Inventek Systems
Inventek
Systems
ISM20736S
Embedded
Bluetooth Low Energy SIP Module
Data Sheet
1
ISM20736S_DS_20103
Inventek Systems
Table of Contents
1
2
General Description....................................................................................................................... 4
PART NUMBER DETAIL DESCRIPTION ................................................................................ 5
2.1
Ordering Information ................................................................................................................ 5
3
General Features ............................................................................................................................ 5
3.1
Limitations ................................................................................................................................ 5
3.2
Regulatory Compliance ............................................................................................................. 5
4
Complementary Documents .......................................................................................................... 6
4.1
Inventek Systems....................................................................................................................... 6
5
Specifications ................................................................................................................................ 6
5.1
Module Architecture ................................................................................................................. 6
6
Environmental Specifications ....................................................................................................... 7
7
Hardware Electrical Specifications ............................................................................................... 7
7.1
Absolute Maximum Ratings...................................................................................................... 7
7.2
Recommended Operating Ratings ............................................................................................. 7
7.3
ADC Specifications ................................................................................................................... 7
8
Power Consumption ...................................................................................................................... 8
8.1.1
Estimated Power Consumption ................................................................................. ..8
9
Module Pin Out ............................................................................................................................. 9
9.1
Detailed Pin Description ......................................................................................................... 10
10
AC Characteristics....................................................................................................................... 15
10.1.1 UART Timing Specifications ................................................................................... 15
10.1.2 SPI Timing Specifications ......................................................................................... 16
10.1.3 BSC Interface Timing ............................................................................................... 17
11
INTERFACES ............................................................................................................................. 18
11.1 SPI (Serial Peripheral Interface) ............................................................................................. 18
11.2 UART ...................................................................................................................................... 18
11.3 I2C ........................................................................................................................................... 18
11.4 GPIO........................................................................................................................................ 19
11.5 ADC ........................................................................................................................................ 19
11.6 PWM ....................................................................................................................................... 19
11.7 32.768 kHz Oscillator ............................................................................................................. 21
12
External Reset ............................................................................................................................. 22
13
Bluetooth Low energy Specifications ......................................................................................... 22
13.1 Receiver RF Specifications ..................................................................................................... 23
13.2 Transmitter RF Specifications................................................................................................. 23
14
ON BOARD PROCESSOR ........................................................................................................ 24
14.1 EEPROM Interface ................................................................................................................. 24
15
Mechanical Specification ............................................................................................................ 25
16
ISM20736S Footprint .................................................................................................................. 26
17
Recommend Stencil..................................................................................................................... 27
18
PCB Layout Recommendations .................................................................................................. 28
19
PRODUCT COMPLIENCE CONSIDERATIONS .................................................................... 29
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20
21
REFLOW PROFILE ................................................................................................................... 30
PACKAGING INFORMATION ................................................................................................ 30
Pin 1 Location in the Tape/Reel .......................................................................................................... 30
21.1 MSL Level / Storage Condition .............................................................................................. 31
22
REVISION CONTROL .............................................................................................................. 31
23
CONTACT INFORMATION ..................................................................................................... 31
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1 General Description
The Inventek ISM20736S module is an embedded wireless Bluetooth low energy (BLE)
connectivity device, based on the Broadcom BCM20736 BLE with integrated M3 Cortex
processor SoC chip, RF antenna, matching and decoupling network, and 512 Kb EEPROM.
The module provides a number of features and standard peripheral interfaces (see “Summary
of Key Features” below), enabling connection to an embedded design. It supports BLE
baseband, stack, and several fully qualified profiles embedded in ROM (see “Typical
Applications” below), and the option of loading additional profiles into RAM. The ISM20736S
adds wireless charging, simultaneous central and peripheral operation. The low cost, small
foot print (6.5 mm x 6.5 mm x 1.2 LGA 48 pin package and ease of design-in make it ideal for
a range of embedded applications.
Summary of Key Features:
Bluetooth low energy (BLE)-compliant
Supports Adaptive Frequency Hopping
Excellent receiver sensitivity
On-chip support for 3.0 Bluetooth HCI (H5) and peripheral UARTs
On-chip support for Serial Peripheral Interfaces (master and slave modes SPI)
Integrated ARM Cortex-M3 based microprocessor core
RoHS compliant
Typical Applications:
The module has been designed to provide low power, low cost, and robust communications
for applications operating in the globally available 2.4GHz unlicensed industrial, scientific, and
medical (ISM) band. The following application profiles are supported in ROM:
Battery Status
Blood Pressure Monitor
Find Me
Heart Rate Monitor
Proximity
Thermometer
Weight Scale
Time
Additional profiles that can be supported from RAM include:
Blood Glucose Monitor
Temperature Alarm
Location
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2 PART NUMBER DETAIL DESCRIPTION
2.1 Ordering Information
Part Number
ISM20736S
3
Description
Bluetooth LE Module
General Features
Based on the Broadcom BCM20736 Bluetooth Low Energy 4.0 (WICED SMARTTM)
Baseband/Radio device.
Integrates Bluetooth SMART embedded stack, and fully qualified application profiles in
ROM
CPU ARM Cortex™-M3 32-bit RISC core.
Inputs +3.93 V tolerant
The devices operate from 1.62-3.63 V power supply.
Power-saving mode allows the design of low-power applications.
Lead Free Design which is compliant with ROHS requirements.
FCC/CE Compliance Certified
3.1 Limitations
Inventek Systems products are not authorized for use in safety-critical applications (such
as life support) where a failure of the Inventek Systems product would reasonably be
expected to cause severe personal injury or death.
3.2 Regulatory Compliance
CE
FCC ID: QDS-BRCM1078
Canada IC: 4324A-BRCM1078
Taiwan NCC ID: CCAF13LP1890T1
Europe (EU) R&TTECE Mark Modular approval.
Japan MIC (RF) ID: 007-AB0221 Modular approval.
LMA (Limited Modular Approval) in a specific host.
There are specific regulatory requirements imposed by regulatory authorities around the world on radio devices.
Customers using Broadcom SIP modules are advised to engage with an accredited test lab to determine the overall
system level regulatory requirements. Customers may be able to leverage Broadcom's regulatory test reports.
Please discuss the process with your test lab, such as FCC ID transfers. Broadcom can provide authorizations as
needed
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4 Complementary Documents
4.1 Inventek Systems
FCC Test Report
5 Specifications
5.1 Module Architecture
Figure 1 Inventek’s ISM20736S Block Diagram
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6 Environmental Specifications
Item
Operating Temperature Range
Storage Temperature Range
Humidity
Description
-40 deg. C to +85 deg. C
-40 deg. C to +125 deg. C
95% max non-condensing
7 Hardware Electrical Specifications
7.1 Absolute Maximum Ratings
Symbol
Description
Min
Supply Power
Input Supply Voltage
Max
Unit
3.63
V
Voltage Ripple
0
+/-2%
Vbat
1.62
3.63
V
7.2 Recommended Operating Ratings
Symbol
Min
VBAT
1.62
Typ Max Unit
-
3.63
V
7.3 ADC Specifications
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Number of input
channels
Channel switching rate
-
-
-
9
-
-
fch
-
-
-
Input Signal range
Vinp
-
0
-
3.63
V
Reference settling time
-
Changing refsel
7.5
-
-
us
Input resistance
Rinp
Effective, single ended
-
500
-
KΩ
Input capacitance
Cinp
-
-
-
5
pF
Conversion rate
fC
-
5.859
-
187
KHz
Conversion time
TC
-
5.35
-
170.7
us
Resolution
R
-
-
16
-
bits
Effective number of
bits
-
In specified
performance range
See
section
-
-
-
7
133.33 Kch/s
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9.5
Absolute voltage
measurement error
Current
-
-
±2
-
%
I
Using on-chip
firmware driver
Iavdd1p2+Iavdd3p3
-
-
1
mA
Power
P
-
-
1.5
-
mW
Leakage Current
Ileakage
T=25
-
-
100
nA
Power-up time
Tpowerup
-
-
-
200
us
Integral nonlinearity
INL
In guaranteed
performance ranges
In guaranteed
performance ranges
-1
-
1
LSB
Differential nonlinearity
DINL
a
-1
-
1
LSB
a
a
. LSBs are expressed at 10 bit level.
8 Power Consumption
The Power Management Unit (PMU) provides power management features that can be
invoked by software through power management registers or packet-handling in the
baseband core. There are several low-power operations for the BBC:
Physical layer packet handling turns RF on and off dynamically within packet TX and
RX.
Bluetooth-specified low-power connection mode. While in these low-power connection
modes, the ISM20736 runs on the Low Power Oscillator and wakes up after a
predefined time period.
The following power modes are supported:
Active mode
Idle mode
Sleep mode
HIDOFF (Deep Sleep) mode
In HIDOFF (Deep Sleep) mode, the ISM20736 baseband and core are powered off -- this
mode minimizes chip power consumption and is intended for long periods of inactivity.
8.1.1 Estimated Power Consumption
Operational Mode
Receive
Transmit
Sleep
HIDOFF
(DeepSleep)
Description
Receiver and baseband are both operating, 100%
— ON
Transmitter and baseband are both operating
Internal LPO is in use
8
Typ. Max. Unit
24
28
mA
24
55
2
ISM20736S_DS_20103
28
60
2.5
mA
uA
uA
Inventek Systems
9 Module Pin Out
Figure 2 Pin Mapping
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9.1 Detailed Pin Description
Pin # Pin Name
I/O Type
Description
Default Direction: Input
After POR State: Input Floating
1
GPIO: P27
PWM1
I
Alternate Function Description:
1-
SPI_2: MOSI (master and slave)
Current: 16 mA
2
GND
GND
GND
3
VBAT
I
Battery Supply Input.
4
GND
GND
GND
5
GND
GND
GND
6
GND
GND
GND
7
GND
GND
GND
8
GND
GND
GND
9
GND
GND
GND
10
NC
-
NC – Leave Floating
11
GND
GND
GND
12
GND
GND
GND
13
GND
GND
GND
14
GND
GND
GND
15
GND
GND
GND
16
GND
GND
GND
17
GND
GND
GND
18
UART_RX
I
UART_RX, this pin has been pulled down via 10K ohm
inside module.
19
UART_TX
O PU
UART_TX
20
GND
GND
GND
21
SCL
I/O PU
Clock signal for an external I2C device
22
SDA
I/O PU
Data signal for an external I2C device
23
GND
GND
GND
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Pin #
Pin Name
I/O Type Description
24
GND
GND
GND
Default Direction: Input
This pin was tied to WP pin of internal EEPROM inside
module.
After POR State: Input Floating
25
GPIO: P1
I
Tied to WP of internal EEPROM, External 10K pullup
required
Test mode control
High: test mode
26
TMC
I
Let it floating if not used.
This Pin was connected to GND via 10K internally.
27
RESET_N
I/O PU
Active-low system reset with open-drain output
Default Direction: Input
After POR State: Input Floating
Alternate Function Description:
28
29
GPIO: P0
GND
I
GND
1-
A/D converter input
2-
Peripheral UART: puart_tx
3-
SPI_2: MOSI (master and slave)
4-
IR_RX
5-
60Hz_main
GND
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Pin #
Pin Name
I/O Type
Description
Default Direction: Input
After POR State: Input Floating
30
GPIO: P3
I
Alternate Function Description:
1-
Peripheral UART: puart_cts
2-
SPI_2: SPI_CLK (master and slave)
Default Direction: Input
After POR State: Input Floating
Alternate Function Description:
31
GPIO: P2
I
1-
Peripheral UART: puart_rx
2-
SPI_2: SPI_CS (slave only)
3-
SPI_2: SPI_MOSI (master only)
Default Direction: Input
After POR State: Input Floating
Alternate Function Description:
32
GPIO: P4
I
1-
Peripheral UART: puart_rx
2-
SPI_2: MOSI (master and slave)
3-
IR_TX
Default Direction: Input
After POR State: Input Floating
33
GPIO: P8
I
Alternate Function Description:
1-
A/D converter input
Default Direction: Input
After POR State: Input Floating
Alternate Function Description:
34
GPIO: P33
I
1-
A/D converter input
2-
SPI_2: MOSI (slave only)
3-
Auxiliary clock output: ACLK1
4-
Peripheral UART: puart_rx
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Pin # Pin Name
I/O Type
Description
Default Direction: Input
After POR State: Input Floating
Alternate Function Description:
35
GPIO: P32
I
1-
A/D converter input
2-
SPI_2: SPI_CS (slave only)
34-
Auxiliary clock output: ACLK0
Peripheral UART: puart_tx
Default Direction: Input
After POR State: Input Floating
36
GPIO: P25
I
Alternate Function Description:
1-
SPI_2: MISO (master and slave)
2-
Peripheral UART: puart_rx
Default Direction: Input
After POR State: Input Floating
Alternate Function Description:
37
38
GPIO: P24
GND
I
GND
GPIO: P13
1-
SPI_2: SPI_CLK (master and slave)
2-
Peripheral UART: puart_tx
GND
Default Direction: Input
PWM3
After POR State: Input Floating
I
Alternate Function Description:
1- A/D converter input
39
GPIO: P28
Default Direction: Input
PWM2
After POR State: Input Floating
Alternate Function Description:
I
1-
A/D converter input
2-
LED1
3-
IR_TX
Current: 16mA
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Pin # Pin Name
I/O Type
GPIO: P14
Description
Default Direction: Input
PWM2
After POR State: Input Floating
I
Alternate Function Description:
1-
A/D converter input
Default Direction: Input
40
After POR State: Input Floating
Alternate Function Description:
GPIO: P38
I
1-
A/D converter input
2-
SPI_2: MOSI (master and slave)
3-
IR_TX
Default Direction: Input
After POR State: Input Floating
Alternate Function Description:
41
GPIO: P15
I
1-
A/D converter input
2-
IR_RX
3-
60 Hz_main
GPIO: P26
Default Direction: Input
PWM0
After POR State: Input Floating
Alternate Function Description:
42
I
1-
SPI_2: SPI_CS (slave only)
Current: 16 mA
Default Direction: Input
After POR State: Input Floating
GPIO: P12
I
43
Alternate Function Description:
1-
A/D converter input
2-
XTALO32K
Low-power oscillator (LPO) output.
Alternative Function:
XTALO32K
O
• P12
• P26
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Pin Name
I/O Type
Description
Default Direction: Input
After POR State: Input Floating
GPIO: P11
I
44
Alternate Function Description:
1-
A/D converter input
2-
XTALI32K
Low-power oscillator (LPO) input is used.
Alternative Function:
XTALI32K
I
• P11
• P27
45
GND
GND
GND
46
GND
GND
GND
47
GND
GND
GND
48
GND
GND
GND
Note:
When pin 43 (XTALO32K) is used, ADC/GPIO:P12 is unavailable. P26 may still be available.
When pin 44 (XTALI32K) is used, ADC/GPIO:P11 is unavailable. P27 may still be available
10 AC Characteristics
10.1.1
UART Timing Specifications
Characteristics
Min Max
Unit
Delay time, UART_CTS_N low to UART_TXD valid
- 24 Baud out cycles
Setup time, UARTS_CTS_N high before midpoint of stop bit - 10
ns
Delay time, midpoint of stop bit to UART_RTS_N high
- 2 Baud out cycles
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Figure 2 : UART Timing
10.1.2
SPI Timing Specifications
The SPI interface supports clock speeds up to 12 MHz with VDDIO > 2.2V. The supported
clock speed is 6 MHz when 2.2V > VDDIO > 1.62V.
Reference
Characteristics
Min
Typ Max
1
Time from CSN assert to first clock edge 1 SCK 100 ∞
2
Master setup time
- ½ SCK 3
Master hold time
½ SCK 4
Slave setup time
- ½ SCK 5
Slave hold time
½ SCK 6
Time from last clock edge to CSN deasserted SCK
10 100
Figure 3: SPI Timing – Mode 0 and 2
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Figure 4: SPI Timing – Mode 1 and 3
10.1.3
BSC Interface Timing
Reference
Characteristics
Min
Max
Unit
1
Clock Frequency
- 100/400/800/1000 KHz
2
START condition setup time 650
ns
3
START condition hold time 280
ns
4
Clock low time
650
ns
5
Clock high time
380
ns
6
Data input hold time a
0
ns
7
Data input setup time
100
ns
8
STOP condition setup time 280
ns
9
Output valid from clock
400
ns
10
Bus free time b
650
ns
Figure 3 : BSC Interface Timing
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11 INTERFACES
11.1 SPI (Serial Peripheral Interface)
The BCM20736 has one independent SPI interface. Each interface has a 16-byte transmit
buffer and a 16-byte receive buffer. To support more flexibility for user applications, the
BCM20736 has optional I/O ports that can be configured individually and separately for each
functional pin, as shown in tables below. The BCM20736 acts as an SPI master device that
supports 1.8V or 3.3V SPI slaves. The BCM20736 can also act as an SPI slave device that
supports a 1.8V or 3.3V SPI master.
11.2 UART
The UART is a standard 2-wire interface (RX and TX) and has adjustable baud rates from
9600 bps to 1 Mbps. The baud rate can be selected via a vendor-specific UART HCI
command. The interface supports the Bluetooth 3.0 UART HCI (H5) specification. The default
baud rate for H5 is 115.2 Kbaud.
Both high and low baud rates can be supported by running the UART clock at 24 MHz. The
ISM20736 UART operates correctly with the host UART as long as the combined baud rate
error of the two devices is within ±5%.
11.3 I2C
The BCM20736 provides a 2-pin master BSC interface, which can be used to retrieve
configuration information from an external EEPROM or to communicate with peripherals such
as track-ball or touch-pad modules, and motion tracking ICs used in mouse devices. The BSC
interface is compatible with 12C slave devices. The BSC does not support multimaster
capability or flexible wait-state insertion by either master or slave devices. The following
transfer clock rates are supported by the BSC:
100kHz
400kHz
800 kHz (Not a standard I2C-compatible speed.)
1 MHz (Compatibility with high-speed 12C-compatible devices is not guaranteed.)
The following transfer types are supported by the BSC:
Read (Up to 16 bytes can be read.)
Write (Up to 16 bytes can be written.)
Read-then-Write (Up to 16 bytes can be read and up to 16 bytes can be written.)
Write-then-Read (Up to 16 bytes can be written and up to 16 bytes can be read.)
Hardware controls the transfers, requiring minimal firmware setup and supervision.
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The clock pin (SCL) and data pin (SDA) are both open-drain I/O pins. Pull-up resistors
external to the BCM20736 are required on both the SCL and SDA pins for proper operation.
11.4 GPIO
The ISM20736 general-purpose I/Os (GPIOs). All GPIOs support programmable pull-up and
pull-down resistors, and all support a 2 mA drive strength except P26, P27, and P28, which
provide a 16 mA drive strength at 3.3V supply.
11.5 ADC
The ISM20736 contains a 16-bit ADC (effective number of bits is 10).
The conversion time is 10 us. There is a built-in reference with supply- or bandgap-based
reference modes. The maximum conversion rate is 187 kHz. There is a rail-to-rail input swing.
The ADC input range (Vinp) is selectable by firmware control:
When an input range of 0—3.6V is used, the input impedance is 3 MO.
When an input range of 0—2.4V is used, the input impedance is 1.84 MO.
When an input range of 0—1.2V is used, the input impedance is 680 KO.
Mode ENOB (Typical) Maximum Sampling Rate (KHz) Latency (us) a
0
13
5.859
171
1
12.6
11.7
85
2
12
46.875
21
3
11.5
93.75
11
4
10
187
5
a
. Settling time after switching channels.
11.6 PWM
The ISM20736 has internal PWM channels. The following GPIOs can be mapped as PWMs:
P26
P14/P28 (Dual bonded, only one of two is available.)
P13
Each of the PWM channels, PWMO-3, contains the following registers:
10-bit initial value register (read/write)
10-bit toggle register (read/write)
10-bit PWM counter value register (read)
The PWM configuration register is shared among PWMO-3 (read/write). This 12-bit
register is used:
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To configure each PWM channel.
To select the clock of each PWM channel.
To change the phase of each PWM channel.
Figure 3: Structure of one PWM channel
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11.7 32.768 kHz Oscillator
Parameter
Output Frequency
Frequency tolerance
Start-up time
XTAL drive leve
XTAL series
resistance
XTAL shunt
capacitance
Symbol
Conditions
Minimum Typical Maximum Unit
Foscout
32.768
KHz
Crystal dependent
100
ppm
Tstartup
500
ms
Pdrv
For crystal
0.5
uW
selection
Rseries
For crystal
70
KΩ
selection
Cshunt
For crystal
1.3
pF
selection
Figure 4: 32 KHz Oscillator Block Diagram
It is a standard Pierce oscillator using a comparator with hysteresis on the output to create a
single-ended digital output. The hysteresis was added to eliminate any chatter when the input
is around the threshold of the comparator and is ~100 mV. This circuit can be operated with a
32 KHz or 32.768 KHz crystal oscillator or be driven with a clock input at similar frequency.
The default component values are: R1= 10 MΩ, C1=C2=~10 pF. The values of C1 and C2 are
used to fine-tune the oscillator.
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12 External Reset
Figure 5: External Reset Timing
13 Bluetooth Low energy Specifications
The ISM20736 Bluetooth Baseband Core (BBC) implements all of the time-critical functions
required for high performance Bluetooth operation, including:
Data de-/framing, de-/whitening, HEC, FEC, CRC
Link key generation
Independently handles HCI events
Frequency hopping generator
E0 encryption
Link control layer
Adaptive frequency hopping
Test mode
The ISM20736 integrated radio transceiver is optimized for operation in 2.4GHz ISM band,
and fully meets or exceeds Bluetooth Radio Specification 4.0. It consists of:
Transmitter
Digital modulator
Power Amplifier (PA) that can transmit up to 4 dBm for class 2 operation
Receiver, featuring extended dynamic range and high-order on-chip filtering
Digital demodulator and bit synchronizer
Receiver signal strength indicator
Local oscillator with internal loop filter, that provides fast frequency hopping (1600
hops/second) across 79 maximum available channels
Automatic calibration scheme, activating during hop settling and normal operation to
compensate for temperature, gain, phase, transceiver analog parts characteristics and
process variations
Internal LDO regulator that provides power to the digital and RF circuits
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13.1 Receiver RF Specifications
Parameter
Mode and Conditions Min Typ Max Unit
Receiver Section a
Frequency Range
2402
2480 MHz
RX sensitivity (standard)
0.1% BER, 1Mbps
-94
dBm
Maximum input
-10
dBm
Measurements @ 3V
a
. 30.8% PER.
. Desired signal is 3 dB above the reference sensitivity level (defined as -70 dBm).
c
. Measurement resolution is 10 MHz.
d
. Measurement resolution is 3 MHz.
e
. Measurement resolution is 25 MHz.
b
13.2 Transmitter RF Specifications
Parameter
Min Typ Max
Unit
Transmitter Section
Frequency range
2402
2480
MHz
Output power adjustment range
-20
4
dBm
Default output power
2.0
dBm
Output power variation
2.5
dB
Initial carrier frequency tolerance
±150
KHz
Frequency Drift
Frequency drift
±50
KHz
Drift rate
20 KHz/50 us
Frequency deviation
Average deviation in payload
225
275
KHz
(sequence used is 00001111)
Maximum deviation in payload
185
KHz
(sequence used is 10101010)
Channel spacing
2
MHz
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14 ON BOARD PROCESSOR
The ISM20736 microprocessor unit executes software from the link control (LC) layer up to
the application layer components. The microprocessor is based on an ARM Cortex M3, 32-bit
RISC processor with embedded ICE-RT debug and JTAG interface units. The unit has 320
KB of ROM for program storage and boot-up, 60 KB of RAM for scratch-pad data, and patch
RAM code. The internal boot ROM provides power-on reset flexibility, which enables the
same device to be used in different HID applications with an external serial EEPROM or with
an external serial flash memory. At power-up, the lowest layer of the protocol stack is
executed from the internal ROM memory. External patches may be applied to the ROM-based
firmware to provide flexibility for bug fixes and feature additions. The device can also support
the integration of user applications.
14.1 EEPROM Interface
The ISM20736 provides a Broadcom Serial Control (BSC) master interface. The BSC is
programmed by the CPU to generate four types of BSC bus transfers: read-only, write-only,
combined read/write, and combined write / read. BSC supports both low-speed and fast mode
devices. The BSC is compatible with a Philips 12C slave device, except that master
arbitration (multiple l2C masters contending for the bus) is not supported. The EEPROM can
contain customer application configuration information including: application code,
configuration data, patches, pairing information, BD_ADDR, baud rate, SDP service record,
and file system information used for code.
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15 Mechanical Specification
The Physical dimensions of the module are as follow:
6.5 x 6.5 x 1.18 mm (Tolerance +/- 0.1mm)
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16 ISM20736S Footprint
Note:
1. Please use Un-Solder Mask to design the Module Footprint.
2. There are two types pad size in the Module.
- Type A:
Pad size: 0.6 x 0.25 mm & Solder Mask Opening: 0.7 x 0.35mm
- Type B
Pad size: 0.55 x 0.3mm & Solder Mask Opening: 0.65 x 0.4mm
- Type C:
Pad size: 0.4 x 0.4mm & Solder Mask Opening: 0.5 x 0.5 mm
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17 Recommend Stencil
Figure 4: Bottom View
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18 PCB Layout Recommendations
The following layout recommendations
•
Connect to system ground from side B of the module (pins 13–22).
• An L-shaped ground plane is required for the embedded BLE antenna. Keep the GND
continuous. Do not cut off the GND shape to accommodate trace routes.
• If the L-shaped GND plane is located on the top layer of the PCB, do not place
components on the ground plane. If this cannot be avoided, move the L-shaped ground
plane to another layer.
• Antenna efficiency of 31–41% can be achieved based on the layout and the
dimensions listed below. Following these layout recommendations is expected to
yield 50+ meters of usable range; deviating from these recommendations may
reduce the range of the antenna.
– D: 4.5 mm (typical)
– G, H, S: 3 mm (typical)
-
L: 3 mm (minimum)
– W: 0.4 mm (typical)
• Route signal traces out of the module from side C (between pins 27 and 30) or side B
(between pins 16 and 19) of the module. Traces can be overlapped to avoid routing through
the keep-out area.
•
Do not route traces from side A or side D.
Side A indicates the side of Pin #1 - Pin #12 of the ISM20736S.
•
Side B indicates the side of Pin #13 - Pin #22 of the ISM20736S.
•
Side C indicates the side of Pin #23 - Pin #34 of the ISM20736S.
•
Side D indicates the side of Pin #35 - Pin #44 of the ISM20736S.
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L-shaped ground arrangement in the 2nd layer (purple color) and the top-side component
placement and trace routing (blue color). We can see that some components and routings are
placing in the L-shaped area on the top layer and the “L -shaped” ground is connected to system
ground in the 2nd layer.
The clearance area (marked in yellow) and L-shaped GND area (marked in green).
Figure 5: L Shaped Ground (Arranged in 2nd layer only)
Figure 6 : L Shaped Ground Plane , 2nd layer)
It is also recommended to have a 0.4mm gap between the top of the module and plastic case.
19 PRODUCT COMPLIANCE CONSIDERATIONS
RoHS: Restriction of Hazardous Substances (RoHS) directive has come into force
since 1st July 2006 all electronic products sold in the EU must be free of hazardous
materials, such as lead. Inventek is fully committed to being one of the first to
introduce lead-free GPS products while maintaining backwards compatibility and
focusing on a continuously high level of product and manufacturing quality.
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EMI/EMC: The Inventek module design embeds EMI/EMC suppression features and
accommodations to allow for higher operational reliability in noisier (RF)
environments and easier integration compliance in host (OEM) applications.
FCC/CE: The module is compliant with FCC/CE.
20 REFLOW PROFILE
Temperature
2450c
2170c
2000c
1500c
Time
Pre-heating
Soldering
90~120 sec
60~90 sec
21 PACKAGING INFORMATION
Pin 1 Location in the Tape/Reel
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21.1 MSL Level / Storage Condition
Level 3 等級3
260℃ 攝氏 260度
168 hours 168小時
MMMDDYYYY 月+日+西元年
[
22 REVISION CONTROL
Document : ISM20736S
External Release
Date
4/17/2016
Author
FMT
Revision
1.0
Comment
Preliminary
23 CONTACT INFORMATION
Inventek Systems
2 Republic Road
Billerica Ma, 01862
Tel: 978-667-1962
Sales@inventeksys.com
www.inventeksys.com
Inventek Systems reserves the right to make changes without further notice to any products or data herein to improve reliability,
function, or design. The information contained within is believed to be accurate and reliable. However Inventek Systems does not
assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit
described herein, neither does it convey any license under its patent rights nor the rights of others.
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