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SBB830-QTY10

SBB830-QTY10

  • 厂商:

    CHIPQUIK

  • 封装:

    -

  • 描述:

    830 PTS SOLDER-IN BREADBOARD (EX

  • 详情介绍
  • 数据手册
  • 价格&库存
SBB830-QTY10 数据手册
SBB830-QTY10 Datasheet revision 1.5 www.Proto-Advantage.com 10 pack: 830 pts solder-in breadboard (Exact Solderless Match) Top View Bottom View Product Highlights Immersion Gold Finish All holes are gold plated and are on a 0.1" grid 1/16” (1.6mm) thick FR-4 UL94V-0 Accepts a variety of wire sizes (20-32 AWG) 4 mounting holes Usage This board exactly copies the routing of an 830-pts full size solderless breadboard. Allows direct transfer of circuits prototyped in a solderless breadboard to a solder-in breadboard to facilitate functional insystem testing or field testing. Specifications Wiring Pattern: Dimensions: PCB construction: PCB operating temperature range: PCB reflow maximum temperature: PCB trace width: PCB trace thickness: PCB trace current capacity*: Hole size: Recommended pin size: Diameter of 4 corner mounting holes: 2 Distribution Strips 1 Terminal Strip 200 Distribution Holes 630 Terminal Holes 6.6" x 2.3" x 0.0625" (167.64mm x 58.42mm x 1.6mm) FR-4 UL94V-0 -40°C to +130°C (-40°F to +266°F) +260°C (500°F) 0.059” (1.5mm) 1 oz copper / ft2 (1.4 mils) (0.03556 mm) 10A continuous @ 40°C rise, 13A continuous @ 80°C rise* 1.0mm (40 mils) diameter 25 mil square wire wrap posts or smaller 3.2mm (125 mils) * Derived from IPC-2221 current capacity graphs at 25°C ambient temperature. Actual current capacity will vary based on air flow, component density, and other factors. 1 © 2007-2022 Proto Advantage™ Top View of SBB830 Topside silkscreen lines between holes show where bottom traces electrically connect holes. (Representative drawing only - not to scale) 2 © 2007-2022 Proto Advantage™ Complete Line of Proto Advantage Exact Solderless Match Solder-in Breadboards: Tiny breadboard match (P/N: SBB170) Full size breadboard match (P/N: SBB830) 1/6 size breadboard match (P/N: SBB136) 1/4 size breadboard match (P/N: SBB206) 1/2 size breadboard match (P/N: SBB400) 3 © 2007-2022 Proto Advantage™
SBB830-QTY10
物料型号:文档中没有明确列出具体物料型号

器件简介:该面包板允许直接将电路从无焊接面包板转移到焊接面包板,以便进行功能系统测试或现场测试。

引脚分配:文档中提到有200个分发孔和630个终端孔,但没有详细列出每个引脚的功能。

参数特性:包括尺寸、PCB构造材料、操作温度范围、回流最高温度、走线宽度、走线厚度、走线电流容量、孔径和推荐引脚尺寸。

功能详解:面包板的顶视图显示了孔之间的电气连接。

应用信息:适用于需要将电路原型转移到焊接面包板进行测试的情况。

封装信息:文档中提到了浸金表面处理,所有孔都是镀金的,并且位于0.1英寸的网格上。
SBB830-QTY10 价格&库存

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SBB830-QTY10
  •  国内价格 香港价格
  • 1+318.358821+39.81033

库存:30