27045183

Eccostock®LoK Low Loss, Low Dielectric Constant Plastic LOW LOSS LOW-K DIELECTRIC MATERIAL Eccostock LoK is a low dielectric constant, low loss and low weight thermosetting plastic for RF and microwave insulation. It weighs only about half that of polystyrene and one quarter that of polytetrafluorethylene. Eccostock LoK has better dimensional stability than other low loss plastics. It will not cold flow, nor will it flow when heat is applied. Soldering iron temperatures will not soften Eccostock LoK, only slightly degrade in the immediate area of contact. It is completely unicellular and is unaffected by moisture. FEATURES AND BENEFITS MARKETS • Low dielectric constant • Lightweight • Good dimensional stability • Commercial Telecom • Security and Defense SPECIFICATIONS TYPICAL PROPERTIES ECCOSTOCK LOK Temperature Range °C (°F) Frequency Density g/cc -70 to 150 (-94 to 302) 60 Hz to 10 Ghz 0.54 Dielectric Constant Dielectric Strength, volts/mil (kv/mm) Dissipation Factor 1.7 300 (11.8)