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AL12P72L8BKK0M

AL12P72L8BKK0M

  • 厂商:

    ATPELECTRONICS

  • 封装:

    RDIMM240

  • 描述:

    MODULE DDR3L SDRAM 4GB 240RDIMM

  • 详情介绍
  • 数据手册
  • 价格&库存
AL12P72L8BKK0M 数据手册
ATP Industrial Grade DRAM Modules Targeted Product Portfolio, Engineered Specifically for Your Mission Critical Applications Product Category Speed (MT/s) DDR4 RDIMM RDIMM VLP UDIMM/UDIMM ECC SO-DIMM ECC DDR3 DDR2 1866 1600 1333 1066 RDIMM UDIMM/UDIMM ECC SO-RDIMM SO-CDIMM SO-DIMM mini-RDIMM FB-UDIMM* 800 667 533 400 UDIMM/UDIMM ECC SO-CDIMM SO-DIMM 400 333 266 Features • Density: 4GB to 16GB • Increase performance and bandwidth which is • Low profile up to 3200 MT/s • Very Low Profile (VLP) options • Decrease voltage for better power consumption (VLP: 0.74" height) • Provide better reliability, availability and serviceability (RAS) and improve data integrity as well. 2133 LRDIMM RDIMM UDIMM/UDIMM ECC SO-RDIMM SO-DIMM/SO-DIMM ECC mini-RDIMM mini-UDIMM ECC Form Factor • Density: 1GB to 32GB 32GB to 64GB(LRDIMM) • Chipkill support • Low profile • Fly-by command/address/control bus with • Very Low Profile (VLP) options on-DIMM termination. (VLP: 0.74" height) • Higher bandwidth performance, effectively up to • Ultra Low Profile (ULP) options 1866 MT/s (ULP: 0.7"~0.72” height) • Better performance at low power; 1.5V (Normal) and 1.35V(Low Voltage) • Density: 1GB to 8GB • Chipkill support • Low Profile • Very Low Profile (VLP) options FB-DIMM (VLP:0.72"~0.74" height) • Low power and low voltage options • Apple FB-DIMM DDR* • Low Profile • Density: 512MB to 1GB • Very Low Profile (VLP) options • Chipkill support (VLP:0.72"~0.74" height) SDRAM* RDIMM UDIMM/UDIMM ECC SO-UDIMM Product Portfolio Category Industrial Grade Family SO-DIMM UDIMM RDIMM * • Low Profile • Density: 256MB to 1GB PC 133 • Very Low Profile (VLP) options • Chipkill support PC 100 (VLP:0.72"~0.74" height) • Legacy system support Product DDR3 DDR2 DDR* SDRAM* Features • Extended temperature: -40°C ~ +85°C • Controlled BOM and SPD • For mission critical industrial applications • conformal coating Available on a project basis. ATP TAIWAN(HQ) ATP USA ATP EUROPE ATP JAPAN ATP CHINA TEL: +886-2-2659-6368 FAX: +886-2-2659-4982 sales-apac@atpinc.com TEL: +1-408-732-5000 FAX: +1-408-732-5055 sales@atpinc.com TEL: +49-89-374-9999-0 FAX: +49-89-374-9999-29 sales-europe@atpinc.com TEL: +81-3-6206-8097 FAX: +81-3-6206-8098 sales-japan@atpinc.com TEL: +86-21-5080-2220 FAX: +86-21-5080-2219 sales@cn.atpinc.com OPD0215
AL12P72L8BKK0M
物料型号:文档中没有直接提供物料型号信息。

器件简介:文档主要介绍了ATP公司的工业级DRAM模块产品组合,这些产品专为关键任务型应用设计。

引脚分配:文档中没有提供具体的引脚分配信息。

参数特性:文档列出了DDR4、DDR3、DDR2、DDR以及SDRAM等不同类别的DRAM模块的参数特性,包括速度、形态尺寸、特性等。

功能详解:文档中提到了不同DRAM模块的主要特性,如扩展温度范围、控制的物料清单和SPD、针对关键工业应用的保护涂层等。

应用信息:文档指出这些产品适用于关键任务型工业应用。

封装信息:文档提供了各种DRAM模块的封装选项,包括低剖面和超低剖面选项。
AL12P72L8BKK0M 价格&库存

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