KNTC0805/10KF3950

KNTC0805/10KF3950 外形尺寸 Shape and Dimensions  尺寸：见图 1 和表 1  Dimensions: See Fig.1 and Table 1.  PCB 焊盘：见图 2 和表 1  Recommended PCB pattern for reflow soldering: See Fig.2 and Table 1 图 1 Fig.1 图 2 Fig.2 表 1（Table 1） 单位 unit: inch[mm] 类别 Type L W T a 0805 0.079±0.008 0.049±0.008 0.033±0.008 0.020±0.012 [2012] [2.0±0.2] [1.25±0.2] [0.85±0.2] [0.5±0.3] A B C [1.0-1.1] [0.6-0.7] [1.0-1.2] 电气特性 Electrical Characteristics 电阻值 B 常数 B 常数 型号 Resistance B Constant B Constant Part No (25℃) (25/50℃) (25/85℃) (kΩ) （K） （K） 允许工作电流 Permissible Operating Current ( 25℃) （mA） 10±1% 3950±1% 3987 0.44 KNTC0805/10KF3950 1/12 耗散系数 Dissipation Factor (mW/℃) 2.0 热时间常数 Thermal Time Constant (s) ＜5 额定功率 Rated Electric Power(25℃) (mW) 100 工作温度 Operating ambient temperature (℃) -40～+125 Test and Measurement Procedures 检验和测试程序 Test Conditions 测试条件 Unless otherwise specified, the standard atmospheric 如无特别规定，检验和测试的标准大气环境条件如下： a. 环境温度：20±15℃； conditions for measurement/test as: b. 相对湿度：65±20%； a. Ambient Temperature: 20±15℃ c. 气压：86 kPa~106 kPa b. Relative Humidity: 65±20% c. Air Pressure: 86kPa to 106kPa 如果对测试结果有异议，则在下述条件下测试： a. 环境温度：25±2℃； If any doubt on the results, measurements/tests should b. 相对湿度：65±5% be made within the following limits: c. 气压：86kPa ~ 106kPa a. Ambient Temperature: 25±2℃ b. Relative Humidity: 65±5% c. Air Pressure: 86kPa to 106kPa Inspection Equipment 检查设备 外观检查：20 倍放大镜； Visual Examination: 20×magnifier 阻值检查：热敏电阻测试仪 Resistance value test: Thermistor resistance tester 电性测试 序号 No. Electrical Test 项目 Items 25℃零功率电阻值 1 Nominal Zero-Power Resistance at 25℃(R25) 测试方法及备注 Test Methods and Remarks 环境温度 Ambient temperature：25±0.05℃ 测试功率 Measuring electric power：≤0.1mW 分别在环境温度 25±0.05℃， 50±0.05℃或 85±0.05℃下测量电阻值。 Measure the resistance at the ambient temperature of 25±0.05℃, 50±0.05℃ or 2 B 值常数 Nominal B Constant 85±0.05℃. B(25-50℃)= lnR25 −lnR50 1 T25 −1 T50 B(25-85℃)= T：绝对温度（K）Absolute temperature (K) lnR25 −lnR85 1 T25 −1 T85 在零功率条件下，当热敏电阻的环境温度发生急剧变化时，热敏电阻元件产生 最初温度 T0 与最终温度 T1 两者温度差的 63.2%的温度变化所需要的时间，通 常以秒(S)表示。 The total time for the temperature of the thermistor to change by 63.2% of the difference from ambient temperature T0 (℃) to T1 (℃) by the drastic change of the power applied to thermistor from Non-zero Power to Zero-Power state, normally expressed in second(S). 3 热时间常数 Thermal Time Constant 2/12 在一定环境温度下，NTC 热敏电阻通过自身发热使其温度升高 1℃时所需要的 功率，通常以 mW/℃表示。可由下面公式计算： The required power which makes the NTC thermistor body temperature raise 1 ℃ 4 through self-heated, normally expressed in milliwatts per degree Celsius (mW/℃). It 耗散系数 Dissipation Factor can be calculated by the following formula: δ= 6 在环境温度 25℃下因自身发热使表面温度升高 100℃所需要的功率。 额定功率 5 W T−T0 The necessary electric power makes thermistor’s temperature rise 100℃ by Rated Power self-heating at ambient temperature 25℃. 在静止空气中通过自身发热使其升温为 1℃的电流。 允许工作电流 The current that keep body temperature of chip NTC on the PC board in still air Permissible operating current rising 1°C by self-heating. 信赖性试验 Reliability Test 项目 Items 测试标准 Standard 要求 Requirements 将晶片焊接在测试基板上（如右图所示的环氧玻璃布板），按箭头 端电极无脱落且瓷体无损伤。 所示方向施加作用力； No removal or split of the termination Solder the chip to the testing jig (glass epoxy board shown in the right) or other defects shall occur. using eutectic solder. Then apply a force in the direction of the arrow. 端头附着力 Terminal 测试方法及备注 Test Methods and Remarks IEC 60068-2-21 Strength 尺寸 Size F 0201, 0402, 0603 5N 0805 10N 保持时间 Duration 10±1s 将晶片焊接在测试基板上（如右图所示的环氧玻璃布板），按下图 1 无外观损伤。 No visible damage. 箭头所示方向施加作用力； Solder the chip to the test jig (glass epoxy board shown in the right) 2 ∣∆R25/R25∣≤5% using a eutectic solder. Then apply a force in the direction shown as 单位 unit：mm follow; 抗弯强度 Resistance IEC 60068-2-21 to Flexure 尺寸 弯曲变形量 Size Flexure 0201, 1mm 0402, 0603, 0805 2mm 施压速度 Pressurizing Speed ＜0.5mm/s 3/12 保持时间 Duration 10±1s 类型 Type a b c 0201 0.25 0.3 0.3 0402 0.4 1.5 0.5 0603 1.0 3.0 1.2 0805 1.2 4.0 1.65 1 将晶片焊接在测试基板上（如右图所示的环氧玻璃布板）； 无外观损伤。 Solder the chip to the testing jig (glass epoxy board shown in the No visible damage. left) using eutectic solder. 2 晶片以全振幅为 1.5mm 进行振动，频率范围为 10Hz ～55 Hz； The chip shall be subjected to a simple harmonic motion having 振动 Vibration total amplitude of 1.5mm, the frequency being varied uniformly IEC 60068-2-80 between the approximate limits of 10 and 55 Hz. 3 振动频率按 10Hz→55Hz→10Hz 循环，周期为 1 分钟，在空间 三个互相垂直的方向上各振动 2 小时（共 6 小时）。 The frequency ranges from 10 to 55 Hz and return to 10 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3mutually perpendicular directions (total of 6 hours). 坠落 Dropping 可焊性 Solderability IEC 60068-2-32 IEC 60068-2-58 从 1m 的高度让晶片自由坠落至水泥地面 10 次。 无外观损伤。 Drop a chip 10 times on a concrete floor from a height of 1 meter. No visible damage. 1 1 焊接温度 Solder temperature: 245±5℃. 2 浸渍时间 Duration: 3±0.3s. 3 焊锡成分 Solder: Sn/3.0Ag/0.5Cu. 4 助焊剂 Flux: （重量比）25%松香和 75%酒精 No visible damage. 2 Resistance to Soldering IEC 60068-2-58 Heat Wetting shall exceed coverage. 1 焊接温度 Solder temperature: 260±5℃. 2 浸渍时间 Duration: 10±1s. 3 焊锡成分 Solder: Sn/3.0Ag/0.5Cu. 4 助焊剂 Flux: （重量比）25%松香和 75%酒精 5 元件端电极的焊锡覆盖率不小于 95%。 25% Resin and 75% ethanol in weight. 耐焊性 无外观损伤； 1 无外观损伤； No visible damage. 25% Resin and 75% ethanol in weight. 2 ∣∆R25/R25∣≤5% 试验后标准条件下放置 1~2 小时后测量。 3 ∣∆B/B∣≤2% 1 无外观损伤； The chip shall be stabilized at normal condition for 1~2 hours before measuring. 1 无负载于下表所示的环境条件下重复 5 次。 5 cycles of following sequence without loading. 温度周期 Temperature IEC 60068-2-14 cycling 2 步骤 Step 温度 Temperature 时间 Time 1 -40±5℃ 30±3min 2 25±2℃ 5±3min No visible damage. 3 125±2℃ 30±3min 2 ∣∆R25/R25∣≤3% 4 25±2℃ 5±3min 3 ∣∆B/B∣≤2% 1 无外观损伤； 试验后标准条件下放置 1~2 小时后测量。 The chip shall be stabilized at normal condition for 1~2 hours before measuring. 1 125±5℃ in air, for 1000±24 hours without loading. 高温存放 Resistance to dry heat 在 125±5℃空气中，无负载放置 1000±24 小时。 IEC 60068-2-2 2 试验后标准条件下放置 1~2 小时后测量。 The chip shall be stabilized at normal condition for 1~2 hours before measuring. 4/12 No visible damage. 2 ∣∆R25/R25∣≤5% 3 ∣∆B/B∣≤2% 95% 1 1 -40±3℃ in air, for 1000±24 hours without loading. 低温存放 Resistance 在-40±3℃空气中，无负载放置 1000±24 小时。 IEC 60068-2-1 2 to cold No visible damage. 试验后标准条件下放置 1~2 小时后测量。 The chip shall be stabilized at normal condition for 1~2 hours before measuring. 1 IEC 60068-2-78 2 ∣∆R25/R25∣≤5% 3 ∣∆B/B∣≤2% 1 无外观损伤； 在 40±2℃，相对湿度 90~95%空气中，无负载放置 1000±24 小 时。 湿热存放 Resistance to damp heat 40±2℃, 90~95%RH in air, for 1000±24 hours without loading. 2 无外观损伤； No visible damage. 试验后标准条件下放置 1~2 小时后测量。 2 ∣∆R25/R25∣≤3% The chip shall be stabilized at normal condition for 1~2 hours 3 ∣∆B/B∣≤2% 1 无外观损伤； before measuring. 高温负荷 Resistance to high temperature load 1 IEC 60539-1 5.25.4 在 85±2℃空气中，施加允许工作电流 1000±48 小时。 85±2℃in air with permissive operating current for 1000±48 hours 2 试验后标准条件下放置 1~2 小时后测量。 The chip shall be stabilized at normal condition for 1~2 hours before measuring. 编带 Taping 类型 Type 0201 0402 0603 0805 编带厚度 Tape thickness(mm) 0.5±0.15 0.5±0.15 0.8±0.15 0.85±0.2 编带材质 Tape material 每盘数量 Quantity per Reel 纸带 15K 10K (1) 编带图 Taping Drawings 5/12 Paper Tape 4K 4K No visible damage. 2 ∣∆R25/R25∣≤5% 3 ∣∆B/B∣≤2% (2) 纸带尺寸 Paper Tape Dimensions (单位 Unit：mm) 0201 系列 0402 系列 0603 系列 0805 系列 (3) 卷盘尺寸 Reel Dimensions(单位 Unit：mm) 4.3±0.2 4.0±0.1 2.45±0.2 5.0±0.1 13.5±0.2 B A 58±2.0 9.0±1.5 3.0±0.1 178±2.0 6/12 Storage 储存    储存条件 Storage Conditions a. 储存温度：-10℃～40℃ a. Storage Temperature: -10℃～40℃ b. 相对湿度：≤75%RH b. Relative Humidity: ≦75%RH c. 避免接触粉尘、腐蚀性气氛和阳光 c. Keep away from corrosive atmosphere and sunlight. 储存期限：产品交付后 6 个月  Period of Storage: 6 Months after delivery Notes ＆ Warnings 注意事项   热敏电阻不可在以下条件下工作或储存： (1) 腐蚀性气体或还原性气体 The thermistors shall not be operated and stored under the following environmental condition: (1) Corrosive or deoxidized atmospheres (氯气、硫化氢气体、氨气、硫酸气体、一氧化氮等)。 (such as chlorine, sulfurated hydrogen, ammonia, sulfuric (2) 挥发性或易燃性气体 acid, nitric oxide and so on) (3) 多尘条件 (2) Volatile or inflammable atmospheres (4) 高压或低压条件 (3) Dusty condition (5) 潮湿场所 (4) Excessively high or low pressure condition (6) 存在盐水、油、化学液体或有机溶剂的场所 (5) Humid site (7) 强烈振动 (6) Places with brine, oil, chemical liquid or organic (8) 存在类似有害条件的其他场所 solvent (7) Intense vibration (8) Places with analogously deleterious conditions  热敏电阻的陶瓷属于易碎材料，使用时不可 The ceramic body of the thermistors is fragile, no excessive pressure or impact shall be exerted on it.  施加过大压力或冲击。  热敏电阻不可在超过目录规定的温度范围情  况下工作。 7/12 The thermistors shall not be operated beyond the specified “Operating Temperature Range” in the catalog. 建议焊接条件  10 Recommended Soldering Technologies  回流焊 温升 1~2℃/sec. 1~2℃/sec. Ramp 预热：150~170℃/90±30 sec. Pre-heating: 150~170℃/90±30 sec. 大于 240℃时间：20~40sec Time above 240℃: 20~40 sec. 峰值温度：最高 260℃/10 sec. Peak temperature: 260℃Max./10 sec. 焊锡：96.5Sn/3.0Ag/0.5Cu Solder paste: 96.5Sn/3.0Ag/0.5Cu 回流焊：最多 2 次  Re-flowing Profile 手工焊 Max.2 times for re-flowing  Iron Soldering Profile 烙铁功率：最大 20W Iron soldering power: Max.20W 预热：150℃/60sec. Pre-heating: 150℃/60sec. 烙铁头温度：最高 280℃ Soldering Tip temperature: 280℃Max. 焊接时间：最多 3sec. Soldering time: 3 sec Max. 焊锡：96.5Sn/3.0Ag/0.5Cu Solder paste: 96.5Sn/3.0Ag/0.5Cu 手工焊：最多 1 次 Max.1 times for iron soldering [注：不要使烙铁头接触到端头] [Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.] 8/12 R-T 表 R-T table 温度 R 最小值 R 中心值 R 最大值 阻值公差 温度公差 Temp. (℃) R_Min (Kohm) R_Cent (Kohm) R_Max (Kohm) Res TOL. Temp. TOL.(℃) -40 329.927 345.275 361.300 4.64% 0.67 -39 308.651 322.791 337.545 4.57% 0.66 -38 288.892 301.925 315.514 4.50% 0.66 -37 270.532 282.549 295.071 4.43% 0.65 -36 253.464 264.549 276.091 4.36% 0.65 -35 237.587 247.816 258.459 4.29% 0.64 -34 222.812 232.254 242.072 4.23% 0.64 -33 209.055 217.774 226.833 4.16% 0.63 -32 196.239 204.292 212.655 4.09% 0.63 -31 184.293 191.735 199.457 4.03% 0.62 -30 173.153 180.032 187.165 3.96% 0.61 -29 162.760 169.120 175.711 3.90% 0.61 -28 153.059 158.941 165.033 3.83% 0.60 -27 144.000 149.441 155.073 3.77% 0.60 -26 135.535 140.571 145.779 3.71% 0.59 -25 127.622 132.284 137.102 3.64% 0.59 -24 120.207 124.522 128.979 3.58% 0.58 -23 113.270 117.266 121.391 3.52% 0.58 -22 106.779 110.480 114.298 3.46% 0.57 -21 100.701 104.130 107.664 3.39% 0.56 -20 95.008 98.185 101.459 3.33% 0.56 -19 89.674 92.618 95.650 3.27% 0.55 -18 84.672 87.402 90.211 3.21% 0.55 -17 79.982 82.513 85.115 3.15% 0.54 -16 75.580 77.927 80.339 3.10% 0.53 -15 71.449 73.626 75.861 3.04% 0.53 -14 67.569 69.588 71.661 2.98% 0.52 -13 63.924 65.797 67.719 2.92% 0.51 -12 60.498 62.237 64.019 2.86% 0.51 -11 57.277 58.890 60.543 2.81% 0.50 -10 54.247 55.744 57.278 2.75% 0.49 -9 51.396 52.786 54.208 2.69% 0.49 -8 48.712 50.002 51.322 2.64% 0.48 -7 46.184 47.382 48.606 2.58% 0.47 -6 43.803 44.916 46.051 2.53% 0.47 -5 41.559 42.592 43.646 2.47% 0.46 -4 39.441 40.400 41.377 2.42% 0.45 -3 37.443 38.333 39.240 2.37% 0.45 -2 35.559 36.385 37.227 2.31% 0.44 -1 33.781 34.548 35.328 2.26% 0.43 0 32.102 32.814 33.538 2.21% 0.43 1 30.518 31.179 31.851 2.16% 0.42 9/12 温度 R 最小值 R 中心值 R 最大值 阻值公差 温度公差 Temp. (℃) R_Min (Kohm) R_Cent (Kohm) R_Max (Kohm) Res TOL. Temp. TOL.(℃) 2 29.022 29.636 30.259 2.10% 0.41 3 27.608 28.178 28.756 2.05% 0.40 4 26.271 26.800 27.336 2.00% 0.40 5 25.007 25.497 25.994 1.95% 0.39 6 23.808 24.263 24.724 1.90% 0.38 7 22.674 23.096 23.523 1.85% 0.37 8 21.601 21.992 22.387 1.80% 0.37 9 20.584 20.947 21.313 1.75% 0.36 10 19.622 19.958 20.297 1.70% 0.35 11 18.711 19.022 19.336 1.65% 0.34 12 17.847 18.135 18.425 1.60% 0.33 13 17.028 17.294 17.563 1.55% 0.33 14 16.251 16.498 16.746 1.51% 0.32 15 15.514 15.742 15.972 1.46% 0.31 16 14.814 15.025 15.237 1.41% 0.30 17 14.150 14.345 14.541 1.37% 0.29 18 13.519 13.699 13.880 1.32% 0.29 19 12.921 13.086 13.253 1.27% 0.28 20 12.351 12.504 12.657 1.23% 0.27 21 11.811 11.951 12.092 1.18% 0.26 22 11.296 11.426 11.555 1.13% 0.25 23 10.808 10.926 11.045 1.09% 0.24 24 10.342 10.452 10.561 1.04% 0.24 25 9.900 10.000 10.100 1.00% 0.23 26 9.471 9.570 9.670 1.04% 0.24 27 9.062 9.162 9.261 1.09% 0.25 28 8.673 8.773 8.872 1.13% 0.26 29 8.304 8.402 8.501 1.18% 0.27 30 7.952 8.049 8.147 1.22% 0.29 31 7.616 7.713 7.811 1.26% 0.30 32 7.297 7.393 7.490 1.31% 0.31 33 6.993 7.088 7.184 1.35% 0.32 34 6.703 6.797 6.892 1.39% 0.33 35 6.427 6.520 6.613 1.43% 0.35 36 6.164 6.255 6.348 1.47% 0.36 37 5.913 6.003 6.094 1.52% 0.37 38 5.673 5.762 5.852 1.56% 0.38 39 5.445 5.532 5.621 1.60% 0.40 40 5.226 5.313 5.400 1.64% 0.41 41 5.018 5.103 5.189 1.68% 0.42 42 4.819 4.903 4.987 1.72% 0.43 43 4.629 4.711 4.795 1.76% 0.45 44 4.448 4.529 4.610 1.80% 0.46 45 4.274 4.354 4.434 1.84% 0.47 46 4.109 4.187 4.266 1.88% 0.49 10/12 温度 R 最小值 R 中心值 R 最大值 阻值公差 温度公差 Temp. (℃) R_Min (Kohm) R_Cent (Kohm) R_Max (Kohm) Res TOL. Temp. TOL.(℃) 47 3.951 4.027 4.104 1.92% 0.50 48 3.799 3.874 3.950 1.96% 0.51 49 3.655 3.728 3.803 2.00% 0.53 50 3.516 3.588 3.661 2.04% 0.54 51 3.384 3.454 3.526 2.08% 0.55 52 3.257 3.326 3.396 2.12% 0.57 53 3.135 3.203 3.272 2.16% 0.58 54 3.019 3.086 3.153 2.19% 0.59 55 2.908 2.973 3.039 2.23% 0.61 56 2.801 2.865 2.930 2.27% 0.62 57 2.699 2.761 2.825 2.31% 0.64 58 2.601 2.662 2.724 2.35% 0.65 59 2.507 2.567 2.628 2.38% 0.66 60 2.417 2.476 2.535 2.42% 0.68 61 2.331 2.388 2.447 2.46% 0.69 62 2.248 2.304 2.362 2.49% 0.71 63 2.169 2.224 2.280 2.53% 0.72 64 2.092 2.146 2.201 2.57% 0.74 65 2.019 2.072 2.126 2.60% 0.75 66 1.949 2.001 2.053 2.64% 0.76 67 1.882 1.932 1.984 2.67% 0.78 68 1.817 1.866 1.917 2.71% 0.79 69 1.754 1.803 1.852 2.75% 0.81 70 1.695 1.742 1.790 2.78% 0.82 71 1.637 1.684 1.731 2.82% 0.84 72 1.582 1.628 1.674 2.85% 0.85 73 1.529 1.574 1.619 2.88% 0.87 74 1.479 1.522 1.566 2.92% 0.88 75 1.430 1.472 1.516 2.95% 0.90 76 1.383 1.424 1.467 2.99% 0.92 77 1.337 1.378 1.419 3.02% 0.93 78 1.294 1.333 1.374 3.06% 0.95 79 1.251 1.290 1.330 3.09% 0.96 80 1.211 1.249 1.288 3.12% 0.98 81 1.172 1.209 1.247 3.16% 0.99 82 1.135 1.171 1.208 3.19% 1.01 83 1.099 1.134 1.171 3.22% 1.03 84 1.064 1.099 1.135 3.26% 1.04 85 1.031 1.065 1.100 3.29% 1.06 86 0.998 1.032 1.066 3.32% 1.07 87 0.967 1.000 1.033 3.35% 1.09 88 0.937 0.969 1.002 3.38% 1.11 89 0.908 0.940 0.972 3.42% 1.12 90 0.881 0.911 0.943 3.45% 1.14 91 0.854 0.884 0.914 3.48% 1.16 11/12 温度 R 最小值 R 中心值 R 最大值 阻值公差 温度公差 Temp. (℃) R_Min (Kohm) R_Cent (Kohm) R_Max (Kohm) Res TOL. Temp. TOL.(℃) 92 0.828 0.857 0.887 3.51% 1.17 93 0.803 0.831 0.861 3.54% 1.19 94 0.779 0.807 0.835 3.57% 1.21 95 0.755 0.783 0.811 3.61% 1.22 96 0.733 0.760 0.787 3.64% 1.24 97 0.711 0.738 0.765 3.67% 1.26 98 0.691 0.716 0.743 3.70% 1.27 99 0.670 0.695 0.721 3.73% 1.29 100 0.651 0.675 0.701 3.76% 1.31 101 0.632 0.656 0.681 3.79% 1.33 102 0.614 0.637 0.662 3.82% 1.34 103 0.596 0.619 0.643 3.85% 1.36 104 0.579 0.602 0.625 3.88% 1.38 105 0.563 0.585 0.608 3.91% 1.40 106 0.547 0.569 0.591 3.94% 1.41 107 0.532 0.553 0.575 3.97% 1.43 108 0.517 0.538 0.559 4.00% 1.45 109 0.502 0.523 0.544 4.03% 1.47 110 0.489 0.508 0.529 4.05% 1.49 111 0.475 0.495 0.515 4.08% 1.50 112 0.462 0.481 0.501 4.11% 1.52 113 0.449 0.468 0.487 4.14% 1.54 114 0.437 0.456 0.474 4.17% 1.56 115 0.425 0.443 0.462 4.20% 1.58 116 0.414 0.432 0.450 4.22% 1.60 117 0.403 0.420 0.438 4.25% 1.62 118 0.392 0.409 0.427 4.28% 1.63 119 0.382 0.399 0.416 4.31% 1.65 120 0.372 0.388 0.405 4.34% 1.67 121 0.362 0.378 0.395 4.36% 1.69 122 0.353 0.368 0.385 4.39% 1.71 123 0.344 0.359 0.375 4.42% 1.73 124 0.335 0.350 0.365 4.44% 1.75 125 0.326 0.341 0.356 4.47% 1.77 12/12