DA14586-00F02ATDB-P

SmartBond™ DA14586 Smallest, lowest power and most integrated Bluetooth 5 SoC with integrated Flash Connected devices are constantly evolving. New generations appear that are smarter, more full featured and have longer battery lifetimes. To enable this, SmartBond has evolved too. The DA14586 offers designers all the benefits of the industry-leading DA14580 but with even greater flexibility to create more advanced applications from the smallest footprints and power budgets. As part of the Dialog SmartBond family, the DA14586 is the smallest, lowest power and most integrated Bluetooth® solution available. This versatile SoC is ideal for adding Bluetooth low energy to products like remote controls, proximity tags, beacons, connected medical devices and smart home nodes. It supports all Bluetooth developments up to and including Bluetooth 5 and Bluetooth low energy Mesh. Plus, with 2 Mb of Flash memory and 96 kB of RAM, the DA14586 has double the memory for user applications of its predecessor to take full advantage of the standard’s features. It also includes an integrated microphone interface for voice support at low additional cost. Like all SmartBond solutions, the DA14586 is easy to design-in and supports standalone as well as hosted applications. It is supported by a complete development environment and Dialog’s SmartSnippets™ software that helps you optimize your software for power consumption. OTP 64 kB FLASH 2Mb RAM 32 kB ADC KEYBOARD RAM 16 kB WAKEUP RAM 16 kB 4-CH DMA RAM 32 kB QDEC PCM/12S PDM XTAL32K RCX Applications ■ ■ ■ ■ ■ ■ ■ ■ ■ DCDC BUCK SRC TIMERS RC32KHz RC16MHz RADIO UARTx2 SPI 12C Digital PHY SWD CPU BLE 5.0 MAC Ready ARM M0™ XTAL16M DA14586 ROM 128 kB DCDC BOOST LDOs GPIO matrix www.dialog-semiconductor.com/bluetoothlowenergy Remote controls Proximity tags and trackers Beacons Connected medical devices Smart home Human Interface Devices VR controllers Connected sensors Wireless charging SoC Features • Complies with Bluetooth 5.0, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) • Supports up to 8 Bluetooth LE connections • Fast cold boot in less than 50 ms • Processing units - 16 MHz 32 bit ARM Cortex-M0 with SWD interface - Dedicated Link Layer Processor - AES-128 bit encryption Processor • Memories - 2 Mb FLASH memory - 64 kB One-Time-Programmable (OTP) memory - 96 kB Data/Retention SRAM - 128 kB ROM Operating System and protocol stack • Power management - Integrated Buck DCDC converter - P0, P1, P2 and P3 ports with 3.3 V tolerance - Easy decoupling of only 4 supply pins - Supports coin and alkaline battery cells - 1.8 V cold boot support-buck mode - 10-bit ADC for battery voltage measurement • Digital controlled oscillators - 16 MHz crystal (±20 ppm max) and RC oscillator - 32 kHz crystal (±50 ppm) - RCX oscillator(±500 ppm max) • Flexible Reset Circuitry - System & Power On Reset in a single pin • General purpose, Capture and Sleep timers - Digital interfaces - Gen. purpose I/Os: 24 (QFN40) - 2 UARTs with hardware flow control maximum data rate 1.0 Mbps - SPI+™ interface - I²C bus at 100 kHz, 400 kHz - 3-axes capable Quadrature Decoder • Analog interfaces - 4-channel 10-bit ADC www.dialog-semiconductor.com/bluetoothlowenergy • Radio transceiver - Fully integrated 2.4 GHz CMOS transceiver - Single wire antenna: no RF matching or RX/TX switching required - Current consumption with supply voltage equal 3 V: ▪ TX: 3.4 mA, RX: 3.7 mA (with ideal DC-DC) - +0 dBm transmit output power - -20 dBm output power in ‘Near Field Mode’ - -93 dBm receiver sensitivity • Packages: - QFN 40 pins, 5 mm x 5 mm x 0.9 mm Bluetooth 5.0 Supporting the Bluetooth 5.0 core specification, DA14586 enables new enhanced Bluetooth low energy functionality ideal for applications such as remote controls, beacons, connected sensors and innovative medical devices. Among the new features, DA14586 supports Data Packet Length Extension, Link Layer Privacy v1.2, Secure Connections, Bluetooth low energy Mesh and Efficient connectable Advertising. Audio Processing Unit The integrated Audio Unit (AU) is equipped with a Pulse-Density Modulation (PDM) interface that can be connected to up to 2 input devices (e.g. MEMS microphones) or output devices, a PulseCode modulation (PCM) controller which provides an up to 192 kHz synchronous interface to external audio devices, ISDN circuits and serial data interfaces (I2S) and a 24-bit Sample Rate Converting unit (SRC) used to convert the sampling rate of audio samples between the various interfaces. PDM and PCM functionality can be mapped to any GPIO through the user programmable pin logic. An integrated DMA controller handles all data transfers between the AU and the RAM providing the CPU with the freedom to cope with other tasks. Enhanced Memory The DA14586 has a large memory capacity for user applications: 2 Mb of FLASH memory, 96 kB of Data RAM with retention capability, 128 kB of ROM and 64 kB of One-Time-Programmable (OTP) memory. The granularity of the RAM cells (32 kB/16 kB/16 kB/32 kB) allows retaining only the RAM needed and achieves the minimum power consumption during the sleep state. Compatibility www.dialog-semiconductor.com/bluetoothlowenergy As part of the SmartBond family and successor of the DA1458x product family, DA14586 is fully pin-compatible with DA14580, DA14581 and DA14583 existing designs may be quickly upgraded. DA14586 is suitable for fully hosted applications without an external MCU. Software and Tools The DA14586 is also supported by Dialog SmartSnippets Studio, a royalty-free software development platform for all SmartBond devices, which contains: ■ S  martSnippets Toolbox: A tool suite covering all software developer needs, including power profiling, FLASH or OTP programming and testing ■ SmartSnippets DA1458x Software Development Kit and documentation Ordering Information Part number Package Pitch(mm) Size (mm) Shipment Pack Quantity DA14586-00F02AT2 QFN40 0.4 5 x 5 x 0.9 Reel 100/1000/5000 Dialog Semiconductor Worldwide Sales Offices - www.dialog-semiconductor.com email: info@diasemi.com United Kingdom Phone: +44 1793 757700 The Netherlands Phone: +31 73 640 88 22 Japan Phone: +81 3 5425 4567 Singapore Phone: +65 648 499 29 Korea Phone: +82 2 3469 8200 Germany Phone: +49 7021 805-0 North America Phone: +1 408 845 8500 Taiwan Phone: +886 281 786 222 Hong Kong Phone: +852 3769 5200 China (Shenzhen) Phone: +86 755 2981 3669 This publication is issued to provide outline information only, which unless agreed by Dialog Semiconductor may not be used, applied, or reproduced for any purpose or be regarded as a representation relating to products. All use of Dialog Semiconductor products, software and applications referred to in this document are subject to Dialog Semiconductor’s Standard Terms and Conditions of Sale, available on the company website (www.dialog-semiconductor.com) unless otherwise stated. Dialog and the Dialog logo are trademarks of Dialog Semiconductor plc or its subsidiaries. All other product or service names are the property of their respective owners. © Copyright 2016 Dialog Semiconductor. All rights reserved. 1216CREA China (Shanghai) Phone: +86 21 5424 9058