SG901-1028 Miniature Wi-Fi Radio
Overview
Features
The SG901-1028 is a single chip based
802.11b/g WLAN radio for embedded, lowpower and very small form factor mobile
applications. The product conforms to the IEEE
802.11b and 802.11g protocols operating in the
2.45GHz ISM frequency band supporting OFDM
data rates of 54, 48, 36, 24, 18, 12, 9, and
6Mbps. It also supports CCK data rates of 11
and 5.5Mbps and legacy data rates of 2 and
1Mbps.
• FCC Module Certification
• RoHs Compliant
• Fully integrated 802.11 Solution
• Custom drivers available for your host
• Extremely small footprint
• Ultra Low Current consumption
• Fully compliant with the IEEE 802.11b and
802.11g WLAN standards
• Support for 54, 48, 36, 24, 18, 12, 9, and
6Mbps OFDM, 11 and 5.5Mbps CCK and
Legacy 2 and 1Mbps data rates
• Single Chip 802.11b/g WLAN solution with fully
integrated:
The SG901-1028 is a fully integrated wireless
radio including a ZIF transceiver, RF
Synthesizer/VCO, high-speed data converters,
an OFDM/CCK digital baseband processor, an
ARM9-based MAC and a complete Power
Management Unit. The on module Power
Amplifier completes a highly integrated chip set
solution.
Host control is provided by either an SDIO or
SPI interface.
This complete design allows quick integration
into a number of different applications.
°
°
°
°
°
°
°
°
Zero IF (ZIF) transceiver
Voltage Controlled Oscillator (VCO)
High-Speed A/D and D/A Converters
Radio Power Management Unit
OFDM and CCK baseband processor
ARM9 Media Access Controller (MAC)
SPI serial host interface (up to 48MHz)
SDIO serial host interface (up to 50MHz)
• Intelligent Power Control, Including 802.11
Power Save Mode
• Supports SPI interface
• Supports SDIO interface
Applications
• Personal Digital Assistants (PDA)
• Portable Computers
• Hand-held Data Transfer Devices
• Cameras
• Computer Peripherals
• Cable Replacement
• Cellular Phones
Ordering Information
SG901-1028-C-TR
SG901-1028-C-BLK
SG901-1028-ET-TR
SG901-1028-ET-BLK
1-321-255-0515
www.sagrad.com
Commercial temperature,
Tape and Reel
Commercial temperature, Bulk
Extended temperature,
Tape and Reel
Extended temperature, Bulk
DOC#: SG914-0005 Rev 9.1
Block Diagram
Wi-Fi MODULE
Antenna
Connector
STLC4560
Power Management Unit
Host
Interface
Connection
SPI/SDIO
ZIF
Transceiver
Power
Amplifier
Baseband
Processor
MAC
High-Speed
Data Converters
FCC Certification
Comment
FCC ID
Certified for use
with these
Antennas
Other Antennas
1-321-255-0515
VRA-SG9011028
W1038
Pulse Antennas 2.4 – 2.5 GHz with Reverse SMA connector
W1037
Pulse Antennas 2.4 – 2.5 GHz with Reverse SMA connector
MLPV2400NGP
PCTEL Ant 2.4 – 2.5 GHz with reverse SMA
13018-1
Beijing Evercommunication Ant 2.4 – 2.5 GHz with IPX
(U.FL Compatible, recommended for cost sensitive applications)
Additional Antennas may be added to the approval list at additional cost. Contact Sagrad for
additional information
WWW.SAGRAD.COM
DOC#: SG914-0005 rev. 9.1
General Electrical Specifications
Parameter
Test Condition / Comment
Min.
Typ.
Max.
Units
-0.3
4.0
V
0
70
°C
Absolute Maximum Ratings
3.3V Supply
Operating Conditions and Input Power Specifications
Operating Temperature Range
(See ordering information)
3.3V Supply
VHIO Supply
Commercial
Extended temperature
-30
Input Supply Voltage
Power Management Unit 3.3V Supply input
3.0
Standby Mode
Current
Power Save Mode
Current
3.3V, 25°C, POWERUP=1.8V, Sleep clock
32.768kHz
100mS beacon period, 75 byte beacons @ 1Mbps,
short Preamble, DTIM = 3
Shutdown Current
3.3V 25°C, POWERUP=0V
Peak TX Current
During Transmitting packets, 3.3V, 25°C
Peak RX Current
During Receiving packets, 3.3V, 25°C
Input Supply Voltage
VHIO input supply determines Host CMOS logic
levels
Input Supply Current
Standby Mode
Current
3.3
420
85
°C
5.5
V
0.5
mA
2
mA
8
uA
520
mA
253
1.62
mA
1.8
1.98
V
VHIO = 1.8V
0.5
6
mA
VHIO = 1.8V
10
uA
Digital Interface Specifications (25°C)
Parameter
Test Condition / Comment
Min.
Typ.
Max.
Units
0.8
1.98
V
0
0.3
V
Digital Interface Specifications
VIH
POWER UP Input
PMU Power up control. Active High
VIL
Pull-Down
Host CMOS Inputs
VIH
500
VHIO supply domain
VIL
VOH
Host CMOS
Outputs
IOH = 0.2mA, VHIO supply domain
VOL
IOL = 2mA, VHIO supply domain
Input Current
VHIO supply domain
VHIO
V
0
0.3*VHIO
V
VHIO 0.2
VHIO
V
0
0.4
V
-1.0
+1.0
uA
Frequency
SLEEP_CLK Input
Accuracy
kΩ
0.7*VHIO
32.768
VHIO supply domain
Duty Cycle
30
kHz
500
ppm
70
%
Max.
Units
RF Characteristics (25°C)
Parameter
Test Condition / Comment
RF Frequency Range
802.11 G 54Meg
RF Output Power
(note 1)
Meeting FCC and 802.11 EVM
2500
12
MHz
dBm
Meeting FCC and 802.11 EVM
15
dBm
802.11 B 11Meg
Meeting FCC and 802.11 EVM
15
dBm
802.11 G 6Meg
-71
10% PER
802.11 B 11Meg
FCC Compliance
Typ.
802.11 G 6Meg
802.11 G 54Meg
Receiver Sensitivity
Min.
2400
dBm
-88
dBm
-84
dBm
Passed FCC part 15C
Note 1: Output Power is measured at the RF Antenna
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DOC#: SG914-0005 rev. 9.1
Inputs/Outputs Required
`
Comment
Digital Connector
RF
Connector
Power
Location
LGA interface - (see connector pin list)
Part Number
Hirose U.FL-R-SMT(10)
Location
Top Side
3.3V
Input Supply Voltage
Connector Pin List
SIGNAL NAME
VHIO
PIN NUMBER
28, 29
DESCRIPTION
NOTES
Supply Voltage for I/O's
Recommended I/O voltage range 1.6V
to 2.0V (nominal 1.8V) (see note 1).
SPI_CSn
20
SPI_DI
22
SPI: Serial Host Chip Select/SDIO: Data 3
SPI: Serial Host Data Input/SDIO: Data 0
SPI_CLK
18
SPI: Clock/SDIO: CLK
SPI_DO
19
SPI: Serial Host Data Output/SDIO: CMD
SDIO_SDAT2
21
SDIO: Data 2
IRQ
23
SPI: Serial Host Interrupt/SDIO: Data 1
SERHOSTMODE
3
SPI/SDIO Select
High = SPI, Low = SDIO
POWER UP
4
Power Up Enable (from host)
High = normal mode, Low = Sleep
Mode
SLEEPCLK
17
32.768 kHz Sleep Clock
3.3V
12, 13, 26, 27
GND
1, 2, 5, 6, 7, 8, 9, 10, 11, 14,
15, 16, 24, 25, 30, 31
Input Supply
Further decoupling may be required to
sustain 250mA inrush currents during
packet transmission
Ground Connections
Note 1: This I/O supply operates to 3.3V. However, it is recommended that a level translator to 1.8V be used on host applications
beyond 2.0V (i.e. TI-TXS0108 for SDIO).
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DOC#: SG914-0005 rev. 9.1
Encryption Support
Feature
Windows
Linux
CE
WEP
Yes
Yes
Yes
TKIP
Yes
Yes
Yes
AES/CCMP (HW accel)
Yes
Yes
Yes
Security
WPA
Yes-WZC
WPA2
Yes
Third Party
Supplicant
Third Party
Supplicant
WZC (shared key), Third party suppl.
Third Party Supplicant
QoS
HCF (Q1/2006)
Q1/06
Q1/06
Q1/06
WMM
Yes
Yes
Yes
WMM U-APSD
Yes
Yes
Yes
EDCF
Yes
Yes
Yes
Q1/06
Q1/06
Q1/06
WMM-SA (Q1/2006)
Cisco Standards
CCX v1
Yes
CCX v2
Yes
Third Party
Supplicant
Third Party
Supplicant
Third Party Supplicant
Third Party Supplicant
Certifications
802.11d Support
Yes
Yes
Yes
WiFi Certification
Yes
Yes*
Yes* (XP certification transfers)
WHQL
NA
NA
NA
Bluetooth Coexistence
PTA (802.15.2)
Yes
Yes
Yes
802.11/BT on same Antenna
Yes
Yes
Yes
802.11/BT on 2 Antennas
Yes
Yes
Yes
Data and Voice Simultaneously
Yes
Yes
Yes
Data and Data Simultaneously
Yes
Yes
Yes
Voice and Voice Simultaneously
Yes
Yes
Yes
*Throughput depends on SPI speed. We recommend a 33Mhz SPI to pass WiFi PDA Throughput requirements
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DOC#: SG914-0005 rev. 9.1
Software Support
Little Endian
1-321-255-0515
Arm
X
Arm4
X
Arm9e
X
Armi
X
i386
X
mips
X
Big Endian
X
powerpc
X
sh
X
sh4
X
thumb
X
xscale
X
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X
DOC#: SG914-0005 rev. 9.1
HW/SW Overview - SoftMAC Architecture
• User Space, WPA Supplicant
–
–
Supplicant required to:
•Handle user input/configuration
WPA handshaking
•Transport protocol (EAP/PEAP)
•Handle certificates
•Install keys in UMAC
• Wi-Fi DRIVER
–
Allows for porting to custom
embedded OS and Processor
Host
USERSPACE/WPA
SPACE/WPASUPPLICANT
SUPPLICANT
USER
802.3
Frames
Kernel
DRV
DRV
DRV
DRV
Wi-Fi DRIVER*
Upper API
Driver API
UMAC
• UMAC
–
Binary Library file
•Links with driver
•Provides configuration API to:
– Select encryption type
– Set Key
•Handles initial
Authentication/Association to the
AP
•Configures LMAC for the correct
encryption
802.11 Frames
and control
messages
Resource
management:
frames, memory,
timers, debug
Wi-Fi Module
• LMAC
–
–
Binary file, contains ARM executable
code
Hardware encryption/decryption of
data according to configured
encryption type and key.
Hardware Layer
LMAC
LMAC
Customer responsible for porting the WiFi Driver and any user space
applications such as the supplicant.
SG923-0002
EVK PC-16/SPI Performance Kit
(1) SG901-1028 802.11 b & g fully FCC certified Wi-Fi
module soldered on a carrier board
(1) PCMCIA board for SPI applications
(1) Interposer board
(1) Software Driver CD
(1) Data sheet for the SG901-1028
(1) Schematics of interposer board
(1) Schematics of PCMCIA board
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Interconnect API
SG923-0003
SDIO/SPI Embedded Software
Eval Kit
(1) SG901-1028 802.11 b & g fully FCC certified Wi-Fi module
soldered on carrier board
(1) SDIO interface board for SDIO applications
(1) Software Driver CD
(1) Data sheet for the SG901-1028
(1) Schematics of SDIO board
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DOC#: SG914-0005 rev. 9.1
Mechanical
•
•
Maximum Peak Reflow Temperature: 240oC
Recommended Reflow Profile:
•
Moisture Level Sensitivity : 3
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DOC#: SG914-0005 rev. 9.1
Module Dimensions:
Parameter
Min.
Typ.
Dimension Length
Width
Height
24.51
19.00
3.63
Max.
Units
mm
mm
mm
0.043
[1.09]
0.146
[3.71]
0.143
[3.63]
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DOC#: SG914-0005 rev. 9.1
Recommended Layout
NOTE: Center paddle is centered on package layout.
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DOC#: SG914-0005 rev. 9.1
Tape and Reel Information
10mm
4mm
36mm
44mm
36m
m
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DOC#: SG914-0005 rev. 9.1