SGGP.25.4.A.02

  SGGP.25A Specification Part No. SGGP.25A Product Name GPS/GLONASS SMT Patch Antenna Features 25mm*25mm*4.5mm Single Feed SMT Mount GPS: 1575MHz GLONASS: 1602MHz Patent pending RoHS SGGP.25.4.A.02 | page 1 of 14 1. Introduction This ceramic 25mm GPS/GLONASS patch antenna is mounted via SMT process and has been pre-tuned for a 50*50mm ground plane. Custom part no’s tuned for different ground-plane or layout positions and taking into account the specific conditions in your device can be created and supplied by Taoglas. 2. Specification Original Patch Specification tested on 50*50mm ground plane No.: PARAMETER Specification Notes 1 Range of Receiving Frequency 2 Center Frequency 1592± 3MHz With 50*50mm ground plane 3 Bandwidth 8MHz min Return Loss > 1.62100 GHz 3 2 1: 2: 49.844 Ω -1.0605 Ω 1.60200 GHz 3: 24.081 Ω 5.4004 GHz 1.60800 GHz 4: 8.6426 Ω 22.757 Ω 1.62100 GHz 2 1 Center 1 592.000 000 MHz Span 100.000 000 MHz CH3 Markers 49.156 Ω 0.0020 Ω 1.57542 Ghz SGGP.25.4.A.02 | page 3 of 14 4. Radiation Patterns 4.1 1575MHz - XZ and YZ Plane 30 330 0 -5 -10 -15 60 300 -20 -25 -30 -35 -40 90 270 -45 120 240 150 (dBi) 210 180 Pattern Model No. Test Mode Freq (Mhz) Max Gain (dBi) Min Gain (dBi) Avg. Gain (dBi) Source Polar Date 1 SGGP.25 XZ 1575.42 -0.36 / 356.00 -8.52 / 248.00 -3.54 V+H 2012/6/8 2 SGGP.25 YZ 1575.42 1.20 / 351.00 -9.29 / 105.00 -2.49 V+H 2012/6/8 SGGP.25.4.A.02 | page 4 of 14  4.2 1602MHz - XZ and YZ Plane 30 330 0 -5 -10 -15 60 300 -20 -25 -30 -35 -40 90 270 -45 120 240 150 (dBi) 210 180 Pattern Model No. Test Mode Freq (Mhz) Max Gain (dBi) Min Gain (dBi) Avg. Gain (dBi) Source Polar Date 1 SGGP.25 XZ 1602.00 2.88 / 355.00 -5.41 / 254.00 -0.65 V+H 2012/6/8 2 SGGP.25 YZ 1602.00 1.95 / 350.00 -8.76 / 249.00 -1.83 V+H 2012/6/8 SGGP.25.4.A.02 | page 5 of 14 5. Mechanical Specifications 5.1 Antenna Dimensions and Drawing   SGGP.25.4.A.02 | page 6 of 14  5.1.1 Footprint Copper Keepout Area   SGGP.25.4.A.02 | page 7 of 14  5.1.2 Paste Area   SGGP.25.4.A.02 | page 8 of 14  5.1.3 Soder Mask (Negative)   SGGP.25.4.A.02 | page 9 of 14  5.1.4 Footprint Composite   SGGP.25.4.A.02 | page 10 of 14  5.2 Test Jig and Dimension SGGPD.25A SGGP.25.4.A.02   | page 11 of 14  5.3 SGGPD.25A   SGGP.25.4.A.02 | page 12 of 14 6. Recommended Reflow Soldering Profile SGGP.25A can be assembled following Pb-free assembly. According to the Standard IPC/JEDEC J-STD-020C, the temperature profile suggested is as follows: Phase Profile Features Pb-Free Assembly (SnAgCu) PREHEAT Temperature Min(Tsmin) 150°C Temperature Max(Tsmax) 200°C Time(ts) from (Tsmin to Tsmax) 60-120 seconds RAMP-UP Avg. Ramp-up Rate (Tsmax to TP) 3°C/second(max) REFLOW Temperature(TL) 217°C Total Time above TL (tL) 30-100 seconds PEAK Temperature(TP) 260°C Time(tp) 2-5 seconds RAMP-DOWN Rate 3°C/second(max) Time from 25°C to Peak Temperature 8 minutes max. Composition of solder paste 96.5Sn/3Ag/0.5Cu Solder Paste Model SHENMAO PF606-P26     Soldering Iron condition: Soldering iron temperature 270°C±10°C. Apply preheating at 120°C for 2-3 minutes. Finish soldering for each terminal within 3 seconds, if soldering iron temperature over270°C±10°C or 3 seconds, it will make cause component surface peeling or damage. SGGP.25.4.A.02 | page 13 of 14 7. Packaging Taoglas makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Taoglas reserves all rights to this document and the information contained herein. Reproduction, use or disclosure to third parties without express permission is strictly prohibited. Copyright © Taoglas Ltd. SGGP.25.4.A.02   | page 14 of 14