SmartBond™ DA14681
The most integrated and flexible Bluetooth® low energy SoC
with expandable memory execution space
Create next-generation Bluetooth low energy solutions without compromising on
functionality or battery lifetime, thanks to Dialog’s SmartBond DA14681.
It’s the world’s first single-chip solution for wearables, smart home and other rechargeable devices.
This highly integrated solution supports the full Bluetooth 4.2 features. As a SmartBond device,
it offers the highest performance, lowest power consumption and smallest footprint. Delivering
processing capacity when you need it and saving power when you don’t, it can manage multi-sensor
arrays and enable always-on sensing. Plus our SmartSnippets™ tooling helps you optimize your
software for power consumption.
With an integrated Power Management Unit comprising system power rails, a battery charger and
a fuel gauge, it supports rechargeable batteries natively and can power a complete sensor-based
system. Meanwhile, a dedicated hardware crypto engine delivers banking-level security (including
Apple HomeKit support) with end-to-end encryption to keep personal data safe.
DA14681
16 kB Cache
USB 1.1
Charger
UARTx2
SPIx2
I2Cx2
XTAL16M
PLL96M
ARM M0 CPU
™
XTAL32K
8-CH DMA
AES256
SHA-2
OTP 64 kB
ECC
TRNG
RAM 128 kB
KEYB
QDEC
RADIO
IR
Digital PHY
ADC
BLE 4.2 MAC
TEMP
Applications
■ (Multi-sensor) wearable devices:
- Fitness / activity trackers
- Sport watches
- Smartwatches
■ Smart home
■ Consumer appliances
■ Home automation
■ Voice-controlled remote controls
■ Rechargeable keyboards
■ Toys
■ Industrial automation
TIMERS
PCM/I2S
ROM 128 kB
PDM
QuadSPI CTRL
GPIO matrix
Power Management Unit
www.dialog-semiconductor.com/bluetoothlowenergy
SoC Features
• Complies to Bluetooth 4.2, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47
Part 15 (US) and ARIB STD-T66 (Japan)
• Flexible processing power
- 32 kHz up to 96 MHz 32-bit ARM Cortex-M0 with 16 kBytes, 4-way associative cache
- Three optimised power modes (Extended sleep, Deep sleep and Hibernation) reducing
current down to 840 nA
• Memories
-
-
-
-
-
64 kB One-Time-Programmable (OTP) memory
128 kB Data SRAM with retention capabilities
16 kB Cache SRAM with retention capabilities
128 kB ROM (including boot ROM and Bluetooth low energy stack)
Execution from external QSPI FLASH up to 32 MB
• Power management
-
-
-
-
-
-
Integrated Buck DC-DC converter (1.7 V - 4.75 V)
Three power supply pins for external devices
Supports Li-Polymer, Li-Ion, coin cells, NiMH and alkaline batteries
Charger (up to 5.0 V) with programmable curves
High accuracy state-of-charge fuel gauge
Programmable threshold for brownout detection
• Clocks
-
-
-
-
16 MHz crystal and RC oscillators
32 kHz crystal and RC oscillators
10.5 kHz RCX oscillator as a 32 kHz crystal replacement
Low power PLL up to 96 MHz
• Three general purpose timer/counters with PWM, one of them 16-bit up/down timer/counter with
PWM available in extended sleep mode
• Application cryptographic engine with ECC, AES-256, SHA-1, SHA-256, SHA-512 and a FIPS
140-2-compliant True Random Number Generator
• Digital interfaces
-
-
-
-
-
-
-
-
-
-
-
37 (AQFN) or 21 (WL-CSP) general purpose I/Os with programmable voltage levels
Quad-SPI FLASH interface
Two UARTs, one with hardware flow control
Two SPI+™ interfaces
Two I²C bus interfaces at 100 kHz, 400 kHz
Three-axis capable Quadrature Decoder
PDM interface with HW sample rate converter (2 mics or 2 speakers)
I²S/PCM master/slave interface up to 8 channels
Keyboard scanner with de-bouncing
Infrared (IR) interface (PWM)
USB Full Speed (FS) device interface
www.dialog-semiconductor.com/bluetoothlowenergy
• Analog interfaces
-
-
-
8-channel 10-bit ADC with averaging capability achieving 11.5 ENOB
Three matched white LED drivers
Temperature sensor
• Radio transceiver
-
-
-
-
2.4 GHz CMOS transceiver with integrated balun
50 Ω matched single wire antenna interface
0 dBm transmit output power and -94 dBm receiver sensitivity
Supply current at VBAT1 (3 V): 3.4 mA (TX), 3.1 mA (RX)
• Packages
-
-
AQFN with 60 pins, 6 mm x 6 mm x 0.9 mm
WL-CSP with 53 balls, 3.406 mm x 3.010 mm x 0.5 mm
Power Management
VBUS
LDO_USB_RET
VBAT1
Vsys
LDO_USB
CC/CV
110mA/3mA
V33
LDO_VBAT_RET
LDO_VBAT
V12
Vcore
LDO_IO2
Vflash
LDO_IO_RET2
LDO_IO
SIMO
DCDC
LDO_IO_RET
LDO_RADIO
LDO_CORE
4.7µF
LDO_SLEEP
There are 3 power rails that can
4.2V – 5.75V
be used to supply external devices
1.7V – 4.75V
namely Vsys, Vflash and Vext. There
- +
are also internal rails used for the
core and the radio (Vcore , Vradio). All
of the rails are supplied by a normal
LDO, a Retention LDO or one of the
outputs of the Single Inductance
Multiple Output (SIMO) DCDC
converter. When the SoC is active,
the DCDC is enabled. When the SoC
is in sleep mode, then the Retention
LDOs are supplying the rails.
4.7µF
The normal LDOs are used while
10µF
powering up the system or during
transitions from active to sleep and
vice-versa.
VDD1V8
75mA/3mA
V14
Vradio
Vext
VDD1V8P
10µF
75mA/3mA
10µF
0.47µH
The driving capability of the various rails is depicted in the figure: light blue for active, dark blue
for sleep. LDOs as well as DCDC outputs can be switched on/off depending on the application’s
requirements. A flexible Constant Current / Constant Voltage (CC/CV) charger supplying currents
from 200 uA to 400 mA allows for native re-chargeable batteries support. Finally, a State-of-Charge
engine, monitors the remaining capacitance of the battery when the system is active. The Power
Management Unit reduces Bill of Material and enables full control of the power budget of the final
product.
www.dialog-semiconductor.com/bluetoothlowenergy
Application CPU
The ARM M0™ CPU is equipped with a configurable 16 kB cache which can operate in direct,
two-way or four-way associative mode. Moreover, the cache line size can be programed to be 8,
16 or 32 bytes. The SoC allows for eXecute In Place (XIP) operation directly from the QSPI FLASH
(up to 32 MB) or the OTP. There are 2 separate buses, one serving the code execution path (CPU,
FLASH) and another which serves data storage (DMA, Peripherals) hence eliminating latencies in
application execution. The CPU can be clocked by the XTAL16 crystal oscillator (16 MHz), or by a
low-power internal PLL which boosts the frequency to 96 MHz, enabling complex applications or
algorithms without the use of an external or dedicated MCU.
System Booting
The DA14681 supports booting from a serial interface or from a non-volatile memory (QSPI FLASH
or OTP). It also comes with a pre-defined header residing in OTP which contains configuration
flags but also trim values and preferred settings programmed during silicon manufacturing and/or
final product testing by the customer. Booting latency might vary from 15 ms (NVM booting path) to
some hundreds of ms (serial path) depending on the serial interface used and the speed/size of the
booting transaction.
Sleep Modes
The DA14681 comprises multiple power domains which are powered by the Vcore rail and can be
switched on or off by software. This flexibility combined with manipulating clocks and retainable
RAM cells, leads to the three different sleep modes of the system: Extended Sleep, Deep Sleep and
Hibernation. The first mode is used between Bluetooth low energy activities, the second is a clockless mode with RAM retained (used to store pairing parameters) while the third is a clock-less mode
with all RAM off, achieving the minimum current dissipation.
Software and Tools
The DA14681 is supported by Dialog SmartSnippets Studio, a royalty-free software development
platform for all SmartBond devices, which contains:
■ SmartSnippets Toolbox: A tool suite covering all software developer needs, including power
profiling, FLASH or OTP programming and testing
■ SmartSnippets IDE: An Eclipse CDT based IDE pre-configured plugins allowing easy out of
the box set-up of the build/debug environment
■ SmartSnippets DA1468x Software Development Kit and Documentation
www.dialog-semiconductor.com/bluetoothlowenergy
Specification Parameters
Parameter
Description
Conditions
Min
VBAT
Supply voltage
Recommended operating condition
1.7
IBAT_IDLE
Supply current
CPU is idle (WFI), DCDC on, VBAT=3V
0.4
IBAT_RUN_16MHz
Supply current
CPU executes code from RAM, DCDC on,
peripherals on, VBAT=3V
IBAT_RUN_96MHz
Supply current
IBAT_EXT_SLP
Typ
Max
Unit
4.75
V
0.6
1
mA
1.2
1.4
1.9
mA
CPU executes code from RAM, DCDC on,
peripherals on, VBAT=3V
5.7
6.2
6.9
mA
Supply current
Cache (16kB) and Data (32kB) retained.
XTAL32k used. FLASH in power down.
1.7
2.6
14.7
μA
IBAT_DP_SLP
Supply current
All clocks off. FLASH off. 24kB RAM retained.
1.5
2.4
13.8
μA
IBAT_HIBERN
Supply current
All clocks off. FLASH off. No RAM retained.
0.6
0.7
5.8
μA
PSENSE
Radio sensitivity level
Normal operating conditions; PER=30.8%;
DCDC disabled
PINT_IMD
Radio Intermod.
distortion interferer
Worst case interferer level
PO
Radio output
power level
Maximum gain
INL/DNL
ADC integral/differential
non-linearity
-94
dBm
-35
-31
dBm
-1
0
-2
1
dBm
2
LSB
Ordering Information
Part number
Package
Size (mm)
Shipment
Pack Quantity
DA14681-01000U22
WL-CSP53
3.406 x 3.010 x 0.5
Reel
100/1000/5000
DA14681-01000A92
AQFN60
6 x 6 x 0.9
Reel
100/1000/4000
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