SHT4x
4th Generation, High-Accuracy, Ultra-Low-Power, 16-bit
Relative Humidity and Temperature Sensor
Features
•
Accuracies ΔRH = ±1.0 %RH, ΔT = ±0.1 °C
•
Operating range: 0 … 100 %RH, −40…125 °C
•
VDD = 1.08 V … 3.6 V
•
Fully functional in condensing environment
•
Avg. current: 0.4 µA, Idle current: 80 nA
•
Power heater, true NIST-traceability
•
I2C FM+, CRC checksum, multip. I2C addr.
•
JEDEC JESD47 qualification
•
Patented protection options [1], PTFE
•
Sensor-specific calibration certificate acc. to
membrane and removable protective cover
ISO 17025 : 2017, 3-point temp. calibration
General Description
SHT4x is a digital sensor platform for measuring relative humidity and temperature at different
accuracy classes. Its I2C interface provides several preconfigured I2C addresses while maintaining
an ultra-low power budget. The power-trimmed internal heater can be used at three heating levels
thus enabling sensor operation in demanding environments. The four-pin dual-flat-no-leads
package is suitable for surface mount technology (SMT) processing and comprises an optional onpackage patented PTFE [1] membrane or a removable protective cover. Sensor specific calibration
certificates according to ISO17025, identifiable through unique serial number, are available.
Device Overview
Products
SHT40-AD1B
SHT40-BD1B
SHT40-AD1F
SHT40-AD1P
SHT41-AD1B
SHT43-ADCB
SHT45-AD1B
Functional Block Diagram
Details
base RH&T accur., 0x44 I2C addr.
base RH&T accur., 0x45 I2C addr.
SHT40-AD1B with PTFE membrane
SHT40-AD1B with protective cover
intermed. RH&T accur., 0x44 I2C addr.
ISO17025 3-point calibration certificate
±1.0 %RH, ±0.1 °C accur., 0x44 I2C addr.
Full product list on page 20
SCAN ME to give feedback and help us to
improve this document. —Thank you!
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Contents
Features ............................................................................................................................................................................................ 1
General Description ...................................................................................................................................................................... 1
Device Overview ............................................................................................................................................................................ 1
Functional Block Diagram ........................................................................................................................................................... 1
Contents ........................................................................................................................................................................................... 2
1 Quick Start – Hello World ........................................................................................................................................................ 3
2 Humidity and Temperature Sensor Specifications .......................................................................................................... 4
2.1 Relative Humidity ............................................................................................................................................................... 4
2.2 Temperature ........................................................................................................................................................................ 6
2.3 Recommended Operating Conditions ......................................................................................................................... 7
2.4 ISO17025 certification with 3-point calibration data ............................................................................................... 8
3 Electrical Specifications ........................................................................................................................................................... 9
3.1 Electrical Characteristics ................................................................................................................................................. 9
3.2 Timings ............................................................................................................................................................................... 10
3.3 Absolute Maximum Ratings ......................................................................................................................................... 10
4 Sensor Operation ..................................................................................................................................................................... 11
4.1 I2C communication ......................................................................................................................................................... 11
4.2 I2C Communication Timing .......................................................................................................................................... 11
4.3 Data type & length ........................................................................................................................................................... 11
4.4 Checksum Calculation ................................................................................................................................................... 11
4.5 Command Overview ....................................................................................................................................................... 12
4.6 Conversion of Signal Output ........................................................................................................................................ 12
4.7 Serial number ................................................................................................................................................................... 13
4.8 Reset & Abort ................................................................................................................................................................... 13
4.9 Heater Operation ............................................................................................................................................................. 13
5 Physical Specification ............................................................................................................................................................. 14
5.1 Package Description ....................................................................................................................................................... 14
5.2 Package Outline............................................................................................................................................................... 14
5.3 Land Pattern ...................................................................................................................................................................... 15
5.4 Pin Assignment & Laser Marking ............................................................................................................................... 15
5.5 Thermal Information........................................................................................................................................................ 16
6 Protection Options ................................................................................................................................................................... 16
6.1 Membrane Option ............................................................................................................................................................ 16
6.2 Protective Cover .............................................................................................................................................................. 17
7 Quality and Material Contents ............................................................................................................................................. 17
8 Tape and Reel Packaging ..................................................................................................................................................... 18
9 Product Nomenclature ............................................................................................................................................................ 19
10 Ordering Information ............................................................................................................................................................. 20
11 Bibliography ............................................................................................................................................................................. 20
12 Revision History ..................................................................................................................................................................... 21
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1 Quick Start – Hello World
A typical application circuit for SHT4x is shown on the left-hand side of Figure 1. After reaching
the minimal supply voltage and allowing for the maximal power-up time of 1 ms the sensor is ready
for I2C communication. The quickest way to measure humidity and temperature is pseudo-coded
on the right-hand side of Figure 1. Together with the conversion formulae given in equations ( 1 ),
( 2 ), and ( 3 ), the digital signals can be translated into relative humidity and temperature readings.
Typical application circuit
Pseudo code
i2c_write(i2c_addr=0x44, tx_bytes=[0xFD])
wait_seconds(0.01)
rx_bytes = i2c_read(i2c_addr=0x44,
number_of_bytes=6)
t_ticks = rx_bytes[0] * 256 + rx_bytes[1]
checksum_t = rx_bytes[2]
rh_ticks = rx_bytes[3] * 256 + rx_bytes[4]
checksum_rh = rx_bytes[5]
t_degC = -45 + 175 * t_ticks/65535
rh_pRH = -6 + 125 * rh_ticks/65535
if (rh_pRH > 100):
rh_pRH = 100
if (rh_pRH < 0):
rh_pRH = 0
Figure 1. Typical application circuit (left) and pseudo code (right) for easy starting. For details on the signal
cropping in the last four lines see section 4.6.
Find code resources and embedded drivers on: https://github.com/Sensirion/embeddedsht/releases
CAD files can be downloaded from SnapEDA: https://www.snapeda.com/parts/SHT40-AD1BR3/Sensirion/view-part/
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2 Humidity and Temperature Sensor Specifications
Every SHT4x is individually tested and calibrated and is identifiable by its unique serial number
(see section 4.7 for details on the serial number). For the calibration, Sensirion uses transfer
standards, which are subject to a scheduled calibration procedure. The calibration of the reference,
used for the calibration of the transfer standards, is NIST traceable through an ISO/IEC 17025
accredited laboratory.
2.1 Relative Humidity
Parameter
SHT40 RH accuracy1
SHT41 RH accuracy1
SHT43 RH accuracy1
SHT45 RH accuracy1
Repeatability2, 3
Resolution4
Hysteresis
Specified range5
Response time7
Long-term drift8
Conditions
typ.
max.
typ.
max.
typ.
max.
typ.
max.
high
medium
low
At 25 °C
extended6
𝜏63%
typ.
Value
1.8
see Figure 2
1.8
see Figure 3
1.8
see Figure 4
1.0
see Figure 5
0.08
0.15
0.25
0.01
0.8
0 to 100
4
390 Ω
VDD > 2.0 V,
Rpullup > 390 Ω
0.2*
VDD
0.2*
VDD
see section 4.9
Avg. power consumption
(continuous operation
with 1 meas. per second)
-
Capacitive bus load can
be determined from
Cb < trise /(0.8473*Rp).
Rise times are
trise = 300 ns for fast
mode and trise = 120 ns
for fast mode plus
Table 4. Electrical specifications.
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3.2 Timings
Max. values are measured at −40 °C and 1.08 V supply voltage (based on characterization).
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Power-up time
tPU
After hard reset,
VDD ≥ VPOR
-
0.3
1
ms
Soft reset time
tSR
After soft reset
-
-
1
ms
tMEAS,l
Low repeatability
-
1.3
1.6
ms
tMEAS,m
Med. repeatability
-
3.7
4.5
ms
tMEAS,h
High repeatability
-
6.9
8.3
ms
Long pulse
0.9
1
1.1
s
Short pulse
0.09
0.1
0.11
s
Measurement
duration
Heater-on duration
tHeater
Comments
Time between VDD
reaching VPOR and
sensor entering idle
state
Time between ACK of
soft reset command and
sensor entering idle
state. Also valid for I2C
general call reset.
Including tPU:
The three repeatability
modes differ with
respect to measurement
duration, noise level and
energy consumption
After that time the heater
is automatically switched
off
After that time the heater
is automatically switched
off
Table 5. System timing specifications.
3.3 Absolute Maximum Ratings
Stress levels beyond those listed in Table 6 may cause permanent damage or affect the reliability
of the device. These are stress ratings only and functional operation of the device at these
conditions is not guaranteed. Ratings are only tested each at a time.
Parameter
Max. voltage on any pin
Operating temperature range
Storage temperature range12
ESD HBM
ESD CDM
Latch up, JESD78 Class II, 125 °C
Rating
VSS −0.3 V … VDD +0.3 V
−40 °C … 125 °C
−40 °C …150 °C
2 kV
500 V
100 mA
Table 6. Absolute maximum ratings.
12
The recommended storage temperature range is 10-50 °C. Please consult the document “SHTxx Handling Instructions” [2] for more information.
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4 Sensor Operation
4.1 I2C communication
I2C communication is based on NXP’s I2C-bus specification and user manual UM10204 [3].
Supported I2C modes are standard, fast mode, and fast mode plus. Data is transferred in multiples
of 16-bit words and 8-bit checksum (cyclic redundancy check = CRC). All transfers must begin with
a start condition (S) and terminate with a stop condition (P). To finish a read transfer, send not
acknowledge (NACK) and stop condition (P). Addressing a specific slave device is done by sending
its 7-bit I2C address followed by an eighth bit, denoting the communication direction: “zero”
indicates transmission to the slave, i.e. “write”, a “one” indicates a “read” request. Schematics of
the I2C transfer types are sketched in Figure 14. The sensor does not support clock-stretching. In
case the sensor receives a read header and is still busy with e.g. measurement or heating, it will
return a NACK. Measurement data can only be received once and will be deleted from the sensor’s
register after the first acknowledged I2C read header.
Figure 14. I2C transfer types: First a write header is sent to the I2C slave, followed by a command,
for example “measure RH&T with highest precision”. After the measurement is finished the read
request directed to this I2C slave will be acknowledged and transmission of data will be started by
the slave.
4.2 I2C Communication Timing
All details on the timing are following the interface specification of NXP’s user manual UM10204
[3]. Please follow mandatory capacitor and resistor requirements given in Table 4.
4.3 Data type & length
I2C bus operates with 8-bit data packages. Information from the sensor to the master has a
checksum after every second 8-bit data package.
Humidity and temperature data will always be transmitted in the following way: The first value is
the temperature signal (2 * 8-bit data + 8-bit CRC), the second is the humidity signal (2 * 8-bit data
+ 8-bit CRC).
4.4 Checksum Calculation
For read transfers each 16-bit data is followed by a checksum with the following properties
Property
Name
Message Length
Polynomial
Initialization
Value
CRC-8
16-bit
0x31 (x8 + x5 + x4 +1)
0xFF
Reflect Input/Output
Final XOR
Examples
false/false
0x00
CRC(0xBEEF) = 0x92
Table 7. Data checksum properties.
The master may abort a read transfer after the 16-bit data if it does not require a checksum.
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4.5 Command Overview
Command
(hex)
Response length
incl. CRC (bytes)
Description
[return values]
0xFD
6
0xF6
6
0xE0
6
0x89
6
0x94
-
0x39
6
0x32
6
0x2F
6
0x24
6
0x1E
6
0x15
6
measure T & RH with high precision (high repeatability)
[2 * 8-bit T-data; 8-bit CRC; 2 * 8-bit RH-data; 8-bit CRC]
measure T & RH with medium precision (medium repeatability)
[2 * 8-bit T-data; 8-bit CRC; 2 * 8-bit RH-data; 8-bit CRC]
measure T & RH with lowest precision (low repeatability)
[2 * 8-bit T-data; 8-bit CRC; 2 * 8-bit RH-data; 8-bit CRC]
read serial number
[2 * 8-bit data; 8-bit CRC; 2 * 8-bit data; 8-bit CRC]
soft reset
[ACK]
activate heater with 200mW for 1s, including a high precision
measurement just before deactivation
[2 * 8-bit T-data; 8-bit CRC; 2 * 8-bit RH-data; 8-bit CRC]
activate heater with 200mW for 0.1s including a high precision
measurement just before deactivation
[2 * 8-bit T-data; 8-bit CRC; 2 * 8-bit RH-data; 8-bit CRC]
activate heater with 110mW for 1s including a high precision
measurement just before deactivation
[2 * 8-bit T-data; 8-bit CRC; 2 * 8-bit RH-data; 8-bit CRC]
activate heater with 110mW for 0.1s including a high precision
measurement just before deactivation
[2 * 8-bit T-data; 8-bit CRC; 2 * 8-bit RH-data; 8-bit CRC]
activate heater with 20mW for 1s including a high precision
measurement just before deactivation
[2 * 8-bit T-data; 8-bit CRC; 2 * 8-bit RH-data; 8-bit CRC]
activate heater with 20mW for 0.1s including a high precision
measurement just before deactivation
[2 * 8-bit T-data; 8-bit CRC; 2 * 8-bit RH-data; 8-bit CRC]
Table 8. Overview of I2C commands. If the sensor is not ready to process a command, e.g. because it is still
measuring, it will response with NACK to the I2C read header. Given heater power values are typical and
valid for VDD=3.3 V.
4.6 Conversion of Signal Output
The digital sensor signals correspond to following humidity and temperature values:
𝑆𝑅𝐻
𝑅𝐻 = (−6 + 125 ∙ 16
) %RH
2 −1
𝑆𝑇
𝑇 = (−45 + 175 ∙ 16
) °C
2 −1
𝑆𝑇
𝑇 = (−49 + 315 ∙ 16
) °F
2 −1
(1)
(2)
(3)
N.B.: The RH conversion formula (1) allows values to be reported which are outside of the range
of 0 %RH … 100 %RH. Relative humidity values which are smaller than 0 %RH and larger than
100 %RH are non-physical, however these “uncropped” values might be found beneficial in some
cases (e.g. when the distribution of the sensors at the measurement boundaries are of interest).
For all [3]s who do not want to engage in evaluation of these non-physical values, cropping of the
RH signal to the range of 0 %RH … 100 %RH is advised.
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4.7 Serial number
Each sensor has a unique serial number, that is assigned by Sensirion during production. It is
stored in the one-time-programmable memory and cannot be manipulated after production. The
serial number is accessible via I2C command 0x89 and is transmitted as two 16-bit words, each
followed by an 8-bit CRC.
4.8 Reset & Abort
A reset of the sensor can be achieved in three ways:
1. Soft reset: send the reset command described in Table 8.
2. I2C general call reset: all devices on I2C bus are reset by sending the command 0x06 to
the I2C address 0x00.
3. Power down (incl. pulling SCL and SDA low)
Any command that triggers an action at the sensor can be aborted via I2C general call reset or soft
reset.
4.9 Heater Operation
The sensor incorporates an integrated on-package heater which can be switched on by the set of
commands given in Table 8. Three heating powers and two heating durations are selectable. After
reception of a heater-on command, the sensor executes the following procedure:
1. The heater is enabled, and the timer starts its count-down.
2. On timer expiration a temperature and humidity measurement with the highest repeatability
is started, the heater remains enabled.
3. After the measurement is finished the heater is turned off.
4. Temperature and humidity values are now available for readout.
The maximum on-time of the heater commands is one second in order to prevent overheating of
the sensor by unintended usage of the heater. Thus, there is no dedicated command to turn off the
heater. For extended heating periods it is required to send periodic heater-on commands, keeping
in mind that the heater is designed for a maximal duty cycle of less than 10%. To obtain a fast
increase in temperature the idle time between consecutive heating pulses shall be kept minimal.
Possible Heater Use Cases
There will be dedicated Sensirion application notes elaborating on various use cases of the
heater. In general, the applications of the on-package heater range around:
1. Removal of condensed / spray water on the sensor surface. Although condensed water is
not a reliability / quality problem to the sensor, it will however make the sensor nonresponsive to RH changes in the air as long as there is liquid water on the surface.
2. Creep-free operation in high humid environments. Periodic heating pulses allow for creepfree high-humidity measurements for extended times.
Important notes for operating the heater:
1. The heater is designed for a maximum duty cycle of 10%, meaning the total heater-ontime should not be longer than 10% of the sensor’s lifetime.
2. During operation of the heater, sensor specifications are not valid.
3. The temperature sensor can additionally be affected by the thermally induced mechanical
stress, offsetting the temperature reading from the actual temperature.
4. The sensor’s temperature (base temperature + temperature increase from heater) must
not exceed Tmax = 125 °C in order to have proper electrical functionality of the chip.
5. The heater draws a large amount of current once enabled (up to ~75 mA in the highest
power setting). Although a dedicated circuitry draws this current smoothly, the power
supply must be strong enough to avoid large voltage drops that could provoke a sensor
reset.
6. If higher heating temperatures are desired, consecutive heating commands have to be
sent to the sensor. The heater shall only be operated in ambient temperatures below
65 °C else it could drive the sensor outside of its maximal operating temperature.
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5 Physical Specification
5.1 Package Description
SHT4x is provided in an open-cavity dual flat no lead (DFN) package. The humidity sensor opening
is centered on the top side of the package. The sensor chip is made of silicon, hosted on a copper
lead frame and overmolded by an epoxy-based mold compound. Exposed bottom side of the
leadframe with the metallic contacts is Ni/Pd/Au coated, side walls are bare copper.
Moisture sensitivity level (MSL) of one according to IPC/JEDEC J-STD-020 is achieved. It is
recommended to process the sensors within one year after date of delivery.
5.2 Package Outline
Figure 15. Dimensional drawing of SHT4x including package tolerances (units mm).
Figure 16. Dimensional drawing of SHT4xI with filter membrane including package tolerances (units mm)
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5.3 Land Pattern
The land pattern is recommended to be designed according to the used PCB and soldering process
together with the physical outer dimensions of the sensor. For reference, the land pattern used with
Sensirion’s PCBs and soldering processes is given in Figure 17. Soldering of the central die pad
is optional. Sensirion recommends to not solder the central die pad because the sensor can reach
higher temperatures upon heater activation
.
Figure 17. Recommended land pattern (in mm). Details can vary and depend on used PCBs and solder
processes. There shall be no copper under the sensor other than at the pin pads.
5.4 Pin Assignment & Laser Marking
Pin
1
2
3
4
Name
SDA
SCL
VDD
VSS
Comments
Serial data, bidirectional
Serial clock, unidirectional input
Supply voltage
Ground
Figure 18. Pin assignment (transparent top view). Dashed lines are only visible if sensor is viewed from
below. The die pad is not directly connected to any pin.
The laser marking consists of two lines, indicated in Figure 18. In the first line a filled circle serves
as pin-1 indicator and is followed by “SH4”. The last character will indicate the accuracy class of
this product (here “x” serves as place holder). In the second line, the first three characters specify
the product characteristics according to positions 7, 8 and 9 of Table 10. The second three
characters serve as internal batch tracking code.13
13
Please note, there will be no change in the laser marking for the protective option (filter membrane and protective cover).
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5.5 Thermal Information
Symbol
𝑅𝜃𝐽𝐴
𝑅𝜃𝐽𝐶
𝑅𝜃𝐽𝐵
Ψ𝐽𝐵
Ψ𝐽𝑇
Description
Junction-to-ambient
thermal resistance
Junction-to-case
thermal resistance
Junction-to-board
thermal resistance
Junction-to-board
characterization
param.
Junction-to-top
characterization
param.
Heater off, die
pad soldered
(K/W)
Heater on, die
pad soldered
(K/W)
Heater off,
die pad
not soldered
(K/W)
Heater on,
die pad
not soldered
(K/W)
246
308
297
357
189
255
191
257
159
225
193
258
159
223
191
254
38
105
44
112
Table 9. Typical values for thermal metrics. In the “heater on” columns a heater power of 200 mW was
assumed. Soldering of the die pad is not recommended, therefore the two right hand side columns are bold.
Values are based on simulation.
6 Protection Options
6.1 Membrane Option
The filter membrane option for SHT4x family members inherently provides an additional barrier for
all pollutants to enter the sensor opening, thus lowering negative influences on the sensing
element. Mostly designed to keep particles and dust from accumulating and reducing the response
time, the membrane also enables more efficient and easy cleaning, as it helps to reduce liquid
intrusion into the sensor opening. Even though not selectively filtering, in general, physical barriers
allow to reduce the amount of unwanted chemical contamination and help to remove potentially
harmful components by facilitating wiping (flat sensor surface).
The integrated SHT4x PTFE membrane provides additional protection, from particles, and enables
sensor operation in harsh conditions. The membrane has a thickness of 100 µm offering a filtration
efficiency of >99.99% for particles of 200 nm size and larger. Owing to the high permeability and
the small volume between sensing element and membrane, the specified response time of the RH
sensor is unaltered.
Figure 19. SHT4x with integrated PTFE membrane, highlighting the beneficial flat geometry of the SHT4xI.
To ensure full functionality of the sensor and avoid damaging its integrated filter membrane, when
mounting the sensor, follow the reflow soldering process as described in the Handling
Instructions [2]. Furthermore the therein described care regarding board wash and cleaning still
apply.
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6.2 Protective Cover
The SHT4x will be available with a second protective option, a removable protective cover to protect
the sensing element during sensor installation. The sensor will be delivered with the protective
cover attached such that the sensor opening is completely covered and sealed. This enables costeffective brush-over and spray-over application procedures of conformal coating material. Such
coating is often required in highly corrosive environments to protect solder joints. In this process
the protective cover prevents the sensor opening to be sealed by any coating and to it, the foil can
be pulled off with tweezers at the designated non-sticking flap.
The protective cover is made of polyimide making it highly resistant to chemicals and elevated
temperatures14. To ensure full functionality of the cover, when mounting the sensor, follow the
reflow soldering process as described in the Handling Instruction [2].
Figure 20. Sketch of the SHT4x with attached polyimide foil. 15
7 Quality and Material Contents
Qualification of SHT4x is performed based on the JEDEC JESD47 qualification test method,
qualification report available on request. The device is fully RoHS and WEEE compliant, e.g. free
of Pb, Cd, and Hg.
For general remarks of best practice in processing humidity sensor please refer to the handling
instructions [2].
14
15
Up to 260 °C
This a preliminary sketch only and might be subject to change.
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8 Tape and Reel Packaging
All specifications for the tape and reel packaging can be found on Figure 21. Reel diameters are
13 inch and 8 inch for the 10k and the 2.5k packaging sizes, respectively.
Figure 21. Tape and reel specifications including sensor orientation in pocket (see indication of two sensors
on the right side of the tape).
Figure 22. Tape and reel specification including sensor orientation in pocket of sensor with membrane option.
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9 Product Nomenclature
Position
1
2
3
4
5
6
7
8
9
10
11
12
13
Value(s)
S
H
T
4
0
1
5
3
A
B
C
D
1
C
B
F
P
R
2
3
Explanation
Sensirion
Humidity Signal
Temperature Signal
Fourth product generation
Base accuracy
Intermediate accuracy
Best accuracy
ISO17025 certified
delimiter
I2C interface with 0x44 address
I2C interface with 0x45 address
I2C interface with 0x46 address
DFN package
Reserved
3-point calibrated and certified
Blank package
Package with integrated, patented PTFE membrane
Package with removable protective cover for conformal coating (coming soon)
delimiter
Tape on reel packaging
Packaging article contains 2’500 pieces
Packaging article contains 10’000 pieces
Table 10. SHT4x product nomenclature.
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10 Ordering Information
Material Description
SHT40-AD1B-R2
SHT40-AD1B-R3
Material Number
3.000.465
3.000.353
SHT40-AD1F-R2
3.000.820
SHT40-AD1P-R2
tbd
SHT40-BD1B-R2
SHT40-BD1F-R2
SHT40-BD1B-R3
SHT40-CD1B-R3
SHT41-AD1B-R2
SHT41-AD1B-R3
3.000.492
3.000.887
3.000.610
3.000.691
3.000.466
3.000.611
SHT41-AD1F-R2
3.000.885
SHT43-ADCB-R2
3.000.682
SHT43-ADCB-R3
3.000.823
SHT43-BDCB-R3
3.000.904
SHT45-AD1B-R2
3.000.645
SHT45-AD1F-R2
3.000.886
SHT45-AD1B-R3
3.000.750
Details
base RH&T acc., 0x44 I2C addr.
base RH&T acc., 0x44 I2C addr.
base RH&T acc., 0x44 I2C addr.,
including patented PTFE membrane
base RH&T acc., 0x44 I2C addr.,
including removable protective cover
available Q2/23
base RH&T acc., 0x45 I2C addr.
base RH&T acc., 0x45 I2C addr.
base RH&T acc., 0x45 I2C addr.
base RH&T acc., 0x46 I2C addr.
intermed. RH&T acc., 0x44 I2C addr.
intermed. RH&T acc., 0x44 I2C addr.
intermed. RH&T acc., 0x44 I2C addr
including patented PTFE membrane
3-point calibrated, ISO17025 certified,
0x44 I2C addr.
3-point calibrated, ISO17025 certified,
0x44 I2C addr.
3-point calibrated, ISO17025 certified,
0x45 I2C addr.
±1.0 %RH, ±0.1 °C acc., 0x44 I2C addr.
±1.0 %RH, ±0.1 °C acc., 0x44 I2C addr.
Including patented PTFE membrane
±1.0 %RH, ±0.1 °C acc., 0x44 I2C addr.
Quantity (pcs)
2’500
10’000
2’500
2’500
2’500
2’500
10’000
10’000
2’500
10’000
2’500
2’500
10’000
10’000
2’500
2’500
10’000
Table 11. SHT4x ordering options.
11 Bibliography
[1] K. Ehrhorn, "A Humidity Sensor and a Methode for Manufacturing the Same.". UK, DE, FR, NL, DM, BE, US, CN
Patent EP1810013, US7741950, CN101040181, 2005.
[2] Sensirion, "Handling Instructions for Humidity Sensors," 2020.
[3] NXP Semiconductors, "User manual UM10204," vol. Rev. 6, 2014.
www.sensirion.com / D1
Version 6 – February 2023
20/22
12 Revision History
Date
October 2020
July 2021
Version
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2
March 2022
3
November 2022
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multiple
multiple
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all
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January 2023
February 2023
www.sensirion.com / D1
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6
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Changes
Initial release
Typo correction
Included checksum in Figure 1
Included description of NIST traceability in section 2
Included repeatability clarification in Table 1
Clarified I2C communication in section 4.1
Removed waiting time specification in Table 5
Specified serial number in 4.7
Updated qualification status in section 6
Deleted binary com. & included return values in Table 8
Updated note on duty cycle of heater in section 4.9
Added note on large current drawn by heater in section 4.9
Updated ordering information in Table 11
Included SHT45 RH- and T-accuracy specifications
Extended max. heater duty cycle to 10%
Reduced RH response time to 4s in Table 1
Reduced long-term drift to