JK-SMD0805 Series
Surface Mountable PTC Resettable Fuse: JK-SMD0805 Series
Features:
RoHS Compliant & Halogen Free
faster tripping, 0805 Dimension, Surface mountable, Solid state
Operation Current: 0.05A~1.10A
Maximum Voltage: 6V~15Vdc
Operating Temperature:-40℃ TO 85℃
Product Dimensions
Terminal pad materials :Tin-Plated Nickle-copper
Terminal pad solderability : Meets EIA specification
RS 186-9E and ANSI/J-STD-002 Category 3.
Pig.1
Unit :mm
Model
Marking
SMD0805-005
A
B
C
D
E
Min
Max
Min
Max
Min
Max
Min
Min
1
2.00
2.20
1.20
1.50
0.45
1.00
0.20
0.10
SMD0805-010
1
2.00
2.20
1.20
1.50
0.40
1.00
0.20
0.10
SMD0805-020
2
2.00
2.20
1.20
1.50
0.40
1.00
0.20
0.10
SMD0805-035
3
2.00
2.20
1.20
1.50
0.30
1.00
0.20
0.10
SMD0805-050
5
2.00
2.20
1.20
1.50
0.40
0.80
0.20
0.10
SMD0805-075
7
2.00
2.20
1.20
1.50
0.50
1.20
0.20
0.10
SMD0805-100
0
2.00
2.20
1.20
1.50
0.50
1.20
0.20
0.10
SMD0805-110
0
2.00
2.20
1.20
1.50
0.50
1.20
0.20
0.10
Page 1 of 6
JK-SMD0805 Series
Thermal Derating Chart-IH(A)
Maximum ambient operating temperatures(℃)
Model
-40
-20
0
25
40
50
60
70
85
JK-SMD0805-005
0.07
0.06
0.055
0.05
0.04
0.35
0.3
0.25
0.15
JK-SMD0805-010
0.14
0.12
0.11
0.1
0.8
0.7
0.6
0.5
0.3
JK-SMD0805-020
0.28
0.25
0.23
0.20
0.17
0.14
0.12
0.10
0.07
JK-SMD0805-035
0.47
0.44
0.39
0.35
0.30
0.27
0.24
0.20
0.14
JK-SMD0805-050
0.68
0.62
0.55
0.50
0.40
0.37
0.33
0.29
0.23
JK-SMD0805-075
1.00
0.90
0.79
0.75
0.63
0.57
0.53
0.41
0.34
JK-SMD0805-100
1.35
1.25
1.10
1.00
0.82
0.74
0.65
0.55
0.42
JK-SMD0805-110
1.45
1.35
1.20
1.10
0.92
0.84
0.75
0.65
0.52
Electrical Characteristic
Vmax
Imax
Ihold
Itrip
Pd
(Vdc)
(A)
(A)
(A)
Max.
(W)
Current
Time
Rimin
R1max
(A)
(Sec)
()
()
SMD0805-005
15
100
0.05
0.15
0.5
0.5
2.00
2.00
50.0
SMD0805-010
15
100
0.10
0.30
0.5
0.5
1.50
1.00
6.00
SMD0805-020
9
100
0.20
0.50
0.5
8.0
0.02
0.50
3.50
SMD0805-035
6
100
0.35
0.75
0.5
8.0
0.10
0.25
1.20
SMD0805-050
6
100
0.50
1.00
0.6
8.0
0.10
0.15
0.85
SMD0805-075
6
100
0.75
1.50
0.6
8.0
0.20
0.09
0.385
SMD0805-100
6
100
1.00
1.95
0.6
8.0
0.30
0.06
0.23
SMD0805-110
6
100
1.10
2.20
0.6
8.0
0.30
0.06
0.21
Model
Maximum time to trip
Part Numbering System
JK- SMD0805 - □□□
Holding current Rating
0805
Dimension Surface Mount Device
JK mark
Page 2 of 6
Resistence
JK-SMD0805 Series
Test Procedures And Requirements
Test
Test Conditions
Accept/Reject Criteria
Resistance
In still air @ 25℃
Rmin≤R≤Rmax
Time to Trip
Specified current,Vmax,25℃
Tmaximum Time to Trip
Hold Current
30min,at IH
No trip
Trip Cycle Life
Vmax,Imax,100cycles
No arcing or burning
Trip Endurance
Vmax,1 hours
No arcing or burning
Physical Characteristics and Environmental Specifications
Physical Characteristics
Terminal materials :
Tin-Plated Nickle-copper
Soldering
Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3.
zone
Environmental Specifications
Test
Conditions
Resistance Change
Passive aging
85℃,1000hours
±10%
Humidity aging
85℃/85%RH.1000 hours
±5%
Thermal shock
MIL-STD-202,Method 107G
+85℃/-40℃,20times
-30% typical resistance change
Solvent Resistance
MIL-STD-202,Method 215
no change
Vibration
ML-STD-883C,Test Condition A
No chage
Electrical Specifications:
Ihold = Hold Current. Maximum current device will not trip in 25°C still air.
Itrip = Trip Current. Minimum current at which the device will always trip in 25°C still air.
Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax).
Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax).
Pd=Maximum power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C.
R1max = Maximum device resistance is measured one hour post reflow.
Page 3 of 6
JK-SMD0805 Series
Recommended pad layout (mm)
Solder reflow conditions
Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free.
● Devices are not designed to be wave soldered to the bottom side of the board.
● Recommended maximum paste thickness is 0.25mm (0.010inch).
● Devices can be cleaned using standard industry methods and solvents.
● Soldering temprature profile meets RoHs leadfree process.
Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements
Page 4 of 6
JK-SMD0805 Series
Tape Specification And
Reel Dimensions
Coverning Specifications
EIA 481-1(Unit:mm)
W
8.00± 0.30
P0
4.0 ± 0.10
P1
4.0± 0.10
P2
2.0 ± 0.05
A0
1.65 ± 0.10
B0
2.35 ± 0.10
D0
1.55± 0.05
F
3.50± 0.05
E1
1.75 ± 0.10
T
0.20± 0.10
Leader min.
390
Trailer min.
160
Reel Dimensions
A
178±1.0
N
59±1
W1
8.5+1.0/-0.2
W2
12.0±1
Packaging Quantity
Model
Quantity
Model
Quantity
JK-SMD0805-005
5000
JK-SMD0805-050
5000
JK-SMD0805-010
5000
JK-SMD0805-075
4000
JK-SMD0805-020
5000
JK-SMD0805-100
4000
JK-SMD0805-035
5000
JK-SMD0805-110
4000
Storage
The maximum ambient temperature shall not exceed 38℃. Storage temperatures higher than 38℃ could result in the
deformation of packaging materials. The maximum relative humidity recommended for storage is 60%. High humidity with
high temperature can accelerate the oxidation of the solder plating on the termination and reduce the solderability of the
components. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be
opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present
Page 5 of 6
JK-SMD0805 Series
WARNING
• Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and
flame.
• PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be
used when repeated fault conditions or prolonged trip events are anticipated.
• Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended
electronic, thermal, and mechanical procedures for electronic components.
• Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC.
• Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.
• Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the
performance of the devices.PPTC SMD can be cleaned by standard methods.
• Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper
board layouts or reflow profilecould negatively impact solderability performance of our devices.
Notes:
The specification is intended to present application,product and technical data to assist the user in selecting PPTC circuit
production devices,However,users should imdependently evaluate and test the suitability of each product.JinRui makes on
warranties as to the acduracy or completeness of the information and disclaims any liatility resulting form its use,JinRui’s
only obligations are those im the JinRui Standard Rerms and Conditions of Sale and in no case will JinRui be liable for any
incidental,imdirect,or consequential damages arising from the sale,resale,or misues of its products. Jinrui reserves the right
to change of update, without notice, any information contained in this specification.
Page 6 of 6
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