SMD1210-075-13.2V

SEA & LAND ELECTRONIC CORP. WWW.SEALAND-PPTC.COM ALPHA-TOP TECHNOLOGY CORP. WWW.ALPHA-TOP.COM APPROVAL SHEET MODEL NO.： SMD1210 Series CUSTOMER： CUSTOMER'S APPROVAL： AUTHORIZED SIGNATURE/STAMP： DATE MANUFACTURER: HEAD OFFICE: China Branch: Submitted by: Approved by: DATE: 13F.,No.120-10,Sec.3,Zhongshan Rd.,Zhonghe Dist.,New Taipei City 23544,Taiwan Tel: 886-2-8221-2567 Fax:882-2-2225-7268 E-mail:service@chipfast.com.tw 31 Chang-Xin-Zon Road,Gao-Ling lndustrial Zone,Chiu-chang Town, Huey Yang Distric,Huey Zhou City,Guang Dong516221,CHINA Tel: 86-752-3562001 Fax:86-752-3558696 E-mail:service@atpptc.com Chung Cheng YC Lin 2-Mar-22 SEA & LAND ELECTRONIC CORP. 第 1页 Features Applications ■ Surface Mount Devices Almost anywhere there is a low voltage ■ Lead free device power supply, up to 30V and a load to be ■ Size 3.2*2.5mm/0.12*0.10 inch protected, including: ■ Surface Mount packaging ■ Computer mother board, Modem. for automated assembly ■ Telecommunication equipments. SMD1210 Series Alpha-Top (Sea&Land Alliance) Performance Specification Vmax Imax Ihold Itrip Pd Model Marking @25°C @25°C Typ. (Vdc) (A) (A) (A) (W) SMD1210-005 30 100 0.05 0.15 0.6 αA SMD1210-010 30 100 0.10 0.30 0.6 αB SMD1210-020 30 100 0.20 0.40 0.6 αC SMD1210-035 6 100 0.35 0.75 0.6 αD SMD1210-050 13.2 100 0.50 1.00 0.6 αF SMD1210-075 6 100 0.75 1.50 0.6 αG SMD1210-110 6 100 1.10 2.20 0.6 αH SMD1210-150 6 100 1.50 3.00 0.6 αL SMD1210-175 6 100 1.75 3.50 0.8 αN SMD1210-200 6 100 2.00 4.00 0.8 αS Ihold = Hold Current. Maximum current device will not trip in 25°C still air. Itrip = Trip Current. Minimum current at which the device will always trip in 25°C still air. Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax). Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax). Pd = Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage. Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C. R1max = Maximum device resistance is measured one hour post reflow. CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame. Maximum Time To Trip Current Time (A) (Sec) 0.25 1.50 0.50 0.60 8.0 0.02 8.0 0.20 8.0 0.10 8.0 0.10 8.0 0.30 8.0 0.50 8.0 0.60 8.0 1.00 Environmental Specifications Test Conditions Passive aging +85°C, 1000 hrs. Humidity aging +85°C, 85% R.H. , 168 hours Thermal shock +85°C to -40°C, 20 times Resistance to solvent MIL-STD-202,Method 215 Vibration MIL-STD-202,Method 201 Ambient operating conditions : - 40 °C to +85 °C Maximum surface temperature of the device in the tripped state is 125 °C AGENCY APPROVALS : UL pending Regulation/Standard: 2002/95/EC Resistance Rimin (Ω) 2.800 0.800 0.400 0.200 0.180 0.070 0.050 0.030 0.020 0.015 Resistance change ±5% typical ±5% typical ±33% typical No change No change EN14582 Ihold Versus Temperature Model SMD1210-005 SMD1210-010 SMD1210-020 SMD1210-035 SMD1210-050 SMD1210-075 SMD1210-110 SMD1210-150 SMD1210-175 SMD1210-200 -40°C 0.08 0.16 0.29 0.47 0.76 1.00 1.69 2.13 2.54 2.90 -20°C 0.07 0.14 0.26 0.45 0.67 0.97 1.48 1.92 2.30 2.63 Maximum ambient operating temperature (Tmao) vs. hold current (Ihold) 0°C 25°C 40°C 50°C 60°C 0.06 0.05 0.04 0.04 0.03 0.12 0.10 0.08 0.07 0.06 0.22 0.20 0.16 0.14 0.13 0.40 0.35 0.33 0.28 0.24 0.58 0.50 0.43 0.40 0.36 0.86 0.75 0.64 0.59 0.54 1.29 1.10 0.88 0.76 0.65 1.71 1.50 1.26 1.14 1.01 2.02 1.75 1.47 1.33 1.18 2.31 2.00 1.68 1.52 1.35 第 2页 70°C 0.03 0.05 0.11 0.21 0.32 0.48 0.57 0.89 1.05 1.20 85°C 0.02 0.03 0.08 0.18 0.28 0.40 0.43 0.71 0.86 0.98 R1max (Ω) 50.000 15.000 5.000 1.300 0.900 0.400 0.210 0.110 0.080 0.070 SMD1210 Series Alpha-Top (Sea&Land Alliance) Construction And Dimension (Unit:mm) Model A Min. 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 SMD1210-005 SMD1210-010 SMD1210-020 SMD1210-035 SMD1210-050 SMD1210-075 SMD1210-110 SMD1210-150 SMD1210-175 SMD1210-200 Max. 3.43 3.43 3.43 3.43 3.43 3.43 3.43 3.43 3.43 3.43 Min. 2.35 2.35 2.35 2.35 2.35 2.35 2.35 2.35 2.35 2.35 B Max. 2.80 2.80 2.80 2.80 2.80 2.80 2.80 2.80 2.80 2.80 Min. 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.40 0.50 0.50 Dimensions & Marking Termination Pad Characteristics Terminal pad materials： Terminal pad solderability： 1.0士0.1 E Min. 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 α 1.0 士0.1 2.5士0.1 B D Marking A D D Min. 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 Max. 0.80 0.80 0.80 0.80 0.80 0.80 0.80 0.80 1.20 1.20 Recommended Pad Layout (mm) A B C = Trademark A = Part identification E 2.0士0.1 C Tin-plated Nickel-Copper Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3. Rework Use standard industry practices, the removal device must be replaced with a fresh one. Thermal Derating Curve Typical Time-To-Trip At 25°C · Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame. · PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated. · Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components. · Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC. · Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space. · Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance of the devices. PPTC SMD can be cleaned by standard methods. · Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper board layouts or reflow profile could negatively impact solderability performance of our devices. 第 3页 SMD1210 Series Alpha-Top (Sea&Land Alliance) Recommended Solder Reflow Conditions Preheating 300 Soldering Cooling ‧Recommended reflow methods：IR, vapor phase oven, hot air oven. ‧Devices are not designed to be wave soldered to the bottom side 250 of the board. 200 ‧Recommended maximum paste thickness is 0.25 mm (0.010 inch). 190 ‧Devices can be cleaned using standard method and solvents. 160 Note：If reflow temperatures exceed the recommended profile, 100 0 devices may not meet the performance requirements. 60-120 sec. 30~60sec. EIA Tape Component Dimensions Tape And Reel Specifications (mm) EIA 481-2 8.0 ± 0.20 4.0 ± 0.10 4.0 ± 0.10 2.0 ± 0.10 2.82 ± 0.10 3.52± 0.10 4.35 1.5 + 0.1, -0.0 7.5 ± 0.05 1.75 ± 0.10 6.25 0.6 0.1 0.90 ± 0.1 390 160 178 50 8.4 + 1.5, -0.0 22.4 P0 T P2 D0 Embossment E1 Cover tape A0 B1 F K0 T1 W E2 B0 P1 EIA Reel Dimensions W2(measured at hub) 2 Cover tape A 2 0 Governing Specifications W P0 P1 P2 A0 B0 B1max. D0 F E1 E2min. Tmax. T1max. K0 Leader min. Trailer min. Reel Dimensions A max. N min. W1 W2max. 120 sec. 2 N(hub dia.) W1(measured at hub) Carrier tape Embossed cavity Storage And Handling ‧ Storage conditions：40°C max, 70% R.H. ‧ Devices may not meet specified performance if storage conditions are exceeded. Order Information SMD1210 Product name Size 3225 mm / 1210 inch SMD：surface mount device Tape & reel packaging per EIA481-1 050 Hold Current 0.50A Labeling Information Sea & Land Electronic Corp. Pb Model: Part no.: Spec.: Lot no.: Q'ty: RoHS 倉儲：密封！溫度：18～33℃/濕度：30～60％ A 第 4页 Packaging Tape & Reel Quantity 050,075 The others 4,000 pcs/reel 4,500 pcs/reel