K1812L200/12DR

K1812L200/12DR Unit:mm 1、Physical Dimensions(size of 1812) A Part Number K1812L200/12DR B C D Min Max Min Max Min Max Min 4.37 4.73 3.07 3.41 0.60 1.00 0.30 Top and Bottom View Side View A C Marking Marking B T200 D 2、Electrical Characteristics Part Number IH (A) IT (A) Vmax (V) I max (A) K1812L200/12DR 2.00 4.00 12 100 Ttrip (Max time to trip) Current(A) 8.0 Time(S) 3.00 Pd typ （W） R min (Ω) R1max (Ω) 1.2 0.020 0.080 IH: Holding Current: maximum current at which the device will not trip in 25℃ still air. IT: Tripping Current minimum current at which the device will trip in 25℃ still air. Vmax: Maximum voltage device can withstand without damage at rated current. I max: Maximum fault current device can withstand without damage at rated voltage. T trip: Maximum time to trip(s) at assigned current. Pd typ: Rated working power. R min: Minimum resistance of device prior to trip at 25℃. R1 max: Maximum resistance of device is measured one hours post reflow at 25℃. Noted: All electrical function test is conducted after PCB mounted. 3、Thermal Derating K1812L200/12DR Hold Current(A) Trip Current(A) Maximum ambient operating temperature -40℃ -20℃ 0℃ 25℃ 40℃ 50℃ 60℃ 70℃ 85℃ 3.08 6.16 2.71 5.42 2.35 4.70 2.00 4.00 1.80 3.60 1.60 3.20 1.50 3.00 1.40 2.80 1.25 2.50 4、Solder Reflow Recommendations 20-40s 260℃ Recommended Pad Layout(mm) Critlcal Zone 1.5±0.05 Ramp-up 1.5±0.05 Temperature 217℃ 60-150s 200℃ 3.2±0.1 Ramp-down Preheat 150℃ 60-180s 2.7±0.1 25℃ 8 minutes max Time Average Ramp-Up Rate:3 ℃/second max Ramp-Down Rate:6 ℃ /second max Notes:If reflow temperatures exceed the recommended profile,devices may not meet the performance requirements. 5、Package Information Packing quantity:1500PCS/Reel Note:Reel packaging per EIA-481-1 standard 1/1