SG901-1039

SG901-1039 Miniature Wi-Fi Radio This document refers to the SG901-1028 mounted in a Molex connector carrier board Overview Features The SG901-1039 is a single chip based 802.11b/g WLAN radio for embedded, lowpower and very small form factor mobile applications. The assembly footprint includes a Molex connector carrier board to facilitate the interface to Sagrad evaluation boards and for special industrial/medical applications where upgrade and simple maintenance is required. • FCC Module Certification • RoHs Compliant • Fully integrated 802.11 Solution • Custom drivers available for your host • Extremely small footprint • Ultra Low Current consumption • Fully compliant with the IEEE 802.11b and 802.11g WLAN standards • Support for 54, 48, 36, 24, 18, 12, 9, and 6Mbps OFDM, 11 and 5.5Mbps CCK and Legacy 2 and 1Mbps data rates • Single Chip 802.11b/g WLAN solution with fully integrated: - Zero IF (ZIF) transceiver, - Voltage Controlled Oscillator (VCO), - High-Speed A/D and D/A Converters, - Radio Power Management Unit (PMU) with on-board supply regulators, - OFDM and CCK baseband processor, - ARM9 Media Access Controller (MAC), - SPI serial host interface (up to 48MHz) - SDIO serial host interface (up to 50MHz) The product conforms to the IEEE 802.11b and 802.11g protocols operating in the 2.45GHz ISM frequency band supporting OFDM data rates of 54, 48, 36, 24, 18, 12, 9, and 6Mbps. It also supports CCK data rates of 11 and 5.5Mbps and legacy data rates of 2 and 1Mbps. The SG901-1039 is a fully integrated wireless radio including a ZIF transceiver, RF Synthesizer/VCO, high-speed data converters, an OFDM/CCK digital baseband processor, an ARM9-based MAC and a complete Power Management Unit. The on module Power Amplifier completes a highly integrated chip set solution. Host control is provided by either an SDIO or SPI interface. This complete design allows quick integration into a number of different applications. • Intelligent Power Control, Including 802.11 Power Save Mode • Supports SPI interface • Supports SDIO interface Applications • Personal Digital Assistants (PDA) • Portable Computers • Hand-held Data Transfer Devices • Cameras • Computer Peripherals • Cable Replacement • Cellular Phones Ordering Information Packaging Order Number Bulk Only SG901-1039-C-BLK (Commercial) SG901-1039-ET-BLK (Ext. Temp) 1-321-255-0515 WWW.SAGRAD.COM DOC#: SG914-0008 rev. 2.1 Block Diagram Wi-Fi MODULE Antenna Connector STLC4560 Power Amplifier Power Management Unit Host Interface Connection Through Carrier Board MOLEX CONNECTOR ZIF Transceiver Baseband Processor MAC High-Speed Data Converters SAGRAD SG901-1039 Radio Block Diagram 1-321-255-0515 WWW.SAGRAD.COM DOC#: SG914-0008 rev. 2.1 General Electrical Specifications Parameter Test Condition / Comment Min. Typ. Max. Units 4.0 V Absolute Maximum Ratings 3.3V Supply -0.3 Operating Conditions and Input Power Specifications 0 70 °C Extended Temperature -30 85 °C Input Supply Voltage Power Management Unit 3.3V Supply input 3.0 Standby Mode Current Power Save Mode Current 3.3V, 25°C, POWERUP=1.8V, Sleep clock 32.768kHz 100mS beacon period, 75 byte beacons @ 1Mbps, short Preamble, DTIM = 3 Shutdown Current 3.3V 25°C, POWERUP=0V Peak TX Current During Transmitting packets, 3.3V, 25°C Peak RX Current During Receiving packets, 3.3V, 25°C Input Supply Voltage VHIO input supply determines Host CMOS logic levels Input Supply Current Standby Mode Current Operating Temperature Range (See ordering information) 3.3V Supply VHIO Supply Commercial 3.3 420 5.5 V 0.5 mA 2 mA 8 uA 520 mA 253 1.62 mA 1.8 1.98 V VHIO = 1.8V 0.5 6 mA VHIO = 1.8V 10 uA Digital Interface Specifications (25°C) Parameter Test Condition / Comment Min. Typ. Max. Units 0.8 1.98 V 0 0.3 Digital Interface Specifications VIH POWER UP Input PMU Power up control. Active High VIL Pull-Down Host CMOS Inputs VIH 500 VHIO supply domain VIL Host CMOS Outputs VOH IOH = 0.2mA, VHIO supply domain VOL IOL = 2mA, VHIO supply domain Input Current VHIO supply domain 0.7*VHIO VHIO V 0 0.3*VHIO V VHIO 0.2 VHIO V 0 0.4 V -1.0 Frequency SLEEP_CLK Input Accuracy +1.0 32.768 VHIO supply domain Duty Cycle V kΩ 30 uA kHz 500 ppm 70 % Max. Units RF Characteristics (25°C) Parameter Test Condition / Comment RF Frequency Range RF Output Power Typ. 2400 802.11 G 54Meg Meeting FCC and 802.11 EVM 802.11 G 6Meg Meeting FCC and 802.11 EVM 802.11 B 11Meg Meeting FCC and 802.11 EVM 802.11 G 54Meg Receiver Sensitivity 2500 12 MHz dBm 15 dBm 15 dBm -68 dBm -88 dBm 10% PER 802.11 G 6Meg FCC Compliance Min. Passed FCC part 15C Note 1: Output Power is measured at the RF Antenna 1-321-255-0515 WWW.SAGRAD.COM DOC#: SG914-0008 rev. 2.1 Inputs/Outputs Required ` Comment Part Number Molex 53748-0308 Location Bottom Side 30 Pins Digital Connector RF Connector Power Part Number Hirose U.FL-R-SMT(10) Location Top Side 3.3V Input Supply Voltage Connector Pin Description SIGNAL NAME VHIO PIN NUMBER 20,21,22 DESCRIPTION NOTES Supply Voltage for I/O's Recommended I/O voltage range 1.6V to 2.0V (nominal 1.8V) (see note 1). SPI_CSn 10 SPI: Serial Host Chip Select/SDIO: Data 3 SPI_DI 9 SPI: Serial Host Data Input/SDIO: Data 0 SPI_CLK 18 SPI: Clock/SDIO: CLK SPI_DO 14 SPI: Serial Host Data Output/SDIO: CMD SDIO_SDAT2 17 SDIO: Data 2 IRQ 5 SPI: Serial Host Interrupt/SDIO: Data 1 SERHOSTMODE 19 SPI/SDIO Select High = SPI, Low = SDIO High = normal mode, Low = Sleep Mode POWER UP 6 Power Up Enable (from host) SLEEPCLK 13 32.768 kHz Sleep Clock 3.3V 3,4,11,12,25,26,27,28 GND 1, 2, 7, 8, 15, 16, 23, 24, 29, 30 Input Supply Further decoupling may be required to sustain 250mA inrush currents during packet transmission Ground Connections Note 1: This I/O supply operates to 3.3V. It is recommended that a level translator to 1.8V be used on host applications beyond 2.0V (i.e. TI-TXS0108 for SDIO). 1-321-255-0515 WWW.SAGRAD.COM DOC#: SG914-0008 rev. 2.1 Encryption Support Feature Windows Linux CE WEP Yes Yes Yes TKIP Yes Yes Yes AES/CCMP (HW accel) Yes Yes Yes Security WPA Yes-WZC WPA2 Yes Third Party Supplicant Third Party Supplicant WZC (shared key), Third party suppl. Third Party Supplicant QoS HCF (Q1/2006) WMM Q1/06 Q1/06 Q1/06 Yes Yes Yes WMM U-APSD Yes Yes Yes EDCF Yes Yes Yes Q1/06 Q1/06 Q1/06 WMM-SA (Q1/2006) Cisco Standards CCX v1 Yes CCX v2 Yes Third Party Supplicant Third Party Supplicant Third Party Supplicant Third Party Supplicant Certifications 802.11d Support Yes Yes Yes WiFi Certification Yes Yes* Yes* (XP certification transfers) WHQL NA NA NA Bluetooth Coexistence PTA (802.15.2) Yes Yes Yes 802.11/BT on same Antenna Yes Yes Yes 802.11/BT on 2 Antennas Yes Yes Yes Data and Voice Simultaneously Yes Yes Yes Data and Data Simultaneously Yes Yes Yes Voice and Voice Simultaneously Yes Yes Yes *Throughput depends on SPI speed. We recommend a 33Mhz SPI to pass WiFi PDA Throughput requirements 1-321-255-0515 WWW.SAGRAD.COM DOC#: SG914-0008 rev. 2.1 Software Support Little Endian 1-321-255-0515 Arm X Arm4 X Arm9e X Armi X i386 X mips X Big Endian X powerpc X sh X sh4 X thumb X xscale X WWW.SAGRAD.COM X DOC#: SG914-0008 rev. 2.1 HW/SW Overview - SoftMAC Architecture • User Space, WPA Supplicant – – Supplicant required to: •Handle user input/configuration WPA handshaking •Transport protocol (EAP/PEAP) •Handle certificates •Install keys in UMAC • Wi-Fi DRIVER – Allows for porting to custom embedded OS and Processor Host USERSPACE/WPA SPACE/WPASUPPLICANT SUPPLICANT USER 802.3 Frames Kernel DRV DRV DRV DRV Wi-Fi DRIVER* Driver API • UMAC – Binary Library file •Links with driver •Provides configuration API to: – Select encryption type – Set Key •Handles initial Authentication/Association to the AP •Configures LMAC for the correct encryption – Binary file, contains ARM executable code Hardware encryption/decryption of data according to configured encryption type and key. 1-321-255-0515 UMAC 802.11 Frames and control messages Resource management: frames, memory, timers, debug Wi-Fi Module • LMAC – Upper API Interconnect API Hardware Layer LMAC LMAC Customer responsible for porting the WiFi Driver and any user space applications such as the supplicant. WWW.SAGRAD.COM DOC#: SG914-0008 rev. 2.1 Implementation The SG901-1039 uses the Molex 53748-0308 connector. The following Molex connectors can be used to mate to the SG901-1039 module: o o 52991-0308 (White) 54167-0308 (Black) Implementation Schematic 1-321-255-0515 WWW.SAGRAD.COM DOC#: SG914-0008 rev. 2.1 Sagrad Evaluation Platforms EV Kit for SPI interface (1) SG901-1039 802.11 b & g fully FCC certified Wi-Fi module soldered on a carrier board (1) PCMCIA board for SPI applications (1) Interposer board (1) Software Driver CD (1) Data sheet for the SG901-1039 (1) Schematics of interposer board (1) Schematics of PCMCIA board 1-321-255-0515 EV Kit for SDIO interface (1) SG901-1039 802.11 b & g fully FCC certified Wi-Fi module soldered on carrier board (1) SDIO interface board for SDIO applications (1) Software Driver CD (1) Data sheet for the SG901-1039 (1) Schematics of SDIO board WWW.SAGRAD.COM DOC#: SG914-0008 rev. 2.1 Mechanical • • Maximum Peak Reflow Temperature: 240oC Moisture Level Sensitivity : 3 Module Dimensions: Parameter Min. Typ. Dimension Length Width Height 1-321-255-0515 WWW.SAGRAD.COM 33.25 22.30 8.63 Max. Units mm mm mm DOC#: SG914-0008 rev. 2.1 Mechanical, continued Suggested Stand-off’s: Swage Threaded Standoffs Round or Hex 2-56 Thread x .156 O.D. (5/32") Use Staking Tool: Cat. No. TL-19 Round Cat. No. "H" "L" For Panel Thickness HEX Cat. No. 1589-2 .125 [3,17] .109 [2,77] 1/16 1731-2 1589-3 .125 [3,17] .140 [3,56] 3/32 1731-3 1590-2 .187 [4,75] .109 [2,77] 1/16 1734-2 1590-3 .187 [4,75] .140 [3,56] 3/32 1734-3 1591-2 .250 [6,35] .109 [2,77] 1/16 1740-2 1591-3 .250 [6,35] .140 [3,56] 3/32 1740-3 1596-2 .375 [9,52] .109 [2,77] 1/16 1743-2 1596-3 .375 [9,52] .140 [3,56] 3/32 1743-3 Keystone: http://www.keyelco.com/pdfs/M55p65.pdf Use Staking Tool: Cat. No. TL-19 1-321-255-0515 WWW.SAGRAD.COM DOC#: SG914-0008 rev. 2.1