JK-SMD0805-110/6V

JK-SMD0805 Series Surface Mountable PTC Resettable Fuse: JK-SMD0805 Series Features：      RoHS Compliant ＆ Halogen Free faster tripping, 0805 Dimension, Surface mountable, Solid state Operation Current: 0.05A~1.10A Maximum Voltage: 6V~15Vdc Operating Temperature：-40℃ TO 85℃ Product Dimensions Terminal pad materials :Tin-Plated Nickle-copper Terminal pad solderability : Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3. Pig.1 Unit ：mm Model Marking SMD0805-005 A B C D E Min Max Min Max Min Max Min Min 1 2.00 2.20 1.20 1.50 0.45 1.00 0.20 0.10 SMD0805-010 1 2.00 2.20 1.20 1.50 0.40 1.00 0.20 0.10 SMD0805-020 2 2.00 2.20 1.20 1.50 0.40 1.00 0.20 0.10 SMD0805-035 3 2.00 2.20 1.20 1.50 0.30 1.00 0.20 0.10 SMD0805-050 5 2.00 2.20 1.20 1.50 0.40 0.80 0.20 0.10 SMD0805-075 7 2.00 2.20 1.20 1.50 0.50 1.20 0.20 0.10 SMD0805-100 0 2.00 2.20 1.20 1.50 0.50 1.20 0.20 0.10 SMD0805-110 0 2.00 2.20 1.20 1.50 0.50 1.20 0.20 0.10 Page 1 of 6 JK-SMD0805 Series Thermal Derating Chart-IH（A） Maximum ambient operating temperatures（℃） Model -40 -20 0 25 40 50 60 70 85 JK-SMD0805-005 0.07 0.06 0.055 0.05 0.04 0.35 0.3 0.25 0.15 JK-SMD0805-010 0.14 0.12 0.11 0.1 0.8 0.7 0.6 0.5 0.3 JK-SMD0805-020 0.28 0.25 0.23 0.20 0.17 0.14 0.12 0.10 0.07 JK-SMD0805-035 0.47 0.44 0.39 0.35 0.30 0.27 0.24 0.20 0.14 JK-SMD0805-050 0.68 0.62 0.55 0.50 0.40 0.37 0.33 0.29 0.23 JK-SMD0805-075 1.00 0.90 0.79 0.75 0.63 0.57 0.53 0.41 0.34 JK-SMD0805-100 1.35 1.25 1.10 1.00 0.82 0.74 0.65 0.55 0.42 JK-SMD0805-110 1.45 1.35 1.20 1.10 0.92 0.84 0.75 0.65 0.52 Electrical Characteristic Vmax Imax Ihold Itrip Pd (Vdc) (A) (A) (A) Max. (W) Current Time Rimin R1max (A) (Sec) () () SMD0805-005 15 100 0.05 0.15 0.5 0.5 2.00 2.00 50.0 SMD0805-010 15 100 0.10 0.30 0.5 0.5 1.50 1.00 6.00 SMD0805-020 9 100 0.20 0.50 0.5 8.0 0.02 0.50 3.50 SMD0805-035 6 100 0.35 0.75 0.5 8.0 0.10 0.25 1.20 SMD0805-050 6 100 0.50 1.00 0.6 8.0 0.10 0.15 0.85 SMD0805-075 6 100 0.75 1.50 0.6 8.0 0.20 0.09 0.385 SMD0805-100 6 100 1.00 1.95 0.6 8.0 0.30 0.06 0.23 SMD0805-110 6 100 1.10 2.20 0.6 8.0 0.30 0.06 0.21 Model Maximum time to trip Part Numbering System JK- SMD0805 - □□□ Holding current Rating 0805 Dimension Surface Mount Device JK mark Page 2 of 6 Resistence JK-SMD0805 Series Test Procedures And Requirements Test Test Conditions Accept/Reject Criteria Resistance In still air @ 25℃ Rmin≤R≤Rmax Time to Trip Specified current，Vmax，25℃ Tmaximum Time to Trip Hold Current 30min，at IH No trip Trip Cycle Life Vmax，Imax，100cycles No arcing or burning Trip Endurance Vmax，1 hours No arcing or burning Physical Characteristics and Environmental Specifications Physical Characteristics Terminal materials : Tin-Plated Nickle-copper Soldering Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3. zone Environmental Specifications Test Conditions Resistance Change Passive aging 85℃,1000hours ±10% Humidity aging 85℃/85%RH.1000 hours ±5% Thermal shock MIL-STD-202,Method 107G +85℃/-40℃,20times -30% typical resistance change Solvent Resistance MIL-STD-202,Method 215 no change Vibration ML-STD-883C,Test Condition A No chage Electrical Specifications: Ihold = Hold Current. Maximum current device will not trip in 25°C still air. Itrip = Trip Current. Minimum current at which the device will always trip in 25°C still air. Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax). Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax). Pd=Maximum power dissipation when device is in the tripped state in 25°C still air environment at rated voltage. Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C. R1max = Maximum device resistance is measured one hour post reflow. Page 3 of 6 JK-SMD0805 Series Recommended pad layout (mm) Solder reflow conditions Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free. ● Devices are not designed to be wave soldered to the bottom side of the board. ● Recommended maximum paste thickness is 0.25mm (0.010inch). ● Devices can be cleaned using standard industry methods and solvents. ● Soldering temprature profile meets RoHs leadfree process. Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements Page 4 of 6 JK-SMD0805 Series Tape Specification And Reel Dimensions Coverning Specifications EIA 481-1(Unit:mm) W 8.00± 0.30 P0 4.0 ± 0.10 P1 4.0± 0.10 P2 2.0 ± 0.05 A0 1.65 ± 0.10 B0 2.35 ± 0.10 D0 1.55± 0.05 F 3.50± 0.05 E1 1.75 ± 0.10 T 0.20± 0.10 Leader min. 390 Trailer min. 160 Reel Dimensions A 178±1.0 N 59±1 W1 8.5+1.0/-0.2 W2 12.0±1 Packaging Quantity Model Quantity Model Quantity JK-SMD0805-005 5000 JK-SMD0805-050 5000 JK-SMD0805-010 5000 JK-SMD0805-075 4000 JK-SMD0805-020 5000 JK-SMD0805-100 4000 JK-SMD0805-035 5000 JK-SMD0805-110 4000 Storage The maximum ambient temperature shall not exceed 38℃. Storage temperatures higher than 38℃ could result in the deformation of packaging materials. The maximum relative humidity recommended for storage is 60%. High humidity with high temperature can accelerate the oxidation of the solder plating on the termination and reduce the solderability of the components. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present Page 5 of 6 JK-SMD0805 Series WARNING • Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame. • PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated. • Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components. • Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC. • Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space. • Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance of the devices.PPTC SMD can be cleaned by standard methods. • Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper board layouts or reflow profilecould negatively impact solderability performance of our devices. Notes： The specification is intended to present application,product and technical data to assist the user in selecting PPTC circuit production devices,However,users should imdependently evaluate and test the suitability of each product.JinRui makes on warranties as to the acduracy or completeness of the information and disclaims any liatility resulting form its use,JinRui’s only obligations are those im the JinRui Standard Rerms and Conditions of Sale and in no case will JinRui be liable for any incidental,imdirect,or consequential damages arising from the sale,resale,or misues of its products. Jinrui reserves the right to change of update, without notice, any information contained in this specification. Page 6 of 6