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9Z19200001

9Z19200001

  • 厂商:

    YL(惠伦晶体)

  • 封装:

    SMD2016_4P

  • 描述:

    无源晶振 19.2MHz ±10ppm 7pF 80Ω SMD2016_4P -30℃~+85℃

  • 数据手册
  • 价格&库存
9Z19200001 数据手册
PRODUCT SPECIFICATION SHEET Customer Customer P/N - Product Type Temperature Sensing Crystal Part Number 9Z19200001 Part Description Nominal Frequency Prepared Li Xiang Reviewed Kuro Peng Approved Xing Yue Date Version A1 SMD TSX 2.0 x 1.6 (TH + Xtal) 19.200000MHz Customer's Approval & Date: 2022-6-29 广东惠伦晶体科技股份有限公司 中 国 广 东 省 东 莞 市 黄 江 镇 东 环 路 鸡 啼 岗 段 68 号 68 Donghuan Road, Jitigang Village, Huangjiang, Dongguan, Guangdong Province, P. R. China WEB : http://www.dgylec.com/ TEL : +86 ( 0 ) 769 - 38879888 FAX : +86 ( 0 ) 769 - 38879889 EMAIL : yl@dgylec.com FAITH LONG CRYSTAL Proprietary and Confidential Information RoHS COMPLIANT Pb Lead-Free Moisture Sensitivity Level 1 Page 1 of 13 SMD TSX 2.0 x 1.6 (TH + Xtal) PN: 9Z19200001 Ver. A1 CONTENTS # Item 1 History of Specification Revision 3 2 Electrical Specifications 4 3 4 5 6 Page 2.1 Specifications for operation condition and electrical characteristics 4 2.2 Specifications for crystal drive level dependency (DLD) 5 2.3 Specifications for GPS quality 6 2.4 NTC thermistor specification table 7 Product Design 8 3.1 Package dimensions and pad functions 8 3.2 Recommended land pattern 8 3.3 Recommended reflow profile 8 3.4 Marking definition 9 3.5 Recommended reflow profile 9 3.6 Structure illustration 10 Reliability Assurance 11 4.1 Mechanical endurance 11 4.2 Environmental endurance 11 Taping and Packing 12 5.1 Tape and reel 12 5.2 Packing standard 13 Specification of the Environment-related Substances FAITH LONG CRYSTAL Proprietary and Confidential Information 14 Page 2 of 13 SMD TSX 2.0 x 1.6 (TH + Xtal) PN: 9Z19200001 Ver. A1 1. History of Specification Revision Ver. Content Date Reviser S0 Initial released 2020-6-24 Chen XuanRu S1 Change marking 2022-6-29 Li Xiang FAITH LONG CRYSTAL Proprietary and Confidential Information Remark Page 3 of 13 SMD TSX 2.0 x 1.6 (TH + Xtal) PN: 9Z19200001 Ver. A1 2. Electrical Specifications 2.1 Specifications for operation condition and electrical characteristics # Parameter Min. Typ. 1 Nominal frequency 19.200000 2 Crystal cut type AT-cut 3 Mode of vibration Fundamental 4 ESD HBM>2000V 5 MSL Level 1 Load capacitance (C ) 6 7.0 L 7 Drive level 10 8 Operating temperature range -30 9 Storage temperature range -40 - Max. Remark 100 +85 +105 Unit MHz pF mW °C °C JESD22-A114-B IPC/JEDEC J-STD-033C Note 1. 10 Initial frequency tolerance -10 - +10 ppm At 25±3°C 11 Frequency drift after reflow -2.0 - +2.0 ppm After two times of reflow 12 Frequency tolerance over temperature -12 - +12 ppm Within -30°C to +85°C. Above +85°C see Note 2. 13 14 15 16 17 18 19 Frequency aging Equivalent series resistance (ESR) Insulation resistance Quality factor (Q) Spurious mode series resistance Shunt Capaitance Motional Capacitance -0.7 500 75,000 1,100 0.3 1.2 - +0.7 80 1.3 3.1 ppm/yr Ω MΩ Ω pF fF Note 3. at DC 100V Note 4. Within ±1 MHz offset. Specified at max drive level. 𝐶2 𝑡 = 𝑡0 − 3𝐶3 20 Inflection point 30.5 - 33.5 °C 21 First-order curve fitting parameter (C1) -0.4 - -0.1 ppm/°C Note 5. 22 Second-order curve fitting parameter (C2) -4.5 0 +4.5 x10-4 2 ppm/°C Note 5. 23 Third-order curve fitting parameter (C3) +8.5 +10.0 +11.5 x10-5 3 ppm/°C Note 5. Note 1 Note 2 Note 3 The load capacitance is measured according to IEC Standard #60444-8. Above 85°C, the frequency tolerance over temperature is bound by the third order coefficient range. The ESR max is specified at max drive level minimum Q, drives a smaller ESR; that is, design the crystal to the minimum Q. Note 4 Note 5 The minimum Q value calculated from ESR and L is smaller than this specification. The curve fitting parameter is obtained from the QTI crystal curve fitting algorithm, using the temperatureinflection point t0 = 29°C. FAITH LONG CRYSTAL Proprietary and Confidential Information Page 4 of 13 SMD TSX 2.0 x 1.6 (TH + Xtal) PN: 9Z19200001 Ver. A1 2. Electrical Specifications (Cont.) 2.2 Specifications for crystal drive level dependency (DLD) # Parameter Min. 1 Drive level measurement condition 0.01 Typ. Max. Unit Remarks - 200 mW Drive level from 0.01 μW to 200 μW to 0.01 μW 2 Number of points 3 DLD Frequency (Maximum - Minimum) - - 3.0 ppm Define as FDLD. Note 6. 4 DLD Frequency (Repeatability) - - 0.7 ppm Define as FDLDH. Note 7. 5 DLD ESR (Maximum - Minimum) - - 20 % Define as DLD10. Note 6. 6 DLD ESR (Repeatability) - - 10 % Define as DLDH3. Note 7 ~ 10. Note 6 Note 7 Note 8 Note 9 Note 10 29 points 15 points up and 15 points down = 29 total data points. Maximum - minimum: Difference between the maximum and minimum in a two-way measurement. In case of ESR, the change rate is (max - min)/min < 20%. Repeatability of the two-way measurement is defined in the above Drive level measurement condition. For DLD ESR (Repeatability), the change rate is defined as (ESR2 - ESR1)/ESR1. ESR1: This is the first measurement on each drive level. ESR2: This is the second measurement on each drive level. FAITH LONG CRYSTAL Proprietary and Confidential Information Page 5 of 13 SMD TSX 2.0 x 1.6 (TH + Xtal) PN: 9Z19200001 Ver. A1 2. Electrical Specifications (Cont.) 2.3 Specifications for GPS quality # Parameter Min. Typ. Max. 200 Unit Remarks mW All measurements in GPS quality are taken at 200 μ W drive level. 1 Drive level measurement condition 2 Residual frequency stability slope -50 - +50 ppb/°C Note 11 and Note 12(Condition 1A). 3 5°C small orbit hysteresis 1 -50 - +50 ppb/°C Note 13 (Condition 1B). 4 5°C small orbit hysteresis 2 100 (magnitude) ppb pk-pk Note 14. Note 11 Note 12 Residual = difference from fifth-order curve fit. Condition 1A – Test condition (continuous temperature rate change of ~1.0°C/min.):  Measure F/T points every 1°C, heating up from -30 to +85°C, subtract a fifth-order polynomial best fit and then calculate the slope of the residual. Note 13 Condition 1B – Hysteresis 1 test condition (continuous temperature rate change of ~1.0°C/minute):  Measure F/T points every 0.5°C while cycling temperature over a 5°C small temperature orbit; an example 5°C small orbit temperature cycle is +30°C to +35°C to +30°C.  During every individual heating/cooling cycle, there should be 11 points. Discard the first point of each heating and cooling cycle. This leaves 10 points for each heating and cooling cycle. Subtract the fifthorder polynomial best fit from 1A for each of the 10 points, and then calculate the slope of the residual for each of these heating and cooling 10 point curves. Note 14 Hysteresis 2 test condition (continuous temperature rate change of ~1.0°C/min.):  Measure F/T points every 0.5°C while cycling temperature over a 5°C small temperature orbit; an example 5°C small orbit temperature cycle is +30°C to +35°C to +30°C.  During every individual heating/cooling cycle there should be 11 points; discard the first and last point of each heating and cooling cycle, which results in 9 temperature points. Calculate the average measured peak-to-peak frequency difference for these 9 temperature points.  The average difference is the magnitude of the small orbit hysteresis 2. 2.4 NTC thermistor specification table # Parameter 1 Operating temperature range 2 Storage temperature range 3 Resistance 4 B-constant 5 Tolerance Min. -30 -40 - Typ. 100 4,250 - Max. +105 +105 1 Unit °C °C kΩ K % Remarks At 25°C* At 25°C - 50°C *In order to get the precise resistance value of the thermistor, the temperature control will be very important during testing since the resistance value will change ~4% per 1℃ temperature difference. Please check the following Murata website for detail explanation. https://www.murata.com/en-us/support/faqs/products/thermistor/ntc/pct/0001 FAITH LONG CRYSTAL Proprietary and Confidential Information Page 6 of 13 PN: 9Z19200001 SMD TSX 2.0 x 1.6 (TH + Xtal) Ver. A1 3. Product Design 3.1 Package dimensions and pad functions (Unit : mm) Top view 3.2 Pad connection diagram and function Bottom view #4 #3 #1 #2 #4 #3 YL 1 9 2 ■□□□□ #1 #2 Lateral view Pad 1 2 3 4 Bottom view 3.3 Recommended land pattern Function Xtal in Thermistor out, connecting to ground Xtal out Thermistor in (Unit : mm) FAITH LONG CRYSTAL Proprietary and Confidential Information Page 7 of 13 PN: 9Z19200001 SMD TSX 2.0 x 1.6 (TH + Xtal) Ver. A1 3. Product Design (Cont.) 3.4 Marking definition Frequency code Ex: 19.200=192 Y L 1 9 2 ■ LOT code (2 digits) Year and Month Administrative Symbo Table of Year and Month code Month JAN FEB Year 2021 2022 2023 2024 2025 2026 2027 2028 A N a n B P b p MAR APR MAY JUN JUL AUG SEP OCT NOV DEC C Q c q D R d r E S e s F T f t G U g u H V h v J W j w K X k x L Y l y M Z m z 3.5 Recommended reflow profile Temp. (℃) 10 sec. Max. 265 260  5 (1) Total time : 360 sec. Max. (2) Solder melting point : 225℃ 220 60 sec. Max. 180 150 120 sec. Max. Time (sec.) FAITH LONG CRYSTAL Proprietary and Confidential Information Page 8 of 13 SMD TSX 2.0 x 1.6 (TH + Xtal) PN: 9Z19200001 Ver. A1 3. Product Design (Cont.) 3.6 Structure illustration # 1 Components Cap (Lid) 2 Base (Package) 3 4 5 6 Pad (Package) Crystal blank Electrode Conductive adhesive 7 Thermistor 8 Solder Materials Kovar (Fe + Co + Ni) Ceramic (AI2O3) + Kovar (Fe + Co + Ni) Ni + Au SiO2 Cr + Nobel material Ag Alumina Ceramics (Al2O3), Ni + Ag+ Sn QTY 1 Finish/Specifications Ni plating 1 Alumina ceramics 4 1 2 2 Tungsten metalization + Ni plating + Au plating - 1 - Sn + Ag + Cu 2 - FAITH LONG CRYSTAL Proprietary and Confidential Information Silicone resin Page 9 of 13 SMD TSX 2.0 x 1.6 (TH + Xtal) PN: 9Z19200001 Ver. A1 4. Reliability Assurance 4.1 Mechanical endurance # Item Test Condition Reference 1 Drop test 150 cm height, fall freely onto stainless plate, 3 times. JIS C6701 2 Shock test 150 g weight, 150 cm height onto concrete floor. Each direction (±x, ±y, ±z) for 3 cycles. IEC-68-02-27 3 Mechanical shock Half sine wave 1000 G. Three mutually perpendicular axes, each axis for 3 times. Duration time 1.0ms. MIL-STD-202F 4 Vibration Frequency range : 10 ~ 55 Hz Amplitude : 1.52 mm Pendicular axes each test time : 2 hours(x,y,z Axis) Total test time 6 hours MIL-STD-883E 5 Gross Leak Standard sample for automatic gross leak detector. Test pressure: 2kg /cm2. MIL-STD-883E 6 Fine Leak Helium bombing 4.5 kgf/cm2 for 2 hours. MIL-STD-883E Solderability Temperature : 260°C ± 5°C Immersing depth : 0.5 mm minimum Immersion time : 5 ±1 seconds Flux : Rosin resin methyl alcohol solvent (1:4) GB/T 2424.172008 / IEC 60068-244:1995; GB/T 2423.282005 / IEC 60068-220:1979 Resistance To Soldering Heat Pre-heat temperature 125℃ Pre-heat time 60 ~ 120 sec. Test temperature 260 ±5℃ Test time 5 ±1 sec. MIL-STD-202F 7 8 *Storage conditions :18 months 4.2 Environmental endurance # Item 1 High temperature storage 2 Low temperature storage *Constant humidity :40~70% Test Condition Temperature : +125°C ± 3°C Duration : 500 ± 12 hours Reference MIL-STD-883E Temperature : -40°C ± 3°C Duration : 500 ± 12 hours MIL-STD-883E Total 100 cycles of the following temperature cycle 1 cycle o 3 Thermal shock (Air to Air) 125+/- 3 C MIL-STD-883E 25 oC -55+/- 3 o C 30 min. 30 min. 10 min. max. 4 High temperature & humidity Temperature : 85°C ± 3°C Humidity : RH 85% Duration : 500 hours FAITH LONG CRYSTAL Proprietary and Confidential Information JIS C5023 Page 10 of 13 SMD TSX 2.0 x 1.6 (TH + Xtal) PN: 9Z19200001 Ver. A1 5. Taping and Packing 5.1 Tape and reel (EIA-481-2) Direction of feed Index mark Direction of products Carrier tape Reel Cover tape Reel label (Model, Qty, Lot, ...) Package Type Dimension (Unit : mm) A0 B0 1.90±0.1 2.30±0.1 2016 TSX (8mm) P1 P2 4.00±0.1 2.00±0.1 Standard Reel Quantity is 3000 pcs per reel. The inspection standard of tape tension Item K0 1.25±0.10 D1 1.00±0.05 T 0.25±0.05 D0 1.55±0.05 W 8.00±0.3 P0 4.00±0.1 E 1.75±0.2 Defect Method F 3.50±0.1 Appearance All 1. The tape is not coincidence 2. The bubble Visual inspection Tape tension 2016 - 8mm Overstep 34±6g (28 to 40g) Pull test FAITH LONG CRYSTAL Proprietary and Confidential Information Page 11 of 13 SMD TSX 2.0 x 1.6 (TH + Xtal) PN: 9Z19200001 Ver. A1 5. Taping and Packing (Cont.) 5.2 Packing standard Out-going packing instruction Reel packing Name:Reel Standard:Diameter 18cm Material:Plastics Name:Anti-static shielding bag Standard:205250mm Material:APET/CPP Inner packing Name:Bubble wrap Standard:430330(t)20mm Material:HDPE Quantity : Max.15 reels Carton Name:Carton Standard:400400(H)280mm Material:AB corrugated paper Quantity:4 bags L1 L2 The label information Label Label Drawing Name of Article Spec. L1 条码标签 Bar Code Label (Chintz Paper) 1. Part No. 2. Lot No. 3. Q'ty 4. Freq. 7050mm White L2 条码标签 Bar Code Label (Chintz Paper) 1. Part No. 2. Date Code 3. Q'ty 4. Freq. 7050mm White Remark: Label size Printing Specifications on the label is for default templates purpose and may change with different product. If any specified requirements for labels packaging is needed, please provide the instruction information. FAITH LONG CRYSTAL Proprietary and Confidential Information Page 12 of 13 SMD TSX 2.0 x 1.6 (TH + Xtal) PN: 9Z19200001 Ver. A1 6. Specification of the Environment-related Substances # Range Banned Substances Max. concentration (ppm; mg/kg) Product Packing 1 镉及镉化合物 Cadmium and cadmium compounds 100 100 2 铅及铅化合物 Lead and lead compounds 1000 100 3 汞及汞化合物 Mercury and mercury compounds 1000 100 4 六价铬化合物 +6 Hexavalent-Chromium VI (Cr ) 1000 100 5 聚溴联苯 PBB Polybrominated biphenyls 1000 N/A 6 聚溴二苯醚 PBDE Polybrominated diphenyl ethers 1000 N/A 7 邻苯二甲酸二(2-乙基己基)酯 DEHP Di (2-ethylhexyl) phthalate 1000 N/A 8 邻苯二甲酸丁苄酯 BBP Butyl Benzyl Phthalate 1000 N/A 9 邻苯二甲酸二丁酯 DBP Dibutyl Phthalate 1000 N/A 10 邻苯二甲酸二异丁酯 DIBP Diisobutyl Phthalate 1000 N/A 11 氟(F)、氯(Cl)、溴(Br)、碘(I) Fluorine, Chlorine, Bromine, Iodine 900、900、900、900 注:Br + Cl<1000 N/A 12 包装材料中重金属(汞、镉、六价铬、 铅、PBB、PBDE)之总量 Heavy metals (mercury, cadmium, lead, Cr+6,PBB and PBDE) in packing materials N/A 100 铅(Pb) + 镉(Cd) + 汞(Hg) + 六价 铬(Cr+6)
9Z19200001 价格&库存

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9Z19200001
  •  国内价格
  • 1+1.06560
  • 30+1.02960
  • 100+0.99360
  • 500+0.92160
  • 1000+0.88560
  • 2000+0.86400

库存:0