Product Technical Specification
AirPrime HL8518, HL8528 and HL8529
4117047
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December 10, 2015
Product Technical Specification
Important Notice
Due to the nature of wireless communications, transmission and reception of data can never be
guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant
delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used
in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used
in situations where failure to transmit or receive data could result in damage of any kind to the user or
any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless
accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or
received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or
receive such data.
Safety and Hazards
Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without
proper device certifications. These areas include environments where cellular radio can interfere such
as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to
any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere
with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is
on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When
operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard
systems.
Note:
Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door
is open. Sierra Wireless modems may be used at this time.
The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of
a vehicle. Doing so will detract from the driver or operator’s control and operation of that vehicle. In
some states and provinces, operating such communications devices while in control of a vehicle is an
offence.
Limitations of Liability
This manual is provided “as is”. Sierra Wireless makes no warranties of any kind, either expressed or
implied, including any implied warranties of merchantability, fitness for a particular purpose, or
noninfringement. The recipient of the manual shall endorse all risks arising from its use.
The information in this manual is subject to change without notice and does not represent a
commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES
SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL,
GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING,
BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR
REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS
PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY
THIRD PARTY.
Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability
arising under or in connection with the Sierra Wireless product, regardless of the number of events,
occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the
Sierra Wireless product.
Customer understands that Sierra Wireless is not providing cellular or GPS (including A-GPS)
services. These services are provided by a third party and should be purchased directly by the
Customer.
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Product Technical Specification
SPECIFIC DISCLAIMERS OF LIABILITY: CUSTOMER RECOGNIZES AND ACKNOWLEDGES
SIERRA WIRELESS IS NOT RESPONSIBLE FOR AND SHALL NOT BE HELD LIABLE FOR ANY
DEFECT OR DEFICIENCY OF ANY KIND OF CELLULAR OR GPS (INCLUDING A-GPS)
SERVICES.
Patents
This product may contain technology developed by or for Sierra Wireless Inc.
This product includes technology licensed from QUALCOMM®.
This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents
licensed from InterDigital Group and MMP Portfolio Licensing.
Copyright
© 2015 Sierra Wireless. All rights reserved.
Trademarks
Sierra Wireless®, AirPrime®, AirLink®, AirVantage®, WISMO®, ALEOS® and the Sierra Wireless and
Open AT logos are registered trademarks of Sierra Wireless, Inc. or one of its subsidiaries.
Watcher® is a registered trademark of NETGEAR, Inc., used under license.
Windows® and Windows Vista® are registered trademarks of Microsoft Corporation.
Macintosh® and Mac OS X® are registered trademarks of Apple Inc., registered in the U.S. and other
countries.
QUALCOMM® is a registered trademark of QUALCOMM Incorporated. Used under license.
Other trademarks are the property of their respective owners.
Contact Information
Sales Desk:
Post:
Technical Support:
RMA Support:
Fax:
Web:
Phone:
1-604-232-1488
Hours:
8:00 AM to 5:00 PM Pacific Time
Contact:
http://www.sierrawireless.com/sales
Sierra Wireless
13811 Wireless Way
Richmond, BC
Canada
V6V 3A4
support@sierrawireless.com
repairs@sierrawireless.com
1-604-231-1109
http://www.sierrawireless.com/
Consult our website for up-to-date product descriptions, documentation, application notes, firmware
upgrades, troubleshooting tips, and press releases: www.sierrawireless.com
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Document History
Version
Date
Updates
1.0
May 20, 2015
Creation
1.1
May 29, 2015
Updated:
1 Introduction
2 Pad Definition
Table 32 26Mhz Clock Interface Pin Description
Table 54 Ordering Information
Deleted 4.1 Model Views
Added 8 Conformance with ATEX
2.0
December 02, 2015
Updated:
Table 1 Supported Bands/Connectivity
1.2 Physical Dimensions
Table 2 General Features
Table 3 ESD Specifications
1.9 Environmental and Certifications
2 Pad Definition
Table 8 Power Supply
3.4 Current DC Power Consumption
4 Mechanical Drawings
6 Reliability Specification
7 Legal Information
Table 54 Ordering Information
Deleted HSIC
2.1
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Updated Table 11 Current Consumption
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Contents
1. INTRODUCTION ................................................................................................ 11
1.1.
Common Flexible Form Factor (CF3) ..............................................................................11
1.2.
Physical Dimensions .......................................................................................................12
1.3.
General Features .............................................................................................................12
1.4.
Encryption Support ..........................................................................................................15
1.5.
Architecture .....................................................................................................................15
1.6.
Interfaces .........................................................................................................................16
1.7.
Connection Interface .......................................................................................................16
1.8.
ESD .................................................................................................................................17
1.9.
Environmental and Certifications .....................................................................................17
1.9.1.
Environmental Specifications ...................................................................................17
1.9.2.
Regulatory ................................................................................................................18
1.9.3.
RoHS Directive Compliant .......................................................................................19
1.9.4.
Disposing of the Product ..........................................................................................19
1.10.
References ......................................................................................................................19
2. PAD DEFINITION ............................................................................................... 20
2.1.
Pin Types .........................................................................................................................24
2.2.
Pin Configuration (Top View, Through Module) ..............................................................25
3. DETAILED INTERFACE SPECIFICATIONS ..................................................... 26
3.1.
Power Supply ..................................................................................................................26
3.1.1.
Electrical Characteristics ..........................................................................................26
3.1.2.
Pin Description .........................................................................................................26
3.1.3.
Burst Transmission Current Requirements ..............................................................27
3.1.4.
Power Input (VBATT) ...............................................................................................28
3.2.
Ground Connection .........................................................................................................28
3.3.
Decoupling of Power Supply Signals ..............................................................................28
3.4.
Current DC Power Consumption .....................................................................................29
3.5.
VGPIO .............................................................................................................................31
3.5.1.
Electrical Characteristics ..........................................................................................31
3.5.2.
Pin Description .........................................................................................................31
3.6.
BAT_RTC ........................................................................................................................31
3.6.1.
Electrical Characteristics ..........................................................................................32
3.6.2.
Pin Description .........................................................................................................32
3.7.
SIM Interface ...................................................................................................................32
3.7.1.
Electrical Characteristics ..........................................................................................33
3.7.2.
Pin Description .........................................................................................................33
3.7.3.
UIM1_DET................................................................................................................34
3.7.4.
Application ................................................................................................................34
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3.8.
USB .................................................................................................................................35
3.8.1.
Electrical Characteristics ..........................................................................................35
3.8.2.
Pin Description .........................................................................................................35
3.9.
Electrical Information I/O .................................................................................................35
3.10.
General Purpose Input/Output (GPIO) ............................................................................36
3.11.
Main Serial Link (UART1) ................................................................................................37
3.11.1. Pin Description .........................................................................................................37
3.11.2. 8-wire Application .....................................................................................................38
3.11.3. 4-wire Application .....................................................................................................38
3.11.4. 2-wire Application .....................................................................................................38
3.12.
POWER ON Signal (PWR_ON_N) ..................................................................................39
3.13.
Reset Signal (RESET_IN_N) ..........................................................................................39
3.14.
ADC .................................................................................................................................40
3.14.1. Electrical Characteristics ..........................................................................................40
3.14.2. Pin Description .........................................................................................................40
3.15.
PWM ................................................................................................................................41
3.15.1. Electrical Characteristics ..........................................................................................41
3.15.2. Pin Description .........................................................................................................41
3.15.3. Application ................................................................................................................42
3.16.
Clock Interfaces ...............................................................................................................43
3.16.1. Electrical Characteristics ..........................................................................................43
3.16.2. Pin Description .........................................................................................................43
3.17.
PCM .................................................................................................................................43
3.17.1. Electrical Characteristics ..........................................................................................44
3.17.2. PCM Waveforms ......................................................................................................45
3.17.3. PCM Master Mode ...................................................................................................45
3.17.4. PCM Slave Mode .....................................................................................................46
3.17.5. Pin Description .........................................................................................................47
3.18.
Debug Interfaces .............................................................................................................47
3.18.1. Debug Port ...............................................................................................................47
3.18.2. JTAG ........................................................................................................................47
3.19.
RF Interface .....................................................................................................................48
3.19.1. RF Connection .........................................................................................................48
3.19.2. RF Performances .....................................................................................................49
3.19.3. TX Burst Indicator (2G_TX_ON) ..............................................................................49
4. MECHANICAL DRAWINGS ............................................................................... 51
5. DESIGN GUIDELINES ....................................................................................... 53
5.1.
Power-Up Sequence .......................................................................................................53
5.2.
Module Switch-Off ...........................................................................................................53
5.3.
Emergency Power OFF ...................................................................................................54
5.4.
Sleep Mode Management ...............................................................................................54
5.4.1.
Using UART .............................................................................................................54
5.4.2.
Using USB ................................................................................................................54
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5.5.
Power Supply Design ......................................................................................................55
5.6.
ESD Guidelines for SIM Card ..........................................................................................55
5.7.
ESD Guidelines for USB..................................................................................................56
5.8.
Dual SIM Application .......................................................................................................56
5.9.
Radio Frequency Integration ...........................................................................................57
6. RELIABILITY SPECIFICATION ......................................................................... 58
6.1.
Reliability Compliance .....................................................................................................58
6.2.
Reliability Prediction Model .............................................................................................58
6.2.1.
Life Stress Test ........................................................................................................58
6.2.2.
Environmental Resistance Stress Tests ..................................................................59
6.2.3.
Corrosive Resistance Stress Tests ..........................................................................59
6.2.4.
Thermal Resistance Cycle Stress Tests ..................................................................60
6.2.5.
Mechanical Resistance Stress Tests .......................................................................61
6.2.6.
Handling Resistance Stress Tests ...........................................................................62
7. LEGAL INFORMATION ..................................................................................... 63
7.1.
FCC Regulations .............................................................................................................63
7.2.
IC Regulations .................................................................................................................64
7.3.
CE Regulation .................................................................................................................65
8. CONFORMANCE WITH ATEX........................................................................... 66
9. ORDERING INFORMATION .............................................................................. 67
10. TERMS AND ABBREVIATIONS ........................................................................ 68
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List of Figures
Figure 1.
Architecture Overview ..................................................................................................... 15
Figure 2.
Mechanical Overview ...................................................................................................... 16
Figure 3.
Pin Configuration ............................................................................................................. 25
Figure 4.
Power Supply During Burst Transmission ....................................................................... 27
Figure 5.
Power Supply Requirements ........................................................................................... 28
Figure 6.
Power Supply Voltage Drops Shapes During Burst Transmission ................................. 29
Figure 7.
UIM1 Application Reference Schematic .......................................................................... 34
Figure 8.
8-wire UART Application Example .................................................................................. 38
Figure 9.
4-wire UART Application Example .................................................................................. 38
Figure 10.
2-wire UART Application Example .................................................................................. 38
Figure 11.
PWR_ON_N Assertion Time ........................................................................................... 39
Figure 12.
Relative Timing for the PWM Output ............................................................................... 41
Figure 13.
Example of an LED Driven by either the PWM1 or PWM2 Output ................................. 42
Figure 14.
Example of a BUZZER Driven by either the PWM1 or PWM2 Output ............................ 42
Figure 15.
PCM Timing Waveform ................................................................................................... 45
Figure 16.
PCM Master Mode Timing............................................................................................... 45
Figure 17.
PCM Master Mode Timing............................................................................................... 46
Figure 18.
JTAG Timing Waveform .................................................................................................. 48
Figure 19.
2G_TX_ON State during TX Burst .................................................................................. 50
Figure 20.
Schematic Diagram ......................................................................................................... 51
Figure 21.
Footprint .......................................................................................................................... 52
Figure 22.
PWR_ON_N Sequence with VGPIO Information ............................................................ 53
Figure 23.
PWR_ON_N Sequence with Trampup ................................................................................ 53
Figure 24.
Power OFF Sequence for PWR_ON_N, VGPIO ............................................................. 54
Figure 25.
Voltage Limiter Example ................................................................................................. 55
Figure 26.
EMC and ESD Components Close to the SIM ................................................................ 55
Figure 27.
ESD Protection for USB .................................................................................................. 56
Figure 28.
Reference Design for Dual SIM Application .................................................................... 56
Figure 29.
GSM Antenna Connection with Antenna Detection ........................................................ 57
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List of Tables
Table 1.
Supported Bands/Connectivity ........................................................................................ 11
Table 2.
General Features ............................................................................................................ 12
Table 3.
ESD Specifications .......................................................................................................... 17
Table 4.
Environmental Specifications .......................................................................................... 17
Table 5.
Regulation Compliance ................................................................................................... 18
Table 6.
Pad Definition .................................................................................................................. 20
Table 7.
Pin Type Codes ............................................................................................................... 24
Table 8.
Power Supply .................................................................................................................. 26
Table 9.
Power Supply Pin Description ......................................................................................... 26
Table 10.
Radio Burst Rates – Connected Mode ............................................................................ 27
Table 11.
Current Consumption (at nominal voltage, 3.7V) ............................................................ 29
Table 12.
Current Consumption per Power Supply (VBATT_PA and VBATT) ............................... 30
Table 13.
VGPIO Electrical Characteristics ..................................................................................... 31
Table 14.
VGPIO Pin Description .................................................................................................... 31
Table 15.
BAT_RTC Electrical Characteristics................................................................................ 32
Table 16.
BAT_RTC Pin Description ............................................................................................... 32
Table 17.
Electrical Characteristics of UIM1 ................................................................................... 33
Table 18.
UIM1 Pin Description ....................................................................................................... 33
Table 19.
USIM Socket Pin Description .......................................................................................... 34
Table 20.
Electrical Characteristics of USB..................................................................................... 35
Table 21.
USB Pin Description ........................................................................................................ 35
Table 22.
Digital I/O Electrical Characteristics ................................................................................ 35
Table 23.
GPIO Pin Description ...................................................................................................... 36
Table 24.
UART1 Pin Description ................................................................................................... 37
Table 25.
PWR_ON_N Electrical Characteristics ........................................................................... 39
Table 26.
RESET_IN_N Electrical Characteristics .......................................................................... 40
Table 27.
ADC Electrical Characteristics ........................................................................................ 40
Table 28.
ADC Pin Description ........................................................................................................ 40
Table 29.
PWM Electrical Characteristics ....................................................................................... 41
Table 30.
PWM Pin Description ...................................................................................................... 41
Table 31.
32.768Khz Clock Interface Pin Description .................................................................... 43
Table 32.
26Mhz Clock Interface Pin Description .......................................................................... 43
Table 33.
Clock Interface Pin Description ....................................................................................... 43
Table 34.
Digital Audio PCM Electrical Characteristics ................................................................... 44
Table 35.
PCM Master Mode Parameters ....................................................................................... 45
Table 36.
PCM Slave Mode Parameters ......................................................................................... 46
Table 37.
Digital Audio PCM Pin Description .................................................................................. 47
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Table 38.
SW Trace Pin Description ............................................................................................... 47
Table 39.
JTAG Pin Connection ...................................................................................................... 47
Table 40.
JTAG Pin Description ...................................................................................................... 48
Table 41.
RF Pin Connection .......................................................................................................... 49
Table 42.
RF Performance .............................................................................................................. 49
Table 43.
Burst Indicator States ...................................................................................................... 49
Table 44.
2G_TX_ON Burst Characteristics .................................................................................. 49
Table 45.
2G_TX_ON Burst Pin Description .................................................................................. 50
Table 46.
Standards Conformity...................................................................................................... 58
Table 47.
Life Stress Test................................................................................................................ 58
Table 48.
Environmental Resistance Stress Tests ......................................................................... 59
Table 49.
Corrosive Resistance Stress Tests ................................................................................. 59
Table 50.
Thermal Resistance Cycle Stress Tests ......................................................................... 60
Table 51.
Mechanical Resistance Stress Tests .............................................................................. 61
Table 52.
Handling Resistance Stress Tests .................................................................................. 62
Table 53.
ATEX Conformance ........................................................................................................ 66
Table 54.
Ordering Information ....................................................................................................... 67
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1. Introduction
This document is the Product Technical Specification for the AirPrime HL8518, HL8528 and HL8529
Embedded Modules. It defines high level features and illustrates the interfaces for these features. This
document is intended to cover hardware aspects, including electrical and mechanical, of the AirPrime
HL8518, HL8528 and HL8529.
The AirPrime HL8518, HL8528 and HL8529 modules belong to the AirPrime HL Series from the
Essential Connectivity Module family. These are industrial grade Embedded Wireless Modules that
provide voice and data connectivity on GPRS, EDGE RX, WCDMA, HSDPA and HSUPA networks
(as listed in Table 1 Supported Bands/Connectivity).
The HL8518, HL8528 and HL8529 modules support a large variety of interfaces such as Digital Audio,
GPIOs and UART to provide customers with the highest level of flexibility in implementing high-end
solutions.
Transmit band
(Tx)
Receive band
(Rx)
Maximum Output Power
UMTS B1
1922 to1978 MHz
2112 to 2168 MHz
22.5 dBm (± 1.5 dB)
UMTS B2
1852 to 1908 MHz
1932 to 1988 MHz
22.5 dBm (± 1.5 dB)
UMTS B5
826 to 847 MHz
871 to 892 MHz
22.5 dBm (± 1.5 dB)
UMTS B8
882 to 913 MHz
927 to 958 MHz
22.5 dBm (± 1.5 dB)
GSM 850
824 to 849 MHz
869 to 894 MHz
33 dBm ± 2 dB GSM, GPRS
E-GSM 900
880 to 915 MHz
925 to 960 MHz
33 dBm ± 2 dB GSM, GPRS
DCS 1800
1710 to 1785 MHz
1805 to 1880 MHz
30 dBm ± 2 dB GSM, GPRS
PCS 1900
1850 to 1910 MHz
1930 to 1990 MHz
30 dBm ± 2 dB GSM, GPRS
1.1.
HL8529
RF Band
HL8528
Supported Bands/Connectivity
HL8518
Table 1.
Common Flexible Form Factor (CF3)
The AirPrime HL8518, HL8528 and HL8529 belong to the Common Flexible Form Factor (CF3)
family of modules. This family consists of a series of WWAN modules that share the same mechanical
dimensions (same width and length with varying thicknesses) and footprint. The CF3 form factor
provides a unique solution to a series of problems faced commonly in the WWAN module space as it:
Accommodates multiple radio technologies (from 2G to LTE advanced) and band groupings
Supports bit-pipe (Essential Module Series) and value add (Smart Module Series) solutions
Offers electrical and functional compatibility
Provides Direct Mount as well Socketability depending on customer needs
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1.2.
Introduction
Physical Dimensions
The AirPrime HL8518, HL8528 and HL8529 modules are compact, robust, fully shielded modules with
the following dimensions:
Length: 23 mm
Width: 22 mm
Thickness: 2.5 mm
Weight: 2.65 g
Note:
Dimensions specified above are typical values.
1.3.
General Features
The table below summarizes the AirPrime HL8518, HL8528 and HL8529 features.
Table 2.
General Features
Feature
Physical
Electrical
Description
Small form factor (146-pin solderable LGA pad) – 23mm x 22mm x 2.5mm
(nominal)
Metal shield can
RF connection pad
Baseband signals connection
Single or double supply voltage (VBATT and VBATT_PA) – 3.2V – 4.5V
HL8518 (dual-band UMTS and dual-band GSM):
UMTS B1
UMTS B8
E-GSM 900
DCS 1800
HL8528 (dual-band UMTS and dual-band GSM):
RF
UMTS B2
UMTS B5
GSM 850
PCS 1900
HL8529 (dual-band UMTS):
Audio interface
4117047
UMTS B2
UMTS B5
Digital interface (ONLY)
Supports Enhanced Full Rate (EFR), Full Rate (FR), Half Rate (HR), and
both Narrow-Band and Wide-band Adaptive Multirate (AMR-NB and AMRWB) vocoders
MO and MT calling
Echo cancellation and noise reduction
Emergency calls (112, 110, 911, etc.)
Incoming call notification
DTMF generation
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Product Technical Specification
Feature
SIM interface
Application interface
Introduction
Description
Dual SIM Single Standby (DSSS) with fast network switching capability
1.8V/3V support
SIM extraction / hot plug detection
SIM/USIM support
Conforms with ETSI UICC Specifications.
Supports SIM application tool kit with proactive SIM commands
NDIS NIC interface support (Windows XP, Windows 7, Windows 8, Windows
CE, Linux)
Multiple non-multiplexed USB channel support
Dial-up networking
USB selective suspend to maximize power savings
CMUX multiplexing over UART
AT command interface – 3GPP 27.007 standard, plus proprietary extended
AT commands
Dual-mode UMTS (WCDMA) / HSDPA / HSUPA / EDGE RX / GPRS / GSM
operation
GSM/GPRS/EDGE RX
GPRS Class 12
EDGE RX
CSD (Circuit-switched data bearers)
Release 4 GERAN Feature Package 1
SAIC / DARP Phase 1
Latency Reduction
Repeated FACCH and Repeated SACCH
GPRS ROHC
Enhanced Operator Name String (EONS)
Enhanced Network Selection (ENS)
WCDMA
3GPP WCDMA FDD Multimode Type II UE Protocol Stack
Configurable for data classes up to 384 kBit/s
Inter-RAT Handover and Cell Reselection
Supports two types of Compressed Mode
Network Assisted Cell Change from UTRAN to GERAN and GERAN to
UTRAN
CSD (Circuit-switched data bearers) over WCDMA (transparent/non
transparent up to 64 kBit/s; Support for Video Telephony)
HSDPA (High Speed Downlink Packet Access)
Compliant with 3GPP Release 5
HSDPA Category 8 data rate – 7.2 Mbps (peak rate)
IPv6 support
HSUPA (High Speed Uplink Packet Access)
Compliant with 3GPP Release 6
HSUPA Category 6 data rate - 5.76 Mbps (peak rate)
Robust Header Compression (RoHC)
Protocol Stack
Fractional DPCH
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Feature
Description
HSPA+ (Evolved High Speed Packet Access)
Compliant with 3GPP Release 7
Higher-Order Modulation (HOM)
MAC-ehs support
Continuous Packet Connectivity (CPC)
Enhanced F-DPCH
Enhanced Cell FACH
Circuit Switched Voice over HSPA
SMS MO and MT
CS and PS support
SMS saving to SIM card or ME storage
SMS reading from SIM card or ME storage
SMS sorting
SMS concatenation
SMS Status Report
SMS replacement support
SMS storing rules (support of AT+CNMI, AT+CNMA)
Call Barring
Call Forwarding
Call Hold
Caller ID
Call Waiting
Multi-party service
USSD
Automatic answer
Multiple (up to 20) cellular packet data profiles
Sleep mode for minimum idle power draw
Automatic GPRS attach at power-up
GPRS detach
Mobile-originated PDP context activation / deactivation
Support QoS profile
Release 97 – Precedence Class, Reliability Class, Delay Class, Peak
Throughput, Mean Throughput
Release 99 QoS negotiation – Background, Interactive, and Streaming
Static and Dynamic IP address. The network may assign a fixed IP address
or dynamically assign one using DHCP (Dynamic Host Configuration
Protocol).
Supports PAP and CHAP authentication protocols
PDP context type (IPv4, IPv6, IPv4v6). IP Packet Data Protocol context
RFC1144 TCP/IP header compression
Interaction with existing GSM services (MO/MT SMS voice calls) while:
GPRS is attached, or
In a GPRS data session (class B GPRS suspend / resume procedures)
Protocol Stack
SMS
Supplementary
Services
Connectivity
Introduction
Operating temperature ranges (industrial grade):
Environmental
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Class A: -30°C to +70°C
Class B: -40°C to +85°C
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Product Technical Specification
Introduction
Feature
Description
RTC
Real Time Clock (RTC) with calendar and alarm
Temperature Sensor
1.4.
Temperature monitoring
Alarms
Encryption Support
The AirPrime HL8518, HL8528 and HL8529 supports the following encryption algorithms:
Ciphering algorithms A51, A52 and A53
GEA1/GEA2 and GEA3 algorithm for GPRS encryption
Cyclic Redundancy Check (CRC) with programmable polynomial
UMTS confidentiality algorithm f8 for message ciphering (Kasumi based UEA1)
UMTS integrity algorithm f9 for message authentication (Kasumi based UIA1 and SNOW 3G
based UIA2)
1.5.
Architecture
The figure below presents an overview of the AirPrime HL8518, HL8528 and HL8529 modules
internal architecture and external interfaces.
AirPrime HL8518, HL8528 and HL8529
RX_DCS
26MHz
Transceiver
SAW
Filters
RX_DCS
TX_2G
3G
PA
RX_2G
RX_3G
2G PA
+
Antenna
Switch
Isoplexer
B1/B8GSM900
RF
RF
Or
LGA-146
ADC x2
UART1 (8pins)
Debug (2pins)
JTAG
26M_CLKOUT
32K_CLKOUT
SIM1
RESET_IN_N
TP1
PWR_ON_N
PWM x 2
2G_TX_ON
USB
TX_3G
Baseband
B2-PCS/B5GSM850
Or
B2/B5
MCU
DSP
PMU
RF
RF
LGA-146
VBATT
GND
VGPIO
BAT_RTC
GPIO x 12
Analog Baseband
Peripherals
PCM
Memory
(Flash + RAM)
Figure 1.
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32.768KHz
Architecture Overview
Rev 2.1
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15
Product Technical Specification
1.6.
Introduction
Interfaces
The AirPrime HL8518, HL8528 and HL8529 modules provide the following interfaces and peripheral
connectivity:
1x – 8-pin UART
1x – Active Low RESET
1x – USB 2.0
1x – Backup Battery Interface
2x – System Clock Out
1x – Active Low POWER ON
1x – 1.8V/3V SIM
1x – Digital Audio
2x – ADC
1x – JTAG Interface
1x – Debug Interface
2x – PWM
12x – GPIOs
1x – 2G TX Burst Indicator
1x – GSM Antenna
1.7.
Connection Interface
The AirPrime HL8518, HL8528 and HL8529 modules are an LGA form factor device. All electrical and
mechanical connections are made through the 146 Land Grid Array (LGA) pads on the bottom side of
the PCB.
Figure 2.
Mechanical Overview
The 146 pads have the following distribution:
66 inner signal pads, 1x0.5mm, pitch 0.8mm
1 reference test point (Ground), 1.0mm diameter
7 test point (JTAG), 0.8mm diameter, 1.20mm pitch
64 inner ground pads, 1.0x1.0mm, pitch 1.825mm/1.475mm
4 inner corner ground pads, 1x1mm
4 outer corner ground pads, 1x0.9mm
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Product Technical Specification
1.8.
Introduction
ESD
Refer to the following table for ESD Specifications.
Note:
Information specified in the following table is preliminary and subject to change.
Table 3.
ESD Specifications
Category
Connection
Specification
Operational
RF ports
IEC-61000-4-2 — Level (Electrostatic Discharge Immunity Test)
Unless otherwise specified:
Non-operational
Host connector
interface
SIM connector
Signals
Other host signals
1.9.
JESD22-A114 +/- 1kV Human Body Model
JESD22-A115 +/- 200V Machine Model
JESD22-C101C +/- 250V Charged Device Model
ESD protection is highly recommended at the point where the
USIM contacts are exposed, and for any other signals that would
be subjected to ESD by the user.
Environmental and Certifications
1.9.1.
Environmental Specifications
The environmental specification for both operating and storage conditions are defined in the table
below.
Table 4.
Environmental Specifications
Conditions
Range
Operating Class A
-30°C to +70°C
Operating Class B
-40°C to +85°C
Storage
-40°C to +85°C
Note:
The upper limit of Class A is subject to module PCB temperature. A progressive 3G output power
reduction feature is implemented for when PCB temperatures are above +80°C. This leads to a
calibrated 3G TX power output up to +80°C for the PCB temperature and automatic decrease at
higher temperatures. Therefore, depending on module activity and customer design, the upper limit
of Class A could be lower than 70°C.
Class A is defined as the operating temperature ranges that the device:
Shall exhibit normal function during and after environmental exposure.
Shall meet the minimum requirements of 3GPP or appropriate wireless standards.
Class B is defined as the operating temperature ranges that the device:
Shall remain fully functional during and after environmental exposure
Shall exhibit the ability to establish a voice, SMS or DATA call (emergency call) at all times
even when one or more environmental constraint exceeds the specified tolerance.
Unless otherwise stated, full performance should return to normal after the excessive
constraint(s) have been removed.
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Product Technical Specification
1.9.2.
Introduction
Regulatory
The AirPrime HL8518, HL8528 and HL8529 modules are compliant with the following regulations:
R&TTE directive 1999/5/EC
FCC
IC
These compliances will be reflected on the AirPrime HL8518, HL8528 and HL8529 modules labels
when applicable.
Table 5.
Regulation Compliance
Document
Current
Version
Title
NAPRD.03
v5.18 or
later
Overview of PCS Type certification review board (PTCRB) Mobile Equipment
Type Certification and IMEI control
GCF-CC
v3.51.1 or
later
GCF Conformance Certification Criteria
TS 51.010-1
V10.0.0
(2012-03)
3rd Generation Partnership Project; Technical Specification Group
GSM/EDGE Radio Access Network; Digital cellular telecommunications
system (Phase 2+); Mobile Station (MS) conformance specification; Part 1:
Conformance specification
TS 51.010-2
V10.0.0
(2012-03)
3rd Generation Partnership Project; Technical Specification Group
GSM/EDGE Radio Access Network; Mobile Station (MS) conformance
specification; Part 2: Protocol Implementation Conformance Statement
(PICS) proforma specification
EN 301511
V9.0.2
(2003-03)
Global System for Mobile Communications (GSM); Harmonized EN for Mobile
Stations in the GSM 900 and GSM 1800 Bands Covering Essential
Requirements Under Article 3.2 of the R&TTE Directive (1999/5/EC)
EN 301489-1
V1.9.2
(2011-09)
Electromagnetic compatibility and Radio spectrum Matters (ERM);
ElectroMagnetic Compatibility (EMC) standard for radio equipment and
services; Part 1: Common technical requirements
EN 301489-3
V1.4.1
(2002-08)
Electromagnetic compatibility and Radio spectrum Matters (ERM);
ElectroMagnetic Compatibility (EMC) standard for radio equipment and
services; Part 3: Specific conditions for Short-Range Devices (SRD)
operating on frequencies between 9 kHz and 40 GHz
EN 301489-7
V1.3.1
(2005-11)
Electromagnetic Compatibility and Radio Spectrum Matters (ERM);
ElectroMagnetic Compatibility (EMC) Standard for Radio Equipment and
Services; Part 7: Specific Conditions for Mobile and Portable Radio and
Ancillary Equipment of Digital Cellular Radio Telecommunications Systems
(GSM and DCS)
EN 60950-1
NA
IEC 60950-1:2005/A1:2009
EN 60950-1:2006/A11:2009/A1:2010/A12:2011/AC :2011
Information technology equipment – safety- and general requirements
EN 300440-1
v1.6.1
(2012-08)
Electromagnetic compatibility and Radio spectrum Matters (ERM); Short
range devices; Radio equipment to be used in the 1 GHz to 40 GHz
frequency range;
Part 1: Technical characteristics and test methods
EN 300440-2
V1.4.1
(2012-08)
Electromagnetic compatibility and Radio spectrum Matters (ERM); Short
range devices; Radio equipment to be used in the 1 GHz to 40 GHz
frequency range;
Part 2: Harmonized EN under article 3.2 of the R&TTE Directive
4117047
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Product Technical Specification
Introduction
Document
Current
Version
Title
FCC Part 22H
NA
Cellular Radiotelephone Service; Subpart H: Cellular Radiotelephone Service
FCC Part 24E
NA
Personal Communications Service; Subpart E: Broadband PCS.
1.9.3.
RoHS Directive Compliant
The AirPrime HL8518, HL8528 and HL8529 modules are compliant with RoHS Directive 2011/65/EU
which sets limits for the use of certain restricted hazardous substances. This directive states that
“from 1st July 2006, new electrical and electronic equipment put on the market does not contain lead,
mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated
diphenyl ethers (PBDE)”.
1.9.4.
Disposing of the Product
This electronic product is subject to the EU Directive 2012/19/EU for Waste Electrical
and Electronic Equipment (WEEE). As such, this product must not be disposed of at a
municipal waste collection point. Please refer to local regulations for directions on how
to dispose of this product in an environmental friendly manner.
1.10. References
[1]
AirPrime HL Series Customer Process Guidelines
Reference Number: 4114330
[2]
AirPrime HL6 and HL8 Series AT Commands Interface Guide
Reference Number: 4114680
[3]
AirPrime HL Series Dual SIM Single Standby Application Note
Reference Number: 2174034
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19
2.
Pad Definition
AirPrime HL8518, HL8528 and HL8529 pins are divided into 3 functional categories.
Core functions and associated pins cover all the mandatory features for M2M connectivity and will be available by default across all CF 3 family of
modules. These Core functions are always available and always at the same physical pin locations. A customer platform using only these functions
and associated pins is guaranteed to be forward and/or backward compatible with the next generation of CF3 modules.
Extension functions and associated pins bring additional capabilities to the customer. Whenever an Extension function is available on a module, it
is always at the same pin location.
Custom functions and associated pins are specific to a given module, and make an opportunistic use of specific chipset functions and I/Os.
Custom features should be used with caution as there is no guarantee that the custom functions available on a given module will be available on
other CF3 modules.
Other pins marked as “not connected” or “reserved” should not be used.
Table 6.
Pad Definition
Pin #
Signal Name
Function
I/O
I/O HW
Reset
State**
Driver
Pad
Class*
1
GPIO1
General purpose input/output
I/O
I, T
E
2
UART1_RI
UART1 Ring indicator
O
I, T/PD
A
3
UART1_RTS
UART1 Request to send
I
I, T/PD
4
UART1_CTS
UART1 Clear to send
O
I, T/PD
5
UART1_TX
UART1 Transmit data
I
I, T/PD
6
UART1_RX
UART1 Receive data
O
I, T/PD
7
UART1_DTR
UART1 Data terminal ready
I
I, T/PD
8
UART1_DCD
UART1 Data carrier detect/
O
I, L
A
9
UART1_DSR
UART1 Data set ready
O
I, T/PD
A
10
GPIO2
General purpose input/output
I/O
I, T/PD
A
4117047
Rev 2.1
A
Active
Low /
High
Power
Supply
Domain
Recommendation for
Unused Pins
Type
1.8V
Left Open
Extension
1.8V
Left Open
Core
L
1.8V
Connect to UART1_CTS
Core
L
1.8V
Connect to UART1_RTS
Core
1.8V
Mandatory connection
Core
1.8V
Mandatory connection
Core
L
1.8V
Connect to UART1_DSR
Core
L
1.8V
Left Open
Core
L
1.8V
Connect to UART1_DTR
Core
1.8V
Left Open
Core
A
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Product Technical Specification
Pad Definition
Pin #
Signal Name
Function
I/O
I/O HW
Reset
State**
Active
Low /
High
Power
Supply
Domain
Recommendation for
Unused Pins
Type
11
RESET_IN_N
Input reset signal
I
I, T/PU
L
1.8V
Left Open
Core
12
USB_D-
I/O
T
Left Open
Extension
13
USB_D+
I/O
T
Left Open
Extension
14
NC
Not Connected
(Reserved for future use)
-
-
-
-
-
Left Open
Not connected
15
NC
Not Connected
(Reserved for future use)
-
-
-
-
-
Left Open
Not connected
16
USB_VBUS
USB VBUS
17
NC
Not Connected
(Reserved for future use)
5V
Left Open
Extension
-
-
-
-
-
Left Open
Not connected
18
NC
Not Connected
(Reserved for future use)
-
-
-
-
-
Left Open
Not connected
19
NC
Not Connected
(Reserved for future use)
-
-
-
-
-
Left Open
Not connected
20
NC
Not Connected
(Reserved for future use)
-
-
-
-
-
Left Open
Not connected
21
BAT_RTC
Power supply for RTC backup
I/O
N/A
1.8V
Left Open
Extension
22
23
26M_CLKOUT
26MHz System Clock Output
O
I, T/PD
B
1.8V
Left Open
Extension
32K_CLKOUT
32.768kHz System Clock Output
O
I, T/PD
B
1.8V
Left Open
Extension
24
ADC1
Analog to digital conversion
I
N/A
1.2V
Left Open
Extension
25
ADC0
Analog to digital conversion
I
N/A
1.2V
Left Open
Extension
26
UIM1_VCC
1.8V/3V SIM1 Power supply
O
N/A
1.8V/3V
Mandatory connection
Core
27
UIM1_CLK
1.8V/3V SIM1 Clock
O
O, L
E
1.8V/3V
Mandatory connection
Core
28
UIM1_DATA
1.8V/3V SIM1 Data
I/O
O, L/PD
E
1.8V/3V
Mandatory connection
Core
29
UIM1_RESET
1.8V/3V SIM1 Reset
O
O, L
E
1.8V/3V
Mandatory connection
Core
4117047
USB Data Negative (Low / Full Speed)
USB Data Negative (High Speed)
USB Data Positive (Low / Full Speed)
USB Data Positive (High Speed)
Driver
Pad
Class*
3.3V
0.38V
3.3V
0.38V
I
Rev 2.1
L
December 10, 2015
21
Product Technical Specification
Pad Definition
Pin #
Signal Name
Function
I/O
I/O HW
Reset
State**
Driver
Pad
Class*
Active
Low /
High
Power
Supply
Domain
Recommendation for
Unused Pins
Type
30
NC
Not Connected
(Reserved for future use)
-
-
-
-
-
Left Open
Not connected
31
NC
Not Connected
(Reserved for future use)
-
-
-
-
-
Left Open
Not connected
32
NC
Not Connected
(Reserved for future use)
-
-
-
-
-
Left Open
Not connected
33
PCM_OUT
PCM data out
O
I, T/PD
C
1.8V
Left Open
Extension
34
PCM_IN
PCM data in
I
I, T/PD
1.8V
Left Open
Extension
35
PCM_SYNC
PCM sync out
I/O
I, T/PD
C
1.8V
Left Open
Extension
36
PCM_CLK
PCM clock
I/O
I, T/PD
C
1.8V
Left Open
Extension
37
GND
Ground
0V
0V
Mandatory connection
Core
38
NC
Not Connected
-
-
Left Open
Not connected
39
GND
Ground
0V
0V
Mandatory connection
Core
40
GPIO7
General purpose input/output
I/O
O, L
A
1.8V
Left Open
Core
41
GPIO8
General purpose input/output
I/O
I, T/PD
A
1.8V
Left Open
Core
42
NC
Not Connected
-
-
-
-
-
Left Open
Not connected
43
NC
Not Connected
-
-
-
-
-
Left Open
Not connected
44
DEBUG_TX
Debug transmit data
O
I, T/PD
A
1.8V
Left Open
Extension
45
VGPIO
GPIO voltage output
O
N/A
1.8V
Left Open
Core
46
GPIO6
General purpose input/output
I/O
O, L
1.8V
Left Open
Core
47
TP1
Test Point 1
0 - Download Mode
Open - Normal Mode
I
O, L
1.8V
Left Open
Extension
48
GND
Ground
0V
0V
Mandatory connection
Core
49
RF_MAIN
RF GSM Input/output
Mandatory connection
Core
50
GND
Ground
0V
0V
Mandatory connection
Core
51
DEBUG_RX
Debug receive data
I
1.8V
Left Open
Extension
4117047
-
-
-
A
L
N/A
Rev 2.1
I, T/PD
December 10, 2015
22
Product Technical Specification
Pad Definition
Pin #
Signal Name
Function
I/O
I/O HW
Reset
State**
Driver
Pad
Class*
52
GPIO10
General purpose input/output
I/O
I, T/PD
53
GPIO11
General purpose input/output
I/O
54
GPIO15
General purpose input/output
I/O
55
NC1
Reserved for future use
56
NC2
Reserved for future use
57
PWM1
Pulse Width Modulation
O
I, T/PD
A
58
PWM2 /
GPIO12
Pulse Width Modulation /
General purpose input/output
I/O
L
A
59
PWR_ON_N
Active Low Power On control signal
I
60
2G_TX_ON
2G TX burst indicator
O
I, T/PD
Power
Supply
Domain
Recommendation for
Unused Pins
Type
A
1.8V
Left Open
Extension
I, T/PD
A
1.8V
Left Open
Extension
I, T/PD
A
1.8V
Left Open
Extension
Left Open
Not connected
Left Open
Not connected
1.8V
Left Open
Extension
1.8V
Left Open
Extension
L
1.8V
Mandatory connection
Core
H
1.8V
Left Open
Extension
61
VBATT_PA
Power supply (refer to section 3.1
Power Supply for more information)
I
N/A
3.2V (min)
3.7V (typ)
4.5V (max)
Mandatory connection
Core
62
VBATT_PA
Power supply (refer to section 3.1
Power Supply for more information)
I
N/A
3.2V (min)
3.7V (typ)
4.5V (max)
Mandatory connection
Core
63
VBATT
Power supply
I
N/A
3.2V (min)
3.7V (typ)
4.5V (max)
Mandatory connection
Core
64
UIM1_DET /
GPIO3
UIM1 Detection / General purpose
input/output
I/O
I, T/PD
A
H
1.8V
Left Open
Core
65
GPIO4
General purpose input/output
I/O
I, T/PD
A
H
1.8V
Left Open
Extension
66
GPIO5
General purpose input/output
I/O
I, T/PU
E
1.8V
Left Open
Extension
67-70
GND
Ground
0V
71 166
Note:
167234
GND
Ground
0V
236
JTAG_RESET
JTAG RESET
I
4117047
A
Active
Low /
High
0V
Core
0V
Core
These pins are not available on the AirPrime HL8518, HL8528 and HL8529 modules.
Rev 2.1
I, T
L
1.8V
Left Open
December 10, 2015
Extension
23
Product Technical Specification
Pad Definition
Pin #
Signal Name
Function
I/O
I/O HW
Reset
State**
237
JTAG_TCK
JTAG Test Clock
I
I, PD
238
JTAG_TDO
JTAG Test Data Output
O
O, T
239
JTAG_TMS
JTAG Test Mode Select
I
I, PU
240
JTAG_TRST
JTAG Test Reset
I
I, PU
241
JTAG_TDI
JTAG Test Data Input
I
I, PU
242
JTAG_RTCK
JTAG Returned Test Clock
O
O, L
Driver
Pad
Class*
Active
Low /
High
A
L
A
*
Refer to Table 22 Digital I/O Electrical Characteristics for more information.
**
I = Input, O = Output, PU = Pull up, PD = Pull down, H = High, L = Low, T = High impedance, N/A = Not applicable
2.1.
Table 7.
Power
Supply
Domain
Recommendation for
Unused Pins
Type
1.8V
Left Open
Extension
1.8V
Left Open
Extension
1.8V
Left Open
Extension
1.8V
Left Open
Extension
1.8V
Left Open
Extension
1.8V
Left Open
Extension
Pin Types
Pin Type Codes
Type
Definition
I
Digital Input
O
Digital Output
I/O
Digital Input / Output
L
Active High
H
Active Low
T
Tristate
T/PU
Tristate with pull-up enabled
T/PD
Tristate with pull-down enabled
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Product Technical Specification
200
173
189
212
227
234
231
220
201
174
188
211
226
233
232
221
202
175
225
209
185
224
208
184
223
207
183
222
206
182
203
205
181
176
204
180
179
178
JTAG_TDO
JTAG_TCK
JTAG_RESET
GPIO5
JTAG_TMS
66
242
241
240
239
238
237
236
65
GPIO4
64
UIM1_DET/GPIO3
Core pin
63
VBATT
Extension pin
62
VBATT_PA
61
VBATT_PA
60
2G_TX_ON
59
PWR_ON_N
58
PWM2/GPIO12
57
PWM1
56
NC2
55
NC1
54
GPIO15
53
GPIO11
52
GPIO10
70
GND
DEBUG_RX
GND
RF_MAIN
GND
TP1
GPIO6
VGPIO
NC
DEBUG_TX
NC
GPIO8
GPIO7
GND
NC
GND
PCM_CLK
PCM_IN
4117047
GND
170
PCM_SYNC
169
Figure 3.
67
177
51
210
1
2
3
219
50
69
4
230
49
GND
172
229
36
33
199
228
35
32
171
213
187
34
NC
236
190
186
PCM_OUT
218
48
31
5
NC
217
237
198
47
30
6
NC
238
197
46
29
7
UIM1_RESET
239
45
28
8
UIM1_DATA
9
27
240
44
26
UIM1_CLK
216
43
UIM1_VCC
10
25
215
241
196
42
ADC0
11
24
214
195
41
ADC1
12
32K_CLKOUT
23
191
194
40
22
13
26M_CLKOUT
193
39
21
14
BAT_RTC
192
38
20
15
19
NC
37
NC
16
68
17
GND
18
242
JTAG_TRST
167
JTAG_TDI
168
JTAG_RTCK
GPIO1
UART1_RI
UART1_RTS
UART1_CTS
UART1_TX
UART1_RX
UART1_DTR
UART1_DCD
UART1_DSR
RESET_IN_N
GPIO2
USB_D-
USB_D+
NC
NC
USB_VBUS
NC
Pin Configuration (Top View, Through Module)
NC
2.2.
Pad Definition
Pin Configuration
Rev 2.1
December 10, 2015
25
3. Detailed Interface Specifications
Note:
If not specified, all electrical values are given for VBATT=3.7V and an operating temperature of
25°C.
For standard applications, VBATT and VBATT_PA must be tied externally to the same power
supply. For some specific applications, AirPrime HL8518, HL8528 and HL8529 modules support
separate VBATT and VBATT_PA connection if requirements below are fulfilled.
3.1.
Power Supply
The AirPrime HL8518, HL8528 and HL8529 modules are supplied through the VBATT signal.
3.1.1.
Electrical Characteristics
The following table describes the electrical characteristics of the Power Supply interface.
Table 8.
Power Supply
Supply
Minimum
Typical
Maximum
VBATT voltage (V)
3.21
3.7
4.5
VBATT_PA voltage (V) Full Specification
3.21
3.7
4.5
VBATT_PA voltage (V) Extended Range
2.82
3.7
4.5
1
This value has to be guaranteed during the burst
2
No guarantee of 3GPP performances over extended range
Note:
Load capacitance for VBATT is around 30µF ± 20% embedded inside the module.
Load capacitance for VBATT_PA is around 20µF ± 20% embedded inside the module.
3.1.2.
Pin Description
The following table describes the pin description of the Power Supply interface.
Table 9.
Power Supply Pin Description
Pin Number
Signal Name
I/O
Description
63
VBATT
I
Power supply (base band)
61, 62
VBATT_PA
I
Power supply (radio frequency)
37, 39, 48, 67-70, 167-234
GND
4117047
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Ground
December 10, 2015
26
Product Technical Specification
3.1.3.
Detailed Interface Specifications
Burst Transmission Current Requirements
The power supply must be able to deliver high current peaks in a short time due to the burst
transmission nature of GSM. For supply filtering recommendations, please refer to section 3.3
Decoupling of Power Supply Signals.
The following table describes radio burst rates in connected mode. For detailed power consumption
figures, refer to section 3.4 Current DC Power Consumption.
Radio Burst Rates – Connected Mode
Table 10.
GSM/GPRS
Multislot Class
Class 10
Class 12
RF Power
Amplifier Current
Slot Duration
Period
Rising Time
2.2A peak
577 μs
4.615 ms
10 μs
The corresponding radio burst rates in connected mode are as follows:
GSM/GPRS class 2 terminals emit 577 µs radio bursts every 4.615 ms
GPRS class 10 terminals emit 1154 µs radio bursts every 4.615 ms
GPRS class 12 terminals emit 2308 µs radio bursts every 4.615 ms
In connected mode, the RF Power Amplifier current (2.2A peak in GSM /GPRS mode) flows with a
ratio of:
1/8 of the time (around 577 µs every 4.615 ms for GSM /GPRS cl 2 – 2RX/1TX), and
4/8 of the time (around 2308 µs every 4.615 ms for GSM /GPRS cl 12 – 4RX/1TX) with the
rising time at around 10 µs.
V
Voltage Behavior during TX Transmissions
3.8V
VBATT
Residual
Noise
3.7V
Voltage
Drop
Uripp
3.6V
t
I
Peak Current at Max RF
Transmissions
Example:
PCL5
33dBm
(GSM900)
T = 577uS
T = 4.615mS
Figure 4.
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Power Supply During Burst Transmission
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3.1.4.
Detailed Interface Specifications
Power Input (VBATT)
An external power supply uses the VBATT pins to:
Supply the AirPrime HL8518, HL8528 and HL8529 modules.
Directly supply the RF components.
It is essential to keep the voltage ripple to a minimum at this connection to avoid any
phase error or spectrum modulation degradation.
An inadequate power supply can significantly affect RF performance (TX power,
modulation spectrum, EMC performance, spurious emission, frequency error, etc.).
Provide reference voltage VGPIO (through internal regulators) for the baseband signals.
When the AirPrime HL8518, HL8528 and HL8529 modules are supplied with a battery, the total
impedance (battery + protections + PCB) should be such that the supply will be >= 3.2 V during GSM
burst mode operation drawing a maximum peak current of 2.2 A for 577 µs (one slot) or 1154 µs (two
slots) TX.
3.2.
Ground Connection
The AirPrime HL8518, HL8528 and HL8529 modules shielding case is the grounding. The ground
must be connected on the motherboard through a complete layer on the PCB.
The ground connection is made by soldering the LGA ground pins and rectangular ground pad to the
ground plane of the application board.
3.3.
Decoupling of Power Supply Signals
The ETSI standard defines specific requirements for phase error and spectrum modulation. Both are
mandatory and can be affected by the choice of power supply filtering. It is highly recommended to
provide multiple capacitor values to solve an eventual Amplitude and Phase Modulation issue.
AirPrime HL8518, HL8528 and HL8529 modules already here embedded decoupling capacitors on
the VBATT lines, but additional external decoupling may be required.
EMI/RFI issues – Add a capacitor (10pF~33pF) close to the VBATT pins.
TDMA noise (217 Hz) – Place a low ESR decoupling capacitors (at least 100 µF) as close to
the module as possible to reduce noise.
Mandatory
Not Mandatory
Recommended
AirPrime HL8518,
HL8528 and HL8529
10 – 33pF
≥ 100µF
> 1mF
VBATT
GND
Figure 5.
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Product Technical Specification
Detailed Interface Specifications
The figure below shows the power supply voltage drop shapes during GSM 2G transmission.
V
V
Not Critical
Critical
3.8V
3.8V
VBATT
VBATT
3.7V
3.7V
3.6V
3.6V
Phase Error Risk
t
t
V
V
Not Critical
Not Critical
3.8V
3.8V
VBATT
VBATT
Residual
Noise
3.7V
3.7V
3.6V
3.6V
Spectrum Modulation Risk
t
t
Figure 6.
3.4.
Power Supply Voltage Drops Shapes During Burst Transmission
Current DC Power Consumption
The following table lists the current consumption of the AirPrime HL8518, HL8528 and HL8529
modules at different conditions.
Note:
The following data is under the setup recommended in section 5.5 Power Supply Design.
The USB is disconnected for the lowest current consumption.
Typical values are measured at ambient temperature, and maximum values are measured over the
entire operating temperature range. (The measurements are done with a CMU200 and with a 50Ω
load.) For a description of input voltage requirements, see section 3.1 Power Supply.
Table 11.
Current Consumption (at nominal voltage, 3.7V)
Parameters
Typical
Off mode
50 µA
Sleep mode - GSM DRX2
(registered to the network)
Sleep mode - GSM DRX9
(registered to the network)
Sleep mode - WCDMA DRX6
(registered to the network)
4117047
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GSM900
1.5 mA
3.15 mA
DCS1800
1.5 mA
3.15 mA
GSM850
1.6 mA
3.4 mA
PCS1900
1.6 mA
3.4 mA
GSM900
1.15 mA
2.7 mA
DCS1800
1.0 mA
2.7 mA
GSM850
1.3 mA
2.9 mA
PCS1900
1.25 mA
2.95 mA
Band 1
1.75 mA
3.45 mA
Band 2
2 mA
3.75 mA
Band 5
2 mA
3.8 mA
Band 8
1.75 mA
3.5 mA
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Product Technical Specification
Detailed Interface Specifications
Parameters
Sleep mode - WCDMA DRX9
(registered to the network)
WCDMA in communication mode
(Voice Call)
WCDMA in communication mode
(HSDPA)
WCDMA in communication mode
(HSUPA)
GSM in communication mode
GPRS (2 TX,3 RX)
Peak current consumption
Table 12.
Typical
Maximum
Band 1
1.1 mA
2.7 mA
Band 2
1.3 mA
2.9 mA
Band 5
1.3 mA
3.2 mA
Band 8
1.1 mA
2.7 mA
Band 1
620 mA
735 mA
Band 2
620 mA
735 mA
Band 5
500 mA
650 mA
Band 8
500 mA
650 mA
Band 1
700 mA
880 mA
Band 2
680 mA
900 mA
Band 5
550 mA
760 mA
Band 8
580 mA
800 mA
Band 1
700 mA
880 mA
Band 2
665 mA
900 mA
Band 5
550 mA
760 mA
Band 8
580 mA
800 mA
GSM900 / GSM850 (PCL=5)
220 mA
250 mA
DCS / PCS (PCL=0)
165 mA
175 mA
GSM900 / GSM850 (PCL=5)
425 mA
460 mA
DCS / PCS (PCL=0)
300 mA
335 mA
GSM900 / GSM850
1.9 A
2.2A
DCS / PCS
1.8 A
2.0A
Typical
Maximum
Current Consumption per Power Supply (VBATT_PA and VBATT)
Parameters
Average current GSM in
communication mode
E-GSM 900 / GSM 850 (PCL=5)
185 mA
210 mA
DCS 1800/ PCS 1900 (PCL=0)
130 mA
135 mA
Average current
GPRS (2 TX,3 RX)
E-GSM 900 / GSM 850 (PCL=5)
370 mA
395 mA
DCS 1800/ PCS 1900 (PCL=0)
245 mA
270 mA
Band 1
520 mA
615 mA
Band 2
520 mA
615 mA
Band 5
405 mA
530 mA
Band 8
405 mA
530 mA
Average current GSM in
communication mode
E-GSM 900 / GSM 850 (PCL=5)
35 mA
40 mA
DCS 1800/ PCS 1900 (PCL=0)
35 mA
40 mA
Average current
GPRS (2 TX,3 RX)
E-GSM 900 / GSM 850 (PCL=5)
55 mA
65 mA
DCS 1800/ PCS 1900 (PCL=0)
55 mA
65 mA
Band 1
100 mA
120 mA
Band 2
100 mA
120 mA
Band 5
95 mA
120 mA
Band 8
95 mA
120 mA
VBATT_PA
Average current
WCDMA in
communication mode
(Voice Call)
VBATT
Average current
WCDMA in
communication mode
(Voice Call)
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3.5.
Detailed Interface Specifications
VGPIO
The VGPIO output can be used to:
Pull-up signals such as I/Os
Supply the digital transistors driving LEDs
Act as a voltage reference for the ADC interfaces, ADC0 and ADC1
The VGPIO output is available when the AirPrime HL8518, HL8528 and HL8529 module is switched
ON.
3.5.1.
Electrical Characteristics
The following table describes the electrical characteristics of the VGPIO interface.
Table 13.
VGPIO Electrical Characteristics
Parameter
Min
Typ
Max
Remarks
Voltage level (V)
1.7
1.8
1.9
Both active mode and sleep mode
Current capability active
mode (mA)
-
-
50
Power Management support up to 50mA output.
Rise Time(ms)
-
-
1.5
Start-Up time from 0V
3.5.2.
Pin Description
The following table describes the pin description of the VGPIO interface.
Table 14.
VGPIO Pin Description
Pin Number
Signal Name
I/O
I/O Type
Function
45
VGPIO
O
1.8V
(Power supply) GPIO voltage output
3.6.
BAT_RTC
The AirPrime HL8518, HL8528 and HL8529 modules provide an input/output to connect a Real Time
Clock power supply.
This pin is used as a back-up power supply for the internal Real Time Clock. The RTC is supported
when VBATT is available but a back-up power supply is needed to save date and hour when VBATT
is switched off.
If VBATT is available, the back-up battery can be charged by the internal 1.8V power supply regulator.
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3.6.1.
Detailed Interface Specifications
Electrical Characteristics
The following table describes the electrical characteristics of the BAT_RTC interface.
Table 15.
BAT_RTC Electrical Characteristics
Parameter
Minimum
Typical
Maximum
Unit
Input voltage
-5%
1.8
+5%
V
Input current consumption
-
2.5
-
µA
Output current capability
7
-
-
mA
Output voltage
-5%
1.8
+5%
V
Max charging current (@VBATT=3.7V)
-
25
-
mA
Note:
When used with the HL Series snap-in socket, or when compatibility with HL6528x is needed,
Sierra Wireless recommends adding a 10µF capacitor to the BAT_RTC pin.
3.6.2.
Pin Description
The following table describes the pin description of the BAT_RTC interface.
Table 16.
BAT_RTC Pin Description
Pin Number
Signal Name
I/O
Function
21
BAT_RTC
I/O
Power supply for RTC backup
3.7.
SIM Interface
The AirPrime HL8518, HL8528 and HL8529 modules have one physical SIM interface, UIM1, which
has optional support for dual SIM application with an external SIM switch. Refer to Section 5.8 Dual
SIM Application for more information regarding dual SIM.
The UIM1 interface allows control of a 1.8V/3V SIM and is fully compliant with GSM 11.11
recommendations concerning SIM functions.
The five signals used by this interface are as follows:
UIM1_VCC: power supply
UIM1_CLK: clock
UIM1_DATA: I/O port
UIM1_RST: reset
UIM1_DET:SIM detection (optional)
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3.7.1.
Detailed Interface Specifications
Electrical Characteristics
The following table describes the electrical characteristics of the UIM1 interface.
Table 17.
Electrical Characteristics of UIM1
Parameter
Min
Typ
Max
Remarks
UIM1 Interface Voltage : (V)
( VCC, CLK, IO, RST )
2.7
3.0
3.15
1.65
1.80
1.95
The appropriate output
voltage is auto detected
and selected by software.
VIH : Input Voltage-High
(VDD=1.8V)
VDD*0.7
-
1.95
VIL : Input Voltage-Low
(VDD=1.8V)
0
-
VDD*0.2
VOH : Output Voltage-High
(VDD=1.8V)
VDD*0.7
-
1.95
VOL : Output Voltage-Low
(VDD=1.8V)
0
-
VDD*0.2
VIH : Input Voltage-High
(VDD=3.0V)
VDD*0.7
-
3.15
VIL : Input Voltage-Low
(VDD=3.0V)
0
-
VDD*0.2
VOH : Output Voltage-High
(VDD=3.0V)
VDD*0.7
-
3.15
VOL : Output Voltage-Low
(VDD=3.0V)
0
-
VDD*0.2
UIM1 DET
1.33
1.80
2.1
High active
UIM1_VCC Current (mA)
-
-
10
Max output current in sleep
mode = 3 mA
UIM1_VCC Line Regulation (mV/V)
-
-
50
At Iout Max.
UIM1_VCC Power-up Setting Time (µs)
from power down
-
10
-
UIM1 Interface
Voltage: (V)
(VCC, CLK,
IO, RESET )
3.7.2.
Pin Description
The following table describes the pin description of the UIM1 interface.
Table 18.
UIM1 Pin Description
Pin Number
Signal Name
I/O
I/O Type
Function
26
UIM1_VCC
O
1.8V/3V
UIM1 Power supply
27
UIM1_CLK
O
1.8V/3V
UIM1 Clock
28
UIM1_DATA
I/O
1.8V/3V
UIM1 Data
29
UIM1_RESET
O
1.8V/3V
UIM1 Reset
64
UIM1_DET
I
1.8V
UIM1 detection
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GPIO3
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Product Technical Specification
3.7.3.
Detailed Interface Specifications
UIM1_DET
UIM1_DET is used to detect and notify the application about the insertion and removal of a SIM
device in the SIM socket connected to the main SIM interface (UIM1). When a SIM is inserted, the
state of UIM1_DET transitions from logic 0 to logic 1. Inversely, when a SIM is removed, the state of
UIM1_DET transitions from logic 1 to logic 0.
The GPIO used for UIM1_DET is GPIO3.
Enabling or disabling this SIM detect feature can be done using the AT+KSIMDET command. For more
information about this command, refer to document [2] AirPrime HL6 and HL8 Series AT Commands
Interface Guide.
3.7.4.
Application
3.7.4.1.
Reference Schematic
J1
UIM1_VCC
1
6
AirPrime HL8518,
HL8528 and HL8529
VGPIO
8
UIM1_CLK
3
UIM1_DET
4
UIM1_DATA
7
UIM1_RESET
2
2
1
NC_D2-6
VPP
CC8
CLK
CC4
I/O
RST
GND
C2
470 nF
6
R1
4
100 kΩ
3
C1
1
470 pF
5
D2
VCC
D1
3
4
6
2
GND
5
GND
GND
Figure 7.
UIM1 Application Reference Schematic
3.7.4.2.
USIM Socket Pin Description
The following table describes the required USIM socket pins.
Table 19.
USIM Socket Pin Description
Pin Number
Signal Name
Description
1
UIM1_VCC
UIM1 Power supply
2
UIM1_RESET
UIM1 Reset
3
UIM1_CLK
UIM1 Clock
4
UIM1_DET
UIM1 detection
5
GROUND
GND
6
-
-
7
UIM1_DATA
UIM1 Data
8
VGPIO
Power supply
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Product Technical Specification
3.8.
Detailed Interface Specifications
USB
The AirPrime HL8518, HL8528 and HL8529 modules have one USB interface.
3.8.1.
Electrical Characteristics
The following table describes the electrical characteristics of the USB interface.
Table 20.
Electrical Characteristics of USB
Signal
I/O
I/O Type
USB_D+
I/O
USB_D-
I/O
USB data
(DP, DM)
I/O
USB_VBUS
I
3.8.2.
Min.
Typ.
Max.
Unit
Analog
3.06
3.3
3.6
V
Analog
3.06
3.3
3.6
V
VIH: Input Voltage-High
2
-
3.2
V
VIL: Input Voltage-Low
-0.3
-
0.8
V
VOL: Static Output Voltage-Low
-
-
0.45
V
VOH: Static Output Voltage-High
2.45
-
-
V
Voltage input
4.75
5.0
5.25
V
Analog
Analog
Parameter
USB_VBUS Input current consumption
mA
Pin Description
The following table describes the pin description of the USB interface.
Table 21.
USB Pin Description
Pin Number
Signal Name
I/O
I/O Type
Function
12
USB_D-
I/O
3.3V
USB data negative line pad
13
USB_D+
I/O
3.3V
USB data positive line pad
16
USB_VBUS
I
5V
USB VBUS
Note:
When the 5V USB supply is not available, connect USB_VBUS to VBATT to supply the USB
interface.
3.9.
Electrical Information I/O
The AirPrime HL8518, HL8528 and HL8529 modules support different groups of digital interfaces with
varying current drain limits. The following table enumerates these interface groupings and enumerates
the electrical characteristics of each digital interface.
The DC characteristics of the pads are compatible with CMOS JEDEC standard EIA/JESD8-5.
Table 22.
Digital I/O Electrical Characteristics
Parameter
Min
Typ
Max
VIL: Input voltage for general digital pad (V)
-0.2
-
VDD*0.2
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Product Technical Specification
Detailed Interface Specifications
Parameter
Min
Typ
Max
Conditions
VIH: Input voltage for general digital pad (V)
VDD*0.7
-
VDD + 0.2
Input / Output leakage Current (µA)
-
-
±0.7
VDD (V)
1.7
1.8
1.9
-
-
0.2
IOL = + 0.1mA
-
-
0.35
IOL = +6.0mA
VDD-0.35
-
-
IOH = - 6.0mA
VDD-0.2
-
-
IOH = - 0.1mA
-
-
0.2
IOL = + 0.1mA
-
-
0.35
IOL = +4.0 mA
VDD-0.35
-
-
IOH = - 4.0mA
VDD-0.2
-
-
IOH = - 0.1mA
-
-
0.2
IOL = + 0.1mA
-
-
0.35
IOL = +2.0mA
VDD-0.35
-
-
IOH = - 2.0mA
VDD-0.2
-
-
IOH = - 0.1mA
-
-
0.2
IOL = + 0.1mA
-
-
0.35
IOL = +1.0mA
VDD-0.35
-
-
IOH = - 1.0mA
VDD-0.2
-
-
IOH = - 0.1mA
-
-
0.2
IOL = + 0.1mA
-
-
0.35
IOL = +1.0mA
VDD-0.35
-
-
IOH = - 1.0mA
VDD-0.2
-
-
IOH = - 0.1mA
Driver Pad Class A
VOLA: Output Voltage-Low (V)
VOHA: Output Voltage-High (V)
Driver Pad Class B
VOLB: Output Voltage-Low (V)
VOHB: Output Voltage-High (V)
Driver Pad Class C
VOLC: Output Voltage-Low (V)
VOHC: Output Voltage-High (V)
Driver Pad Class D
VOLD: Output Voltage-Low (V)
VOHD: Output Voltage-High (V)
Driver Pad Class E
VOLE: Output Voltage-Low (V)
VOHE: Output Voltage-High (V)
3.10. General Purpose Input/Output (GPIO)
The AirPrime HL8518, HL8528 and HL8529 modules provide 12 GPIOs, 2 of which have multiplexes.
Table 23.
GPIO Pin Description
Pin Number
Signal Name
1
I/O
Power Supply Domain
GPIO1
I/O
1.8V
10
GPIO2*
I/O
1.8V
40
GPIO7
I/O
1.8V
41
GPIO8
I/O
1.8V
46
GPIO6
I/O
1.8V
52
GPIO10
I/O
1.8V
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Product Technical Specification
Pin Number
Signal Name
53
Detailed Interface Specifications
I/O
Power Supply Domain
GPIO11
I/O
1.8V
54
GPIO15
I/O
1.8V
58
GPIO12
PWM2
I/O
1.8V
64
GPIO3
UIM1_DET
I/O
1.8V
65
GPIO4
I/O
1.8V
66
GPIO5
I/O
1.8V
*
Multiplex
This pin can be used to trigger the module to wake up from Sleep Mode.
3.11. Main Serial Link (UART1)
The main serial link (UART1) is used for communication between the AirPrime HL8518, HL8528 and
HL8529 modules and a PC or host processor. It consists of a flexible 8-wire serial interface that
complies with RS-232 interface.
The supported baud rates of the UART1 are 300, 1200, 2400, 4800, 9600, 19200, 38400, 57600,
115200, 230400, 460800, 500000, 750000, 921600, 1843200, 3000000, 3250000 and 6000000 bit/s.
The signals used by UART1 are as follows:
TX data (UART1_TX)
RX data (UART1_RX)
Request To Send (UART1_RTS)
Clear To Send (UART1_CTS)
Data Terminal Ready (UART1_DTR)
Data Set Ready (UART1_DSR)
Data Carrier Detect (UART1_DCD)
Ring Indicator (UART1_RI)
Note:
Signal names are according to PC view.
3.11.1. Pin Description
The following table describes the pin description of the UART1 interface.
Table 24.
UART1 Pin Description
Pin #
Signal Name*
I/O*
Description
2
UART1_RI
O
Signal incoming calls (voice and data), SMS, etc.
3
UART1_RTS
I
Wakes the module up when AT+KSLEEP=1 is used
4
UART1_CTS
O
Ready to receive AT commands
5
UART1_TX
I
Transmit data
6
UART1_RX
O
Receive data
7
UART1_DTR
I
(active low)
Prevents the module from entering sleep mode, switches between
data mode and command mode, and wakes the module up.
8
UART1_DCD
O
Signal data connection in progress
9
UART1_DSR
O
Signal UART interface is ON
*
4117047
According to PC view.
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Detailed Interface Specifications
3.11.2. 8-wire Application
VGPIO
AirPrime
HL8518, HL8528
and HL8529
Figure 8.
Level shifter use
TP
UART1_RX
TP
UART1_CTS
TP
UART1_DSR
TP
UART1_DCD
TP
UART1_RI
TP
UART1_DTR
TP
UART1_TX
TP
UART1_RTS
TP
R
R
R
R
R
R
R
R
RXD
CTS
DSR
DCD
RI
Customer
Application
DTR
TXD
RTS
8-wire UART Application Example
3.11.3. 4-wire Application
VGPIO
AirPrime
HL8518, HL8528
and HL8529
Level shifter use
TP
TP
UART1_CTS
TP
UART1_DSR
TP
DSR
UART1_DCD
TP
DCD
UART1_RI
TP
RI
UART1_TX
TP
TXD
UART1_RTS
TP
R
R
CTS
Customer
Application
DTR
UART1_DTR
Figure 9.
RXD
UART1_RX
R
R
RTS
4-wire UART Application Example
3.11.4. 2-wire Application
VGPIO
AirPrime
HL8518, HL8528
and HL8529
4117047
RXD
UART1_RX
TP
UART1_CTS
TP
CTS
UART1_DSR
TP
DSR
UART1_DCD
TP
DCD
UART1_RI
TP
RI
R
UART1_DTR
DTR
UART1_RTS
RTS
UART1_TX
Figure 10.
Level shifter use
TP
TP
R
Customer
Application
TXD
2-wire UART Application Example
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Product Technical Specification
Detailed Interface Specifications
3.12. POWER ON Signal (PWR_ON_N)
A low level signal has to be provided to switch the AirPrime HL8518, HL8528 and HL8529 modules
ON.
It is internally connected to the permanent 1.8V supply regulator inside the HL8518, HL8528 and
HL8529 via a pull-up resistor. Once VBAT is supplied to the module, this 1.8V supply regulator will be
enabled and so the PWR_ON_N signal is by default at high level.
The PWR_ON_N signal’s characteristics are listed in the table below.
Table 25.
PWR_ON_N Electrical Characteristics
Parameter
Min
Input Voltage-Low (V)
Typical
Max
-
0.51
Input Voltage-High (V)
1.33
-
2.2
Power-up period (ms) from PWR_ON_N falling edge
2000
-
-
PWR_ON_N assertion time (ms)
25
As PWR_ON_N is internally pulled up with 200kΩ, a simple open collector or open drain transistor
must be used for ignition.
Note:
The software starts operating when the module is ON, but “AT Command Ready” will depend on
whether UART or USB is used.
PWR_ON_N
PWR_ON_N
assertion time
> 25 ms
Figure 11.
PWR_ON_N Assertion Time
VGPIO is an output from the module that can be used to check if the module is active.
When VGPIO = 0V, the module is OFF.
When VGPIO = 1.8V, the module is ON (it can be in idle, communication or sleep mode)
Note:
PWR_ON_N cannot be used to power the module off. To power the module off, use AT command
AT+CPOF.
3.13. Reset Signal (RESET_IN_N)
To reset the module, a low level pulse must be sent on the RESET_IN_N pin for 10ms. This action will
immediately restart the AirPrime HL8518, HL8528 and HL8529 modules with the PWR_ON_N signal
at low level. (If the PWR_ON_N signal is at high level, the module will be powered off.) As
RESET_IN_N is internally pulled up, a simple open collector or open drain transistor can be used to
control it.
The RESET_IN_N signal will reset the registers of the CPU and reset the RAM memory as well, for
the next power on.
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Note:
Detailed Interface Specifications
As RESET_IN_N is referenced to the VGPIO domain (internally to the module), it is impossible to
reset before the module starts or to try to use RESET_IN_N as a way to start the module.
Another more costly solution would be to use MOS transistor to switch the power supply off and
restart the power up procedure using the PWR_ON_N input line.
Table 26.
RESET_IN_N Electrical Characteristics
Parameter
Min
Input Voltage-Low (V)
Typical
Max
-
0.51
Input Voltage-High (V)
1.33
-
2.2
Power-up period (ms) from RESET_IN_N falling edge*
2000
-
-
*
With the PWR_ON_N Signal at low level
3.14. ADC
Two Analog to Digital Converter inputs, ADC0 and ADC1, are provided by the AirPrime HL8518,
HL8528 and HL8529 modules. These converters are 10-bit resolution ADCs ranging from 0 to 1.2V.
Typically, the ADCx input can be used to monitor external temperature. This is very useful for
monitoring the application temperature and can be used as an indicator to safely power the
application OFF in case of overheating (for Li-Ion batteries).
3.14.1. Electrical Characteristics
The following table describes the electrical characteristics of the ADC interface.
Table 27.
ADC Electrical Characteristics
Parameter
Min
Typ
Max
Remarks
ADC Resolution (bits)
-
10
-
Input Voltage Range (V)
0
-
1.2
Update rate per channel (kHz)
-
-
125
Integral Nonlinearity (bits)
-
-
±2
LSB
Offset Error (bits)
-
-
±1
LSB
Gain
849
853
858
Input Resistance (MΩ)
1
-
-
Input Capacitance (pF)
-
1
-
General purpose input
3.14.2. Pin Description
The following table describes the pin description of the ADC interface.
Table 28.
ADC Pin Description
Pin Number
Signal Name
I/O
I/O Type
Description
25
ADC0
I
1.2V
Analog to digital conversion
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Pin Number
Signal Name
I/O
I/O Type
Description
24
ADC1
I
1.2V
Analog to digital conversion
3.15. PWM
The AirPrime HL8518, HL8528 and HL8529 modules provide two PWM signals that can be used in
conjunction with an external transistor for driving a vibrator, or a backlight LED.
Each PWM uses two 7-bit unsigned binary numbers: one for the output period and one for the pulse
width or the duty cycle.
The relative timing for the PWM output is shown in the figure below.
Figure 12.
Relative Timing for the PWM Output
3.15.1. Electrical Characteristics
The following table describes the electrical characteristics of the PWM interface.
Table 29.
PWM Electrical Characteristics
Parameter
Conditions
Minimum
Typical
Maximum
Unit
VOH
High impedance load
--
1.8
-
V
VOL
-
-
-
0.2
V
IPEAK
-
-
-
8
mA
Frequency
-
25.6
-
1625
kHz
Duty cycle
-
1
-
99
%
3.15.2. Pin Description
The following table describes the pin description of the PWM interface.
Table 30.
PWM Pin Description
Pin Number
Signal Name
I/O
I/O Type
Description
57
PWM1
I/O
1.8V
PWM output
58
PWM2
I/O
1.8V
PWM output multiplexed with GPIO12
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3.15.3. Application
Both PWM1 and PWM2 signals can be used in conjunction with an external transistor for driving a
vibrator, or a backlight LED.
Figure 13.
Example of an LED Driven by either the PWM1 or PWM2 Output
The value of R607 can be harmonized depending on the LED (D605) characteristics.
The recommended digital transistor to use for T601 is the DTC144EE from ROHM.
Figure 14.
Example of a BUZZER Driven by either the PWM1 or PWM2 Output
The recommended MOS transistor to use for T1 is the RUM003N02 from ROHM; and the
recommended diode to use for D1 is the BAS16W from NXP.
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Detailed Interface Specifications
3.16. Clock Interfaces
The AirPrime HL8518, HL8528 and HL8529 modules support two digital clock interfaces.
3.16.1. Electrical Characteristics
The following table describes the pin description of the clock out interfaces.
Table 31.
32.768Khz Clock Interface Pin Description
Parameter
Conditions
Minimum
Typical
Maximum
Unit
Duty cycle
-
-
50
-
%
Clock frequency
-
-120ppm
32768
+120ppm
Hz
Table 32.
26Mhz Clock Interface Pin Description
Parameter
Conditions
Minimum
Typical
Maximum
Unit
Duty cycle
-
45
-
55
%
Clock frequency
-
-
26
-
MHz
Period
-
38.457
-
38.465
ns
Clock accuracy
-
-100
-
100
ppm
3.16.2. Pin Description
Table 33.
Clock Interface Pin Description
Pin Number
Signal Name
I/O
I/O Type
Description
22
26M_CLKOUT
O
1.8V
26MHz Digital Clock output
23
32K_CLKOUT
O
1.8V
32.768kHz Digital Clock output
Enabling or disabling the clock out feature can be done using AT commands. For more information
about AT commands, refer to document [2] AirPrime HL6 and HL8 Series AT Commands Interface
Guide.
3.17. PCM
The Digital Audio (PCM) Interface allows connectivity with standard audio peripherals. It can be used,
for example, to connect an external audio codec.
The programmability of this interface allows addressing a large range of audio peripherals.
The signals used by the Digital Audio Interface are as follows:
PCM_SYNC: The frame synchronization signal delivers an 8 kHz frequency pulse that
synchronizes the frame data in and the frame data out.
PCM_CLK: The frame bit clock signal controls data transfer with the audio peripheral.
PCM_OUT: The frame “data out” relies on the selected configuration mode.
PCM_IN: The frame “data in” relies on the selected configuration mode.
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Detailed Interface Specifications
The PCM interface is a high speed full duplex interface that can be used to send and receive digital
audio data to external audio ICs. The Digital Audio Interface also features the following:
PCM master or slave
16 bits data word length, linear mode
MSB first
Configurable PCM bit clock rate on 256kHz, 384kHz or 512kHz
Long frame sync
Refer to the following table for the electrical characteristics of the digital audio interface.
3.17.1. Electrical Characteristics
Table 34.
Digital Audio PCM Electrical Characteristics
Signal
Description
Tsync_low +
Tsync_high
PCM_SYNC frequency
8
Khz
Tsync_low +
Tsync_high
PCM_SYNC period
125
µs
Tsync_low
PCM_SYNC low time
124
µs
Tsync_high
PCM_SYNC high time
1
µs
TCLK-cycle
PCM_CLK period
-
3.9
-
µs
TIN-setup
PCM_IN setup time
59.6
-
-
ns
TIN-hold
PCM_IN hold time
12
-
-
ns
TOUT-delay
PCM_OUT delay time
-
-
21.6
ns
TSYNC-delay
PCM_SYNC output delay
-24
-
31.2
ns
VDD
PCM Signaling Voltage
1.1
1.2
1.3
V
VIH
I/O Voltage input low
0.65*VDD
-
VDD+0.3
V
VIL
I/O Voltage input high
-0.3
-
0.35*VDD
V
VOL
I/O Voltage output low
-
-
0.45
V
VOH
I/O Voltage output high
VDD-0.45
-
-
V
IL
I/O Leakage current
-
-
±0.7
µA
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3.17.2. PCM Waveforms
The following figure shows the PCM timing waveform.
Figure 15.
PCM Timing Waveform
3.17.3. PCM Master Mode
Figure 16.
PCM Master Mode Timing
Table 35.
PCM Master Mode Parameters
Symbol
Description
Min
Typ
Max
Unit
tI2Sbs1
PCM_CLK clock period
T-4
T
-
ns
tI2Sbs2
PCM_CLK low time
T/2 – 20
T/2
-
ns
tI2Sbs3
PCM_CLK high time
T/2 – 20
T/2
-
ns
tI2Sbs4
PCM_SYNC high begin after clock PCM_CLK
high begin
-24
-
2 x tCP + 12
ns
tI2Sbs5
PCM_SYNC high end after PCM_CLK how end
-24
-
2 x tCP + 12
ns
tI2Sbs6
PCM_OUT invalid before PCM_CLK low-end
-
-
24
ns
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Detailed Interface Specifications
Symbol
Description
Min
Typ
Max
Unit
tI2Sbs7
PCM_OUT valid after PCM_CLK high begin
-
-
tCP + 12
ns
tI2Sbs8
PCM_IN setup time before PCM_CLK high end
tCP + 50
-
-
ns
tI2Sbs9
PCM_IN hold time after PCM_CLK low begin
12
-
-
ns
Note:
T corresponds to the audio sampling rate (48 kHz, 44.1 kHz, 32 kHz, 24 kHz, 22.05 kHz, 16 kHz, 12
kHz, 11.025 kHz and 8 kHz) and to the frame length (17 bit, 18bit, 32bit, 48bit or 64 bit).
3.17.4. PCM Slave Mode
Figure 17.
PCM Master Mode Timing
Table 36.
PCM Slave Mode Parameters
Symbol
Description
Min
Typ
Max
Unit
tI2Sbs1
PCM_CLK clock period
T
-
-
n
tI2Sbs2
PCM_CLK low time
120
-
-
ns
tI2Sbs3
PCM_CLK high time
120
-
-
ns
tI2Sbs4
PCM_SYNC high begin before PCM_CLK low
begin (latching edge of PCM_CLK )
2 x tCP + 17
-
-
ns
tI2Sbs5
PCM_SYNC low begin before PCM_CLK low
begin (latching edge of PCM_CLK )
2 x tCP + 17
-
-
ns
tI2Sbs6
PCM_OUT invalid before PCM_CLK rising edge
(shifting edge of PCM_CLK )
-
-
12
ns
tI2Sbs7
PCM_OUT valid after PCM_CLK rising edge
(shifting edge of PCM_CLK )
-
-
3 x tCP + 12
ns
tI2Sbs8
PCM_IN setup time before PCM_CLK falling
edge
tCP + 12
-
-
ns
tI2Sbs9
PCM_IN hold time after PCM_CLK falling edge
24
-
-
ns
Note:
4117047
T corresponds to the audio sampling rate (48 kHz, 44.1 kHz, 32 kHz, 24 kHz, 22.05 kHz, 16 kHz, 12
kHz, 11.025 kHz and 8 kHz) and to the frame length (17 bit, 18bit, 32bit, 48bit or 64 bit).
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Detailed Interface Specifications
3.17.5. Pin Description
Table 37.
Digital Audio PCM Pin Description
Pin Number
Signal Name
I/O
I/O Type
Description
36
PCM_CLK
O
1.8V
PCM clock
35
PCM_SYNC
O
1.8V
PCM synchronization
34
PCM_IN
I
1.8V
PCM data in
33
PCM_OUT
O
1.8V
PCM data out
3.18. Debug Interfaces
The AirPrime HL8518, HL8528 and HL8529 modules provide 2 interfaces for a powerful debug
system.
3.18.1. Debug Port
The AirPrime HL8518, HL8528 and HL8529 modules provides a 2-wire debug port interface, providing
real-time instruction and data trace of the Modem Core.
Table 38.
SW Trace Pin Description
Pin Number
Signal Name*
I/O*
44
DEBUG_TX
O
1.8V
Debug Transmit Data
51
DEBUG_RX
I
1.8V
Debug Receive Data
*
Note:
I/O Type
Function
According to module view.
It is strongly recommended to provide access through Test Points to this interface.
3.18.2. JTAG
The JTAG interface provides debug access to the core of the AirPrime HL8518, HL8528 and HL8529
modules. These JTAG signals are accessible through solder-able test points.
3.18.2.1.
Table 39.
Electrical Characteristic
JTAG Pin Connection
Symbol
Parameter
Min
Typ
Max
Unit
tc1
JTAG_TCK clock period
--
38
-
ns
tc2
JTAG_TCK clock period high
12
-
-
ns
tc3
JTAG_TCK clock period low
12
-
-
ns
tc4
JTAG_TDI setup time to JTAG_TCK
12
-
-
ns
tc5
JTAG_TDI hold time from JTAG_TCK
10
-
-
ns
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Detailed Interface Specifications
Symbol
Parameter
Min
Typ
Max
Unit
tc6
JTAG_TDO valid before JTAG_TCK low-end
-
0
-
s
tc7
JTAG_TDO valid after JTAG_TCK high begin
-
20
-
ns
3.18.2.2.
Figure 18.
JTAG Timing Waveform
3.18.2.3.
Table 40.
JTAG Waveforms
Pin Description
JTAG Pin Description
Pin Number
Signal Name
I/O
I/O Type
Function
47
TP1
O
1.8V
Test Point 1
236
JTAG_RESET
I
1.8V
JTAG RESET
237
JTAG_TCK
I
1.8V
JTAG Test Clock
238
JTAG_TDO
O
1.8V
JTAG Test Data Output
239
JTAG_TMS
I
1.8V
JTAG Test Mode Select
240
JTAG_TRST
I
1.8V
JTAG Test Reset
241
JTAG_TDI
I
1.8V
JTAG Test Data Input
242
JTAG_RTCK
O
1.8V
JTAG Returned Test Clock
Note:
It is recommended to provide access through Test Points to this interface (for Failure Analysis
debugging). All signals listed in table above shall be outputs on the customer board to allow JTAG
debugging.
3.19. RF Interface
The GSM RF interface of the AirPrime HL8518, HL8528 and HL8529 modules allows the transmission
of RF signals. This interface has a 50Ω nominal impedance.
3.19.1. RF Connection
A 50Ω (with maximum VSWR 1.1:1, and 0.5dB loss) RF track is recommended to be connected to
standard RF connectors such as SMA, UFL, etc. for antenna connection.
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Table 41.
Detailed Interface Specifications
RF Pin Connection
Pin Number
RF Signal
Impedance
VSWR Rx (max)
VSWR Tx (max)
49
RF_MAIN
50Ω
3:1
3:1
3.19.2. RF Performances
RF performances are compliant with the ETSI recommendation GSM 05.05.
Table 42.
RF Performance
Frequency Band
Typical Sensitivity (dBm)
GSM850/EGSM
-109
DCS/PCS
-108
UMTS B1
-110
UMTS B2
-110
UMTS B5
-110
UMTS B8
-110
3.19.3. TX Burst Indicator (2G_TX_ON)
The AirPrime HL8518, HL8528 and HL8529 modules provide a signal, 2G_TX_ON, for TX Burst
indication. The 2G_TX_ON is a 1.8V signal and its status signal depends on the module transmitter
state.
Refer to the following table for the status of the 2G_TX_ON signal depending on the embedded
module’s state.
Table 43.
Burst Indicator States
Embedded Module State
2G_TX_ON
During TX burst
High
No TX
Low
During TX burst, there is a higher current drain from the VBATT_PA power supply which causes a
voltage drop. This voltage drop from VBATT_PA is a good indication of a high current drain situation
during TX burst.
The blinking frequency is about 217Hz.
The output logic high duration, Tduration, depends on the number of TX slots and is computed as
follows:
T duration = T advance + (0.577ms x number of TX slots) + T delay
Table 44.
2G_TX_ON Burst Characteristics
Parameter
Minimum
Tadvance
30µs
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Detailed Interface Specifications
Parameter
Minimum
Tdelay
5µs
Figure 19.
2G_TX_ON State during TX Burst
Table 45.
2G_TX_ON Burst Pin Description
Typical
Maximum
Pin Number
Signal Name
I/O
I/O Type
Function
60
2G_TX_ON
O
1.8V
2G TX burst indicator
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4. Mechanical Drawings
Figure 20.
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Schematic Diagram
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Product Technical Specification
Figure 21.
4117047
Mechanical Drawings
Footprint
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5. Design Guidelines
5.1.
Power-Up Sequence
Apply a LOW level logic to the PWR_ON_N pin (pin 59); within 25ms, VGPIO will appear to be at
1.8V. Either a USB or UART1 interface could be used to send AT commands. Note that for USB
connections, the time when AT commands can be sent will depend on the initialization time used for
the USB connection with the USB host.
Figure 22.
Note:
PWR_ON_N Sequence with VGPIO Information
As PWR_ON_N is internally pulled up with 200kΩ, a simple open collector or open drain transistor
must be used for ignition.
The PWR_ON_N pin has the minimum assertion time requirement of 25ms, with LOW active. Once
the valid power on trigger is detected, the PWR_ON_N pin status can be left open.
VBATT has to ramp up within 32 ms to reach the value of 3.2V; otherwise, the module may not power
up.
Figure 23.
5.2.
PWR_ON_N Sequence with Trampup
Module Switch-Off
AT command AT+CPOF enables the user to properly switch the AirPrime HL8518, HL8528 and
HL8529 modules off. The PWR_ON signal must be set to high (inactive) before the AT+CPOF
command is sent.
Note:
If the PWR_ON signal is active (low level) when the AT+CPOF command is sent, the module will
not power off.
If required, the module can be switched off by controlling the power supply. This can be used, for
example, when the system freezes and no reset line is connected to the AirPrime HL8518, HL8528
and HL8529 modules. In this case, the only way to get control over the module back is to switch off
the power line.
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AT+CPOF
Module is ON
Design Guidelines
PWR_ON_N
Internal pull-up to
1V8 (must be High)
Module is OFF
2 seconds
VGPIO
Figure 24.
Power OFF Sequence for PWR_ON_N, VGPIO
Note:
PWR_ON_N is internally pulled up by 200kΩ to 1.8V.
Caution:
Ensure that no external pull-ups are applied on IO pins while the module is OFF.
5.3.
Emergency Power OFF
If required, the module can be switched off by controlling the RESET_IN_N pin (pin 11). This must
only be used in emergency situations if the system freezes (not responding to AT commands).
To perform an emergency power off, a low level pulse must be sent on the RESET_IN_N pin for 10ms
while the PWR_ON signal is inactive (high level). This action will immediately shut the HL8518,
HL8528 and HL8529 modules down and the registers of the CPU and RAM memory will be reset for
the next power on.
5.4.
Sleep Mode Management
5.4.1.
Using UART
AT command AT+KSLEEP enables sleep mode configuration.
AT+KSLEEP=0:
The module is active when DTR signal is active (low electrical level).
When DTR is deactivated (high electrical level), the module will enter sleep mode after a
while.
On DTR activation (low electrical level), the module wakes up.
AT+KSLEEP=1:
The module determines when it enters sleep mode (when no more tasks are running).
“0x00” character on the serial link wakes the module up.
AT+KSLEEP=2:
The module never enters sleep mode.
5.4.2.
Using USB
Use AT+KSLEEP=1 to allow the module to automatically enter sleep mode while the USB interface is
in use.
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5.5.
Design Guidelines
Power Supply Design
The AirPrime HL8518, HL8528 and HL8529 modules should not be supplied with voltage over 4.5V
even temporarily or however briefly.
If the system’s main board power supply unit is unstable or if the system’s main board is supplied with
over 4.5V, even in the case of transient voltage presence on the circuit, the module’s power amplifier
may be severely damaged.
To avoid such issues, add a voltage limiter to the module’s power supply lines so that VBATT and
VBATT_PA signal pads will never receive a voltage surge over 4.5V. The voltage limiter can be as
simple as a Zener diode with decoupling capacitors as shown in the diagram below.
Power Supply
Figure 25.
5.6.
+
C405
150 µF
C407
100 nF
+
C404
1.5 mF
D405
D404
0.5 pF
VBATT/VBATT_PA
Voltage Limiter Example
ESD Guidelines for SIM Card
Decoupling capacitors must be added as close as possible to the SIM card connectors on UIM1_CLK,
UIM1_RST, UIM1_VCC and UIM1_DATA signals to avoid EMC issues and to pass the SIM card type
approval tests, according to the drawings below.
A typical schematic for hardware SIM detection is provided below.
Figure 26.
4117047
EMC and ESD Components Close to the SIM
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Product Technical Specification
5.7.
Design Guidelines
ESD Guidelines for USB
CONNECTOR
When the USB interface is externally accessible, it is required to have ESD protection on the
USB_VBUS, USB_D+ and USB_D- signals.
USB_VBUS
USB_D+
USB_D-
1
2
2
3
Figure 27.
1
AirPrime HL8518,
HL8528 and HL8529
3
ESD Protection for USB
Note:
It is not recommended to have an ESD diode with feedback path from USB_VBUS to either
USB_D+ or USB_D-.
5.8.
Dual SIM Application
Using an external switch and GPIOs, the AirPrime HL8518, HL8528 and HL8529 modules can
support Dual SIM Single Standby with fast network switching. Refer to document [2] AirPrime HL6
and HL8 Series AT Commands Interface Guide for related AT commands.
Figure 28.
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Reference Design for Dual SIM Application
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Product Technical Specification
5.9.
Design Guidelines
Radio Frequency Integration
The AirPrime HL8518, HL8528 and HL8529 modules are equipped with an external antenna. A 50Ω
line matching circuit between the module, the customer’s board and the RF antenna is required, for
GSM feed path, as shown in the example below.
Antenna Detection
15kΩ 1%
VGPIO
100kΩ 1%
ADC0
15kΩ 1%
GPIO5
AirPrime
HL8518, HL8528
and HL8529
22pF
33kΩ 1%
47nH
5.6kΩ 1%
GSM antenna
TBD
RF_MAIN
TBD
Figure 29.
Note:
4117047
TBD
33pF
Rant
10kΩ
GSM Antenna Connection with Antenna Detection
Antenna detection circuit is optional. Rant is the equivalent DC terminating resistor of the antenna.
Rant should be close to 10KΩ.
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6. Reliability Specification
The AirPrime HL8518, HL8528 and HL8529 modules are tested against the Sierra Wireless
Automotive Reliability Specification defined below.
6.1.
Reliability Compliance
The AirPrime HL8518, HL8528 and HL8529 modules connected on a development kit board
application is compliant with the following requirements.
Table 46.
Standards Conformity
Abbreviation
Definition
IEC
International Electro technical Commission
ISO
International Organization for Standardization
6.2.
Reliability Prediction Model
6.2.1.
Life Stress Test
The following tests the AirPrime HL8518, HL8528 and HL8529 modules’ product performance.
Table 47.
Life Stress Test
Designation
Condition
Performance Test
PT3T° & PT
Standard: N/A
Special conditions:
Temperature:
Class A: -30°C to +70°C
Class B: -40°C to +85°C
Rate of temperature change: ± 3°C/min
Recovery time: 3 hours
Operating conditions: Powered
Duration: 14 days
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6.2.2.
Reliability Specification
Environmental Resistance Stress Tests
The following tests the AirPrime HL8518, HL8528 and HL8529 modules’ resistance to extreme
temperature.
Table 48.
Environmental Resistance Stress Tests
Designation
Condition
Cold Test Active
COTA
Standard: IEC 680068-2-1, Test Ad
Special conditions:
Temperature: -40°C
Temperature variation: 1°C/min
Operating conditions: Powered ON with a power cycle of 1 minute ON and
2 minutes OFF
Duration: 3 days
Resistance to Heat Test
RH
Standard: IEC 680068-2-2, Test Bb
Special conditions:
Temperature: +85°C
Temperature variation: 1°C/min
Operating conditions: Powered ON with a power cycle of 15 minutes ON
and 15 minutes OFF
Duration: 50 days
6.2.3.
Corrosive Resistance Stress Tests
The following tests the AirPrime HL8518, HL8528 and HL8529 modules’ resistance to corrosive
atmosphere.
Table 49.
Corrosive Resistance Stress Tests
Designation
Condition
Humidity Test
HUT
Standard: IEC 60068-2-3, Test Ca
Special conditions:
Temperature: +65°C
RH: 95%
Temperature variation: 3 ± 0.6°C/min
Operating conditions: Powered on, DUT is powered up for 15 minutes and
OFF for 15 minutes
Duration: 10 days
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Reliability Specification
Designation
Condition
Moist Heat Cyclic Test
MHCT
Standard: IEC 60068-2-30, Test Db
Special conditions:
Upper temperature: +40 ± 2°C
Lower temperature: +25 ± 5°C
RH:
Upper temperature: 93%
Lower temperature: 95%
Number of cycles: 21 (1 cycle/24 hours)
Operating conditions: Powered ON for 15 minutes during each 3 hours
ramp up and 3 hours ramp down (in middle) for every cycle
Duration: 21 days
6.2.4.
Thermal Resistance Cycle Stress Tests
The following tests the AirPrime HL8518, HL8528 and HL8529 modules’ resistance to extreme
temperature cycling.
Table 50.
Thermal Resistance Cycle Stress Tests
Designation
Condition
Standard: IEC 60068-2-14, Test Na
Thermal Shock Test
TSKT
Special conditions:
Temperature: -30°C to +80°C
Temperature Variation: less than 30s
Number of cycles: 600
Dwell Time: 10 minutes
Operating conditions: Un-powered
Duration: 9 days
Standard: IEC 60068-2-14, Test Nb
Temperature Change
TCH
Special conditions:
Temperature: -40°C to +90°C
Temperature Variation: 3 ± 0.6°C/min
Number of cycles: 400
Dwell Time: 10 minutes
Operating conditions: Un-powered
Duration: 29 days
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6.2.5.
Reliability Specification
Mechanical Resistance Stress Tests
The following tests the AirPrime HL8518, HL8528 and HL8529 modules’ resistance to vibrations and
mechanical shocks.
Table 51.
Mechanical Resistance Stress Tests
Designation
Condition
Standard: IEC 60068-2-6, Test Fc
Special conditions:
Sinusoidal Vibration Test
SVT
Frequency range: 16 Hz to 1000 Hz
Acceleration:
5G from 16 to 62 Hz
3G from 62 to 200 Hz
1G from 200 to 1000 Hz
Sweep rate: 1 octave / cycle
Number of Sweep: 20 sweeps / axis
Sweep direction: ± X, ± Y, ± Z
Displacement: 0.35mm (peak-peak)
Operating conditions: Un-powered
Duration: 42 days
Standard: IEC 60068-2-64, Test Fh
Special conditions:
Random Vibration Test
RVT
Frequency range: 10 Hz – 2000 Hz
Power Spectral Density in [(m/s²)²/Hz]
0.1 g2/Hz at 10Hz
0.01 g2/Hz at 250Hz
0.005 g2/Hz at 1000Hz
0.005 g2/Hz at 2000Hz
Peak factor : 3
Duration per Axis : 1 hr / axis
Operating conditions: Un-powered
Duration: 1 day
Standard: IEC 60068-2-27, Test Ea
Special conditions:
Shock Test 1:
Wave form: Half sine
Peak acceleration: 30g
Duration: 11ms
Number of shocks: 8
Direction: ±X, ±Y, ±Z
Shock Test 2:
Wave form: Half sine
Peak acceleration: 100g
Duration: 6ms
Number of shocks: 3
Direction: ±X, ±Y, ±Z
Mechanical Shock Test
MST
Operating conditions: Un-powered
Duration: 72 hours
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6.2.6.
Reliability Specification
Handling Resistance Stress Tests
The following tests the AirPrime HL8518, HL8528 and HL8529 modules’ resistance to handling
malfunctions and damage.
Table 52.
Handling Resistance Stress Tests
Designation
ESDC Test
Condition
Standard: JESD22-A114, JESD22-A115, JEDEC JESD 22 – C101C
Special conditions:
HBM (Human Body Model) : 1kV (Class 1C)
MM (Machine Model): 200V (Class B)
CDM (Charged Device Model) : 250V (Class C1)
Operating conditions: Powered
Duration: 3 days
Free Fall Test
FFT
Standard : IEC 60068-2-32, Test Ed
Special conditions:
Number of drops: 2 drops per unit and per axis (total 12 drops)
Height: 1m
Operating conditions: Un-powered
Duration: 6 hours
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7. Legal Information
Note:
7.1.
This section is only applicable to the AirPrime HL8528 and HL8529 modules.
FCC Regulations
FCC Caution: Any changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate this equipment.
IMPORTANT NOTE – FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with minimum distance 20cm between the radiator &
your body.
This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
The AirPrime HL8528 and HL8529 modules are currently pending modular approval for mobile
applications. Once approved, integrators may use the AirPrime HL8528 and HL8529 in their final
products without additional FCC certification if they meet the following conditions. Otherwise,
additional FCC approvals must be obtained.
1. At least 20 cm separation distance between the antenna and the user’s body must be
maintained at all times.
2. To comply with FCC regulations limiting both maximum RF output power and human
exposure to RF radiation, the maximum antenna gain including cable loss in a mobile-only
exposure condition must not exceed:
TBD dBi in the cellular band
TBD dBi in the PCS band
3. The AirPrime HL8528 and HL8529 must not transmit simultaneously with other collocated
radio transmitters within a host device.
4. The RF signal must be routed on the application board using tracks with a 50Ω characteristic
impedance. Basically, the characteristic impedance depends on the dielectric, the track width
and the ground plane spacing. In order to respect this constraint, Sierra Wireless
recommends using MicroStrip or StripLine structure and computing the Tracks width with a
simulation tool (like AppCad shown in the figure below and that is available free of charge at
http://www.agilent.com).
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If a multi-layered PCB is used, the RF path on the board must not cross any signal (digital,
analog or supply).
If necessary, use StripLine structure and route the digital line(s) "outside" the RF structure. An
example of proper routing is shown in the figure below.
Stripline and Coplanar design requires having a correct ground plane at both sides.
Consequently, it is necessary to add some vias along the RF path. It is recommended to use
Stripline design if the RF path is fairly long (more than 3cm), since MicroStrip design is not
shielded. Consequently, the RF signal (when transmitting) may interfere with neighbouring
electronics (AF amplifier, etc.). In the same way, the neighbouring electronics (microcontrollers, etc.) may degrade the reception performances. The GSM/GPRS connector is
intended to be directly connected to a 50Ω antenna and no matching is needed.
5. A label must be affixed to the outside of the end product into which the AirPrime HL8528 and
HL8529 modules are incorporated, with a statement similar to the following:
This device contains FCC ID: N7NHL8528 (for devices using the HL8528)
This device contains FCC ID: N7NHL8529 (for devices using the HL8529)
6. A user manual with the end product must clearly indicate the operating requirements and
conditions that must be observed to ensure compliance with current FCC RF exposure
guidelines.
The end product with an AirPrime HL8528 and HL8529 modules may also need to pass the FCC Part
15 unintentional emission testing requirements and be properly authorized per FCC Part 15.
Note:
If this module is intended for use in a portable device, you are responsible for separate approval to
satisfy the SAR requirements of FCC Part 2.1093.
7.2.
IC Regulations
IC Radiation Exposure Statement:
This equipment complies with IC RSS-102 radiation exposure limits set forth for an
uncontrolled environment. This equipment should be installed and operated with minimum
distance 20cm between the radiator & your body.
This device and its antenna(s) must not be co-located or operating in conjunction with any
other antenna or transmitter.
This Class B digital apparatus complies with Canadian ICES-003.
Under Industry Canada regulations, this radio transmitter may only operate using an antenna
of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To
reduce potential radio interference to other users, the antenna type and its gain should be so
chosen that the equivalent isotropically radiated power (e.i.r.p) is not more than necessary for
successful communication.
Labeling Requirements for the Host Device (from Section 7.2 of RSP-100, Issue 10,
November 2014): The host device shall be properly labeled to identify the module within the
host device. The Industry Canada certification label of a module shall be clearly visible at all
times when installed in the host device, otherwise the host device must be labeled to display
the Industry Canada certification number of the module, preceded by the words – Contains
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transmitter module, or the word – Contains, or similar wording expressing the same meaning,
as follows:
Contains transmitter module IC: 2417C-HL8528 (for devices using the HL8528)
Contains transmitter module IC: 2417C-HL8529 (for devices using the HL8529)
This device complies with Industry Canada license-exempt RSS standard(s). Operation is
subject to the following two conditions: (1) this device may not cause interference, and (2) this
device must accept any interference, including interference that may cause undesired
operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada
applicables aux appareils radio exempts de licence.
This radio transmitter (identify the device by certification number, or model number if
Category II) has been approved by Industry Canada to operate with the antenna types listed
below with the maximum permissible gain and required antenna impedance for each antenna
type indicated. Antenna types not included in this list, having a gain greater than the
maximum gain indicated for that type, are strictly prohibited for use with this device.
TBD dBi in Band 2
TBD dBi in Band 5
Antenna types having a gain greater than the maximum gain indicated for that type are strictly
prohibited for use with this device.
7.3.
CE Regulation
The minimum distance between the user and/or any bystander and the radiating structure of the
transmitter is 20 cm.
Assessment of compliance of the product with the requirements relating to the Radio and
Telecommunication Terminal Equipment Directive (EC Directive 1999/5/EC) was performed by
PHOENIX TESTLAB (Notified Body No.0700).
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8. Conformance with ATEX
The AirPrime HL8518, HL8528 and HL8529 modules are intended for use in telecommunication
equipment.
Table 53.
ATEX Conformance
Module
2G Bands
3G Bands
Sum of All Capacitors*
Sum of All Inductors*
HL8518
EGSM/DCS
Band I, Band VIII
140 µF
9.8 µH
HL8528
GSM850/PCS
Band II, Band V
142 µF
9.8 µH
HL8529
N/A
Band II, Band V
130 µF
9.8 µH
*
Including worst case tolerance rating 20%.
The AirPrime HL8518, HL8528 and HL8529 modules have a maximum potential difference, internally
generated, of 30 V. This voltage may be reached under fault conditions; for example, on the RF feed
in 850 and 900 MHz bands when the module is emitting at its maximum power, and only under certain
circumstances (for instance very poor VSWR).
There are no cells, batteries or piezo electric devices (with the exception of commonly used radio
parts such as quartz filters and SAW filters) inside the module.
The maximum RF output is 2W/1W in bands 850/900 and 1800/1900 at the RF output of the module
when connected to a 50 Ω load.
Note:
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9. Ordering information
Table 54.
Ordering Information
Model Name
Part Number
Designation
HL8518
1102589
HL8518
HL8528
1102576
HL8528
HL8529
1102578
HL8529
DEV-KIT
6000620
DEV-KIT, HL series
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10. Terms and Abbreviations
Abbreviation
Definition
ADC
Analog to Digital Converter
AGC
Automatic Gain Control
AT
Attention (prefix for modem commands)
CDMA
Code Division Multiple Access
CF3
Common Flexible Form Factor
CLK
Clock
CODEC
Coder Decoder
CPU
Central Processing Unit
DAC
Digital to Analog Converter
DTR
Data Terminal Ready
EGNOS
European Geostationary Navigation Overlay Service
EMC
Electromagnetic Compatibility
EMI
Electromagnetic Interference
EN
Enable
ESD
Electrostatic Discharges
ETSI
European Telecommunications Standards Institute
FDMA
Frequency-division multiple access
GAGAN
GPS aided geo augmented navigation
GLONASS
Global Navigation Satellite System
GND
Ground
GNSS
Global Navigation Satellite System
GPIO
General Purpose Input Output
GPRS
General Packet Radio Service
GSM
Global System for Mobile communications
Hi Z
High impedance (Z)
IC
Integrated Circuit
IMEI
International Mobile Equipment Identification
I/O
Input / Output
LED
Light Emitting Diode
LNA
Low Noise Amplifier
MAX
Maximum
MIN
Minimum
MSAS
Multi-functional Satellite Augmentation System
N/A
Not Applicable
PA
Power Amplifier
PC
Personal Computer
PCB
Printed Circuit Board
PCL
Power Control Level
PLL
Phase Lock Loop
PWM
Pulse Width Modulation
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Terms and Abbreviations
Abbreviation
Definition
QZSS
Quasi-Zenith Satellite System
RF
Radio Frequency
RFI
Radio Frequency Interference
RMS
Root Mean Square
RST
Reset
RTC
Real Time Clock
RX
Receive
SCL
Serial Clock
SDA
Serial Data
SIM
Subscriber Identification Module
SMD
Surface Mounted Device/Design
SPI
Serial Peripheral Interface
SW
Software
PSRAM
Pseudo Static RAM
TBC
To Be Confirmed
TBD
To Be Defined
TP
Test Point
TX
Transmit
TYP
Typical
UART
Universal Asynchronous Receiver-Transmitter
UICC
Universal Integrated Circuit Card
USB
Universal Serial Bus
UIM
User Identity Module
VBATT
Main Supply Voltage from Battery or DC adapter
VSWR
Voltage Standing Wave Ratio
WAAS
Wide Area Augmentation System
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