1001312

PRODUCT SPEC SHEET: Embedded 2.4GHz ANTENNA Part No. 1001312 Embedded WiFi/ISM/BT/Zigbee Antenna 2.4 GHz, 2.0x1.2mm KEY BENEFITS Ethertronics’ series of Ceramic Antennas deliver on the key needs of device designers for higher functionality and performance in smaller/thinner designs. These innovative antennas provide compelling advantages for 2.4GHz enabled cell phones, media players and other mobile devices. DESIGN ADVANTAGES Best in Class Performance  Minimal ground clearance and component “keep out” area.  High selectivity eliminates the need for additional filters and frees up board space. END USER ADVANTAGES Superior Range  Greater antenna efficiency means longer range and a better end user experience. Exceptional Coverage  Better coverage delivers more reliable wireless connections for mobile phones, laptops, stereo headsets, cars media players, audio systems and more. SERVICE AND SUPPORT Quicker Time-to-Market  Standard part means fewer design changes.  Simple implementation.  Single part works for various PCB sizes and layouts. Extensive RF Experience  Our antennas are supported by extensive documentation, and when needed, by the expertise of RF engineers who have integrated hundreds of antenna designs into wireless devices. RoHS Compliant  Ethertronics’ antennas comply with the European RoHS Directive 2002/95/EC. Global Operations & Design Support  Ethertronics’ global operations encompass an integrated network of design centers that provide local customer support. More information is available on our Website at www.ethertronics.com/resources/. ETHERTRONICS 5501 Oberlin Drive, Suite 100, San Diego, CA. 92121, USA www.ethertronics.com Tel +(1) 858.550.3820 | fax +(1) 858.550.3821 | contact: info@ethertronics.com PRODUCT: Embedded 2.4GHz Antenna - P/N 1001312 Ethertronics’ Embedded BT Ceramic Antenna Specifications Ethertronics produces a wide variety of standard and custom antennas to meet user needs. Below are the typical performances. Electrical Specifications Typical Characteristics All values are defined, Pi matching circuit will be required, Test board size = 110x55mm ground plane. Specifications Frequency Band 2.400GHz ~ 2.485GHz VSWR Less than 3 Polarization Linear Peak Gain 1.72 dBi Typ. Peak Efficiency 72.3% Typ Impedance 50Ω Typ. Size Mechanical Specifications Mounting L W H A 2.0±0.3 1.2±0.3 .55±0.2 0.4±0.25 2.00x1.20x0.55mm Surface Mount VSWR ETHERTRONICS 5501 Oberlin Drive, Suite 100, San Diego, CA. 92121, USA www.ethertronics.com Tel +(1) 858.550.3820 | fax +(1) 858.550.3821 | contact: info@ethertronics.com PRODUCT: Embedded 2.4GHz Antenna - P/N 1001312 Recommended PCB Layout (Unit = mm) *0402 Component Matching Component Pad Pad *Clearance Area: 8x2.5mm RF Input *The 0402 Component is used for tuning the frequency in very limited, extreme cases. In most applications, the 0402 component will not be necessary. 8 3.5 1.5 2.25 2.25 0.5 0.4 0.7 1.4 0.5 1.25 1 1.8 2.5 0.44 1.1 0.68 0.72 *Clearance area 8mm x 2.5mm: All metallization should be removed from all PCB layers. ETHERTRONICS 5501 Oberlin Drive, Suite 100, San Diego, CA. 92121, USA www.ethertronics.com Tel +(1) 858.550.3820 | fax +(1) 858.550.3821 | contact: info@ethertronics.com PRODUCT: Embedded 2.4GHz Antenna - P/N 1001312 2D Gain Patterns (2442 MHz) E-theta E-phi E-total ETHERTRONICS 5501 Oberlin Drive, Suite 100, San Diego, CA. 92121, USA www.ethertronics.com Tel +(1) 858.550.3820 | fax +(1) 858.550.3821 | contact: info@ethertronics.com PRODUCT: Embedded 2.4GHz Antenna - P/N 1001312 Tape & Reel Specifications Quantity/Reel = 5,000 Unit = mm A B C D E F L W 8.00±0.30 3.5±0.05 1.75±0.10 2.00±0.05 4.00±0.10 1.50±0.10 2.30±0.10 1.55±0.10 Symbol Spec. A 178.0±2.0 B 2.0±0.5 C 13.0±0.5 D 21.0±0.8 E 62.0±1.5 F 9.0±0.5 G 13.0±1.0 ETHERTRONICS 5501 Oberlin Drive, Suite 100, San Diego, CA. 92121, USA www.ethertronics.com Tel +(1) 858.550.3820 | fax +(1) 858.550.3821 | contact: info@ethertronics.com PRODUCT: Embedded 2.4GHz Antenna - P/N 1001312 Reliability Testing Item Condition Specification Thermal Shock 1. 2. 3. 4. 5. 30±3 minutes at -40°C±5°C Convert to +105°C (5 minutes) 30±3 minutes at +105°C±5°C Convert to -40°C (5 minutes) Total: 100 continuous cycles No apparent damage. Fulfills the electrical spec after test. Humidity Resistance 1. 2. 3. Humidity: 85% R.H. Temperature: 85±5°C Time: 1,000 hours No apparent damage. Fulfills the electrical spec after test. High Temperature Resistance 1. 2. Temperature: 150°C±5°C Time: 1,000 hours No apparent damage. Fulfills the electrical spec after test. Low Temperature Resistance 1. 2. Temperature: -40°C±5°C Time: 1,000 hours No apparent damage. Fulfills the electrical spec after test. Soldering Heat Resistance 1. 2. Solder bath temperature: 260±5°C Bathing time: 10±1 seconds No apparent damage. Solderability The dipped surface of the terminal shall be at least No apparent damage. 95% covered with solder after being dipped in a solder bath of 245±5°C for 3±1 seconds Storage Conditions Warehouse Temperature Range: The temperature should be within 0~30°C and humidity should be less than 60% RH. The product should be used within 1 year from the time of delivery On Board Temperature Range: The temperature should be within -40~85°C and humidity should be less than 85% RH. Operating Temperature Range Operating temperature range: -40°C to +105°C ETHERTRONICS 5501 Oberlin Drive, Suite 100, San Diego, CA. 92121, USA www.ethertronics.com Tel +(1) 858.550.3820 | fax +(1) 858.550.3821 | contact: info@ethertronics.com PRODUCT: Embedded 2.4GHz Antenna - P/N 1001312 Temperature of termination Recommended Reflow Soldering Time A 1st Rising Temperature The normal to preheating temperature 30s to 60s B Preheating 140°C to 160°C 60s to 120s nd C 2 Rising Temperature Preheating to 200°C 20s to 40s D Main Heating if 220°C 50s~60s if 230°C 40s~50s if 240°C 30s~40s if 250°C 20s~40s if 260°C 20s~40s 200°C to 100°C 1°C /s ~ 4°C /s E Regular Cooling *reference: J-STD-020C Soldering Gun Procedure Note the following when using a solder gun to replace the antenna 1. The tip temperature must be less than 350°C for the period within 3 seconds when using a soldering gun under 30W. 2. The soldering gun tip shall not touch this part directly. Soldering Volume Note that excess of soldering volume will easily crach the body of this product. © 2011 Ethertronics. All rights reserved. Ethertronics, the Ethertronics logo, shaping antenna technology, Isolated Magnetic Dipole and the iMD logo are trademarks of Ethertronics. All other trademarks are the property of their respective owners. Specifications subject to change and are dependent upon actual implementation. 1001312 1May2013