67SLG040040025PI00

Soft SMD Grounding Contacts Metallized Film-over-Foam SMD METALLIZED FILM-OVER-FOAM GROUNDING CONTACT Laird’s SMD (Surface Mount Device) Grounding Contact is a foam cored contact with a metalized polyimide film outer covering. It is used for circuit grounding of SMT (Surface Mount Technology) devices. These contacts are designed to be solder reflow compatible, and are suitable for automatic processing. FEATURES MARKETS • • • • • • • • • • • • • • • • • Sn / Cu Plated PI Film outer layer Polymeric Foam Core Soft SMD contacts are RoHS compliant Halogen-free per IEC-61249-2-21 standard Reflow tunnel compatible to 260°C Patent Pending UL94 HB Flammability Rating Item Unit Cabinet applications LCD and Plasma TV Medical equipment Servers Printers Automotive Laptop computers and tablets Networking equipment Desktop computers Telecommunications cabinets Value Z-Axis Resistance Before Reflow Ω