BTA316B-800B
3Q Hi-Com Triac
23 July 2018
Product data sheet
1. General description
Planar passivated high commutation three quadrant triac in a SOT404 plastic package intended for
use in circuits where high static and dynamic dV/dt and high dI/dt can occur. This "series B" triac
will commutate the full RMS current at the maximum rated junction temperature without the aid of a
snubber.
2. Features and benefits
•
•
•
•
•
•
•
3Q technology for improved noise immunity
High commutation capability with maximum false trigger immunity
High immunity to false turn-on by dV/dt
High voltage capability
Planar passivated for voltage ruggedness and reliability
Surface mountable package
Triggering in three quadrants only
3. Applications
•
•
•
Electronic thermostats (heating and cooling)
High power motor controls e.g. washing machines and vacuum cleaners
Rectifier-fed DC inductive loads e.g. DC motors and solenoids
4. Quick reference data
Table 1. Quick reference data
Symbol
Parameter
VDRM
repetitive peak offstate voltage
IT(RMS)
RMS on-state current
ITSM
Tj
Conditions
Min
Typ
Max
Unit
-
-
800
V
-
-
16
A
non-repetitive peak on- full sine wave; Tj(init) = 25 °C;
tp = 20 ms; Fig. 4; Fig. 5
state current
-
-
140
A
full sine wave; Tj(init) = 25 °C;
tp = 16.7 ms
-
-
150
A
-
-
125
°C
VD = 12 V; IT = 0.1 A; T2+ G+;
Tj = 25 °C; Fig. 7
2
-
50
mA
VD = 12 V; IT = 0.1 A; T2+ G-;
Tj = 25 °C; Fig. 7
2
-
50
mA
full sine wave; Tmb ≤ 101 °C; Fig. 1;
Fig. 2; Fig. 3
junction temperature
Static characteristics
IGT
gate trigger current
BTA316B-800B
WeEn Semiconductors
3Q Hi-Com Triac
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VD = 12 V; IT = 0.1 A; T2- G-;
Tj = 25 °C; Fig. 7
2
-
50
mA
IH
holding current
VD = 12 V; Tj = 25 °C; Fig. 9
-
-
60
mA
VT
on-state voltage
IT = 18 A; Tj = 25 °C; Fig. 10
-
1.3
1.5
V
Dynamic characteristics
dVD/dt
rate of rise of off-state
voltage
VDM = 536 V; Tj = 125 °C; (VDM = 67%
of VDRM); exponential waveform; gate
open circuit
1000
-
-
V/µs
dIcom/dt
rate of change of
commutating current
VD = 400 V; Tj = 125 °C; IT(RMS) = 16 A;
dVcom/dt = 20 V/µs; (snubberless
condition); gate open circuit
20
-
-
A/ms
5. Pinning information
Table 2. Pinning information
Pin
Symbol Description
Simplified outline
1
T1
main terminal 1
2
T2
main terminal 2
3
G
gate
mb
T2
mounting base; main
terminal 2
Graphic symbol
mb
T2
sym051
T1
G
2
1
3
D2PAK (SOT404)
6. Ordering information
Table 3. Ordering information
Type number
BTA316B-800B
BTA316B-800B
Product data sheet
Package
Name
Description
Version
D2PAK
plastic single-ended surface-mounted package (D2PAK); 3
leads (one lead cropped)
SOT404
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3Q Hi-Com Triac
7. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VDRM
repetitive peak off-state
voltage
IT(RMS)
RMS on-state current
ITSM
non-repetitive peak onstate current
2
Conditions
2
Min
Max
Unit
-
800
V
full sine wave; Tmb ≤ 101 °C; Fig. 1;
Fig. 2; Fig. 3
-
16
A
full sine wave; Tj(init) = 25 °C; tp = 20 ms;
Fig. 4; Fig. 5
-
140
A
full sine wave; Tj(init) = 25 °C; tp = 16.7 ms
-
150
A
I t
I t for fusing
tp = 10 ms; SIN
-
98
A²s
dIT/dt
rate of rise of on-state
current
IG = 100 mA
-
100
A/µs
IGM
peak gate current
-
2
A
PGM
peak gate power
-
5
W
PG(AV)
average gate power
-
0.5
W
Tstg
storage temperature
-40
150
°C
Tj
junction temperature
-
125
°C
over any 20 ms period
003aab685
60
IT(RMS)
(A)
50
003aab684
20
IT(RMS)
(A)
16
40
12
30
8
20
4
10
0
10-2
10-1
f = 50 Hz; Tmb = 101 °C
Fig. 1. RMS on-state current as a function of surge
duration; maximum values
BTA316B-800B
Product data sheet
0
-50
1
10
surge duration (s)
0
50
100
150
Tmb (°C)
Fig. 2. RMS on-state current as a function of mounting
base temperature; maximum values
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003aab689
20
Ptot
(W)
15
10
conduction
angle,
(degrees)
form
factor
a
30
60
90
120
180
2.816
1.976
1.570
1.329
1.110
α = 180°
120°
90°
α
60°
30°
5
0
0
2
4
6
8
10
12
14
IT(RMS) (A)
16
α = conduction angle
a = form factor = IT(RMS) / IT(AV)
Fig. 3. Total power dissipation as a function of RMS on-state current; maximum values
003aab668
160
ITSM
(A)
120
80
ITSM
IT
40
0
t
1/f
Tj(init) = 25 °C max
1
102
10
number of cycles (n)
103
f = 50 Hz
Fig. 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
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Product data sheet
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003aab671
103
ITSM
(A)
(1)
102
ITSM
IT
t
10
10-5
tp
Tj(init) = 25 °C max
10-4
10-3
10-2
tp (s)
10-1
tp ≤ 20 ms
(1) dIT/dt limit
Fig. 5. Non-repetitive peak on-state current as a function of pulse duration; maximum values
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Product data sheet
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8. Thermal characteristics
Table 5. Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-mb)
thermal resistance
from junction to
mounting base
full cycle; Fig. 6
-
-
1.2
K/W
half cycle; Fig. 6
-
-
1.7
K/W
thermal resistance
from junction to
ambient free air
printed circuit board mounted; minimum
footprint
-
55
-
K/W
Rth(j-a)
003aab776
10
Zth(j-mb)
(K/W)
(1)
1
(2)
10- 1
P
10- 2
t
tp
10- 3
10- 5
10- 4
10- 3
10- 2
10- 1
1
tp (s)
10
(1) Unidirectional (half cycle)
(2) Bidirectional (full cycle)
Fig. 6. Transient thermal impedance from junction to mounting base as a function of pulse duration
BTA316B-800B
Product data sheet
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9. Characteristics
Table 6. Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VD = 12 V; IT = 0.1 A; T2+ G+;
Tj = 25 °C; Fig. 7
2
-
50
mA
VD = 12 V; IT = 0.1 A; T2+ G-;
Tj = 25 °C; Fig. 7
2
-
50
mA
VD = 12 V; IT = 0.1 A; T2- G-;
Tj = 25 °C; Fig. 7
2
-
50
mA
VD = 12 V; IG = 0.1 A; T2+ G+;
Tj = 25 °C; Fig. 8
-
-
60
mA
VD = 12 V; IG = 0.1 A; T2+ G-;
Tj = 25 °C; Fig. 8
-
-
90
mA
VD = 12 V; IG = 0.1 A; T2- G-;
Tj = 25 °C; Fig. 8
-
-
60
mA
Static characteristics
IGT
IL
gate trigger current
latching current
IH
holding current
VD = 12 V; Tj = 25 °C; Fig. 9
-
-
60
mA
VT
on-state voltage
IT = 18 A; Tj = 25 °C; Fig. 10
-
1.3
1.5
V
VGT
gate trigger voltage
VD = 12 V; IT = 0.1 A; Tj = 25 °C;
Fig. 11
-
0.8
1
V
VD = 400 V; IT = 0.1 A; Tj = 125 °C;
Fig. 11
0.25
0.4
-
V
VD = 800 V; Tj = 125 °C
-
0.1
0.5
mA
ID
off-state current
Dynamic characteristics
dVD/dt
rate of rise of off-state
voltage
VDM = 536 V; Tj = 125 °C; (VDM = 67%
of VDRM); exponential waveform; gate
open circuit
1000
-
-
V/µs
dIcom/dt
rate of change of
commutating current
VD = 400 V; Tj = 125 °C; IT(RMS) = 16 A;
dVcom/dt = 20 V/µs; (snubberless
condition); gate open circuit
20
-
-
A/ms
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Product data sheet
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001aac669
3
001aab100
3
(1)
IGT
IL
IL(25°C)
IGT(25°C)
2
2
(2)
(3)
1
1
0
- 50
0
50
100
Tj (°C)
0
-50
150
(1) T2- G(2) T2+ G(3) T2+ G+
0
50
100
Tj (°C)
150
Fig. 8. Normalized latching current as a function of
junction temperature
Fig. 7. Normalized gate trigger current as a function of
junction temperature
001aab099
3
003aab666
50
IT
(A)
IH
IH(25°C)
40
2
30
(1)
20
(2)
(3)
1
10
0
-50
0
50
100
Tj (°C)
0
150
0
0.5
1
1.5
VT (V)
2
Vo = 1.024 V; Rs = 0.021 Ω
(1) Tj = 125 °C; typical values
(2) Tj = 125 °C; maximum values
(3) Tj = 25 °C; maximum values
Fig. 9. Normalized holding current as a function of
junction temperature
Fig. 10. On-state current as a function of on-state
voltage
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001aab101
1.6
VGT
VGT(25°C)
1.2
0.8
0.4
-50
0
50
100
Tj (°C)
150
Fig. 11. Normalized gate trigger voltage as a function of junction temperature
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Product data sheet
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10. Package outline
Fig. 12. Package outline D2PAK (SOT404)
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Product data sheet
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limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
11. Legal information
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Data sheet status
Document
status [1][2]
Product
status [3]
Objective
[short] data
sheet
Development This document contains data from
the objective specification for product
development.
Preliminary
[short] data
sheet
Qualification
This document contains data from the
preliminary specification.
Product
[short] data
sheet
Production
This document contains the product
specification.
[1]
[2]
[3]
Definition
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. WeEn Semiconductors makes
no representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Please consult the most recently issued document before initiating or
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The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have
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Product data sheet
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and products using WeEn Semiconductors products, and WeEn
Semiconductors accepts no liability for any assistance with applications or
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whether the WeEn Semiconductors product is suitable and fit for the
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Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
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repeated exposure to limiting values will permanently and irreversibly affect
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Trademarks
Notice: All referenced brands, product names, service names and
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12. Contents
1. General description......................................................1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................1
5. Pinning information......................................................2
6. Ordering information....................................................2
7. Limiting values............................................................. 3
8. Thermal characteristics............................................... 6
9. Characteristics..............................................................7
10. Package outline........................................................ 10
11. Legal information..................................................... 11
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Date of release: 23 July 2018
BTA316B-800B
Product data sheet
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