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X2000

X2000

  • 厂商:

    INGENIC(君正)

  • 封装:

    BGA270

  • 描述:

    X2000

  • 数据手册
  • 价格&库存
X2000 数据手册
X2000/E IoT Application Processor Data Sheet Release Date: Jul 21, 2020 X2000/E IoT Application Processor Data Sheet Copyright © 2005-2020 Ingenic Semiconductor Co., Ltd. All rights reserved. Disclaimer This documentation is provided for use with Ingenic products. No license to Ingenic property rights is granted. Ingenic assumes no liability, provides no warranty either expressed or implied relating to the usage, or intellectual property right infringement except as provided for by Ingenic Terms and Conditions of Sale. Ingenic products are not designed for and should not be used in any medical or life sustaining or supporting equipment. All information in this document should be treated as preliminary. Ingenic may make changes to this document without notice. Anyone relying on this documentation should contact Ingenic for the current documentation and errata. Ingenic Semiconductor Co., Ltd. Ingenic Headquarters, East Bldg. 14, Courtyard #10, Xibeiwang East Road, Haidian District, Beijing 100193, China Tel: 86-10-56345000 Fax: 86-10-56345001 Http: //www.ingenic.com CONTENTS CONTENTS 1 Overview ............................................................................................ 4 1.1 Block Diagram ......................................................................................................................... 4 1.2 Features .................................................................................................................................. 5 1.2.1 CPU Core......................................................................................................................... 5 1.2.2 Video Process Unit(VPU) ................................................................................................ 5 1.2.3 Image Signal Processor(ISPx2)....................................................................................... 5 1.2.4 Memory Interface ............................................................................................................. 6 1.2.5 Audio ................................................................................................................................ 6 1.2.6 MIPI-CSI .......................................................................................................................... 7 1.2.7 Camera ............................................................................................................................ 7 1.2.8 Display ............................................................................................................................. 7 1.2.9 System Functions ............................................................................................................ 7 1.2.10 Peripherals ....................................................................................................................... 9 1.2.11 Bootrom ......................................................................................................................... 11 2 PAD Information ............................................................................... 12 2.1 Pin Map ................................................................................................................................. 12 2.2 Pin Description ...................................................................................................................... 14 2.2.1 GPIO Group A ................................................................................................................ 14 2.2.2 GPIO Group B................................................................................................................ 15 2.2.3 GPIO Group C ............................................................................................................... 17 2.2.4 GPIO Group D ............................................................................................................... 19 2.2.5 GPIO Group E................................................................................................................ 20 2.3 X2000/E Analog PAD DESCRIPTION ................................................................................... 21 2.4 X2000/E Digital PAD DESCRIPTION .................................................................................... 26 3 Electrical Specifications.................................................................... 32 3.1 Absolute Maximum Ratings................................................................................................... 32 3.2 Recommended operating conditions ..................................................................................... 33 3.3 DC Specifications .................................................................................................................. 34 3.4 Audio codec ........................................................................................................................... 40 3.5 Power On, Reset and BOOT ................................................................................................. 41 3.5.1 Power-On Timing ........................................................................................................... 41 3.5.2 Reset procedure ............................................................................................................ 42 3.5.3 BOOT ............................................................................................................................. 43 4 Packaging Information...................................................................... 45 4.1 Overview................................................................................................................................ 45 4.2 Device Dimensions ................................................................................................................ 45 4.3 Solder Ball Materials ............................................................................................................. 46 4.4 Moisture Sensitivity Level ...................................................................................................... 46 3 X2000/E IoT Application Processor Data Sheet Copyright © 2005-2020 Ingenic Semiconductor Co., Ltd. All rights reserved. Overview 1 Overview X2000/E is a low power consumption, high performance and high integrated application processor, the application is focus on IoT devices. And it can match the requirements of many other embedded products. NAME X2000 X2000E 1.1 SIP LPDDR 128MB, LPDDR3 256MB, LPDDR2 RGMII x1 x2 Block Diagram Figure 1-1 X2000/E Diagram 4 X2000/E IoT Application Processor Data Sheet Copyright © 2005-2020 Ingenic Semiconductor Co., Ltd. All rights reserved. Overview 1.2 Features 1.2.1  CPU Core XBurst® 2, at 1.2GHz, Dual Core, Dual-issue, high performance and low power implementation of MIPS32 ISA R5  MIPS32 ISA R5 plus MIPS SIMD instruction set architecture:128bit MSA  Ingenic SIMD instruction set architecture: 128bit MXA  Dual-issue, superscalar, super pipeline with Simultaneous Multi-Threading (SMT) – 2 hardware threads per physical core – Quad instruction fetch per cycle – Dual issue instructions per cycle per thread  32KB L1 D cache +32K L1 I cache ,512 KB L2 cache,32KB SRAM  High-performance Floating-point Unit and SIMD Engine: FSE – 32 x 128-bit register set, 128-bit loads/stores to/from SIMD unit – IEEE-754 2008 compliant  Programmable Memory Management Unit (MMU) – 1st level mini-TLBs (MTLBs) – 8 x 2 entry instruction TLB, 16 x 2 entry data TLB – 2nd level TLBs: 32 × 2 entry VTLB, 256 × 2 entry 4-way set associative FTLB  1.2.2  The XBurst® processor system supports little endian only Video Process Unit(VPU) H.264 Encoder – Input data format NV12/NV21 – Encoding resolution and frame rate up to 1920x1080@30fps – Support hardware RBSP bytes insertion – Support auto-read of slice header – Support reference frame lossless compression  H.264 Decoder – Output data format NV12/NV21 – Decoding resolution and frame rate up to 1920x1080@30fps – Support hardware RBSP bytes eliminate  JPEG Codec – JPEG compressing/decompressing up to 70Mega-pixels per second – Baseline ISO/IEC 10918-1 JPEG compliant – 8-bit pixel depth support – Up to four programmable Quantization tables – Fully programmable Huffman tables 1.2.3  Image Signal Processor(ISPx2) Data stream feature – DVP: raw8 / 10 / 12 / YUV422 input – MIPI: up to 1080P@60fps – Support dual-camera sync 5 X2000/E IoT Application Processor Data Sheet Copyright © 2005-2020 Ingenic Semiconductor Co., Ltd. All rights reserved. Overview – Frame data check, make up for lost data and drop redundant data  Advanced feature – 2A(Auto Exposure/Auto White Balance) supported – Advanced demosaic, color processing, lens shading, sharpen, static/dynamic defect pixel and other modules provide high image quality – 2-D noise reduction filter 1.2.4  Memory Interface DDR Controller – Support LPDDR2, LPDDR3, 16Bit bus width, clock up to 800MHz – 128MB/256MB memory in package,   X2000: 128MB SIP LPDDR3  X2000E: 256MB SIP LPDDR2 SFC Controller – 1 group clock and CE pad – Two Quad SPI, one Octal SPI ( SFC0/1 ) – Support Standard, Dual, Quad SPI and Octal DDR protocol – Clock frequency up to 80MHz in SDR mode – Support multiple transfer modes, standard SPI, dual-output/dual-Input SPI, QuadOutput/Quad-Input SPI, Dual-I/O SPI, Quad-I/O SPI, Full Dual-I/O SPI, Full Quad-I/O SPI, and Octal-I/O 1.2.5  Audio Digital Microphone Array Controller – Support 8 channels digital MIC – 24/16bit precision internal controller, sample rate support 8K, 16K, 32K, 48K and 96K – SNR: 90dB, THD: -90dB @ FS -20dB – Linear high pass filter include. Attenuation: -2.9dB@100Hz, -22dB@27Hz. -36dB@10Hz – Low power voice trigger when waiting to start talking. – Support voice data pre-fetch when trigger enable and the data interface disable, but do not increase the power dissipation. – Support low power voice trigger enable  I2S(1~3) / I2S0 – DMA transfer mode supported – Support share clock mode and split clock mode. – I2S0: Internal I2S CODEC supported – Support master mode and slave mode  – Support number of data pin from 1 to 4 – Support six modes of operation for TDM protocol PCM interface – Support master mode and slave mode – Support four modes of operation for PCM 6 X2000/E IoT Application Processor Data Sheet Copyright © 2005-2020 Ingenic Semiconductor Co., Ltd. All rights reserved. Overview   DSP NORMAL \ LEFT MODE  PCM NORMAL \ LEFT MOD S/PDIF(IN and OUT) – Support IEC 60958-3 compliant, up to 2 channels – Sample bit support 20-bit and 24-bit two mode – Sample rate support, all of IEC60958-3 sample rate(44.1k up to 192k)  Internal Audio Codec (DAC and ADC working together ) – 24 bits DAC / ADC – Sample rate supported: 8k, 12k, 16k, 24k, 32k, 44.1k,48k,96k – Mono Differential input/output – DAC : SNR: 90dB A-Weighted, THD: -80dB @FS,-1dB ; ADC: SNR 90dB 1.2.6  MIPI-CSI MIPI-CSI2(v1.0) interface, resolution up to 1080P@120fps – Support dual 2-lane mode and single 4-lane mode – Support 1-lane, 2-lane and 4-lane mode 1.2.7  Camera Camera interface module(CIM) – Support DVP 8bit / MIPI input ,resolution up to 1280x720@30fps – Support snapshot control – Supported data format: RGB888, RGB565, YCbCr 4:2:2 – Supports ITU656 (YCbCr 4:2:2) input – Support histogram output and global binarization 1.2.8  Display MIPI-DSI2(v1.0) interface Display size up to 1920x1080@40Hz  SLCD controller – Display size up to 640x480@60Hz, 24BPP – Supports different size of display panel  RGB controller – Display size up to 1280x720@60Hz, 24BPP – Support input format, ARGB8888, ARGB1555, RGB888, RGB565, RGB555, YUV422, YUV420 – Support 4 modes parallel interface, 24-bit, 18-bit, 16-bit and 8-bit(third times) – Support frame buffer crop and dither 1.2.9  System Functions Clock generation and power management – On-chip oscillator circuit (support 24MHz) – Two phase-locked loops (PLL) with programmable multiplier – CCLK, HHCLK, H2CLK, PCLK, H0CLK, DDR_CLK frequency can be changed 7 X2000/E IoT Application Processor Data Sheet Copyright © 2005-2020 Ingenic Semiconductor Co., Ltd. All rights reserved. Overview separately for software by setting registers – Functional-unit clock gating – Supply block power shut down  TCU – 8 channels each channel has two pins – Support posedge / negedge / dualedge clock counting – Support gate counting(only count for gating signal) – Support quadrature counting – Support direction counting(add / sub because of input signal) – Support counting after posedge / negedge signal – Support capture counting, output signal high-level time and total cycle time – Support exclk / pclk two clock source  PWM – 16 channels, output signal ~50MHz, signal precision ~500MHz – Cpu / dma mode to update config  OS timer – One event timer for one logic core – One global timer for system time  Interrupt controller – Total 64 interrupt sources – Each interrupt source can be independently enabled  Watchdog timer – A 16-bit Data register and a 16-bit counter – Programmable interrupt generation prior to timeout – Counter clock uses the input clock selected by software   EXTAL / RTCCLK can be used as the clock for counter  The division ratio of the clock can be set to 1, 4, 16, 64, 256 and 1024 by software PDMA Controller – Support up to 32 independent DMA channels – Descriptor or No-Descriptor Transfer mode – Transfer data units: 1-byte, 2-byte, 4-byte, 16-byte, 32-byte, 64-byte, 128-byte – Transfer number of data unit: 1 ~ 224 - 1 – Independent source and destination port width: 8-bit, 16-bit, 32-bit – Fixed three priorities of channel groups: 0~3, highest; 4~11: mid; 12~31: lowest  SAR A/D Controller – 6 Channels – Resolution: 10-bit 8 X2000/E IoT Application Processor Data Sheet Copyright © 2005-2020 Ingenic Semiconductor Co., Ltd. All rights reserved. Overview  RTC (Real Time Clock) – Need external 32768Hz oscillator for 32KHz clock generation. – 32-bits second counter – Programmable and adjustable counter to generate accurate 1 Hz clock – Alarm interrupt, 1Hz interrupt – Stand alone power supply, work in hibernating mode – Power down controller – Alarm wakeup – External pin wakeup with up to 2s glitch filter – Power Detect to Shut down PMU (find Core without voltage then shut PMU other voltage) 1.2.10 Peripherals  General-Purpose I/O ports – Input / output / function port configurable – Low/high, rising/falling edge triggering. Every interrupt source can be masked independent  Six I2C Controller (I2C0~5) – Two-wire I2C serial interface – consists of a serial data line (SDA) and a serial clock (SCL) – Three speeds mode  Standard mode (100 Kb/s)  Fast mode (400 Kb/s)  High speed mode (3.4Mb/s) – Programmable SCL generator – Master or slave I2C operation – 7-bit addressing/10-bit addressing – The number of devices that you can connect to the same I2C-bus is limited only by the maximum bus capacitance of 400pF  One Smart Card Controller (SCC) – Supports normal card and UIM card. – Supports asynchronous character (T=0) communication modes. – Supports asynchronous block (T=1) communication modes. – Supports setting of clock-rate conversion factor F (372, 512, 558, etc.), and bit-rate adjustment factor D (1, 2, 4, 8, 16, 32, 12, 20, etc.). – Supports extra guard time waiting. – Auto-error detection in T=0 receive mode. – Auto-character repeat in T=0 transmit mode. – Transforms inverted format to regular format and vice versa. – Support stop clock function in some power consuming sensitive applications. 9 X2000/E IoT Application Processor Data Sheet Copyright © 2005-2020 Ingenic Semiconductor Co., Ltd. All rights reserved. Overview  Two Synchronous serial interfaces (SSI0~1) – 3 protocols support: National’s Microwire, TI’s SSP, and Motorola’s SPI – Full-duplex or transmit-only or receive-only operation – Programmable transfer order: MSB first or LSB first – Configurable normal transfer mode or Interval transfer mode – Programmable clock phase and polarity for Motorola’s SSI format – Two slave select signal (SSI0_CE0_ / SSI1_CE0_) supporting up to 2 slave devices – Back-to-back character transmission/reception mode – Loop back mode for testing – Data transfer up to 30Mbits/s  Ten UARTs (UART0~9) – Full-duplex operation – Baud rate supports 4800, 9600, 19200, 38400, 43000, 56000, 57600, 115200, 230400, 460800, 576000, 921600, 1000000, 1152000, 1500000, 2000000, 2500000, 3000000, 3500000, 4000000, 6000000, 8000000, 12000000 – 5-, 6-, 7- or 8-bit characters with optional no parity or even or odd parity and with 1, 1½, or 2 stop bits – Internal diagnostic capability Loopback control and break, parity, overrun and framingerror is provided – Separate DMA requests for transmit and receive data services in FIFO mode – Supports modem flow control by software or hardware  Three MMC/SD/SDIO controllers (MSC0,MSC1,SDIO) – All support eMMC 5.1 (command queueing) – Support SD Specification 3.0 – Support SD I/O Specification 1.0 with 1 command channel and 4 data channels – Maximum clock speed is 104MHz – Both support MMC data width 1bit ,4bit, only MSC0 support 8bit – Single or multi block access to the card including erase operation – The maximum block length is 4096bytes  USB 2.0 OTG interface – Complies with the USB 2.0 standard for high-speed (480 Mbps) functions and with the On-The-Go supplement to the USB 2.0 specification – – – –  Support operating as USB peripheral, as USB host Support split transmission Support hub Support remote-wakeup GMAC controller – 10/100 Mbps and 1000Mbps operation 10 X2000/E IoT Application Processor Data Sheet Copyright © 2005-2020 Ingenic Semiconductor Co., Ltd. All rights reserved. Overview – Supports RMII and RGMII PHY interfaces – Support IEEE 1588-2002  Security System – XBurst® , 240MHz – Secret ROM and RAM – Up to 32KB SRAM – True Random Number Generator – Encryption Engine  MD5, SHA, SHA2  AES, support 256-bit, 192-bit, 128-bit key size Algorithm  RSA, support 1024/2048-bit key size – Support secure boot  OTP Slave Interface – Total 2Kb. 1.2.11 Bootrom 16KB Boot ROM memory and 16KB Security Boot ROM 11 X2000/E IoT Application Processor Data Sheet Copyright © 2005-2020 Ingenic Semiconductor Co., Ltd. All rights reserved. PAD Information 2 PAD Information 2.1 Pin Map 12 X2000/E IoT Application Processor Data Sheet Copyright © 2005-2020 Ingenic Semiconductor Co., Ltd. All rights reserved. PAD Information 1 MSC0_D6_SFC1_ A DQ2_WP__UART 0_CTS__PD25 2 3 4 5 6 7 12 13 VSS VDDMEM VREF DDR_VDD1 DDRPLL_VCCA VSS SD15_SSI0_CLK_ SD9_LCD_VSYN SD3_LCD_D19_R UART3_RTS__I2 UART9_TXD_PB3 C_SLCD_DC_PB GMAC1_MDC_PB A C5_SDA_PC28 1 25 19 VDDMEM VDDMEM VSS DDR_VDD1 DDR_VSSA VSS SD10_LCD_HSY SD8_LCD_PCLK SD2_LCD_D18_R UART3_RXD_I2C UART3_TXD_I2C NC_SLCD_WR_P _SLCD_CE__PB2 GMAC1_RX_DV_ B 4_SCK_PC25 4_SDA_PC26 B26 4 PB18 VSS VDDMEM VDDMEM ZQ VSS VDDMEM VDDMEM SD7_LCD_D23_I2 SD14_SSI0_DT_ SD4_LCD_D20_R UART3_CTS__I2 SD0_LCD_D16_P C2_SDA_RGMAC UART9_RXD_PB GMAC1_MDIO_P C C5_SCK_PC27 B16 1_PHY_CLK_PB2 30 B20 3 VSS VSS VSS VSS VSS VDDMEM VDDMEM SD12_SSI0_CE0_ SD13_SSI0_DR_ WE__LCD_D14_ SA12_LCD_D12_ SD11_LCD_DE_ _UART8_RXD_P UART8_TXD_PB2 SLCD_D14_RGM SLCD_D12_RGM D SLCD_TE_PB27 B28 9 AC1_RXD2_PB14 AC1_RXD0_PB12 UART3_TXD_PC I2C5_SCK_PCM_ M_DO_TCK_PD0 DI_TMS_PD04 3 SDIO_CMD_SSI0 SDIO_D1_I2C1_S SDIO_D2_I2C1_S _DT_PD09 CK_PD11 DA_PD12 MSC0_CMD_SFC UART2_RXD_I2C UART3_RXD_PC SDIO_CLK_SSI0_ SDIO_D0_SSI0_D UART3_CTS__I2 I2C5_SDA_PCM_ B 0_CE__SSI1_DT_ 3_SCK_PWM0_T M_CLK_TDI_PD0 CLK_PD08 R_PD10 C4_SCK_PD00 SYNC_PD05 PD18 CU0_IN0_PD30 2 MSC0_D1_SFC0_ MSC0_D0_SFC0_ MSC0_D7_SFC1_ C DQ1_I2C2_SCK_ DQ0_SSI1_DR_P DQ3_HOLD__UA PD20 D19 RT0_RTS__PD26 UART2_TXD_I2C UART3_RTS__I2 SDIO_D3_SSI0_C 3_SDA_PWM1_T C4_SDA_TDO_P E0__PD13 CU0_IN1_PD31 D01 X2000 Ball Assignment Ver1.0 BGA270, 12mm X 12mm X 1.2mm, 0.65pitch, TOP view 8 9 10 11 MSC0_CLK_SFC MSC0_D2_SFC0_ MSC0_D4_SFC1_ MSC0_D3_SFC0_ D 0_CLK_SSI1_CLK DQ2_WP__I2C2_ DQ0_UART0_RX DQ3_HOLD__SSI _PD17 E SDA_PD21 RTC32K_PE23 D_PD23 AVDEFUSE TRST 1_CE0__PD22 14 15 16 17 18 WAIT__LCD_D15 SD6_LCD_D22_I2 RD__LCD_D13_S _SLCD_D15_RG C2_SCK_RGMAC LCD_D13_RGMA MAC1_RXD3_PB 1_RX_CLK_PB22 C1_RXD1_PB13 15 MSC0_D5_SFC1_ EXCLK_CIM_VIC_ DQ1_UART0_TX MCLK_PE24 D_PD24 E F VDDIO_RTC WKUP__PE31 PWRON DRV_VBUS_PE2 2 VSS VSS VDD VDD VSS VDD VDD VSS SD1_LCD_D17_R SA11_LCD_D11_ SA10_LCD_D10_ SA9_LCD_D9_SL GMAC1_TX_EN_ SLCD_D11_RGM SLCD_D10_RGM CD_D9_RGMAC1 F PB17 AC1_TXD3_PB11 AC1_TXD2_PB10 _TXD1_PB09 G OSC32_XO OSC32_XI PPRST_ TEST_TE VDDIO VSS VDD VDD VSS VDD VDD VSS SD5_LCD_D21_R SA8_LCD_D8_SL SA6_LCD_D6_SL SA3_LCD_D3_SL GMAC1_TX_CLK_ CD_D8_RGMAC1 G CD_D6_PB06 CD_D3_PB03 PB21 _TXD0_PB08 PLL_AVDD VDD_RTC VSS_RTC VDDIO VSS VSS VSS VSS VDD VDD VDDIO33 SA5_LCD_D5_SL SA1_LCD_D1_SL SA2_LCD_D2_SL CD_D5_PB05 CD_D1_PB01 CD_D2_PB02 EXCLK_XO PLL_VDD PLL_AVSS VSS VSS VSS VSS VSS VDDIO18 SA7_LCD_D7_SL SA4_LCD_D4_SL CD_D7_PB07 CD_D4_PB04 PLL_VSS BOOT_SEL1_PE 26 VSS VDD VDD VDD VDD VSS SA0_LCD_D0_SL CD_D0_PB00 CIM_EXPOSURE I2C3_SDA_I2S2_ BOOT_SEL0_PE _PA15 RX_BCLK_PA17 25 VSS VDD VDD VSS VSS VDD VDD VSS CIM_VIC_PCLK_P VIC_D10_I2S2_R A14 X_DATA0_PA10 VDDIO33_CIM VSS VSS VSS VSS VDD VDD N VIC_D9_UART7_ CIM_VIC_D7_UAR VIC_D11_I2S2_R VIC_D8_UART7_ TXD_I2S2_RX_LR T6_TXD_I2S2_RX X_DATA1_PA11 RXD_PA08 CK_PA09 _MCLK_PA07 VDDIO18_CIM VSS VDDIO18_SD VDDIO33_SD VSS VSS VDDIO18 P CIM_VIC_D4_UAR CIM_VIC_D5_UAR CIM_VIC_D6_UAR T5_RXD_I2S3_TX T5_TXD_I2S3_TX T6_RXD_I2S3_TX _DATA1_PA04 _DATA2_PA05 _DATA3_PA06 H J K EXCLK_XI I2C3_SCK_I2S3_ BOOT_SEL2_PE TX_BCLK_PA16 27 L CIM_VIC_VSYNC_ CIM_VIC_HSYNC M I2S2_RX_DATA3_ _I2S2_RX_DATA2 PA13 _PA12 CIM_VIC_D3_UAR CIM_VIC_D2_UAR R T4_TXD_I2S3_TX T4_RXD_I2S3_TX _DATA0_PA03 T AUX4 U SADC_VREFP V _LRCK_PA02 AUX2 CIM_VIC_D0_UAR CIM_VIC_D1_UAR T4_CTS__I2S3_T T4_RTS__PA01 X_MCLK_PA00 AUX0 SADC_AVSS AUX3 AUX5 USB_DM0 AUX1 SADC_AVDD USB_DP0 USB_AVD09 1 2 3 4 USB_AVSS USB_VBUS USB_AVD18 5 USB_ID USB_AVD33 USB_BIAS CODEC_MICBIAS CODEC_AVSS PWM4_TCU2_IN0 PWM10_TCU5_IN MSC1_CLK_PWM MSC1_D3_PWM7 _RGMAC0_TXD2 0_RGMAC0_TX_E 2_TCU1_IN0_PE0 _TCU3_IN1_PE05 _I2S1_RX_DATA_ N_SSI1_DR_UAR 0 SCC_SDA_PC04 T4_RTS__PC10 CODEC_HPOUT MSC1_D2_PWM6 SFC0_CLK_SSI1 N _TCU3_IN0_PE04 _CLK_PE16 CODEC_MICLN CODEC_AVDD CODEC_HPOUT MSC1_D1_PWM5 SFC0_CE__SSI1 P _TCU2_IN1_PE03 _DT_PE17 CODEC_MICLP CODEC_VCM MSC1_CMD_PW MSC1_D0_PWM4 M3_TCU1_IN1_P _TCU2_IN0_PE02 E01 6 7 8 9 10 TX_DATAP1 TX_DATAN1 J TX_DATAP0 TX_CLKP TX_CLKN K DSI_AVSS DSI_AVD09 TX_DATAN0 VSS CSI_AVSS DSI_AVD18 RX_DATAP0 RX_DATAN0 M VDDIO33 CSI_AVD09 RX_CLKP0 RX_DATAP1 RX_DATAN1 N PWM0_TCU0_IN0 _PC00 CSI_AVD18 RX_CLKN0 PWM11_TCU5_IN 1_RGMAC0_RX_ DV_SSI1_DT_UA RT4_RXD_PC11 PWM9_TCU4_IN1 PWM12_TCU6_IN DMIC_IN3_UART1 _RGMAC0_RXD3 0_RGMAC0_MDC _TXD_I2C1_SDA_ _SSI1_CE0__UA _SSI1_CLK_UAR NEMC_CS2__PC RT4_CTS__PC09 T4_TXD_PC12 24 PWM7_TCU3_IN1 PWM6_TCU3_IN0 PWM14_TCU7_IN _RGMAC0_RXD1 _RGMAC0_RXD0 SFC0_DQ0_SSI1 0_RGMAC0_TX_ _I2S1_TX_DATA_ _I2S1_TX_LRCK_ _DR_PE18 CLK_SPDIF_OUT UART6_RXD_PC UART5_TXD_PC0 _I2C0_SDA_PC14 07 6 PWM5_TCU2_IN1 PWM3_TCU1_IN1 SFC0_DQ3_HOL _RGMAC0_TXD3 SFC0_DQ1_I2C2 _RGMAC0_TXD1 D__SSI1_CE0__P _I2S1_TX_BCLK_ _SCK_PE19 _I2S1_RX_LRCK_ E21 UART5_RXD_PC SCC_SCK_PC03 05 PWM2_TCU1_IN0 _RGMAC0_TXD0 SFC0_DQ2_WP_ _I2S1_RX_BCLK_ _I2C2_SDA_PE20 UART7_TXD_PC0 2 11 12 H 13 14 PWM13_TCU6_IN DMIC_IN2_UART1 1_RGMAC0_MDI _RXD_I2C1_SCK O_SPDIF_IN_I2C _NEMC_CS1__P 0_SCK_PC13 C23 L P RX_DATAN2 RX_DATAP2 R RX_DATAP3 RX_DATAN3 T PWM8_TCU4_IN0 _RGMAC0_RXD2 DMIC_IN0_UART1 RX_CLKN1 RX_CLKP1 U _I2S1_TX_MCLK_ _CTS__PC21 UART6_TXD_PC0 8 PWM1_TCU0_IN1 PWM15_TCU7_IN _RGMAC0_PHY_ 1_RGMAC0_RX_ DMIC_IN1_UART1 V CLK_I2S1_RX_M DMIC_CLK_PC20 CLK_CIM_VIC_M _RTS__PC22 CLK_UART7_RX CLK_PC15 D_PC01 15 16 13 X2000/E IoT Application Processor Data Sheet Copyright © 2005-2020 Ingenic Semiconductor Co., Ltd. All rights reserved. 17 18 PAD Information 2.2 2.2.1 Ball No. R4 R3 R2 R1 P2 P3 P4 N4 N3 N2 M4 N1 M2 M1 M3 L2 K1 L3 Pin Description GPIO Group A Ball Name CIM_VIC_D0_ UART4_CTS__ I2S3_TX_MCLK_PA00 CIM_VIC_D1_UART4_RTS__PA01 CIM_VIC_D2_UART4_RXD_I2S3_TX_LRCK_PA02 CIM_VIC_D3_UART4_TXD_I2S3_TX_DATA0_PA03 CIM_VIC_D4_UART5_RXD_I2S3_TX_DATA1_PA04 CIM_VIC_D5_UART5_TXD_I2S3_TX_DATA2_PA05 CIM_VIC_D6_UART6_RXD_I2S3_TX_DATA3_PA06 CIM_VIC_D7_UART6_TXD_I2S2_RX_MCLK_PA07 VIC_D8_UART7_RXD_PA08 VIC_D9_UART7_TXD_I2S2_RX_LRCK_PA09 VIC_D10_I2S2_RX_DATA0_PA10 VIC_D11_I2S2_RX_DATA1_PA11 CIM_VIC_HSYNC_I2S2_RX_DATA2_PA12 CIM_VIC_VSYNC_I2S2_RX_DATA3_PA13 CIM_VIC_PCLK_PA14 CIM_EXPOSURE_PA15 I2C3_SCK_I2S3_TX_BCLK_PA16 I2C3_SDA_I2S2_RX_BCLK_PA17 In/O ut Pull Slew Rate Schmitt GPIO IO PU Yes Yes IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO PU PU PU PU PU PU PU PU PU PU PU PD PD PD PD PU PU Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Func0 Func1 Func2 GPA[0] CIM/VIC_D0 UART4_CTS_ I2S3_TX_MCLK GPA[1] GPA[2] GPA[3] GPA[4] GPA[5] GPA[6] GPA[7] GPA[8] GPA[9] GPA[10] GPA[11] GPA[12] GPA[13] GPA[14] GPA[15] GPA[16] GPA[17] CIM/VIC_D1 CIM/VIC_D2 CIM/VIC_D3 CIM/VIC_D4 CIM/VIC_D5 CIM/VIC_D6 CIM/VIC_D7 VIC_D8 VIC_D9 VIC_D10 VIC_D11 CIM_VIC_HSYNC CIM_VIC_VSYNC CIM/VIC_PCLK CIM_EXPOSURE I2C3_SCK I2C3_SDA UART4_RTS_ UART4_RXD UART4_TXD UART5_RXD UART5_TXD UART6_RXD UART6_TXD UART7_RXD UART7_TXD 14 X2000/E IoT Application Processor Data Sheet Copyright © 2005-2020 Ingenic Semiconductor Co., Ltd. All rights reserved. I2S3_TX_LRCK I2S3_TX_DATA0 I2S3_TX_DATA1 I2S3_TX_DATA2 I2S3_TX_DATA3 I2S2_RX_MCLK I2S2_RX_LRCK I2S2_RX_DATA0 I2S2_RX_DATA1 I2S2_RX_DATA2 I2S2_RX_DATA3 I2S3_TX_BCLK I2S2_RX_BCLK Power VDDIO33_CIM VDDIO33_CIM VDDIO33_CIM VDDIO33_CIM VDDIO33_CIM VDDIO33_CIM VDDIO33_CIM VDDIO33_CIM VDDIO33_CIM VDDIO33_CIM VDDIO33_CIM VDDIO33_CIM VDDIO33_CIM VDDIO33_CIM VDDIO33_CIM VDDIO33_CIM VDDIO33_CIM VDDIO33_CIM PAD Information 2.2.2 Ball No. K15 H16 H17 G16 J16 H15 G15 J15 G18 F18 F17 F16 D18 E17 D17 E15 C16 F15 B18 A18 GPIO Group B Ball Name SA0_LCD_D0_SLCD_D0_PB00 SA1_LCD_D1_SLCD_D1_PB01 SA2_LCD_D2_SLCD_D2_PB02 SA3_LCD_D3_SLCD_D3_PB03 SA4_LCD_D4_SLCD_D4_PB04 SA5_LCD_D5_SLCD_D5_PB05 SA6_LCD_D6_SLCD_D6_PB06 SA7_LCD_D7_SLCD_D7_PB07 SA8_LCD_D8_SLCD_D8_RGM AC1_TXD0_PB08 SA9_LCD_D9_SLCD_D9_RGM AC1_TXD1_PB09 SA10_LCD_D10_SLCD_D10_R GMAC1_TXD2_PB10 SA11_LCD_D11_SLCD_D11_R GMAC1_TXD3_PB11 SA12_LCD_D12_SLCD_D12_R GMAC1_RXD0_PB12 RD__LCD_D13_SLCD_D13_RG MAC1_RXD1_PB13 WE__LCD_D14_SLCD_D14_R GMAC1_RXD2_PB14 WAIT__LCD_D15_SLCD_D15_ RGMAC1_RXD3_PB15 SD0_LCD_D16_PB16 SD1_LCD_D17_RGMAC1_TX_ EN_PB17 SD2_LCD_D18_RGMAC1_RX_ DV_PB18 SD3_LCD_D19_RGMAC1_MDC In/ Out IO IO IO IO IO IO IO IO PD PD PD PD PD PD PD PD Slew Rate No No No No No No No No Sch mitt Yes Yes Yes Yes Yes Yes Yes Yes IO PD No IO PD IO Pull GPIO Func0 Func1 Func2 GPB[0] GPB[1] GPB[2] GPB[3] GPB[4] GPB[5] GPB[6] GPB[7] SA0 SA1 SA2 SA3 SA4 SA5 SA6 SA7 LCD_D0 LCD_D1 LCD_D2 LCD_D3 LCD_D4 LCD_D5 LCD_D6 LCD_D7 SLCD_D0 SLCD_D1 SLCD_D2 SLCD_D3 SLCD_D4 SLCD_D5 SLCD_D6 SLCD_D7 Yes GPB[8] SA8 LCD_D8 SLCD_D8 RGMAC1_TXD0 VDDIO33 No Yes GPB[9] SA9 LCD_D9 SLCD_D9 RGMAC1_TXD1 VDDIO33 PD No Yes GPB[10] SA10 LCD_D10 SLCD_D10 RGMAC1_TXD2 VDDIO33 IO PD No Yes GPB[11] SA11 LCD_D11 SLCD_D11 RGMAC1_TXD3 VDDIO33 IO PD No Yes GPB[12] SA12 LCD_D12 SLCD_D12 RGMAC1_RXD0 VDDIO33 IO PU No Yes GPB[13] RD_ LCD_D13 SLCD_D13 RGMAC1_RXD1 VDDIO33 IO PU No Yes GPB[14] WE_ LCD_D14 SLCD_D14 RGMAC1_RXD2 VDDIO33 IO PU No Yes GPB[15] WAIT_ LCD_D15 SLCD_D15 RGMAC1_RXD3 VDDIO33 IO PU No Yes GPB[16] SD0 LCD_D16 SLCDRD IO PU No Yes GPB[17] SD1 LCD_D17 IO PU No Yes GPB[18] SD2 LCD_D18 IO PU No Yes GPB[19] SD3 LCD_D19 15 X2000/E IoT Application Processor Data Sheet Copyright © 2005-2020 Ingenic Semiconductor Co., Ltd. All rights reserved. Func3 Power VDDIO33 VDDIO33 VDDIO33 VDDIO33 VDDIO33 VDDIO33 VDDIO33 VDDIO33 VDDIO33 RGMAC1_TX_EN RGMAC1_RX_D V RGMAC1_MDC VDDIO33 VDDIO33 VDDIO33 PAD Information C18 G17 E16 C17 B17 A17 B16 D16 D14 D15 C15 A16 _PB19 SD4_LCD_D20_RGMAC1_MDI O_PB20 SD5_LCD_D21_RGMAC1_TX_ CLK_PB21 SD6_LCD_D22_I2C2_SCK_RG MAC1_RX_CLK_PB22 SD7_LCD_D23_I2C2_SDA_RG MAC1_PHY_CLK_PB23 SD8_LCD_PCLK_SLCD_CE__P B24 SD9_LCD_VSYNC_SLCD_DC_ PB25 SD10_LCD_HSYNC_SLCD_WR _PB26 SD11_LCD_DE_SLCD_TE_PB2 7 SD12_SSI0_CE0__UART8_RX D_PB28 SD13_SSI0_DR_UART8_TXD_ PB29 SD14_SSI0_DT_UART9_RXD_ PB30 SD15_SSI0_CLK_UART9_TXD_ PB31 IO PU No Yes GPB[20] SD4 LCD_D20 RGMAC1_MDIO IO PU No Yes GPB[21] SD5 LCD_D21 IO PU No Yes GPB[22] SD6 LCD_D22 I2C2_SCK IO PU No Yes GPB[23] SD7 LCD_D23 I2C2_SDA IO PU No Yes GPB[24] SD8 LCD_PCLK SLCD_CE_ VDDIO33 IO PU No Yes GPB[25] SD9 LCD_VSYNC SLCD_DC VDDIO33 IO PU No Yes GPB[26] SD10 LCD_HSYNC SLCD_WR VDDIO33 IO PU No Yes GPB[27] SD11 LCD_DE SLCD_TE VDDIO33 IO PU No Yes GPB[28] SD12 SSI0_CE0_ IO PU No Yes GPB[29] SD13 SSI0_DR IO PU No Yes GPB[30] SD14 SSI0_DT IO PU No Yes GPB[31] SD15 SSI0_CLK UART8_RX D UART8_TX D UART9_RX D UART9_TX D 16 X2000/E IoT Application Processor Data Sheet Copyright © 2005-2020 Ingenic Semiconductor Co., Ltd. All rights reserved. RGMAC1_TX_CL K_O RGMAC1_RX_CL K_I RGMAC1_PHY_ CLK_O VDDIO33 VDDIO33 VDDIO33 VDDIO33 VDDIO33 VDDIO33 VDDIO33 VDDIO33 PAD Information 2.2.3 Ball No. P15 V16 V13 U13 R11 U14 T14 T13 U15 R14 R12 GPIO Group C Ball Name PWM0_TCU0_IN0_PC00 PWM1_TCU0_IN1_RGMAC0_P HY_CLK_I2S1_RX_MCLK_UAR T7_RXD_PC01 PWM2_TCU1_IN0_RGMAC0_T XD0_I2S1_RX_BCLK_UART7_ TXD_PC02 PWM3_TCU1_IN1_RGMAC0_T XD1_I2S1_RX_LRCK_SCC_SC K_PC03 PWM4_TCU2_IN0_RGMAC0_T XD2_I2S1_RX_DATA_SCC_SD A_PC04 PWM5_TCU2_IN1_RGMAC0_T XD3_I2S1_TX_BCLK_UART5_ RXD_PC05 PWM6_TCU3_IN0_RGMAC0_R XD0_I2S1_TX_LRCK_UART5_ TXD_PC06 PWM7_TCU3_IN1_RGMAC0_R XD1_I2S1_TX_DATA_UART6_ RXD_PC07 PWM8_TCU4_IN0_RGMAC0_R XD2_I2S1_TX_MCLK_UART6_ TXD_PC08 PWM9_TCU4_IN1_RGMAC0_R XD3_SSI1_CE0__UART4_CTS __PC09 PWM10_TCU5_IN0_RGMAC0_ TX_EN_SSI1_DR_UART4_RTS In/ Out Pull Slew Rate Sch mitt GPIO IO PD No Yes GPC[0] PWM0_TCU0_IN0 IO PU No Yes GPC[1] PWM1_TCU0_IN1 IO PU No Yes GPC[2] PWM2_TCU1_IN0 IO PU No Yes GPC[3] PWM3_TCU1_IN1 IO PU No Yes GPC[4] PWM4_TCU2_IN0 IO PU No Yes GPC[5] PWM5_TCU2_IN1 IO PU No Yes GPC[6] IO PU No Yes IO PU No IO PU IO PU Func0 Func1 Func2 Func3 Power VDDIO33 RGMAC0_PHY_ CLK I2S1_RX_ MCLK UART7_RXD VDDIO33 RGMAC0_TXD0 I2S1_RX_B CLK UART7_TXD VDDIO33 RGMAC0_TXD1 I2S1_RX_L RCK SCC_SCK VDDIO33 RGMAC0_TXD2 I2S1_RX_ DATA SCC_SDA VDDIO33 RGMAC0_TXD3 I2S1_TX_B CLK UART5_RXD VDDIO33 PWM6_TCU3_IN0 RGMAC0_RXD 0 I2S1_TX_L RCK UART6_RXD VDDIO33 GPC[7] PWM7_TCU3_IN1 RGMAC0_RXD 1 I2S1_TX_D ATA UART6_RXD VDDIO33 Yes GPC[8] PWM8_TCU4_IN0 RGMAC0_RXD 2 I2S1_TX_ MCLK UART6_TXD VDDIO33 No Yes GPC[9] PWM9_TCU4_IN1 RGMAC0_RXD 3 SSI1_CE0_ UART4_CTS _ VDDIO33 No Yes GPC[10] PWM10_TCU5_IN0 RGMAC0_TX_E N SSI1_DR UART4_RTS _ VDDIO33 17 X2000/E IoT Application Processor Data Sheet Copyright © 2005-2020 Ingenic Semiconductor Co., Ltd. All rights reserved. PAD Information R13 R15 T15 T12 V15 V17 U16 V18 T16 R16 B14 B15 C14 A15 __PC10 PWM11_TCU5_IN1_RGMAC0_ RX_DV_SSI1_DT_UART4_RXD _PC11 PWM12_TCU6_IN0_RGMAC0_ MDC_SSI1_CLK_UART4_TXD_ PC12 PWM13_TCU6_IN1_RGMAC0_ MDIO_SPDIF_IN_I2C0_SCK_P C13 PWM14_TCU7_IN0_RGMAC0_ TX_CLK_SPDIF_OUT_I2C0_S DA_PC14 PWM15_TCU7_IN1_RGMAC0_ RX_CLK_CIM_VIC_MCLK_PC1 5 DMIC_CLK_PC20 DMIC_IN0_UART1_CTS__PC2 1 DMIC_IN1_UART1_RTS__PC2 2 DMIC_IN2_UART1_RXD_I2C1_ SCK_NEMC_CS1__PC23 DMIC_IN3_UART1_TXD_I2C1_ SDA_NEMC_CS2__PC24 UART3_RXD_I2C4_SCK_PC25 UART3_TXD_I2C4_SDA_PC26 UART3_CTS__I2C5_SCK_PC2 7 UART3_RTS__I2C5_SDA_PC2 8 IO PU No Yes GPC[11] PWM11_TCU5_IN1 RGMAC0_RX_ DV SSI1_DT UART4_RXD VDDIO33 IO PU No Yes GPC[12] PWM12_TCU6_IN0 RGMAC0_MDC SSI1_CLK UART4_TXD VDDIO33 IO PU No Yes GPC[13] PWM13_TCU6_IN1 RGMAC0_MDIO SPDIF_IN I2C0_SCK VDDIO33 IO PU No Yes GPC[14] PWM14_TCU7_IN0 RGMAC0_TX_C LK SPDIF_OU T I2C0_SDA VDDIO33 IO PU No Yes GPC[15] PWM15_TCU7_IN1 RGMAC0_RX_ CLK CIM/VIC_M CLK IO PD No Yes GPC[20] DMIC_CLK IO PU No Yes GPC[21] DMIC_IN0 UART1_CTS_ VDDIO33 IO PU No Yes GPC[22] DMIC_IN1 UART1_RTS_ VDDIO33 IO PU No Yes GPC[23] DMIC_IN2 UART1_RXD I2C1_SCK NEMC_CS1_ VDDIO33 IO PU No Yes GPC[24] DMIC_IN3 UART1_TXD I2C1_SDA NEMC_CS2_ VDDIO33 IO IO PU PU No No Yes Yes GPC[25] GPC[26] UART3_RXD UART3_TXD I2C4_SCK I2C4_SDA VDDIO33 VDDIO33 IO PU No Yes GPC[27] UART3_CTS_ I2C5_SCK VDDIO33 IO PU No Yes GPC[28] UART3_RTS_ I2C5_SDA VDDIO33 VDDIO33 VDDIO33 18 X2000/E IoT Application Processor Data Sheet Copyright © 2005-2020 Ingenic Semiconductor Co., Ltd. All rights reserved. PAD Information 2.2.4 Ball No. GPIO Group D Ball Name In/ Out Pull Slew Rate Sch mitt GPIO B5 C6 B6 A6 A7 B7 B2 A2 B3 A3 A4 C4 UART3_CTS__I2C4_SCK_PD00 UART3_RTS__I2C4_SDA_TDO_PD01 UART3_RXD_PCM_CLK_TDI_PD02 UART3_TXD_PCM_DO_TCK_PD03 I2C5_SCK_PCM_DI_TMS_PD04 I2C5_SDA_PCM_SYNC_PD05 SDIO_CLK_SSI0_CLK_PD08 SDIO_CMD_SSI0_DT_PD09 SDIO_D0_SSI0_DR_PD10 SDIO_D1_I2C1_SCK_PD11 SDIO_D2_I2C1_SDA_PD12 SDIO_D3_SSI0_CE0__PD13 IO IO IO IO IO IO IO IO IO IO IO IO PU PU PU PU PU PU PU PU PU PU PU PU No No No No No No No No No No No No No No No No No No No No No No No No D1 B1 C2 C1 D2 D4 D3 E4 A1 C3 B4 C5 MSC0_CLK_SFC0_CLK_SSI1_CLK_PD17 MSC0_CMD_SFC0_CE__SSI1_DT_PD18 MSC0_D0_SFC0_DQ0_SSI1_DR_PD19 MSC0_D1_SFC0_DQ1_I2C2_SCK_PD20 MSC0_D2_SFC0_DQ2_WP__I2C2_SDA_PD21 MSC0_D3_SFC0_DQ3_HOLD__SSI1_CE0__PD22 MSC0_D4_SFC1_DQ0_UART0_RXD_PD23 MSC0_D5_SFC1_DQ1_UART0_TXD_PD24 MSC0_D6_SFC1_DQ2_WP__UART0_CTS__PD25 MSC0_D7_SFC1_DQ3_HOLD__UART0_RTS__PD26 UART2_RXD_I2C3_SCK_PWM0_TCU0_IN0_PD30 UART2_TXD_I2C3_SDA_PWM1_TCU0_IN1_PD31 IO IO IO IO IO IO IO IO IO IO IO IO PU PU PU PU PU PU PU PU PU PU PU PU No No No No No No No No No No No No No No No No No No No No No No No No Func0 Func1 Func2 GPD[0] GPD[1] GPD[2] GPD[3] GPD[4] GPD[5] GPD[8] GPD[9] GPD[10] GPD[11] GPD[12] GPD[13] GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 SDIO_CLK SDIO_CMD SDIO_D0 SDIO_D1 SDIO_D2 SDIO_D3 UART3_CTS_ UART3_RTS_ UART3_RXD UART3_TXD I2C5_SCK I2C5_SDA SSI0_CLK SSI0_DT SSI0_DR I2C1_SCK I2C1_SDA SSI0_CE0_ I2C4_SCK I2C4_SDA PCM_CLK PCM_DO PCM_DI PCM_SYNC GPD[17] GPD[18] GPD[19] GPD[20] GPD[21] GPD[22] GPD[23] GPD[24] GPD[25] GPD[26] GPD[30] GPD[31] MSC0_CLK MSC0_CMD MSC0_D0 MSC0_D1 MSC0_D2 MSC0_D3 MSC0_D4 MSC0_D5 MSC0_D6 MSC0_D7 UART2_RXD UART2_TXD SFC0_CLK SFC0_CE_ SFC0_DQ0 SFC0_DQ1 SFC0_DQ2_WP_ SFC0_DQ3_HOLD_ SFC1_DQ0 SFC1_DQ1 SFC1_DQ2_WP_ SFC1_DQ3_HOLD_ I2C3_SCK I2C3_SDA SSI1_CLK SSI1_DT SSI1_DR I2C2_SCK I2C2_SDA SSI1_CE0_ UART0_RXD UART0_TXD UART0_CTS_ UART0_RTS_ PWM0_TCU0_IN0 PWM1_TCU0_IN1 19 X2000/E IoT Application Processor Data Sheet Copyright © 2005-2020 Ingenic Semiconductor Co., Ltd. All rights reserved. Func 3 TDO TDI TCK TMS Power VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO PAD Information 2.2.5 GPIO Group E Ball No. Ball Name In/ Out Pull Slew Rate Schmitt GPIO R10 V10 V9 U9 T9 R9 T10 U10 T11 U11 V12 U12 F4 E2 MSC1_CLK_PWM2_TCU1_IN0_PE00 MSC1_CMD_PWM3_TCU1_IN1_PE01 MSC1_D0_PWM4_TCU2_IN0_PE02 MSC1_D1_PWM5_TCU2_IN1_PE03 MSC1_D2_PWM6_TCU3_IN0_PE04 MSC1_D3_PWM7_TCU3_IN1_PE05 SFC0_CLK_SSI1_CLK_PE16 SFC0_CE__SSI1_DT_PE17 SFC0_DQ0_SSI1_DR_PE18 SFC0_DQ1_I2C2_SCK_PE19 SFC0_DQ2_WP__I2C2_SDA_PE20 SFC0_DQ3_HOLD__SSI1_CE0__PE21 DRV_VBUS_PE22 RTC32K_PE23 IO IO IO IO IO IO IO IO IO IO IO IO IO IO PU PU PU PU PU PU PU PU PU PU PU PU PD PD Yes Yes Yes Yes Yes Yes No No No No No No No No Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes No No EXCLK_CIM_VIC_MCLK_PE24 BOOT_SEL0_PE25 BOOT_SEL1_PE26 BOOT_SEL2_PE27 IO IO IO IO PD PD PD PD No No No No No No No No E3 L4 K4 K2 Func0 Func1 GPE[0] GPE[1] GPE[2] GPE[3] GPE[4] GPE[5] GPE[16] GPE[17] GPE[18] GPE[19] GPE[20] GPE[21] GPE[22] GPE[23] MSC1_CLK MSC1_CMD MSC1_D0 MSC1_D1 MSC1_D2 MSC1_D3 SFC0_CLK SFC0_CE_ SFC0_DQ0 SFC0_DQ1 SFC0_DQ2_WP_ SFC0_DQ3_HOLD_ DRV_VBUS RTC32K PWM2/TCU1_IN0 PWM3/TCU1_IN1 PWM4/TCU2_IN0 PWM5/TCU2_IN1 PWM6/TCU3_IN0 PWM7/TCU3_IN1 SSI1_CLK SSI1_DT SSI1_DR I2C2_SCK I2C2_SDA SSI1_CE0_ GPE[24] GPE[25] GPE[26] GPE[27] EXCLK BOOT_SEL0 BOOT_SEL1 BOOT_SEL2 CIM/VIC_MCLK 20 X2000/E IoT Application Processor Data Sheet Copyright © 2005-2020 Ingenic Semiconductor Co., Ltd. All rights reserved. Power VDDIO33_SD VDDIO33_SD VDDIO33_SD VDDIO33_SD VDDIO33_SD VDDIO33_SD VDDIO33 VDDIO33 VDDIO33 VDDIO33 VDDIO33 VDDIO33 VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO PAD Information 2.3 X2000/E Analog PAD DESCRIPTION Table 2-1 X2000/E function pin description Ball No. Pin Names IO Power Pin Description TRST I VDDIO JTAG reset DDR_VDD1 DDR_VDD1 DDRPLL_VCCA DDR_VSSA VREF ZQ P P P P P I DDR_VDD1 - P P P P P P P P P P P P P P - Debug D6 Memory A11 B11 A12 B12 A10 C10 For sdram supply For sdram supply DDR PHY PLL supply 1.8v ground for sdram, reference voltage for sdram, external reference resistor for output calibrating Power and Ground A9 B8 B9 C8 C9 C12 C13 D12 D13 G6 H6 J13 N6 N8 VDDMEM VDDMEM VDDMEM VDDMEM VDDMEM VDDMEM VDDMEM VDDMEM VDDMEM VDDIO VDDIO VDDIO18 VDDIO18_CIM VDDIO18_SD DDR PHY LPDDR2/3 IO 1.2v supply DDR PHY LPDDR2/3 IO 1.2v supply DDR PHY LPDDR2/3 IO 1.2v supply DDR PHY LPDDR2/3 IO 1.2v supply DDR PHY LPDDR2/3 IO 1.2v supply DDR PHY LPDDR2/3 IO 1.2v supply DDR PHY LPDDR2/3 IO 1.2v supply DDR PHY LPDDR2/3 IO 1.2v supply DDR PHY LPDDR2/3 IO 1.2v supply GPIO 1.8v supply GPIO 1.8v supply GPIO 1.8V supply for 3.3v PAD CIM Type PAD1.8V supply Connect to 1uf capacity for SD type PAD 21 X2000/E IoT Application Processor Data Sheet Copyright © 2005-2020 Ingenic Semiconductor Co., Ltd. All rights reserved. PAD Information H13 N13 M6 N9 A8 A13 B10 B13 C7 C11 D7 D11 F6 F7 F10 F13 G7 G10 G13 H7 H8 H9 H10 J6 J7 J8 J11 J12 K6 K13 L6 VDDIO33 VDDIO33 VDDIO33_CIM VDDIO33_SD VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P - GPIO 3.3V supply for 3.3v PAD GPIO 3.3V supply for 3.3v PAD CIM GPIO 3.3V /1.8Vsupply SD GPIO 3.3V/1.8V supply Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V 22 X2000/E IoT Application Processor Data Sheet Copyright © 2005-2020 Ingenic Semiconductor Co., Ltd. All rights reserved. PAD Information L9 VSS L10 VSS L13 VSS F8 VDD F9 VDD F11 VDD F12 VDD G8 VDD G9 VDD G11 VDD G12 VDD H11 VDD H12 VDD K7 VDD K8 VDD K11 VDD K12 VDD L7 VDD L8 VDD L11 VDD L12 VDD M11 VDD M12 VDD Audio Codec U7 CODEC_AVDD R8 CODEC_AVSS T7 CODEC_MICBIAS T8 CODEC_HPOUTN U8 CODEC_HPOUTP U6 CODEC_MICLN V6 CODEC_MICLP P P P P P P P P P P P P P P P P P P P P P P P - P P AO AO AO AI AI CODEC_AVDD CODEC_AVDD CODEC_AVDD CODEC_AVDD CODEC_AVDD CODEC_AVDD Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V Core digital gound for none DRAM and CORE digital ground, 0V CORE digital power, 0.9V CORE digital power, 0.9V CORE digital power, 0.9V CORE digital power, 0.9V CORE digital power, 0.9V CORE digital power, 0.9V CORE digital power, 0.9V CORE digital power, 0.9V CORE digital power, 0.9V CORE digital power, 0.9V CORE digital power, 0.9V CORE digital power, 0.9V CORE digital power, 0.9V CORE digital power, 0.9V CORE digital power, 0.9V CORE digital power, 0.9V CORE digital power, 0.9V CORE digital power, 0.9V CORE digital power, 0.9V CORE digital power, 0.9V 1.8v supply Ground Electric microphone biasing voltage DAC Differential output N DAC Differential output P ADC Differential input N end ADC Differential input P end 23 X2000/E IoT Application Processor Data Sheet Copyright © 2005-2020 Ingenic Semiconductor Co., Ltd. All rights reserved. PAD Information V7 SADC T3 V1 T2 U2 T1 U3 U1 T4 V2 DSI L17 K16 J18 J17 K18 K17 L15 L16 M16 CSI M18 M17 N18 N17 R17 R18 T18 T17 P17 CODEC_VCM AO CODEC_AVDD AUX0 AUX1 AUX2 AUX3 AUX4 AUX5 SADC_VREFP SADC_AVSS SADC_AVDD AI AI AI AI AI AI AI P P SADC_AVDD SADC_AVDD SADC_AVDD SADC_AVDD SADC_AVDD SADC_AVDD SADC_AVDD TX_DATAN0 TX_DATAP0 TX_DATAN1 TX_DATAP1 TX_CLKN TX_CLKP DSI_AVSS DSI_AVD09 DSI_AVD18 AO AO AO AO AO AO P P P DSI_AVD18 DSI_AVD18 DSI_AVD18 DSI_AVD18 DSI_AVD18 DSI_AVD18 DSI_AVD09 DSI_AVD18 Lane0 negative end Lane0 positive end Lane1 negative end Lane1 positive end CLK negative end CLK positive end ground 0.9V Analog supply 1.8V Analog supply RX_DATAN0 RX_DATAP0 RX_DATAN1 RX_DATAP1 RX_DATAN2 RX_DATAP2 RX_DATAN3 RX_DATAP3 RX_CLKN0 AI AI AI AI AI AI AI AI AI CSI_AVD18 CSI_AVD18 CSI_AVD18 CSI_AVD18 CSI_AVD18 CSI_AVD18 CSI_AVD18 CSI_AVD18 CSI_AVD18 Lane0 negative end Lane0 positive end Lane1 negative end Lane1 positive end Lane2 negative end Lane2 positive end Lane3 negative end Lane3 positive end CLK lane0 negative end SADC_AVDD Referebce voltage output Analog input 0 Analog input 1 Analog input 2 Analog input 3 Analog input 4 Analog input 5 Positive reference voltage input ground 1.8v supply 24 X2000/E IoT Application Processor Data Sheet Copyright © 2005-2020 Ingenic Semiconductor Co., Ltd. All rights reserved. PAD Information N16 RX_CLKP0 U17 RX_CLKN1 U18 RX_CLKP1 M15 CSI_AVSS N15 CSI_AVD09 P16 CSI_AVD18 USB OTG V3 USB_DP0(OTG_DP) U4 USB_DM0(OTG_DM) AI AI AI P P P CSI_AVD18 CSI_AVD18 CSI_AVD18 AIO AIO USB_AVD33 USB_AVD33 CSI_AVD09 CSI_AVD18 CLK lane0 positive end CLK lane1 negative end CLK lane0 positive end ground 0.9V Analog supply 1.8V Analog supply USB OTG data plus USB OTG data minus USB 5-V power supply pin for USB OTG. An external charge pump must provide power to this pin Used to identify the device attached to the PHY. The state of the pin is one of: high impedance (>1M Ω), or low impedance (
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