XL-3216UYC-FB

XL-3216UYC-FB Technical Data Sheet 1206黄（反编） characteristic * 外观尺寸（L/W/H）:3.2*1.6*0.9 mm Appearance dimension (L / w / h): 3.2 x 1.6 x 0.9 mm * 发光颜色及胶体: 高亮度黄色/透明胶体 Luminous color and colloid: high brightness Yellow / transparent colloid * 环保产品，符合ROHS要求 Environmental protection products meet ROHS requirements * EIA规范标准包装 EIA standard packaging * 适用于自动贴片机 Suitable for automatic mounter * 适用于回流焊制程 Suitable for reflow soldering process product application * 医用设备：内窥镜、血氧仪 Medical equipment: endoscope、oximeter * 汽车电子： 背光按键灯、指示灯 Automotive electronics: backlight key light、 indicator light * 工业产品：电子仪表盘、工业设备 Industrial products: electronic instrument panel、industrial equipment * 智能家居： 白色家电、数码管LED Smart home: white appliances, nixie tube LED * 通讯产品： 手机按键灯、路由器、电视盒 Communication products: mobile phone button lamp, router 1 Catalogue Electrical Characteristics.............................................................................................................................3 Typical Characteristic Curves......................................................................................................................5 Reliability Test Items And Conditions........................................................................................................ 6 Outline Dimensions.......................................................................................................................................7 Packaging....................................................................................................................................................... 8 Guideline for Soldering.............................................................................................................................. 10 Precautions.................................................................................................................................................... 12 2 Electrical Characteristics （温度=25℃） 参数名称 Parameter 消耗功率 Consumed power 最大脉冲电流 Maximum pulse current 正向工作电流 Forward working current 反向电压 Reverse voltage 工作环境温度 Operating ambient temperature 储存环境温度 Storage ambient temperature 焊接条件 Welding conditions 符号 Symbol 数值 Rating 单位 Unit Pd 60 mW IFP 100 mA IF 30 mA VR 5 V Topr 室温 Tstg 室温 Tsol 回流焊（reflow soldering）：260°C，10s max 手动焊（manual welding ）：300°C，3s max Limit parameters (Temperature=25°C): * 注： 脉冲宽度≤0.1ms， 占空比≤1/10 * Note: Pulse width≤0.1ms, Duty≤1/10 Electro-Optical Charasteristics (Temperature=25°C): 参数名称 Parameter 符号 Symbol 测试条件 Test conditions 最小值 Min. 典型值 Typ. 最大值 Max. 单位 Unit 正向电压 Forward voltage 光强 light intensity 主波长 Dominant wavelength 峰值波长 Peak wavelength Vf IF=20mA 1.9 ﹍ 2.2 V Iv IF=20mA 60 ﹍ 220 mcd λd IF=20mA 585 ﹍ 594 nm λp IF=20mA ﹍ 588 ﹍ nm 半波宽 Half wave width 反向电流 Reverse current 半光强视角 Half light angle Δλ IF=20mA ﹍ 10 ﹍ nm Ir VR=5V ﹍ ﹍ 10 μA 2θ1/2 IF=20mA ﹍ 120 ﹍ Deg 3 : Brightness grading Code H04 H05 H06 H07 H08 Q21 Q22 Minimum value 60 75 90 110 130 150 180 Maximum 75 90 110 130 150 180 220 Company mcd Test conditions IF=5mA : Voltage grading Code M08 Minimum value 1.9 Maximum Company Test conditions 2.0 M09 2.0 2.1 M10 2.1 2.2 V IF=5mA : Wavelength grading Code HY1 Minimum value 586 Maximum Company Test conditions 587 HY2 587 588 HY3 588 589 HY4 589 590 HY5 590 591 HY6 591 592 HY7 592 593 HY8 593 594 nm IF=5mA 4 Typical Characteristics Curves 5 可靠性实验 类别 Class Reliability experiment 测试项目 Test item 测试环境 Testing environment 室温条件下以最大额定电流持续点亮； 以20mA测试（Continuous lighting at the maximum rated current at room temperature;Test it at 20mA. ） 高温高湿储存 Test it at 20mA.） High IR-Reflow In-Board, 2 Times temperature and 环境温度Ta= 85±5℃,相对湿度RH= 90～95% 耐久性测试 high humidity Endurance test storage 高温储存High环境温度Ta= 85±5℃ temperature storage 低温储存Low 环境温度Ta= -40±5℃ temperature storage 工作寿命 Working life 冷热循环Cold 105℃ ～ 25℃ ～ -55℃ ～ 25℃ and hot cycle 30mins 5mins 30mins 5mins IR-Reflow In-Board, 2 Times 冷热冲击Hot 100± 5℃ ～ -40℃ ± 5℃ and cold impact 20mins 20mins 抗锡试验Anti焊锡温度T.sol= 260 ± 5℃ tin test 环境测试 Environmental testing 红外回流焊 无 铅 制 程 Infrared reflow welding There is lead process 红外回流焊 无铅制程 Infrared reflow welding Leadfree process 升温速度heat up speed(183℃到最高值) ：最大 3℃/秒 维持温度keep temperature在125(±25)℃： 不超过 120秒 维持温度keep temperature在183℃以上： 60-150 秒 最高温度限制范围maximum temperature： 235℃+5/-0℃ 维持keep在235℃+5/-0℃时间：10-15 秒 降温速度cooling rate： 最大6℃/秒 升温速度heat up speed(217℃到最高值) ：最大 3℃/秒 维持温度keep temperature在175(±25)℃： 不超过 180秒 维持温度keep temperature在217℃以上： 60-120 秒 最高温度限制范围maximum temperature： 255℃+0/-5℃ 维持keep在255℃+0/-5℃时间：5-10秒 降温速度cooling rate： 最大6℃/秒 焊锡温度T.sol= 235 ± 5℃ 可焊性试验 浸入速度： 25±2.5 mm/秒 Weldability test 上锡率 ≧95% 焊盘面积 测试时间 Testing time 参考标准 Reference standard 1000小时 1000 hours MIL-STD-750D:1026 （-24小时，+72小时 ) MIL-STD-883D:1005 （-24hours， JIS C 7021:B-1 +72hours MIL-STD-202F:103B 240小时 240hours JIS C 7021:B-11 （ ±2 小时 ) （ ±2hours ) MIL-STD-883D:1008 1000小时 1000 hours JIS C 7021:B-10 （-24小时 +72小时 ) （-24hours+72hours JIS C 7021:B-12 ） 50次循环 50 Circles 50次循环 50 Circles 10 ± 1secs 2次 2times MIL-STD-202F:107D MIL-STD-750D:1051 MIL-STD-883D:1010 MIL-STD-202F:107D MIL-STD-750D:1051 MIL-STD-883D:1011 MIL-STD-202F:210A MIL-STD-750D:2031 JIS C 7021:A-1 MIL-STD-750D:2031.2 J-STD-020C -------- MIL-STD-750D:2031.2 J-STD-020C -------- 浸入时间：2±0.5秒 MIL-STD-202F:208D MIL-STD-750D:2026 MIL-STD-883D:2003 IEC 68 Part 2-20 JIS C 7021:A-2 6 Outline Dimension 3.2± 0.1 注: 1. 单位 : 毫米（mm） Unit: mm 2. 公差 ：如无特别标注则为± 0.1 mm 1.5±0.1 1.3±0.05 1.5±0.1 2.0± 0.1 0.7± 0.05 Tolerances: ± 0.1 mm if unmarked. Suggest Soldering Pad Dimensions 备注： Remarks: 1.单位：毫米（mm） 1 Unit: mm 2.公差： 如无特别标注则为±0.10mm 2. Tolerance: ± 0.10mm unless otherwise specified 7 1 Packaging (1) Belt and disk dimensions 注: 1. 尺寸单位为毫米(mm)。 1. Size unit is mm (mm). 2. 尺寸公差是±0.1mm。 2. The dimensional tolerance is ± 0.1mm. Disk and carrier belt direction of roll and hole dimensions 8 2 Packaging (2) 9 1 Guideline for Soldering (1) 1. Hand Soldering 只建议在修理和重工的情况下使用手工焊接；推荐使用功率低于 3 0 W 的烙铁，焊接时烙铁的温度必须保 持在 300℃以下，且每个电极只能进行一次焊接，每次焊接的持续时间不得超过 3 秒。 人手焊接过程中的不慎操作易引起 LED 产品的损坏，应当小心谨慎。 Manual welding is recommended only for repair and heavy industry situations. A soldering iron of less than 30W is recommended to be used in Hand Soldering. Please keep the temperature of the soldering iron under 300℃ while soldering. Each terminal of the LED is to go for less than 3 second and for one time only. Be careful because the damage of the product is often started at the time of the hand soldering. 2. 推荐使用以下无铅回流焊接温度图进行。 Reflow Soldering: Use the conditions shown in the under Figure ofPb-Free Reflow Soldering. 有铅制程 have lead process 无铅制程 Lead-free process · 回流焊接最多只能进行两次。 Reflow soldering should not be done more than two times. · 在回流焊接升温过程中，请不要对 LED 施加任何压力。 Stress on the LEDs should be avoided during heating in soldering process. · 在焊接完成后，待产品温度下降到室温之后，再进行其他处理。 After soldering, do not deal with the product before its temperature drop down to room temperature. 10 2 Guideline for Soldering (2) 3. Cleaning 在焊接后推荐使用酒精进行清洗，在温度不高于 30℃的条件下持续 3 分钟， 不高于 50℃的条件下持续 30 秒。使用其他类似溶剂清洗前，请先确认使用的溶剂不会对 LED 的封装和环氧树脂部分造成损伤。 超声波清洗也是有效的方法，一般最大功率不应超过 300W ，否则可能对 LED 造成损伤。请根据具体的 情况预先测试清洗条件是否会对 LED 造成损伤。 It is recommended that alcohol be used as a solvent for cleaning after soldering. Cleaning is to go under 30℃ for 3 minutes or 50℃ for 30 seconds. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Ultrasonic cleaning is also an effective way for cleaning. But the influence of Ultrasonic cleaning on LED depends on factors such as ultrasonic power. Generally, the ultrasonic power should not be higher than 300W. Before cleaning, a pretest should be done to confirm whether any damage to LEDs will occur. 此一般指导原则并不适用于所有 PCB 设计和焊接设备的配置。具体工艺受到诸多因素的影响， 请根据特定的PCB设计和焊接设备来确定焊接方案。 Note: This general guideline may not apply to all PCB designs and configurations of all soldering equipment. The technics in practise is influenced by many factors, it should be specialized base on the PCB designs and configurations of the soldering equipment.. 11 1 Precautions (1) 1. Storage · 本产品使用密封防潮抗静电袋包装，并附有干燥剂，未开封的产品有一年的保存时间。 Moisture proof and anti-electrostatic package with moisture absorbent material is used, to keep moisture to a minimum. · 开封前，产品须存放在温度不高于 30℃，湿度不高于 40%RH 的环境中。 Before opening the package, the product should be kept at 30℃ or less and humidity less than 4 0 % RH, and be used within a year. · 开封后，产品须存放在温度不高于 30℃，湿度不高于 10%RH 的环境中，且应该在 24小时（1天） 内使 用完;且贴片后应尽快做焊接。建议工作环境为温度不高于 30℃，湿度不高于 40%RH。 After opening the package, the product should be stored at 30℃ or less and humidity less than 10%RH, and be soldered within 2 4 hours (1 day). An d it sh o u l d be we l d e d as so o n as po s s i b l e af t e r th e pa t c h . It is recommended that the product be operated at the workshop condition of 30℃ or less and humidity less than 40%RH. · 对于尚未焊接的 LED，如果吸湿剂或包装失效，或者产品没有符合以上有效存储条件，烘焙可以起到一定 的性能恢复效果。烘焙条件： （60±5）℃，持续 24 小时。 If the moisture absorbent material has fade away or the LEDs have exceeded the storage time, baking treatment should be performed based on the following condition: (60±5)℃ for 24 hours. 2. Static Electricity 静电和电涌会导致产品特性发生改变，例如正向电压降低等，如果情况严重甚至会损毁产品。所以在使用时必须 采取有效的防静电措施。 所有相关的设备和机器都应该正确接地，同时必须采取其他防止静电和电涌的措施。使用防静电手环，防静电 垫子，防静电工作服、工作鞋、手套，防静电容器，都是有效的防止静电和电涌的措施；严禁使用普通塑料制品。建 议在作业过程中，使用离子风扇来压制静电的产生。 距离LED元件1英尺距离的环境范围内静电场电压小于100V。 Static electricity or surge voltage damages the LEDs. Damaged LEDs will show some unusual characteristic such as the forward voltage becomes lower, or the LEDs do not light at the low current. even not light. All devices, equipment and machinery must be properly grounded. At the same time, it is recommended that wrist bands or anti-electrostatic gloves, anti-electrostatic containers be used when dealing with the LEDs.Using ordinary plastic products are strictly prohibited.It is recommended to use ion fans to suppress the static electricity generation during the operation.The static field voltage is less than 100V within the ambient range of 1 foot distance from the LED element. 12 2 Precautions (2) 3. Design Consideration 设计电路时，通过 LED 的电流不能超过规定的最大值，同时，还需使用保护电阻，否则，微小的电压变 化将会引起较大的电流变化，可能导致产品损毁。 建议使用以下（A）电路，该电路能够很好的调节通过每个 LED 的电流； 不推荐使用（B）电路，该电路 在持续的电压驱动下，LED 的正向电压（VF ）发生变化，电流会随之而发生变化，可能使某些 LED 承受高于 规定的电流值。 In designing a circuit, the current through each LED must not exceed the absolute maximum rating specified for each LED. In the meanwhile, resistors for protection should be applied, otherwise slight voltage shift will cause big current change, burn out may happen. It is recommended to use Circuit A which regulates the current flowing through each LED rather than Circuit B. When driving LEDs with a constant voltage in Circuit B, the current through the LEDs may vary due to the variation in Forward Voltage (VF) of the LEDs. In the worst case, some LED may be subjected to stresses in excess of the Absolute Maximum Rating. (A) (B) 光电参数公差： 正向电压REF / VF： + 0.1V 亮度CAT / IV： + 15% 波长HUE / WLD： + 1nm LED 的特性容易因为自身的发热和环境的温度的改变而发生改变。温度的升高会降低 LED 的发光效率、 影响发光颜色等，所以在设计时应充分考虑散热的问题。 Thermal Design is paramount importance because heat generation may result in the Characteristics decline, such as brightness decreased, Color changed and so on. Please consider the heat generation of the LEDs when making the system design. 13 3 Precautions (3) 4. Others 直接用手拿取产品不但会污染封装树脂表面，也可能由于静电等因素导致产品性能的改变。过度的压力也 直接影响封装内部的管芯和金线，因此请勿对产品施加过度压力，特别当产品处于高温状态下，例如在回 可能 流焊接过 程中。 When handling the product, touching the encapsulant with bare hands will not only contaminate its surface, but also affect on its optical characteristics. Excessive force to the encapsulant might result in catastrophic failure of the LEDs due to die breakage or wire deformation. For this reason, please do not put excessive stress on LEDs, especially when the LEDs are heated such as during Reflow Soldering. LED 的环氧树脂封装部分相当脆弱，请勿用坚硬、尖锐的物体刮、擦封装树脂部分。在用镊子夹取的时 候也应当小心注意。 The epoxy resin of encapsulant is fragile, so please avoid scratch or friction over the epoxy resin surface. While handling the product with tweezers, do not hold by the epoxy resin, be careful. 5. Safety Advice For Human Eyes LED 发光时，请勿直视发光光源，特别是对于一些光强较高的 LED ，强光可能伤害你的眼睛。 Viewing direct to the light emitting center of the LEDs, especially those of great Luminous Intensity, will cause great hazard to human eyes. Please be careful. 14