SGP.1575.18.4.C.02

SPECIFICATION Part No. : SGP.1575.18.4.C.02 Product Name : GPS/GALILEO SMT Patch Antenna Features : 18mm*18mm*4.5mm 1575MHz Centre Frequency Patent Pending RoHS  SPE-11-8-138/F/SS Page 1 of 14 1. Introduction This ceramic GPS patch antenna is based on smart XtremeGain™ technology. It is mounted via SMT process and has been selected as optimal solution for the 45*45mm ground plane. 2. Specification Original Patch Specification tested on 45mm ground plane No Parameter Specification Notes Range of Receiving 1 2 Frequency Center Frequency 1575.42 MHz ± 1.023 MHz 1575.42 ± 3MHz With 45*45mm ground plane Return Loss ≤-10 3 Bandwidth 5MHz min dB 4 VSWR 1.5 max 5 Gain at Zenith +1.0 dBic typ. 6 Gain at 10°elevation -3.0 dBic typ. 7 Axial Ratio 4.0 dB max 8 Polarization RHCP 9 Impedance 50 Ohms Frequency Temperature 10 11 Coefficient（τf） Operating Temperature 0 ± 20ppm / oC -40ºC to +85ºC -40°C to +85°C **Changes in user groundplane and environment will offset centre frequency SPE-11-8-138/F/SS Page 2 of 14 3. Electrical Specifications 3.1 Return Loss, SWR, Impedance, measured on the test fixture SPE-11-8-138/F/SS Page 3 of 14 4. Mechanical Specifications 4.1 Antenna Dimensions and Drawing SPE-11-8-138/F/SS Page 4 of 14 4.2 Antenna Footprint 4.2.1 Top Copper SPE-11-8-138/F/SS Page 5 of 14 4.2.2 Top Paste SPE-11-8-138/F/SS Page 6 of 14 4.2.3 Top Mask SPE-11-8-138/F/SS Page 7 of 14 4.2.4 Composite SPE-11-8-138/F/SS Page 8 of 14 4.3 Test Jig and Dimension SPE-11-8-138/F/SS Page 9 of 14 4.4 Test Fixture set up and measurements SPE-11-8-138/F/SS Page 10 of 14 5. Recommended Reflow Soldering Profile SGP.18C can be assembled following Pb-free assembly. According to the Standard IPC/JEDEC J-STD-020C, the temperature profile suggested is as follow: Phase Profile Features Pb-Free Assembly (SnAgCu) PREHEAT Temperature Min(Tsmin) 150°C Temperature Max(Tsmax) 200°C Time(ts) from (Tsmin to Tsmax) 60-120 seconds RAMP-UP Avg. Ramp-up Rate (Tsmax to TP) 3°C/second(max) REFLOW Temperature(TL) 217°C Total Time above TL (tL) 30-100 seconds Temperature(TP) 260°C Time(tp) 2-5 seconds Rate 3°C/second(max) PEAK RAMP-DOWN Time from 25°C to Peak Temperature 8 minutes max. Composition of solder paste 96.5Sn/3Ag/0.5Cu Solder Paste Model SHENMAO PF606-P26 Soldering Iron condition: Soldering iron temperature 270°C±10°C. Apply preheating at 120°C for 2-3 minutes. Finish soldering for each terminal within 3 seconds, if soldering iron temperature over270°C±10°C or 3 seconds, it will make cause component surface peeling or damage. SPE-11-8-138/F/SS Page 11 of 14 6. Packaging SPE-11-8-138/F/SS Page 12 of 14 Taoglas makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Taoglas reserves all rights to this document and the information contained herein. Reproduction, use or disclosure to third parties without express permission is strictly prohibited. Copyright © Taoglas Ltd. SPE-11-8-138/F/SS Page 13 of 14 SPE-11-8-138/F/SS Page 14 of 14