DA14681-01000U22

SmartBond™ DA14681 The most integrated and flexible Bluetooth® low energy SoC with expandable memory execution space Create next-generation Bluetooth low energy solutions without compromising on functionality or battery lifetime, thanks to Dialog’s SmartBond DA14681. It’s the world’s first single-chip solution for wearables, smart home and other rechargeable devices. This highly integrated solution supports the full Bluetooth 4.2 features. As a SmartBond device, it offers the highest performance, lowest power consumption and smallest footprint. Delivering processing capacity when you need it and saving power when you don’t, it can manage multi-sensor arrays and enable always-on sensing. Plus our SmartSnippets™ tooling helps you optimize your software for power consumption. With an integrated Power Management Unit comprising system power rails, a battery charger and a fuel gauge, it supports rechargeable batteries natively and can power a complete sensor-based system. Meanwhile, a dedicated hardware crypto engine delivers banking-level security (including Apple HomeKit support) with end-to-end encryption to keep personal data safe. DA14681 16 kB Cache USB 1.1 Charger UARTx2 SPIx2 I2Cx2 XTAL16M PLL96M ARM M0 CPU ™ XTAL32K 8-CH DMA AES256 SHA-2 OTP 64 kB ECC TRNG RAM 128 kB KEYB QDEC RADIO IR Digital PHY ADC BLE 4.2 MAC TEMP Applications ■ (Multi-sensor) wearable devices: - Fitness / activity trackers - Sport watches - Smartwatches ■ Smart home ■ Consumer appliances ■ Home automation ■ Voice-controlled remote controls ■ Rechargeable keyboards ■ Toys ■ Industrial automation TIMERS PCM/I2S ROM 128 kB PDM QuadSPI CTRL GPIO matrix Power Management Unit www.dialog-semiconductor.com/bluetoothlowenergy SoC Features • Complies to Bluetooth 4.2, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) • Flexible processing power - 32 kHz up to 96 MHz 32-bit ARM Cortex-M0 with 16 kBytes, 4-way associative cache - Three optimised power modes (Extended sleep, Deep sleep and Hibernation) reducing current down to 840 nA • Memories - - - - - 64 kB One-Time-Programmable (OTP) memory 128 kB Data SRAM with retention capabilities 16 kB Cache SRAM with retention capabilities 128 kB ROM (including boot ROM and Bluetooth low energy stack) Execution from external QSPI FLASH up to 32 MB • Power management - - - - - - Integrated Buck DC-DC converter (1.7 V - 4.75 V) Three power supply pins for external devices Supports Li-Polymer, Li-Ion, coin cells, NiMH and alkaline batteries Charger (up to 5.0 V) with programmable curves High accuracy state-of-charge fuel gauge Programmable threshold for brownout detection • Clocks - - - - 16 MHz crystal and RC oscillators 32 kHz crystal and RC oscillators 10.5 kHz RCX oscillator as a 32 kHz crystal replacement Low power PLL up to 96 MHz • Three general purpose timer/counters with PWM, one of them 16-bit up/down timer/counter with PWM available in extended sleep mode • Application cryptographic engine with ECC, AES-256, SHA-1, SHA-256, SHA-512 and a FIPS 140-2-compliant True Random Number Generator • Digital interfaces - - - - - - - - - - - 37 (AQFN) or 21 (WL-CSP) general purpose I/Os with programmable voltage levels Quad-SPI FLASH interface Two UARTs, one with hardware flow control Two SPI+™ interfaces Two I²C bus interfaces at 100 kHz, 400 kHz Three-axis capable Quadrature Decoder PDM interface with HW sample rate converter (2 mics or 2 speakers) I²S/PCM master/slave interface up to 8 channels Keyboard scanner with de-bouncing Infrared (IR) interface (PWM) USB Full Speed (FS) device interface www.dialog-semiconductor.com/bluetoothlowenergy • Analog interfaces - - - 8-channel 10-bit ADC with averaging capability achieving 11.5 ENOB Three matched white LED drivers Temperature sensor • Radio transceiver - - - - 2.4 GHz CMOS transceiver with integrated balun 50 Ω matched single wire antenna interface 0 dBm transmit output power and -94 dBm receiver sensitivity Supply current at VBAT1 (3 V): 3.4 mA (TX), 3.1 mA (RX) • Packages - - AQFN with 60 pins, 6 mm x 6 mm x 0.9 mm WL-CSP with 53 balls, 3.406 mm x 3.010 mm x 0.5 mm Power Management VBUS LDO_USB_RET VBAT1 Vsys LDO_USB CC/CV 110mA/3mA V33 LDO_VBAT_RET LDO_VBAT V12 Vcore LDO_IO2 Vflash LDO_IO_RET2 LDO_IO SIMO DCDC LDO_IO_RET LDO_RADIO LDO_CORE 4.7µF LDO_SLEEP There are 3 power rails that can 4.2V – 5.75V be used to supply external devices 1.7V – 4.75V namely Vsys, Vflash and Vext. There - + are also internal rails used for the core and the radio (Vcore , Vradio). All of the rails are supplied by a normal LDO, a Retention LDO or one of the outputs of the Single Inductance Multiple Output (SIMO) DCDC converter. When the SoC is active, the DCDC is enabled. When the SoC is in sleep mode, then the Retention LDOs are supplying the rails. 4.7µF The normal LDOs are used while 10µF powering up the system or during transitions from active to sleep and vice-versa. VDD1V8 75mA/3mA V14 Vradio Vext VDD1V8P 10µF 75mA/3mA 10µF 0.47µH The driving capability of the various rails is depicted in the figure: light blue for active, dark blue for sleep. LDOs as well as DCDC outputs can be switched on/off depending on the application’s requirements. A flexible Constant Current / Constant Voltage (CC/CV) charger supplying currents from 200 uA to 400 mA allows for native re-chargeable batteries support. Finally, a State-of-Charge engine, monitors the remaining capacitance of the battery when the system is active. The Power Management Unit reduces Bill of Material and enables full control of the power budget of the final product. www.dialog-semiconductor.com/bluetoothlowenergy Application CPU The ARM M0™ CPU is equipped with a configurable 16 kB cache which can operate in direct, two-way or four-way associative mode. Moreover, the cache line size can be programed to be 8, 16 or 32 bytes. The SoC allows for eXecute In Place (XIP) operation directly from the QSPI FLASH (up to 32 MB) or the OTP. There are 2 separate buses, one serving the code execution path (CPU, FLASH) and another which serves data storage (DMA, Peripherals) hence eliminating latencies in application execution. The CPU can be clocked by the XTAL16 crystal oscillator (16 MHz), or by a low-power internal PLL which boosts the frequency to 96 MHz, enabling complex applications or algorithms without the use of an external or dedicated MCU. System Booting The DA14681 supports booting from a serial interface or from a non-volatile memory (QSPI FLASH or OTP). It also comes with a pre-defined header residing in OTP which contains configuration flags but also trim values and preferred settings programmed during silicon manufacturing and/or final product testing by the customer. Booting latency might vary from 15 ms (NVM booting path) to some hundreds of ms (serial path) depending on the serial interface used and the speed/size of the booting transaction. Sleep Modes The DA14681 comprises multiple power domains which are powered by the Vcore rail and can be switched on or off by software. This flexibility combined with manipulating clocks and retainable RAM cells, leads to the three different sleep modes of the system: Extended Sleep, Deep Sleep and Hibernation. The first mode is used between Bluetooth low energy activities, the second is a clockless mode with RAM retained (used to store pairing parameters) while the third is a clock-less mode with all RAM off, achieving the minimum current dissipation. Software and Tools The DA14681 is supported by Dialog SmartSnippets Studio, a royalty-free software development platform for all SmartBond devices, which contains: ■ SmartSnippets Toolbox: A tool suite covering all software developer needs, including power profiling, FLASH or OTP programming and testing ■ SmartSnippets IDE: An Eclipse CDT based IDE pre-configured plugins allowing easy out of the box set-up of the build/debug environment ■ SmartSnippets DA1468x Software Development Kit and Documentation www.dialog-semiconductor.com/bluetoothlowenergy Specification Parameters Parameter Description Conditions Min VBAT Supply voltage Recommended operating condition 1.7 IBAT_IDLE Supply current CPU is idle (WFI), DCDC on, VBAT=3V 0.4 IBAT_RUN_16MHz Supply current CPU executes code from RAM, DCDC on, peripherals on, VBAT=3V IBAT_RUN_96MHz Supply current IBAT_EXT_SLP Typ Max Unit 4.75 V 0.6 1 mA 1.2 1.4 1.9 mA CPU executes code from RAM, DCDC on, peripherals on, VBAT=3V 5.7 6.2 6.9 mA Supply current Cache (16kB) and Data (32kB) retained. XTAL32k used. FLASH in power down. 1.7 2.6 14.7 μA IBAT_DP_SLP Supply current All clocks off. FLASH off. 24kB RAM retained. 1.5 2.4 13.8 μA IBAT_HIBERN Supply current All clocks off. FLASH off. No RAM retained. 0.6 0.7 5.8 μA PSENSE Radio sensitivity level Normal operating conditions; PER=30.8%; DCDC disabled PINT_IMD Radio Intermod. distortion interferer Worst case interferer level PO Radio output power level Maximum gain INL/DNL ADC integral/differential non-linearity -94 dBm -35 -31 dBm -1 0 -2 1 dBm 2 LSB Ordering Information Part number Package Size (mm) Shipment Pack Quantity DA14681-01000U22 WL-CSP53 3.406 x 3.010 x 0.5 Reel 100/1000/5000 DA14681-01000A92 AQFN60 6 x 6 x 0.9 Reel 100/1000/4000 Dialog Semiconductor Worldwide Sales Offices - www.dialog-semiconductor.com email: info@diasemi.com United Kingdom Phone: +44 1793 757700 The Netherlands Phone: +31 73 640 88 22 Japan Phone: +81 3 5425 4567 Singapore Phone: +65 648 499 29 Korea Phone: +82 2 3469 8200 Germany Phone: +49 7021 805-0 North America Phone: +1 408 845 8500 Taiwan Phone: +886 281 786 222 Hong Kong Phone: +852 3769 5200 China (Shenzhen) Phone: +86 755 2981 3669 This publication is issued to provide outline information only, which unless agreed by Dialog Semiconductor may not be used, applied, or reproduced for any purpose or be regarded as a representation relating to products. 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