APM2T60P200064GAN-7TM

RoHS Recast Compliant M.2 2260 Flash Drive P200-M Product Specifications July 8, 2015 Version 1.2 Apacer Technology Inc. 1F, No.32, Zhongcheng Rd., Tucheng Dist., New Taipei City, Taiwan, R.O.C Tel: +886-2-2267-8000 www.apacer.com Fax: +886-2-2267-2261 M.2 2260 Flash Drive APM2T60P200xxxxAN-XTMX Features:  Standard SATA Interface Compliance – Serial ATA Revision 3.1 compliance – SATA 6.0 Gbps interface – ATA-8 command set  Capacities – 16, 32, 64, 128, 256 GB   Performance* – Interface burst read/write: 600 MB/sec – Sustained read: up to 520 MB/sec – Sustained write: up to 180 MB/sec Flash Management – Built-in hardware ECC – Static/dynamic wear-leveling – Flash bad-block management – S.M.A.R.T. – Power Failure Management – ATA Secure Erase – TRIM  NAND Flash Type: MLC  Endurance – 16GB: 14 TBW – 32GB: 28 TBW – 64GB: 57 TBW – 128GB: 114 TBW – 256GB: 228 TBW  Temperature ranges – Operating: Standard: 0°C to 70°C Extended: -40°C to 85°C – Storage: -40°C to 85°C  Supply voltage – 3.3 V ± 5%  Power consumption (typical)* – Active mode: 540 mA – Idle mode: 105 mA  Connector type – 75-pin SATA-based M.2 module pinout  Form factor – M.2 2260 form factor – Dimensions: 60.00mm x 22.00mm x3.65mm  Shock & Vibration*** – Shock:1500 G – Vibration: 15 G  MTBF: >2,000,000 hours  RoHS Recast compliant (complies with 2011/65/EU standard)  Device Sleep mode (optional) *Varies from capacities. The values for performances and power consumptions presented are typical and may vary depending on flash configurations or platform settings. The term idle refers to the standby state of the device. **Non-operating 1 © 2015 Apacer Technology Inc. Rev. 1.2 M.2 2260 Flash Drive APM2T60P200xxxxAN-XTMX Table of Contents 1. GENERAL DESCRIPTION .................................................................................................... 3 2. PIN ASSIGNMENTS ............................................................................................................... 3 3. PRODUCT SPECIFICATIONS .............................................................................................. 6 3.1 CAPACITY ............................................................................................................................................................. 6 3.2 PERFORMANCE .....................................................................................................................................................6 3.3 ENVIRONMENTAL SPECIFICATIONS .......................................................................................................................7 3.4 MEAN TIME BETWEEN FAILURES (MTBF) ...........................................................................................................7 3.5 CERTIFICATION AND COMPLIANCE .......................................................................................................................7 4. FLASH MANAGEMENT ....................................................................................................... 8 4.1 ERROR CORRECTION/DETECTION .........................................................................................................................8 4.2 BAD BLOCK MANAGEMENT .................................................................................................................................8 4.3 WEAR LEVELING ..................................................................................................................................................8 4.4 POWER FAILURE MANAGEMENT........................................................................................................................... 8 4.5 ATA SECURE ERASE ............................................................................................................................................9 4.6 TRIM ...................................................................................................................................................................9 4.7 SATA POWER MANAGEMENT .............................................................................................................................. 9 4.8 ENDURANCE ....................................................................................................................................................... 10 5. SOFTWARE INTERFACE .................................................................................................. 11 5.1 COMMAND SET ................................................................................................................................................... 11 5.2 S.M.A.R.T.......................................................................................................................................................... 12 6. ELECTRICAL SPECIFICATION ...................................................................................... 13 7. MECHANICAL SPECIFICATIONS .................................................................................. 14 2 © 2015 Apacer Technology Inc. Rev. 1.2 M.2 2260 Flash Drive APM2T60P200xxxxAN-XTMX 1. General Description Apacer’s P200-M is the next generation modularized Solid State Drive (SSD) with the shape of all new M.2 form factor, aimed to be the more suitable for mobile and compact computers with standard width at only 22.00 mm. P200-M appears in M.2 2260 mechanical dimensions and is believed to be the leading add-in storage solution for future host computing systems. The M.2 SSD is designed with SATA-based connector pinouts, providing full compliance with the latest SATA Revision 3.1 interface specifications. Aside from SATA compliance, P200-M delivers exceptional performance and power efficiency. On the other hand, the extreme thin and light form factor makes P200M the ideal choice for mobile computing systems, which appears to be the trend in near future. Regarding reliability, P200-M is built with a powerful SATA controller that supports on-the-module ECC as well as efficient wear leveling scheme. In terms of power efficiency, P200-M is compliant with SATA 6.0 Gbps interface standard so that it can operate on SATA power management modes, which greatly save on power consumption. 2. Pin Assignments This connector does not support hot plug capability. There are a total of 75 pins. 12 pin locations are used for mechanical key locations; this allows such a module to plug into both Key B and Key M connectors. Notch M Notch B Pin1 Pin Type Description 1 CONFIG_3 Ground (according to M.2 configurations for SSD-SATA definition) 2 3.3V Supply Pin, 3.3V 3 GND Ground 4 3.3V Supply pin, 3.3V 5 No connect No connect 6 Not available No connect (used for other purposes) 7 Not available No connect (used for other purposes) 8 Not available No connect (used for other purposes) 9 No connect No connect 10 DAS/DSS Device Activity Signal/Disable Staggered Spin-up 3 © 2015 Apacer Technology Inc. Rev. 1.2 M.2 2260 Flash Drive APM2T60P200xxxxAN-XTMX 11 No connect No connect (used for other purposes) 12 Module key Mechanical notch B 13 Module key Mechanical notch B 14 Module key Mechanical notch B 15 Module key Mechanical notch B 16 Module key Mechanical notch B 17 Module key Mechanical notch B 18 Module key Mechanical notch B 19 Module key Mechanical notch B 20 Not available No connect (used for other purposes) 21 CONFIG_0 Ground (according to M.2 configurations for SSD-SATA definition) 22 Not available No connect (used for other purposes) 23 Not available No connect (used for other purposes) 24 Not available No connect (used for other purposes) 25 Not available No connect (used for other purposes) 26 Not available No connect (used for other purposes) 27 GND Ground 28 Not available No connect (used for other purposes) 29 Not available No connect 30 Not available No connect (used for other purposes) 31 Not available No connect 32 Not available No connect (used for other purposes) 33 GND Ground 34 Not available No connect (used for other purposes) 35 Not available No connect 36 Not available No connect (used for other purposes) 37 Not available No connect 38 Not available No connect 39 GND Ground 40 Not available No connect (used for other purposes) 41 SATA-Rx+ Host receiver differential signal pair 42 Not available No connect (used for other purposes) 43 SATA-Rx- Host receiver differential signal pair 44 Not available No connect (used for other purposes) 45 GND Ground 46 Not available No connect (used for other purposes) 47 SATA-Tx- Host transmitter differential pair 4 © 2015 Apacer Technology Inc. Rev. 1.2 M.2 2260 Flash Drive APM2T60P200xxxxAN-XTMX 48 Not available No connect (used for other purposes) 49 SATA-Tx+ Host transmitter differential pair 50 Not available No connect 51 GND Ground 52 Not available Not used 53 Not available Not used 54 Not available Not used 55 Not available Not used 56 Reserved for MFG Data Manufacturing Data line. Used for SSD manufacturing only. Not used in normal operation. Pins should be left N/C in platform Socket. 57 GND Ground 58 Reserved for MFG clock Manufacturing Clock line. Used for SSD manufacturing only. Not used in normal operation. Pins should be left N/C in platform Socket 59 Module key Mechanical notch M 60 Module key Mechanical notch M 61 Module key Mechanical notch M 62 Module key Mechanical notch M 63 Module key Mechanical notch M 64 Module key Mechanical notch M 65 Module key Mechanical notch M 66 Module key Mechanical notch M 67 Not available No connect (used for other purposes) 68 SUSCLK 32 kHz clock supply input that is provided by PCH to reduce power and cost for the module 69 CONFIG_1 Defines module type 70 3.3V Supply pin, 3.3V 71 GND Ground 72 3.3V Supply pin, 3.3V 73 GND Ground 74 3.3V Supply pin, 3.3V 75 CONFIG_2 Ground 5 © 2015 Apacer Technology Inc. Rev. 1.2 M.2 2260 Flash Drive APM2T60P200xxxxAN-XTMX 3. Product Specifications 3.1 Capacity Capacity specification of P200-M is available as shown in Table 3-1. It lists the specific capacity and the default numbers of heads, sectors and cylinders for each product line. Table 3-1: Capacity specifications Capacity Total Bytes Cylinders Heads Sectors Max LBA 16 GB 16,013,942,784 16,383 16 63 31,277,232 32 GB 32,017,047,552 16,383 16 63 62,533,296 64 GB 64,023,257,088 16,383 16 63 125,045,424 128 GB 128,035,676,160 16,383 16 63 250,069,680 256 GB 256,060,514,304 16,383 16 63 500,118,192 *Display of total bytes varies from file systems, which means not all of the bytes can be used for storage. **Notes: 1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes. LBA count addressed in the table above indicates total user storage capacity and will remain the same throughout the lifespan of the device. However, the total usable capacity of the SSD is most likely to be less than the total physical capacity because a small portion of the capacity is reserved for device maintenance usages. 3.2 Performance Performances of P200-M are listed below in table 3-2. Table 3-2: Performance Capacity 16 GB 32 GB 64 GB 128 GB 256 GB Sustained read (MB/s) 300 510 515 520 520 Sustained write (MB/s) 170 180 180 180 180 Performance Note: Results were measured by CrystalDiskMark and may differ from various flash configurations or host system setting 6 © 2015 Apacer Technology Inc. Rev. 1.2 M.2 2260 Flash Drive APM2T60P200xxxxAN-XTMX 3.3 Environmental Specifications Environmental specification of P200-M series follows MIL-STD-810 standards as shown in Table 3-3. Table 3-3 P200-M environmental specifications Item Specification Operating temperature 0°C ~70°C(standard); -40°C ~85°C (extended) Non-operating temperature -40°C ~85°C Operating humidity 40°C, 90%RH Non-operating humidity 40°C, 93%RH Frequency/Displacement: 20Hz~80Hz/1.52mm Frequency/Acceleration: 80Hz~2000Hz/20G X, Y, Z axis/60mins 1500G, 0.5ms Vibration (Non-operating) shock (Non-operating) Drop (Non-operating) Bending (non-operating) 80cm free fall, 6 face of each unit ≧20N, hold 1min/5times Torque (non-operating) 0.5N-m or ±2.5 deg, hold 1min/5times ESD (Electrostatic) Passed (at relative temp/humidity: 24°C, 49%RH) 3.4 Mean Time Between Failures (MTBF) Mean Time Between Failures (MTBF) is predicted based on reliability data for the individual components in P200-M. The prediction result for P200-M is more than 2,000,000 hours. Notes about the MTBF: The MTBF is predicated and calculated based on “Telcordia Technologies Special Report, SR-332, Issue 2” method. 3.5 Certification and Compliance P200-M complies with the following standards:     CE: EN55022 FCC :CISPR22 BSMI 13438 RoHS Recast 7 © 2015 Apacer Technology Inc. Rev. 1.2 M.2 2260 Flash Drive APM2T60P200xxxxAN-XTMX 4. Flash Management 4.1 Error Correction/Detection P200-M implements a hardware ECC scheme, based on the BCH algorithm. It can detect and correct up to 72 bits error in 1K bytes. 4.2 Bad Block Management Bad blocks are blocks that include one or more invalid bits, and their reliability is not guaranteed. Blocks that are identified and marked as bad by the manufacturer are referred to as “Initial Bad Blocks”. Bad blocks that are developed during the lifespan of the flash are named “Later Bad Blocks”. Apacer implements an efficient bad block management algorithm to detect the factory-produced bad blocks and manages any bad blocks that appear with use. This practice further prevents data being stored into bad blocks and improves the data reliability. 4.3 Wear Leveling NAND flash devices can only undergo a limited number of program/erase cycles, and in most cases, the flash media are not used evenly. If some areas get updated more frequently than others, the lifetime of the device would be reduced significantly. Thus, Wear Leveling is applied to extend the lifespan of NAND flash by evenly distributing write and erase cycles across the media. Apacer provides advanced Wear Leveling algorithm, which can efficiently spread out the flash usage through the whole flash media area. Moreover, by implementing both dynamic and static Wear Leveling algorithms, the life expectancy of the NAND flash is greatly improved. 4.4 Power Failure Management Power Failure Management is a mechanism to prevent data loss during unexpected power failure. DRAM is a volatile memory and frequently used as temporary cache or buffer between the controller and the NAND flash to improve the SSD performance. However, one major concern of the DRAM is that it is not able to keep data during power failure. Accordingly, P200-M applies the flush mechanism, which requests the controller to transfer data to the cache. For P200-M, DDR performs as a cache. Only when the data is fully committed to the NAND flash will the controller send acknowledgement (ACK) to the host. Such implementation can prevent false-positive performance and the risk of power cycling issues. Additionally, it is critical for a controller to shorten the time the in-flight data stays in the cache. Thus, P200-M applies an algorithm to reduce the amount of data resides in the cache to provide a better performance. This algorithm allows incoming data to only have a “pit stop” in the cache and then move to the NAND flash at once. If the flash is jammed due to particular file sizes (such as random 4KB data), the cache will be treated as an “organizer”, consolidating incoming data into groups before written into the flash to improve write amplification. In sum, Power Failure Management proves to provide the reliability required by consumer, industrial, and enterprise-level applications. 8 © 2015 Apacer Technology Inc. Rev. 1.2 M.2 2260 Flash Drive APM2T60P200xxxxAN-XTMX 4.5 ATA Secure Erase ATA Secure Erase is a standard ATA command and will write all “0xFF” to fully wipe all the data on hard drives and SSDs. When this command is issued, the SSD controller will empty its storage blocks and return to its factory default settings. 4.6 TRIM TRIM is a feature which helps improve the read/write performance and speed of solid-state drives (SSD). Unlike hard disk drives (HDD), SSDs are not able to overwrite existing data, so the available space gradually becomes smaller with each use. With the TRIM command, the operating system can inform the SSD which blocks of data are no longer in use and can be removed permanently. Thus, the SSD will perform the erase action, which prevents unused data from occupying blocks all the time. 4.7 SATA Power Management By complying with SATA 6.0 Gb/s specifications, the SSD supports the following SATA power saving modes:  ACTIVE: PHY ready, full power, Tx & Rx operational  PARTIAL: Reduces power, resumes in under 10 µs (microseconds)  SLUMBER: Reduces power, resumes in under 10 ms (milliseconds)  HIPM: Host-Initiated Power Management  DIPM: Device-Initiated Power Management  Device Sleep (DevSleep or DEVSLP): PHY powered down; power consumption ≦ 5 mW; host assertion time ≦ 10 ms; exit timeout from this state ≦ 20 ms (unless specified otherwise in SATA Identify Device Log). Note: 1. The behaviors of power management features would depend on host/device settings. 9 © 2015 Apacer Technology Inc. Rev. 1.2 M.2 2260 Flash Drive APM2T60P200xxxxAN-XTMX 4.8 Endurance The endurance of a storage device is predicted by TeraBytes Written based on several factors related to usage, such as the amount of data written into the drive, block management conditions, and daily workload for the drive. Thus, key factors, such as Write Amplifications and the number of P/E cycles, can influence the lifespan of the drive. Capacity TeraBytes Written 16 GB 14 32 GB 28 64 GB 57 128 GB 114 256 GB 228 Notes:  The measurement assumes the data written to the SSD for test is under a typical and constant rate.  The measurement follows the standard metric: 1 TB (Terabyte) = 1000 GB.  This estimation complies with JEDEC JESD-219, enterprise endurance workload of random data with payload size distribution. 10 © 2015 Apacer Technology Inc. Rev. 1.2 M.2 2260 Flash Drive APM2T60P200xxxxAN-XTMX 5. Software Interface 5.1 Command Set Table 5-1: Command set Command Code Command Code CHECK POWER MODE 98h 10h-1Fh SLEEP 99h Read Sectors 20h SMART B0h Read Sectors without Retry 21h DEVICE CONFIGURATION B1h Read Sectors EXT 24h Read Multiple C4h Read DMA EXT 25h Write Multiple C5h 27h Set Multiple Mode C6h Read Multiple EXT 29h Read DMA C8h Read Log EXT 2Fh Read DMA without Retry C9h Write Sectors 30h Write DMA CAh 31h Write DMA without Retry CBh 34h Write Multiple FUA EXT CEh Write DMA EXT 35h Standby Immediate E0h Set Native Max Address EXT 37h Idle Immediate E1h CFA WRITE SECTORS WITHOUT ERASE 38h Standby E2h E3h Data Set Management Recalibrate Read Native Max Address EXT Write Sectors without Retry Write Sectors EXT Write Multiple EXT 06h 39h IDLE Write DMA FUA EXT 3Dh Read Buffer E4h Write Long EXT 3Fh Check Power Mode E5h Read Verify Sectors 40h Sleep E6h Read Verify Sectors without Retry 41h Flush Cache E7h E8h Read Verify Sectors EXT 42h Write Buffer WRITE UNCORRECTABLE EXT 45h Flush Cache EXT EAh Read FPDMA Queued 60h Identify Device ECh Write FPDMA Queued 61h Set Features EFh Security Set Password F1h F2h Seek Execute Device Diagnostic 70h-71h 90h Security Unlock Initialize Device Parameters 91h Security Erase Prepare F3h Download Microcode 92h Security Erase Unit F4h DOWNLOAD MICROCODE DMA 93h Security Freeze Lock F5h 94h Security Disable Password F6h STANDBY IMMEDIATE 11 © 2015 Apacer Technology Inc. Rev. 1.2 M.2 2260 Flash Drive APM2T60P200xxxxAN-XTMX IDLE IMMEDIATE 95h Read Native Max Address F8 STANDBY 96h Set Max Address F9 IDLE 97h 5.2 S.M.A.R.T. SMART, an acronym for Self-Monitoring, Analysis and Reporting Technology, is an open standard that allows a hard disk drive to automatically detect its health and report potential failures. When a failure is recorded by SMART, users can choose to replace the drive to prevent unexpected outage or data loss. Moreover, SMART can inform users of impending failures while there is still time to perform proactive actions, such as copy data to another device. 12 © 2015 Apacer Technology Inc. Rev. 1.2 M.2 2260 Flash Drive APM2T60P200xxxxAN-XTMX 6. Electrical Specification Table 6-1: Operating range Ambient Temperature 0°C ~ +70°C(standard) -40°C ~ 85°C (extended) Supply Voltage 3.3V±5% (3.135-3.465V) Table 6-2: Typical power consumption Capacity 16 GB 32 GB 64 GB 128 GB 256 GB Active (mA) 370 480 540 535 535 Idle (mA) 100 100 100 100 105 Modes Note: Results may differ from various flash configurations or host system setting 13 © 2015 Apacer Technology Inc. Rev. 1.2 M.2 2260 Flash Drive APM2T60P200xxxxAN-XTMX 7. Mechanical Specifications 14 © 2015 Apacer Technology Inc. Rev. 1.2 M.2 2260 Flash Drive APM2T60P200xxxxAN-XTMX 15 © 2015 Apacer Technology Inc. Rev. 1.2 M.2 2260 Flash Drive APM2T60P200xxxxAN-XTMX 8. Product Ordering Information 8.1 AP Product Code Designations M2 T60 P200 xxxx AN – X TM X Temperature Range Blank: Standard W: Extended Temperature Flash Type Version Control Apacer Brand Capacities: 016G = 032G = 064G = 128G = 256G = 16GB 32GB 64GB 128GB 256GB Solution version Form Factor M.2 Apacer Product Code 16 © 2015 Apacer Technology Inc. Rev. 1.2 M.2 2260 Flash Drive APM2T60P200xxxxAN-XTMX 8.2 Valid Combinations 8.2.1 Standard Temperature Capacity No DEVSLP DEVSLP 16GB 32GB 64GB APM2T60P200016GAN-7TM APM2T60P200032GAN-7TM APM2T60P200064GAN-7TM APM2T60P200016GAN-8TM APM2T60P200032GAN-8TM APM2T60P200064GAN-8TM 128GB 256GB APM2T60P200128GAN-7TM APM2T60P200256GAN-7TM APM2T60P200128GAN-8TM APM2T60P200256GAN-8TM 8.2.2 Extended Temperature Capacity No DEVSLP DEVSLP 16GB 32GB 64GB 128GB APM2T60P200016GAN-7TMW APM2T60P200032GAN-7TMW APM2T60P200064GAN-7TMW APM2T60P200128GAN-7TMW APM2T60P200016GAN-8TMW APM2T60P200032GAN-8TMW APM2T60P200064GAN-8TMW APM2T60P200128GAN-8TMW 256GB APM2T60P200256GAN-7TMW APM2T60P200256GAN-8TMW Note: Valid combinations are those products in mass production or will be in mass production. Consult your Apacer sales representative to confirm availability of valid combinations and to determine availability of new combinations. . 17 © 2015 Apacer Technology Inc. Rev. 1.2 M.2 2260 Flash Drive APM2T60P200xxxxAN-XTMX Revision History Revision Date Description Remark 1.0 10/28/2014 Official release 1.1 07/07/2015 Add endurance information -Added extended temp product support 1.2 07/08/2015 -Revised product ordering information due to FW change(22A) 18 © 2015 Apacer Technology Inc. Rev. 1.2 M.2 2260 Flash Drive APM2T60P200xxxxAN-XTMX Global Presence Taiwan (Headquarters) Apacer Technology Inc. 1F., No.32, Zhongcheng Rd., Tucheng Dist., New Taipei City 236, Taiwan R.O.C. Tel: 886-2-2267-8000 Fax: 886-2-2267-2261 amtsales@apacer.com U.S.A. Apacer Memory America, Inc. 386 Fairview Way, Suite102, Milpitas, CA 95035 Tel: 1-408-518-8699 Fax: 1-408-935-9611 sa@apacerus.com Japan Apacer Technology Corp. 5F, Matsura Bldg., Shiba, Minato-Ku Tokyo, 105-0014, Japan Tel: 81-3-5419-2668 Fax: 81-3-5419-0018 jpservices@apacer.com Europe Apacer Technology B.V. Science Park Eindhoven 5051 5692 EB Son, The Netherlands Tel: 31-40-267-0000 Fax: 31-40-267-0000#6199 sales@apacer.nl China Apacer Electronic (Shanghai) Co., Ltd 1301, No.251,Xiaomuqiao Road, Shanghai, 200032, China Tel: 86-21-5529-0222 Fax: 86-21-5206-6939 sales@apacer.com.cn India Apacer Technologies Pvt Ltd, # 535, 1st Floor, 8th cross, JP Nagar 3rd Phase, Bangalore – 560078, India Tel: 91-80-4152-9061 sales_india@apacer.com 19 © 2015 Apacer Technology Inc. Rev. 1.2