UBT26A05L03
Electrostatic Discharged Protection Devices (ESD) Data Sheet
Description
UBT26A05L03 is designed to protect high speed data interfaces.
It has been specifically designed to protect sensitive components
which is connected to data and transmission lines from overvoltage
caused by electrostatic discharge (ESD), electrical fast transients
(EFT), and lightning.
Features
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IEC61000-4-2 ESD 15KV Air, 8KV contact compliance
SOT23-6L surface mount package
Protects three data lines
Working voltage: 5V
Low leakage current
Low clamping voltage
Solid-state silicon avalanche technology
Lead Free/RoHS compliant
Solder reflow temperature: Pure Tin-Sn, 260~270℃
Flammability rating UL 94V-0
Meets MSL level 1, per J-STD-020
AEC-Q101 qualified
Marking: LC62
I/O1
VBUS
I/O2
6
5
4
1
2
3
I/O1
GND
I/O2
Pin Configuration
Maximum Ratings
Rating
Peak pulse current (tp=8/20μs)
Symbol
Value
Unit
IPP
5
A
ESD voltage (Contact discharge)
±8
VESD
ESD voltage (Air discharge)
Storage & operating temperature range
Revision:ESD-UBT26A05L03-001(A1)
kV
±15
TSTG ,TJ
1/5
-55~+150
℃
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UBT26A05L03
Electrical Characteristics (TJ=25℃)
Parameter
Symbol
Reverse stand-off voltage
Condition
Min.
Typ.
VRWM
Reverse breakdown voltage
Max.
Unit
5.25
V
VBR
IBR=1mA
6
V
Reverse leakage current
IR
VR=5.25V
Each I/O pin
1
μA
Clamping voltage (tp=8/20μs)
VC
IPP=1A
12
V
Clamping voltage (tp=8/20μs)
VC
IPP=5A
17
V
Off state junction capacitance
CJ
0Vdc,f=1MHz
Between I/O
pins and GND
3.5
pF
Typical Characteristics Curves
Figure 1. Power Derating Curve
Figure 2. Pulse Waveforms
110
100
90
% of Peak Power Current
Peak Power Dissipation (%)
100
80
70
60
50
40
30
20
10
0
tr
Peak value Ipp
Waveform
Parameters:
tr=8µs
td=20µs
90
80
70
60
50
40
30
td=t|IPP/2
20
10
0
25
50
100
75
125
150
0
175
0
5
10
15
20
25
30
t-Time (μs)
TA-Ambient Temperature (℃)
Figure 3. Clamping Voltage vs. Peak Pulse Current
Figure 4. Normalized Capacitance vs. Reverse Voltage
5
25
Junction Capacitance (pF)
Clamping Voltage (V)
F=1MHz
20
15
10
Waveform
Parameters:
tr=8µs
tb=20µs
5
0
0
1
2
3
4
5
3
2
1
0
6
IPP-Peak Pulse Current (A)
Revision:ESD-UBT26A05L03-001(A1)
4
0
1
2
3
4
5
Reverse Voltage (V)
2/5
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UBT26A05L03
Applications Information
USB 2.0 port application diagram
Device
upstream
transceiver
HUB
downstream
transceiver
+3.3V
+5V
RPU
SW2
SW1
USB
connector
VBUS
RX LS/FS +
RX HS +
TX HS +
RX LS/FS RX HS TX HS -
D+
D-
GND
TX LS/FS -
VBUS
VBUS
RX LS/FS +
RX HS +
TX HS +
RX LS/FS RX HS TX HS -
TX LS/FS +
Protection
Bus Switch
GND
GND
RS
UBT26A05L03
RS
RS
UBT26A05L03
RS
RPD
Mode
SW 1
SW 2
Low Speed LS
Open
Closed
Full Speed FS
Closed
Open
High Speed HS
Closed then open
Open
Revision:ESD-UBT26A05L03-001(A1)
3/5
TX LS/FS +
TX LS/FS -
RPD
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UBT26A05L03
Recommended Soldering Conditions
Reflow Soldering
Critical Zone
TL to TP
tP
TP
Ramp-up
TL
tL
Temperature
TS max
TS min
Ramp-down
tS
Preheat
25
t 25℃ to Peak
Time
Recommended Conditions
Profile Feature
Pb-Free Assembly
Average ramp-up rate (TL to TP)
3℃/second max.
Preheat
-Temperature Min (TS min)
-Temperature Max (TS max)
-Time (min to max) (ts)
150℃
200℃
60-180 seconds
TS max to TL
-Ramp-up Rate
3℃/second max.
Time maintained above:
-Temperature (TL)
-Time (tL)
217℃
60-150 seconds
Peak Temperature (TP)
260℃
Time within 5℃ of actual Peak Temperature (tP)
Ramp-down Rate
6℃/second max.
Time 25℃ to Peak Temperature
Revision:ESD-UBT26A05L03-001(A1)
20-40 seconds
8 minutes max.
4/5
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UBT26A05L03
Dimensions (SOT23-6L)
A
6
Dimension
F
5
H
4
Symbol
1
2
Inches
Min.
Max.
Min.
Max.
A
2.80
3.00
0.110
0.118
B
2.60
3.00
0.102
0.118
C
0.93
0.97
0.037
0.038
G
E B
Millimeters
3
J
D
C
D
0.41
0.016
E
1.50
1.70
0.059
0.067
F
0.11
0.19
0.004
0.007
G
-
0.10
-
0.004
H
0.40
-
0.016
-
J
1.00
1.20
0.393
0.047
2.30
0.90
(6X)
0.60
(6X)
0.95
Recommended Soldering Pad Layout
Packaging
Tape
P1
P2
K
W
B
F
E
øD0
P0
A
øD1
t
Reel
Symbol
Dimension (mm)
W
8.00±0.30
P0
4.00±0.10
P1
4.00±0.10
P2
2.00±0.10
D0
Φ1.55±0.10
D1
Φ1.05±0.05
E
1.75±0.10
F
3.50±0.10
A
3.40±0.10
B
3.20±0.10
K
1.30±0.10
t
0.25±0.05
D
Φ178.0±2.0
D2
Φ13.0
W1
9.5
D2
D
Revision:ESD-UBT26A05L03-001(A1)
W1
5/5
Quantity: 3000PCS
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