LA.02 2.4GHz Embedded Loop Chip Antenna
Part No:
LA.02
Description:
1dBi 2400MHz to 2500MHz Wi-Fi/Bluetooth/Bluetooth LE/ ZigBee
Features:
8*2*2mm Ceramic Antenna
Surface Mount
Low Profile
Peak gain 1dBi
50 Ohm Impedance
Components can be mounted on opposite side of board to the antenna
RoHS & REACH Compliant
SPE-15-8-40-C
1.
Introduction
3
2.
Specifications
5
3.
Antenna Characteristics
6
4.
Radiation Patterns
8
5.
Mechanical Drawing – Antenna
10
6.
Mechanical Drawing – Evaluation Board
13
7.
Soldering Conditions
14
8.
Packaging
15
9.
Changelog
17
Taoglas makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to
make changes to specifications and product descriptions at any time without notice. Taoglas reserves all rights to this document and
the information contained herein. Reproduction, use or disclosure to third parties without express permission is strictly prohibited.
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2
1.
Introduction
1.
Introduction
1.
Introduction
1.
Introduction
1.
1.
1.
1.
The LA.02 is a 2.4GHz embedded loop chip antenna that has best in class efficiency, 66% on center frequency.
It’s a miniature SMD ceramic component, designed to be mounted directly on the edge of the main device
PCB and is suitable especially for very small space requirements for Bluetooth LE, Wi-Fi, 802.11 applications.
The LA.02 uses this main PCB ground plane to increase antenna efficiency, requiring minimum groundclearance around the antenna. The opposite side of the board on which the antenna is mounted does not
need ground-clearance, allowing more space for components or signal routing. This antenna is delivered on
tape and reel.
Introduction
Introduction
Some frequency offset may happen as is normal with antennas embedded devices, so the antenna can be
tuned for different PCB sizes and enclosures by simply changing the value of the matching circuit. Please
contact your regional Taoglas sales office for support.
Introduction
Many module manufacturers specify peak gain limits for any antennas that are to be connected to that
module. Those peak gain limits are based on free-space conditions. In practice, the peak gain of an antenna
tested in free-space can degrade by at least 1 or 2dBi when put inside a device. So ideally you should go for
a slightly higher peak gain antenna than mentioned on the module specification to compensate for this effect,
giving you better performance.
Introduction
Upon testing of any of our antennas with your device and a selection of appropriate layout, integration
technique, or cable, Taoglas can make sure any of our antennas’ peak gain will be below the peak gain limits.
Taoglas can then issue a specification and/or report for the selected antenna in your device that will clearly
show it complying with the peak gain limits, so you can be assured you are meeting regulatory requirements
for that module.
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3
For example, a module manufacturer may state that the antenna must have less than 2dBi peak gain, but
you don’t need to select an embedded antenna that has a peak gain of less than 2dBi in free-space. This will
give you a less optimized solution. It is better to go for a slightly higher free-space peak gain of 3dBi or more
if available. Once that antenna gets integrated into your device, performance will degrade below this 2dBi
peak gain due to the effects of GND plane, surrounding components, and device housing. If you want to be
absolutely sure, contact Taoglas and we will test. Choosing a Taoglas antenna with a higher peak gain than
what is specified by the module manufacturer and enlisting our help will ensure you are getting the best
performance possible without exceeding the peak gain limits.
This antenna can be mounted with no performance degradation in either orientation as long as the antenna
is soldered correctly via Surface mounting. Please see the integration instructions section for further detail
regarding the optimum way to integrate this antenna into your device.
For further optimization to customer-specific device environments and for support to integrate and test this
antennas performance in your device, contact your regional Taoglas Customer Services Team.
Applications:
Telematics devices
Bluetooth LE Wearables
Bluetooth Headsets
Hand-held devices when Bluetooth/Wi-Fi functions are needed, e.g., smart phone.
IEEE802.11 b/g
ZigBee
Wireless PCMCIA cards or USB dongle
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4
2.
Specifications
3.
Antenna Characteristics2.
Specifications
Antenna
Frequency (MHz)
3.
2400-2500 MHz
Antenna Characteristics
Efficiency (%)
80 x 40 mm Ground Plane
66% (Centre Frequency)
Peak Gain (dBi)
4.
Antenna Radiation Patterns3.Antenna1 dBi (Typ.)
80 x 40 mm Ground Plane
VSWR
Characteristics2.
3.
Specifications
2 max (Centre Frequency)
Impedance (Ω)
50Ω
Polarization
Linear
Bandwidth
Antenna
Characteristics2.
100MHz min.
Specifications
Mechanical
3.
Dimensions (mm)
8.0 x 2.0 x 2.0
Material
Ceramic
Weight (g)
0.11
Antenna Characteristics
Environmental
4.
Temperature Range
-40°C to 85°C
Antenna
Radiation Patterns3.Antenna
Storage Temperature
-40°C to 105°C
0 20 ppm @-20ºC to +80ºC
Temperature Coefficient(τf)
Characteristics
Recommended Reel Storage
Condition
5°C to 40°C
Relative Humidity 20% to 70%
Moisture Sensitivity Level
3 (168 Hours)
4.
Antenna Radiation Patterns
4.
Antenna Radiation Patterns3.Antenna
Characteristics
4.
Antenna Radiation Patterns3.Antenna
Characteristics2.
SPE-15-8-40-C
Specifications
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5
3.
Antenna Characteristics
3.1
4.
Return Loss
Antenna Radiation Patterns3.Antenna
Characteristics
4.
Antenna Radiation Patterns
4.
Antenna Radiation Patterns3.Antenna
Characteristics
3.2
4.
Efficiency
Antenna Radiation Patterns3.Antenna
Characteristics
4.
Antenna Radiation Patterns
4.
Antenna Radiation Patterns
4.
Antenna Radiation Patterns
4.
Antenna Radiation Patterns3.Antenna
Characteristics
4.
Antenna Radiation Patterns3.Antenna
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6
3.3
Average Gain
3.4
Peak Gain
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7
4.
4.
Radiation Patterns
4.1
Test Setup – Antenna on Evaluation Board
Antenna Radiation Patterns
4.
Antenna Radiation Patterns
4.
Antenna Radiation Patterns
4.
Antenna Radiation Patterns
4.
Antenna Radiation Patterns
Y
X
4.
Antenna Radiation Patterns
4.
Antenna Radiation Patterns
Z
Z
X
SPE-15-8-40-C
Y
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8
4.2
2D Radiation Pattern
2400-2500 MHz
5925MHz
XZ Plane
XY Plane
X
Z
Y
4.3
YZ Plane
Y
Z
X
3D Radiation Pattern
2450 MHz
5925MHz
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9
5.
Mechanical Drawing – Antenna
5.1
Antenna Dimension and Drawing
6.
Packaging5.
6.
Packaging
Mechanical Drawing
Unit: mm
7.
Application Note6. Packaging5.
Mechanical
Drawing
5.2
Antenna Footprint
Top Copper:
6.
Packaging5.
Mechanical Drawing
6.
Packaging
7.
Application Note6. Packaging
Top Solder Paste:
7.
Application Note
7.
Application Note6. Packaging
7.
Application Note6. Packaging5.
Mechanical
Drawing
6.
Packaging5.
SPE-15-8-40-C
Mechanical Drawing
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10
Top Solder Mask:
Composite Diagram:
*Taoglas is able to provide CAD drawing file to customers for evaluation.
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11
5.2
Matching Circuit
Like all antennas, surrounding components, enclosures, and changes to the GND plane dimensions
can alter performance. A pi-matching network like the one shown below is required in case
adjustments need to be made. The antenna evaluation board (EVB) has a similar matching network.
The components on the EVB are a good starting point for a new design, but will need to be adjusted
upon integration to as close as possible to 50 Ohm impedance for best performance. The zero ohm
resistor is needed for the ability to solder down a coax pigtail to make measurements with a vector
network analyzer. Contact your regional Taoglas sales office for support.
SPE-15-8-40-C
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12
6.
Mechanical Drawing – Evaluation Board
6.
Packaging5.
6.
Packaging
7.
Application Note6. Packaging5.
Mechanical Drawing
Mechanical
Drawing
6.
Packaging5.
6.
Packaging
Mechanical Drawing
Footprint on Taoglas Evaluation board (Unit: mm)
7.
Application Note6. Packaging
7.
Application Note
7.
Application Note6. Packaging
7.
Application Note6. Packaging5.
Mechanical
Drawing
6.
Packaging5.
SPE-15-8-40-C
Mechanical Drawing
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13
7.
Soldering Conditions
Typical Soldering profile for lead-free process:
6.
Packaging5.
Mechanical Drawing
Phase
6.
Pb-Free Assembly
(SnAgCu)
PREHEAT
Packaging
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(ts) form (Tsmin to Tsmax)
150℃
200℃
60-120 seconds
RAMP-UP
Avg. Ramp-up Rate (Tsmax to TP)
3℃/second(max)
-Temperature(TL)
-Total Time above TL (t L)
-Temperature(TP)
-Time(tp)
Rate
217℃
30-100 seconds
260℃
5-10 second
6℃ / second max.
REFLOW
7.
Profile features
Application Note6. Packaging5.
PEAK
Drawing
RAMP-DOWN
Mechanical
Time from 25℃ to Peak Temperature
8 minutes max.
Composition of solder paste
96.5Sn/3Ag/0.5Cu
Solder Paste Model
SHENMAO PF606-P26
6.
Packaging5.
Mechanical Drawing
6.
Packaging
7.
Application Note6. Packaging
7.
Application Note
7.
Application Note6. Packaging
7.
Application Note6. Packaging5.
Mechanical
Drawing
6.
Packaging5.
SPE-15-8-40-C
Mechanical Drawing
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14
9.
Packaging
6.
Packaging5.
6.
Packaging
7.
Application Note6. Packaging5.
Mechanical Drawing
Mechanical
Drawing
6.
Packaging5.
Mechanical Drawing
6.
Packaging
7.
Application Note6. Packaging
7.
Application Note
7.
Application Note6. Packaging
7.
Application Note6. Packaging5.
Mechanical
Drawing
6.
Packaging5.
SPE-15-8-40-C
Mechanical Drawing
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15
Unit: mm
SPE-15-8-40-C
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16
Changelog for the datasheet
SPE-15-8-040 – LA.02
Revision: C (Current Version)
Date:
Changes:
Changes Made by:
2021-11-1
Format Change, MSL
Erik Landi
Previous Revisions
Revision: B
Date:
Changes:
Changes Made by:
2021-05-18
Amended Footprint drawing
Erik Landi
Revision: A (Original First Release)
Date:
Notes:
Author:
SPE-15-8-40-C
2016-06-17
Initial Release
STAFF
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17
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SPE-15-8-40-C
© Taoglas 18
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