PMPB14XN
40 V, N-channel Trench MOSFET
11 March 2020
Product data sheet
1. General description
N-channel enhancement mode Field-Effect Transistor (FET) in a leadless medium power
DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench
MOSFET technology.
2. Features and benefits
•
•
•
•
•
Very fast switching
Low threshold voltage
Trench MOSFET technology
Side wettable flanks for optical solder inspection
Exposed drain pad for excellent thermal conduction
3. Applications
•
•
•
•
Relay driver
High-speed line driver
Low-side load switch
Switching circuits
4. Quick reference data
Table 1. Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDS
drain-source voltage
Tj = 25 °C
-
-
40
V
VGS
gate-source voltage
-8
-
8
V
ID
drain current
-
-
11.5
A
-
15
18
mΩ
VGS = 4.5 V; Tamb = 25 °C; t ≤ 5 s
[1]
Static characteristics
RDSon
[1]
drain-source on-state
resistance
VGS = 4.5 V; ID = 8.1 A; Tj = 25 °C
2
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and mounting pad for drain 6 cm .
PMPB14XN
Nexperia
40 V, N-channel Trench MOSFET
5. Pinning information
Table 2. Pinning information
Pin
Symbol
Description
1
D
drain
2
D
drain
Simplified outline
1
3
G
gate
2
4
S
source
3
5
D
drain
6
D
drain
7
D
drain
8
S
source
Graphic symbol
D
6
7
8
5
G
4
Transparent top view
S
017aaa253
DFN2020MD‑6 (SOT1220)
6. Ordering information
Table 3. Ordering information
Type number
Package
Name
PMPB14XN
Description
Version
DFN2020MD‑6 plastic, leadless thermal enhanced ultra thin small outline
package with side-wettable flanks (SWF); 6 terminals; 0.65 mm
pitch; 2 mm x 2 mm x 0.65 mm body
SOT1220
7. Marking
Table 4. Marking codes
Type number
Marking code
PMPB14XN
5D
PMPB14XN
Product data sheet
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Nexperia
40 V, N-channel Trench MOSFET
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage
Tj = 25 °C
-
40
V
VGS
gate-source voltage
-8
8
V
ID
drain current
VGS = 4.5 V; Tamb = 25 °C; t ≤ 5 s
[1]
-
11.5
A
VGS = 4.5 V; Tamb = 25 °C
[1]
-
8.1
A
VGS = 4.5 V; Tamb = 100 °C
[1]
-
5.1
A
-
33
A
IDM
peak drain current
Tamb = 25 °C; single pulse; tp ≤ 10 µs
Ptot
total power dissipation
Tamb = 25 °C
[1]
-
1.9
W
Tamb = 25 °C; t ≤ 5 s
[1]
-
3.8
W
-
12.5
W
Tsp = 25 °C
Tj
junction temperature
-55
150
°C
Tamb
ambient temperature
-55
150
°C
Tstg
storage temperature
-65
150
°C
-
1.9
A
Source-drain diode
IS
[1]
source current
Tamb = 25 °C
[1]
2
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and mounting pad for drain 6 cm .
aaa-030137
120
Pder
(%)
Ider
(%)
80
80
40
40
0
-75
Fig. 1.
aaa-030138
120
-25
25
75
Normalized total power dissipation as a
function of ambient temperature
PMPB14XN
Product data sheet
0
-75
125
175
Tamb (°C)
Fig. 2.
-25
75
125
175
Tamb (°C)
Normalized continous drain current as a
function of ambient temperature
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PMPB14XN
Nexperia
40 V, N-channel Trench MOSFET
aaa-030527
102
ID
(A)
Limit RDSon = VDS/ID
tp = 10 µs
10
100 µs
1
1 ms
DC; Tsp = 25 °C
10 ms
10-1
10-2
10-1
Fig. 3.
DC; Tamb = 25 °C;
drain mounting pad 6 cm2
1
100 ms
10
102
VDS (V)
Safe operating area; junction to ambient; continuous and peak drain currents as a function of drainsource voltage
PMPB14XN
Product data sheet
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PMPB14XN
Nexperia
40 V, N-channel Trench MOSFET
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol
Parameter
Rth(j-a)
Conditions
thermal resistance from in free air
junction to ambient
in free air; t ≤ 5 s
Rth(j-sp)
[1]
[2]
thermal resistance from
junction to solder point
Min
Typ
Max
Unit
[1]
-
223
256
K/W
[2]
-
57
66
K/W
[2]
-
29
33
K/W
-
6
10
K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
2
Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for drain 6 cm .
aaa-026869
103
Zth(j-a)
(K/W)
duty cycle = 1
102
0.5
0.25
0.75
0.33
0.2
0.1
0.05
10
0.02
0.01
0
1
10-3
10-2
10-1
1
10
102
tp (s)
103
FR4 PCB, standard footprint
Fig. 4.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
aaa-026870
102
duty cycle = 1
0.75
Zth(j-a)
(K/W)
0.5
0.33
0.2
0.25
0.1
10
0.05
0.02
0.01
0
1
10-3
10-2
10-1
FR4 PCB, mounting pad for drain 6 cm
Fig. 5.
1
10
102
tp (s)
2
103
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMPB14XN
Product data sheet
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Nexperia
40 V, N-channel Trench MOSFET
10. Characteristics
Table 7. Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Static characteristics
V(BR)DSS
drain-source
breakdown voltage
ID = 250 µA; VGS = 0 V; Tj = 25 °C
40
-
-
V
VGSth
gate-source threshold
voltage
ID = 250 µA; VDS = VGS; Tj = 25 °C
0.4
0.65
0.9
V
IDSS
drain leakage current
VDS = 40 V; VGS = 0 V; Tj = 25 °C
-
-
1
µA
IGSS
gate leakage current
VGS = -8 V; VDS = 0 V; Tj = 25 °C
-
-
-100
nA
VGS = 8 V; VDS = 0 V; Tj = 25 °C
-
-
100
nA
RDSon
drain-source on-state
resistance
VGS = 4.5 V; ID = 8.1 A; Tj = 25 °C
-
15
18
mΩ
VGS = 4.5 V; ID = 8.1 A; Tj = 150 °C
-
24
29
mΩ
VGS = 2.5 V; ID = 7.3 A; Tj = 25 °C
-
17
22
mΩ
VGS = 1.8 V; ID = 3 A; Tj = 25 °C
-
23
32
mΩ
VGS = 1.5 V; ID = 0.5 A; Tj = 25 °C
-
40
100
mΩ
gfs
forward
transconductance
VDS = 10 V; ID = 8.3 A; Tj = 25 °C
-
22
-
S
RG
gate resistance
f = 1 MHz
-
2.4
-
Ω
VDS = 20 V; ID = 8.3 A; VGS = 4.5 V;
Tj = 25 °C
-
19.4
28
nC
-
2.4
-
nC
-
5.6
-
nC
-
1625
-
pF
-
99
-
pF
-
85
-
pF
-
5
-
ns
-
8
-
ns
Dynamic characteristics
QG(tot)
total gate charge
QGS
gate-source charge
QGD
gate-drain charge
Ciss
input capacitance
Coss
output capacitance
Crss
reverse transfer
capacitance
td(on)
turn-on delay time
tr
rise time
td(off)
turn-off delay time
-
35
-
ns
tf
fall time
-
15
-
ns
-
0.7
1.2
V
VDS = 20 V; f = 1 MHz; VGS = 0 V;
Tj = 25 °C
VDS = 20 V; ID = 8.3 A; VGS = 4.5 V;
RG(ext) = 6 Ω; Tj = 25 °C
Source-drain diode
VSD
source-drain voltage
PMPB14XN
Product data sheet
IS = 1.9 A; VGS = 0 V; Tj = 25 °C
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PMPB14XN
Nexperia
40 V, N-channel Trench MOSFET
aaa-030526
35
ID
(A)
30
2.5 V
ID
(A)
1.8 V
2.0 V
25
aaa-030528
10-3
4.5 V
min
10-4
typ
max
20
15
1.5 V
10-5
10
5
VGS = 1.2 V
0
Fig. 6.
0
1
2
3
VDS (V)
10-6
4
0
0.5
1.0
VGS (V)
1.5
Tj = 25 °C
VDS = 5 V; Tj = 25 °C
Output characteristics: drain current as a
Fig. 7.
function of drain-source voltage; typical values
Sub-threshold drain current as a function of
gate-source voltage
aaa-030529
80
1.5 V
RDSon
(mΩ)
aaa-030530
80
RDSon
(mΩ)
VGS = 1.8 V
60
40
60
40
2.0 V
Tj = 150 °C
2.5 V
20
20
Tj = 25 °C
3.0 V
4.5 V
0
0
5
10
15
20
25
30
ID (A)
0
35
Tj = 25 °C
Fig. 8.
Product data sheet
2
4
6
VGS (V)
8
ID = 8.3 A
Drain-source on-state resistance as a function
of drain current; typical values
PMPB14XN
0
Fig. 9.
Drain-source on-state resistance as a function
of gate-source voltage; typical values
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PMPB14XN
Nexperia
40 V, N-channel Trench MOSFET
aaa-030531
35
ID
(A)
30
aaa-030532
2.0
a
1.5
25
20
1.0
15
10
Tj = 150 °C
5
0
0
0.5
1
0.5
Tj = 25 °C
1.5
VGS (V)
0
-60
2
0
60
120
Tj (°C)
180
VDS = 5 V
Fig. 10. Transfer characteristics: drain current as a
function of gate-source voltage; typical values
Fig. 11. Normalized drain-source on-state resistance
as a function of junction temperature; typical
values
aaa-030533
1.5
aaa-030534
104
C
(pF)
VGSth
(V)
1.0
Ciss
103
max
typ
Coss
102
0.5
Crss
min
0
-60
0
60
120
Tj (°C)
10
10-1
180
ID = 250 µA; VDS = VGS
Product data sheet
10
VDS (V)
102
f = 1 MHz; VGS = 0 V
Fig. 12. Gate-source threshold voltage as a function of
junction temperature
PMPB14XN
1
Fig. 13. Input, output and reverse transfer capacitances
as a function of drain-source voltage; typical
values
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PMPB14XN
Nexperia
40 V, N-channel Trench MOSFET
aaa-030535
5
VDS
VGS
(V)
ID
4
VGS(pl)
3
VGS(th)
VGS
2
QGS1
1
0
QGS2
0
8
16
QG (nC)
QGS
QGD
QG(tot)
aaa-030347
Fig. 15. Gate charge waveform definitions
24
ID = 8.3 A; VDS = 20 V; Tamb = 25 °C
Fig. 14. Gate-source voltage as a function of gate
charge; typical values
aaa-030536
6
IS
(A)
4
Tj = 150 °C
2
0
0
Tj = 25 °C
0.4
0.8
VSD (V)
1.2
VGS = 0 V
Fig. 16. Source current as a function of source-drain voltage; typical values
11. Test information
P
t2
duty cycle δ =
t1
t2
t1
t
006aaa812
Fig. 17. Duty cycle definition
PMPB14XN
Product data sheet
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Nexperia
40 V, N-channel Trench MOSFET
12. Package outline
DFN2020MD-6: plastic thermal enhanced ultra thin small outline package; no leads;
6 terminals; body 2 x 2 x 0.65 mm
SOT1220
(8×)
pin 1
index area
B
E
A
D
A
T (6×)
A1
detail X
solderable lead
end protrusion
max. 0.02 mm (6×)
C
Lp
E2
J1
D2 3
4
2
5
e
J
D1
bp (6×)
e
1
v
X
E1
0
2 mm
scale
Dimensions (mm are the original dimensions)
Unit
A
A1
bp
min
0.25
nom
max 0.65 0.04 0.35
D
D1
D2
E
E1
E2
1.9
1.0
0.2
1.9
1.1
0.51
2.1
1.2
0.3
2.1
1.3
0.61
e
J
J1
0.65 0.27 0.64
Lp
T
v
y
y1
0.2
0.10
0.16
0.22
0.1
0.05
0.1
0.3
Note
1. Dimension A is including plating thickness.
Outline
version
A B
6
pin 1
index area
mm
y
y1 C
sot1220_po
References
IEC
JEDEC
JEITA
European
projection
Issue date
18-05-30
18-06-07
SOT1220
Fig. 18. Package outline DFN2020MD‑6 (SOT1220)
PMPB14XN
Product data sheet
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Nexperia
40 V, N-channel Trench MOSFET
13. Soldering
Footprint information for reflow soldering of DFN2020MD-6 package
0.33 (6×)
SOT1220
0.76
0.43 (6×)
0.66
0.53 (6×)
0.56
0.25 0.35 0.45
0.775
0.65
2.06
0.285
1.25
1.35
0.35 (6×)
1.05
0.25 (6×)
0.65
0.45 (6×)
0.9
1.1
1.2
0.935
0.935
2.5
solder land
solder land plus solder paste
solder paste deposit
solder resist
occupied area
Dimensions in mm
sot1220_fr
Fig. 19. Reflow soldering footprint for DFN2020MD‑6 (SOT1220)
PMPB14XN
Product data sheet
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PMPB14XN
Nexperia
40 V, N-channel Trench MOSFET
14. Revision history
Table 8. Revision history
Data sheet ID
Release date
Data sheet status
Change notice
Supersedes
PMPB14XN v.1
Product data sheet
-
-
PMPB14XN
Product data sheet
20200311
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40 V, N-channel Trench MOSFET
15. Legal information
injury, death or severe property or environmental damage. Nexperia and its
suppliers accept no liability for inclusion and/or use of Nexperia products in
such equipment or applications and therefore such inclusion and/or use is at
the customer’s own risk.
Data sheet status
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Document status
[1][2]
Product
status [3]
Definition
Objective [short]
data sheet
Development
This document contains data from
the objective specification for
product development.
Preliminary [short]
data sheet
Qualification
This document contains data from
the preliminary specification.
Product [short]
data sheet
Production
This document contains the product
specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or
completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the internet at https://www.nexperia.com.
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Nexperia does not give any representations or
warranties as to the accuracy or completeness of information included herein
and shall have no liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the relevant
full data sheet, which is available on request via the local Nexperia sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
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data sheet shall define the specification of the product as agreed between
Nexperia and its customer, unless Nexperia and customer have explicitly
agreed otherwise in writing. In no event however, shall an agreement be
valid in which the Nexperia product is deemed to offer functions and qualities
beyond those described in the Product data sheet.
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to be accurate and reliable. However, Nexperia does not give any
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or completeness of such information and shall have no liability for the
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to information published in this document, including without limitation
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of an Nexperia product can reasonably be expected to result in personal
PMPB14XN
Product data sheet
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Nexperia makes no representation
or warranty that such applications will be suitable for the specified use
without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using Nexperia products, and Nexperia accepts no liability for
any assistance with applications or customer product design. It is customer’s
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Customers should provide appropriate design and operating safeguards to
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or problem which is based on any weakness or default in the customer’s
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customer(s). Customer is responsible for doing all necessary testing for the
customer’s applications and products using Nexperia products in order to
avoid a default of the applications and the products or of the application or
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liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
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In the event that customer uses the product for design-in and use in
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Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
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40 V, N-channel Trench MOSFET
Contents
1. General description...................................................... 1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................1
5. Pinning information......................................................2
6. Ordering information....................................................2
7. Marking.......................................................................... 2
8. Limiting values............................................................. 3
9. Thermal characteristics............................................... 5
10. Characteristics............................................................ 6
11. Test information.......................................................... 9
12. Package outline........................................................ 10
13. Soldering................................................................... 11
14. Revision history........................................................12
15. Legal information......................................................13
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Nexperia B.V. 2020. All rights reserved
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Date of release: 11 March 2020
PMPB14XN
Product data sheet
All information provided in this document is subject to legal disclaimers.
11 March 2020
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