com Triac 12 September 2018 Product data sheet 1. General description Planar passivated high commutation three quadrant triac in a SOT404 (D2PAK) surface mountable plastic package intended for use in circuits where high static and dynamic dV/dt and high dI/dt can occur. This "series BT" triac will commutate the full RMS current at the maximum rated junction temperature (Tj(max) = 150 °C) without the aid of a snubber. It is used in applications where "high junction operating temperature capability" is required. 2. Features and benefits • • • • • • • • • 3Q technology for improved noise immunity High commutation capability with maximum false trigger immunity High immunity to false turn-on by dV/dt High junction operating temperature capability High voltage capability Less sensitive gate for very high noise immunity Planar passivated for voltage ruggedness and reliability Surface mountable package Triggering in three quadrants only 3. Applications • • • • Applications subject to high temperature Electronic thermostats (heating and cooling) High power motor controls e.g. washing machines and vacuum cleaners Rectifier-fed DC inductive loads e.g. DC motors and solenoids 4. Quick reference data Table 1. Quick reference data Symbol Parameter VDRM repetitive peak offstate voltage IT(RMS) RMS on-state current ITSM Tj Min Typ Max Unit - - 600 V - - 16 A non-repetitive peak on- full sine wave; Tj(init) = 25 °C; tp = 20 ms; Fig. 4; Fig. 5 state current - - 140 A full sine wave; Tj(init) = 25 °C; tp = 16.7 ms - - 150 A - - 150 °C junction temperature Static characteristics Conditions full sine wave; Tmb ≤ 120 °C; Fig. 1; Fig. 2; Fig. 3 BTA316B-600BT WeEn Semiconductors 3Q Hi-Com Triac Symbol Parameter Conditions Min Typ Max Unit IGT gate trigger current VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 °C; Fig. 7 2 - 50 mA VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C; Fig. 7 2 - 50 mA VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 °C; Fig. 7 2 - 50 mA IH holding current VD = 12 V; Tj = 25 °C; Fig. 9 - - 60 mA VT on-state voltage IT = 18 A; Tj = 25 °C; Fig. 10 - 1.3 1.5 V Dynamic characteristics dVD/dt rate of rise of off-state voltage VDM = 402 V; Tj = 150 °C; (VDM = 67% of VDRM); exponential waveform; gate open circuit 1000 - - V/µs dIcom/dt rate of change of commutating current VD = 400 V; Tj = 150 °C; IT(RMS) = 16 A; dVcom/dt = 20 V/µs; (snubberless condition); gate open circuit 20 - - A/ms 5. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline 1 T1 main terminal 1 2 T2 main terminal 2 3 G gate mb T2 mounting base; main terminal 2 Graphic symbol mb T2 sym051 T1 G 2 1 3 D2PAK (SOT404) 6. Ordering information Table 3. Ordering information Type number BTA316B-600BT BTA316B-600BT Product data sheet Package Name Description Version D2PAK plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped) SOT404 All information provided in this document is subject to legal disclaimers. 12 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 2 / 13 BTA316B-600BT WeEn Semiconductors 3Q Hi-Com Triac 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDRM repetitive peak off-state voltage IT(RMS) RMS on-state current ITSM non-repetitive peak onstate current 2 Conditions 2 Min Max Unit - 600 V full sine wave; Tmb ≤ 120 °C; Fig. 1; Fig. 2; Fig. 3 - 16 A full sine wave; Tj(init) = 25 °C; tp = 20 ms; Fig. 4; Fig. 5 - 140 A full sine wave; Tj(init) = 25 °C; tp = 16.7 ms - 150 A I t I t for fusing tp = 10 ms; SIN - 98 A²s dIT/dt rate of rise of on-state current IG = 100 mA - 100 A/µs IGM peak gate current - 2 A PGM peak gate power - 5 W PG(AV) average gate power - 0.5 W Tstg storage temperature -40 150 °C Tj junction temperature - 150 °C over any 20 ms period 003aaj662 20 IT(RMS) (A) 16 003aaj663 60 IT(RMS) (A) 120 °C 50 40 12 30 8 20 4 0 -50 10 0 50 100 Tmb (°C) 0 10-2 150 Fig. 1. RMS on-state current as a function of mounting base temperature; maximum values BTA316B-600BT Product data sheet 10-1 1 10 surge duration (s) f = 50 Hz; Tmb = 120 °C Fig. 2. RMS on-state current as a function of surge duration; maximum values All information provided in this document is subject to legal disclaimers. 12 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 3 / 13 BTA316B-600BT WeEn Semiconductors 3Q Hi-Com Triac 003aaj665 20 P tot (W) 15 conduction angle, (degrees) form factor a 30 60 90 120 180 2.816 1.967 1.570 1.329 1.110 α =180° 120° 90° α 60° 30° 10 5 0 0 2 4 6 8 10 12 14 IT(RMS) (A) 16 Fig. 3. Total power dissipation as a function of RMS on-state current; maximum values 003aab668 160 ITSM (A) 120 80 ITSM IT 40 0 t 1/f Tj(init) = 25 °C max 1 102 10 number of cycles (n) 103 f = 50 Hz Fig. 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values BTA316B-600BT Product data sheet All information provided in this document is subject to legal disclaimers. 12 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 4 / 13 BTA316B-600BT WeEn Semiconductors 3Q Hi-Com Triac 003aab671 103 ITSM (A) (1) 102 ITSM IT t 10 10-5 tp Tj(init) = 25 °C max 10-4 10-3 10-2 tp (s) 10-1 tp ≤ 20 ms (1) dIT/dt limit Fig. 5. Non-repetitive peak on-state current as a function of pulse duration; maximum values BTA316B-600BT Product data sheet All information provided in this document is subject to legal disclaimers. 12 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 5 / 13 BTA316B-600BT WeEn Semiconductors 3Q Hi-Com Triac 8. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base full cycle; Fig. 6 - - 1.5 K/W half cycle; Fig. 6 - - 2 K/W thermal resistance from junction to ambient free air in free air - 60 - K/W Rth(j-a) 003aaj343 10 Zth(j-mb) (K/W) 1 (1) 10-1 (2) PD 10-2 10-3 10-5 tp 10-4 10-3 10-2 10-1 1 tp (s) t 10 (1) Unidirectional (half cycle) (2) Bidirectional (full cycle) Fig. 6. Transient thermal impedance from junction to mounting base as a function of pulse duration BTA316B-600BT Product data sheet All information provided in this document is subject to legal disclaimers. 12 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 6 / 13 BTA316B-600BT WeEn Semiconductors 3Q Hi-Com Triac 9. Characteristics Table 6. Characteristics Symbol Parameter Conditions Min Typ Max Unit VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 °C; Fig. 7 2 - 50 mA VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C; Fig. 7 2 - 50 mA VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 °C; Fig. 7 2 - 50 mA VD = 12 V; IG = 0.1 A; T2+ G+; Tj = 25 °C; Fig. 8 - - 60 mA VD = 12 V; IG = 0.1 A; T2+ G-; Tj = 25 °C; Fig. 8 - - 90 mA VD = 12 V; IG = 0.1 A; T2- G-; Tj = 25 °C; Fig. 8 - - 60 mA Static characteristics IGT IL gate trigger current latching current IH holding current VD = 12 V; Tj = 25 °C; Fig. 9 - - 60 mA VT on-state voltage IT = 18 A; Tj = 25 °C; Fig. 10 - 1.3 1.5 V VGT gate trigger voltage VD = 12 V; IT = 0.1 A; Tj = 25 °C; Fig. 11 - 0.8 1 V VD = 400 V; IT = 0.1 A; Tj = 150 °C; Fig. 11 0.25 0.4 - V VD = 600 V; Tj = 150 °C - 0.1 0.5 mA ID off-state current Dynamic characteristics dVD/dt rate of rise of off-state voltage VDM = 402 V; Tj = 150 °C; (VDM = 67% of VDRM); exponential waveform; gate open circuit 1000 - - V/µs dIcom/dt rate of change of commutating current VD = 400 V; Tj = 150 °C; IT(RMS) = 16 A; dVcom/dt = 20 V/µs; (snubberless condition); gate open circuit 20 - - A/ms BTA316B-600BT Product data sheet All information provided in this document is subject to legal disclaimers. 12 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 7 / 13 BTA316B-600BT WeEn Semiconductors 3Q Hi-Com Triac 003aaj344 3 IGT IGT(25°C) 2 003aaj345 3 IL IL(25°C) (1) (2) 2 (3) 1 1 0 -50 0 50 100 Tj (°C) 0 -50 150 (1) T2- G(2) T2+ G(3) T2+ G+ 0 50 100 Tj (°C) 150 Fig. 8. Normalized latching current as a function of junction temperature Fig. 7. Normalized gate trigger current as a function of junction temperature 003aaj346 3 003aaf675 50 IT IH (A) 40 IH(25°C) 2 30 (1) 20 (2) (3) 1 10 0 -50 0 50 100 Tj (°C) 0 150 0 0.5 1 1.5 VT (V) 2 Vo = 1.024 V; Rs = 0.021 Ω (1) Tj = 150 °C; typical values (2) Tj = 150 °C; maximum values (3) Tj = 25 °C; maximum values Fig. 9. Normalized holding current as a function of junction temperature Fig. 10. On-state current as a function of on-state voltage BTA316B-600BT Product data sheet All information provided in this document is subject to legal disclaimers. 12 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 8 / 13 BTA316B-600BT WeEn Semiconductors 3Q Hi-Com Triac 003aaj664 1.6 VGT VGT(25°C) 1.2 0.8 0.4 -50 0 50 100 Tj (°C) 150 Fig. 11. Normalized gate trigger voltage as a function of junction temperature BTA316B-600BT Product data sheet All information provided in this document is subject to legal disclaimers. 12 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 9 / 13 BTA316B-600BT WeEn Semiconductors 3Q Hi-Com Triac 10. Package outline Fig. 12. Package outline D2PAK (SOT404) BTA316B-600BT Product data sheet All information provided in this document is subject to legal disclaimers. 12 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 10 / 13 BTA316B-600BT WeEn Semiconductors 3Q Hi-Com Triac Right to make changes — WeEn Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. 11. Legal information Data sheet status Document status [1][2] Product status [3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] [2] [3] Definition Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local WeEn Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between WeEn Semiconductors and its customer, unless WeEn Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the WeEn Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, WeEn Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors takes no responsibility for the content in this document if provided by an information source outside of WeEn Semiconductors. In no event shall WeEn Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, WeEn Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of WeEn Semiconductors. Product data sheet Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. WeEn Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.ween-semi.com. BTA316B-600BT Suitability for use — WeEn Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an WeEn Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. WeEn Semiconductors and its suppliers accept no liability for inclusion and/or use of WeEn Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Customers are responsible for the design and operation of their applications and products using WeEn Semiconductors products, and WeEn Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the WeEn Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. WeEn Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using WeEn Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). WeEn does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific WeEn Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. WeEn Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without WeEn Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond WeEn Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies WeEn Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond WeEn Semiconductors’ standard warranty and WeEn Semiconductors’ product specifications. All information provided in this document is subject to legal disclaimers. 12 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 11 / 13 BTA316B-600BT WeEn Semiconductors 3Q Hi-Com Triac Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. BTA316B-600BT Product data sheet All information provided in this document is subject to legal disclaimers. 12 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 12 / 13 BTA316B-600BT WeEn Semiconductors 3Q Hi-Com Triac 12. Contents 1. General description......................................................1 2. Features and benefits.................................................. 1 3. Applications.................................................................. 1 4. Quick reference data....................................................1 5. Pinning information......................................................2 6. Ordering information....................................................2 7. Limiting values............................................................. 3 8. Thermal characteristics............................................... 6 9. Characteristics..............................................................7 10. Package outline........................................................ 10 11. Legal information..................................................... 11 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved For more information, please visit: http://www.ween-semi.com For sales office addresses, please send an email to: salesaddresses@ween-semi.com Date of release: 12 September 2018 BTA316B-600BT Product data sheet All information provided in this document is subject to legal disclaimers. 12 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 13 / 13
BTA316B-600BT,118
物料型号:BTA316B-600BT

器件简介: - 该器件是WeEn Semiconductors生产的三象限双向可控硅。 - 采用平面钝化技术,具有高静态和动态dV/dt以及高dI/dt的电路中使用。 - 能够在最大额定结温(Tj(max) = 150°C)下无辅助消振器地进行全RMS电流的换向。 - 用于需要“高结点工作温度能力”的应用。

引脚分配: - 引脚1 (T1):主端子1 - 引脚2 (T2):主端子2 - 引脚3 (G):门极

参数特性: - 重复峰值关断电压 (VDRM):600V - 正弦波下的RMS通态电流 (IT(RMS)):16A - 非重复峰值通态电流 (ITSM):140A(20ms脉冲),150A(16.7ms脉冲) - 结温 (T):150°C - 门极触发电流 (IGT):2mA到50mA - 保持电流 (IH):60mA - 通态电压 (VT):1.3V到1.5V - 关断状态下电压上升率 (dVp/dt):1000V/s - 换向电流变化率 (dlcom/dt):20A/ms

功能详解: - 三象限技术提高了噪声免疫力。 - 高换向能力,最大误触发免疫。 - 高dV/dt下的高抗误触发能力。 - 高结点工作温度能力。 - 高电压能力。 - 门极较不敏感,具有非常高的噪声免疫力。 - 适合表面贴装的封装。

应用信息: - 适用于高温环境的应用。 - 电子恒温器(加热和冷却)。 - 大功率电机控制,例如洗衣机和吸尘器。 - 整流器供电的直流感性负载,例如直流电机和电磁铁。

封装信息: - 封装类型:D2PAK(SOT404) - 封装描述:塑料单端表面贴装封装,3个引脚(一个引脚裁剪) - 封装尺寸:推荐足迹如图12所示。
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