RFANT7635110A1T

Approval sheet MULTILAYER CERAMIC ANTENNA RFANT BROADBAND Series – RoHS Compliance 2.4 GHz ISM Band Working Frequency RFANT7635110A1T *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_RFANT7635110A1T_V09 Apr.2010 Approval sheet FEATURES 3
Surface Mounted Devices with a small dimension of 7.6 x 3.5 x 1.1 mm meet future miniaturization trend.
380MHz broad bandwidth design makes less influence, less frequency shifting due to outside environmental deviation.
70% small footprint compared to normal band design (140MHz).
Embedded and LTCC (Low Temperature Co-fired Ceramic) technology is able to future integrate with system design as well as beautifying the housing of final product.
High Stability in Temperature / Humidity Change
Free Impedance Matching APPLICATIONS Bluetooth Wireless LAN HormRF ISM band 2.4GHz wireless applications



DESCRIPTION Walsin Technology Corporation develops a new ceramic embedded antenna specified for 2.4 GHz ISM Band application, TM as shown in below “CONSTRUCTION”. Both of Wireless LAN IEEE 802.11b and Bluetooth typically located on this unlicensed frequency band which range covers from 2.4GHz to 2.4835GHz. To fulfil the friendly usage for antenna, this antenna has been designed to a typical 400MHz bandwidth through Walsin’s advanced LTCC (Low Temperature Co-fired Ceramic) technology and superior product design via 3D EM Simulation Skill. 3 This antenna has a rectangular ceramic body with a tiny dimension of 7.6 x 3.5 x 1.1 mm meet the future SMT automation and miniaturization requirements on modern portable devices. CONSTRUCTION Fig 1. Outline of 2.4GHz Chip Antenna DIMENSIONS Figure Dimension L P1 G W WTC Fd P3 G P2 C D T Port definition L 7.60 ± 0.30 mm - W 3.50 ± 0.20 mm - T 1.10 ± 0.10 mm - Fd 0.50 ± 0.20 mm Feed termination G 0.80 ± 0.20 mm Ground termination C 0.50 ± 0.20 mm D 0.50 ± 0.20 mm P1 0.80 ± 0.20 mm Solder termination P2 0.80 ± 0.20 mm Solder termination P3 0.50 ± 0.10 mm Solder termination MARKING: Upon customer requested, max. 5-digit code is allowed. Page 2 of 8 ASC_RFANT7635110A1T_V09 Apr.2010 Approval sheet SOLDER LAND PATTERN DESIGN Figure Lp Symbol Dimension Wp L 8.10 ± 0.10 mm Ws Lp 1.00 ± 0.10 mm Wp 1.20 ± 0.10 mm Lf 1.50 ± 0.10 mm Wf 0.80 ± 0.10 mm Lg 1.50 ± 0.10 mm Wg 1.50 ± 0.10 mm Ws 0.40 ± 0.10 mm Lh 0.50 ± 0.10 mm L Lh Wf Lf Lg Wg S o ld e r in g P a d G ro u n d P a d c o n n e c te d to G r o u n d P a d c o n n e c te d to 5 0 Ω T r a n s m is s io n L in e ELECTRICAL CHARACTERISTICS RFANT7635110A1T Specification Central frequency 2.450 GHz (Note-1) Bandwidth 380 MHz (Typical value) Gain 0 ~ 2 dBi VSWR 2 max. Polarization Linear Azimuth Bandwidth Omni-directional Impedance 50Ω Rated Power (max.) 5 Watts Maximum Input Power 10 Watts for 5 minutes Operation Temperature -40˚ C ~ +85˚ C Note-1. Central Frequency should be defined after customers’ application approval. Page 3 of 8 ASC_RFANT7635110A1T_V09 Apr.2010 Approval sheet RADIATION PATTERN Radiation Pattern and Gain were dependent on measurement board design. Walsin’s LTCC chip antenna is an electrically small antenna (size smaller than 1/10λ). The specification of RFANT7635110A1x series chip antenna was measured based on the PCB size and installation position as shown in the below figure Test Board Return Loss (S11) 20 mm 13 mm Ant. Ant. Thickness 0.8 mm FR4 40 mm 50 Ω Microstrip Ground Plane E-Plane (dBi) H-Plane (dBi) The typical tuning range of Walsin’s chip antenna is about ±150MHz. The performance of embedded ceramic antenna is sensitive influenced by customer's ground area, PC board size, thickness, material, mechanical design and the material of housing for end product. WTC engineers have significant expertise on embedded antenna designs and applications. We can work closely with you to ensure the requirements are met, and optimise the WTC’s antenna performance when installing on your application. Page 4 of 8 ASC_RFANT7635110A1T_V09 Apr.2010 Approval sheet RELIABILITY TEST Test item Solderability JIS C 0050-4.6 JESD22-B102D Test condition / Test method Specification *Solder bath temperature：235 ± 5°C At least 95% of a surface of each terminal *Immersion time：2 ± 0.5 sec electrode must be covered by fresh solder. *Solder：Sn3Ag0.5Cu for lead-free Leaching *Solder bath temperature：260 ± 5°C Loss of metallization on the edges of each of metallization) *Leaching immersion time：30 ± 0.5 sec electrode shall not exceed 25%. IEC 60068-2-58 *Solder : SN63A (Resistance to dissolution Resistance to soldering heat *Preheating temperature：120~150℃, No mechanical damage. JIS C 0050-5.4 1 minute. Samples shall satisfy electrical specification *Solder temperature：270±5°C after test. *Immersion time：10±1 sec Loss of metallization on the edges of each *Solder：Sn3Ag0.5Cu for lead-free electrode shall not exceed 25%. Measurement to be made after keeping at room temperature for 24±2 hrs Drop Test JIS C 0044 *Height：75 cm No mechanical damage. *Test Surface：Rigid surface of concrete Samples shall satisfy electrical specification or steel. after test. *Times：6 surfaces for each units；2 times for each side. Adhesive Strength of Termination JIS C 0051- 7.4.3 Bending test JIS C 0051- 7.4.1 *Pressurizing force： 5N(≦0603)；10N(>0603) No remarkable damage or removal of the termination. *Test time：10±1 sec The middle part of substrate shall be No mechanical damage. pressurized by means of the pressurizing Samples shall satisfy electrical specification rod at a rate of about 1 mm/s per second after test. until the deflection becomes 1mm/s and then pressure shall be maintained for 5±1 sec. Measurement to be made after keeping at room temperature for 24±2 hours Page 5 of 8 ASC_RFANT7635110A1T_V09 Apr.2010 Approval sheet Temperature cycle JIS C 0025 1. 30±3 minutes at -40°C±3°C, No mechanical damage. 2. 10~15 minutes at room temperature, Samples shall satisfy electrical 3. 30±3 minutes at +85°C±3°C, 4. 10~15 minutes at room temperature, specification after test. Total 100 continuous cycles Measurement to be made after keeping at room temperature for 24±2 hrs Vibration JIS C 0040 *Frequency：10Hz~55Hz~10Hz(1min) No mechanical damage. *Total amplitude：1.5mm Samples shall satisfy electrical specification *Test times：6hrs.(Two hrs each in three after test. mutually perpendicular directions) High temperature JIS C 0021 *Temperature：85°C±2°C No mechanical damage. *Test duration：1000+24/-0 hours Samples shall satisfy electrical specification Measurement to be made after keeping at after test. room temperature for 24±2 hrs Humidity (steady conditions) *Humidity：90% to 95% R.H. No mechanical damage. *Temperature：40±2°C Samples shall satisfy electrical specification JIS C 0022 *Time：1000+24/-0 hrs. after test. Measurement to be made after keeping at room temperature for 24±2 hrs ※ 500hrs measuring the first data then 1000hrs data Low temperature JIS C 0020 *Temperature：-40°C±2°C No mechanical damage. *Test duration：1000+24/-0 hours Samples shall satisfy electrical specification Measurement to be made after keeping at after test. room temperature for 24±2 hrs Page 6 of 8 ASC_RFANT7635110A1T_V09 Apr.2010 Approval sheet SOLDERING CONDITION Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2 Fig 2. Infrared soldering profile ORDERING CODE RF Walsin RF device ANT 763511 Product code ANT : Antenna 0 A Dimension code Unit of dimension Per 2 digits of Length, Width, Thickness : 0 : 0.1 mm 1 : 1.0 mm e.g. : 1 T Application Specification Packing A : 2.4GHZ ISM Band Design Code T : 7” Reeled B : GSM 900/1800 Dual Band C : GSM 900 763511 = Length 76, Width 35, Thickness 11 D : GSM 1800 E : GPS F : W-CDMA G : PHS PACKAGING: Plastic Tape specifications (unit :mm) P1 P2 ΦD P0 E F W WTC WTC WTC WTC WTC B0 T A0 Index Dimension (mm) Index Dimension (mm) Page 7 of 8 Ao Bo ΦD T W 3.86 ± 0.10 7.92 ± 0.10 1.55 ± 0.05 1.35 ± 0.10 16.0 ± 0.30 E F Po P1 P2 1.75 ± 0.10 7.50 ± 0.10 4.00 ± 0.10 8.00 ± 0.10 2.00 ± 0.10 ASC_RFANT7635110A1T_V09 Apr.2010 Approval sheet Reel dimensions C A A B C Φ178 Φ60.0 Φ13.5 Index Dimension (mm) B Typing Quantity: 1000 pieces per 7” reel CAUTION OF HANDLING Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects, which might directly cause damage to the third party’s life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Medical equipment (5) Disaster prevention / crime prevention equipment (6) Traffic signal equipment (7) Transportation equipment (vehicles, trains, ships, etc.) (8) Applications of similar complexity and /or reliability requirements to the applications listed in the above. Storage condition (1) Products should be used in 6 months from the day of WALSIN outgoing inspection, which can be confirmed. (2) Storage environment condition.     Products should be storage in the warehouse on the following conditions.    Products should be storage on the palette for the prevention of the influence from humidity, dust and son on. Page 8 of 8 Temperature : -10 to +40°C Humidity : 30 to 70% relative humidity Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of electrode, resulting in poor solderability. Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on. Products should be storage under the airtight packaged condition. ASC_RFANT7635110A1T_V09 Apr.2010