Eccostock®LoK
Low Loss, Low Dielectric Constant Plastic
LOW LOSS LOW-K DIELECTRIC MATERIAL
Eccostock LoK is a low dielectric constant, low loss and low weight thermosetting plastic for RF and
microwave insulation. It weighs only about half that of polystyrene and one quarter that of
polytetrafluorethylene.
Eccostock LoK has better dimensional stability than other low loss plastics. It will not cold flow, nor
will it flow when heat is applied. Soldering iron temperatures will not soften Eccostock LoK, only
slightly degrade in the immediate area of contact.
It is completely unicellular and is unaffected by moisture.
FEATURES AND BENEFITS
MARKETS
• Low dielectric constant
• Lightweight
• Good dimensional stability
• Commercial Telecom
• Security and Defense
SPECIFICATIONS
TYPICAL PROPERTIES
ECCOSTOCK LOK
Temperature Range °C (°F)
Frequency
Density g/cc
-70 to 150 (-94 to 302)
60 Hz to 10 Ghz
0.54
Dielectric Constant
Dielectric Strength, volts/mil (kv/mm)
Dissipation Factor
1.7
300 (11.8)
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